Hot pressing device for preparing high-precision multilayer circuit board

Abstract

The utility model discloses a hot pressing device for preparing a high-precision multilayer circuit board, which comprises a base and a multilayer circuit board body, the upper ends of four corners of the base are fixedly connected with supporting rods, the upper ends of the four supporting rods are provided with the same supporting seat, and the upper end of the central position of the supporting seat is fixedly provided with a hydraulic cylinder; and a horizontal sliding seat is connected among the four supporting rods in a sliding manner. Buffering protection is provided for the material loading seat through the hydraulic buffers and the buffering air bags made of the polyurethane rubber, buffering protection is provided for the pressure bearing seat through the rectangular annular base plate made of the polyurethane rubber, the material loading seat and the pressure bearing seat are prevented from being damaged in the long-term hot pressing process, the service life of the material loading seat and the service life of the pressure bearing seat are prolonged, and the service life of the material loading seat and the pressure bearing seat is prolonged. Balls and limiting grooves are matched with a rectangular annular base plate made of polyurethane rubber to limit the pressure-bearing seat, so that an air cylinder is matched with a jacking block to penetrate through a rectangular opening to jack the pressure-bearing seat out, and the hot-pressed multilayer circuit board in the material carrying seat can be conveniently and quickly taken out.

Description

TECHNICAL FIELD

[0001] The utility model relates to multilayer circuit board preparation technical field especially relates to a kind of high-precision multilayer circuit board preparation and uses hot-pressing device. BACKGROUND

[0002] Multilayer circuit board is made inner layer pattern to be made single-sided or double-sided substrate by printing etching method, and is included in specified interlayer, and then is bonded and fixed by heating and pressing, since the assembly density of multilayer circuit board is high, the connection between components is reduced, thus improve reliability, can increase wiring layer number, to increase design flexibility.

[0003] The existing multilayer circuit board hot-pressing device lacks a buffering structure for carrying the multilayer circuit board during actual use, which can easily cause damage to the carrier seat during long-term hot pressing, and it is not convenient to quickly take out the hot-pressed multilayer circuit board in the carrier seat. The present application proposes a high-precision multilayer circuit board preparation and uses hot-pressing device to solve the above problems. SUMMARY

[0004] In view of the deficiencies and shortcomings in the prior art, the utility model provides a high-precision multilayer circuit board preparation and uses hot-pressing device to solve the technical problems that the existing multilayer circuit board hot-pressing device lacks a buffering structure for carrying the multilayer circuit board during actual use, which can easily cause damage to the carrier seat during long-term hot pressing, and it is not convenient to quickly take out the hot-pressed multilayer circuit board in the carrier seat.

[0005] In order to achieve the above purpose, the utility model adopts the following technical scheme:

[0006] A high-precision multilayer circuit board preparation and uses hot-pressing device, including base and multilayer circuit board body, the upper end of the four corners of the base is fixedly connected with support rod, the upper end of four support rods is equipped with same support seat, the upper end of the center position of support seat is fixedly installed with hydraulic cylinder, horizontal sliding seat is slidably connected between four support rods, the lower end of horizontal sliding seat is equipped with hot-pressing die, the upper end of base is equipped with buffering mechanism, the buffering mechanism is equipped with carrier seat, the upper end of carrier seat is equipped with carrier groove, carrier groove is slidably connected with pressure-bearing seat, the bottom of the center position of carrier groove is equipped with rectangular opening, the upper end of the center position of base is equipped with jacking assembly, jacking assembly is opposite rectangular opening.

[0007] Preferably, the material of the hot-pressing die and the pressure-bearing seat is high-strength die steel.

[0008] Preferably, the buffer mechanism comprises mounting grooves arranged on the base near the upper ends of the front and rear sides respectively, four mounting grooves are arranged near the four supporting rods respectively, hydraulic buffers are fixedly installed on the bottoms of the four mounting grooves, the upper ends of the four hydraulic buffers are fixedly connected with the lower end of the material loading seat, buffer air bags are fixedly connected with the upper ends of the base near the upper ends of the four hydraulic buffers, and the upper ends of the four buffer air bags are fixedly connected with the upper end of the base.

[0009] Preferably, a rectangular ring-shaped pad plate is fixedly connected with the bottom of the material loading groove, the lower end of the pressure bearing seat is in abutting contact with the upper end of the rectangular ring-shaped pad plate, limit grooves are arranged on the left and right side inner walls of the center position of the material loading groove, and the left and right ends of the center position of the pressure bearing seat are inlaid with ball bearings, the two ball bearings are respectively inserted into the two limit grooves and rollingly abut against each other.

[0010] Preferably, the materials of the buffer air bags and the rectangular ring-shaped pad plate are polyurethane rubber.

[0011] Preferably, the jacking assembly comprises a groove arranged on the upper end of the center position of the base, a gas cylinder is fixedly installed on the bottom of the groove, a jacking block is fixedly connected with the upper end of the piston rod of the gas cylinder, and the jacking block is arranged opposite to the rectangular opening.

[0012] Compared with the prior art, the utility model has the beneficial effects that:

[0013] 1. The hydraulic buffers and the buffer air bags made of polyurethane rubber provide buffer protection for the material loading seat, and the rectangular ring-shaped pad plate made of polyurethane rubber provides buffer protection for the pressure bearing seat, so that the material loading seat and the pressure bearing seat are prevented from being damaged in a long-term hot pressing process, and the service life of the material loading seat and the pressure bearing seat is prolonged.

[0014] 2. The ball bearings, the limit grooves and the rectangular ring-shaped pad plate made of polyurethane rubber limit the pressure bearing seat, so that the pressure bearing seat is jacked out after the gas cylinder cooperates with the jacking block and penetrates through the rectangular opening, and the hot-pressed multi-layer circuit board in the material loading seat is conveniently and quickly taken out. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is a perspective view of a hot pressing device for preparing a high-fineness multi-layer circuit board.

[0016] Figure 2 It is a perspective view of a hot pressing device for preparing a high-fineness multi-layer circuit board. Figure 1 It is a perspective view of a hot pressing device for preparing a high-fineness multi-layer circuit board.

[0017] Figure 3 It is a perspective view of a hot pressing device for preparing a high-fineness multi-layer circuit board.

[0018] In the figure: 1 base, 2 multilayer circuit board body, 3 support rod, 4 support seat, 5 hydraulic cylinder, 6 horizontal sliding seat, 7 hot-pressing die, 8 material loading seat, 9 material loading groove, 10 pressure bearing seat, 11 rectangular opening, 12 mounting groove, 13 hydraulic buffer, 14 buffer air bag, 15 rectangular ring-shaped pad plate, 16 limiting groove, 17 ball, 18 groove, 19 air cylinder, 20 jacking block. DETAILED DESCRIPTION

[0019] In the description of the present application, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0020] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all the embodiments.

[0021] Reference Figures 1-3 A hot-pressing device for preparing high-precision multilayer circuit boards, comprising a base 1 and a multilayer circuit board body 2, four support rods 3 are fixedly connected to the upper end of the four corners of the base 1, a same support seat 4 is arranged at the upper ends of the four support rods 3, a hydraulic cylinder 5 is fixedly installed at the upper end of the center position of the support seat 4, a horizontal sliding seat 6 is slidably connected between the four support rods 3, the hydraulic cylinder 5 can drive the horizontal sliding seat 6 to vertically ascend and descend under the limiting action of the four support rods 3, a hot-pressing die 7 is arranged at the lower end of the horizontal sliding seat 6, the materials of the hot-pressing die 7 and the pressure bearing seat 10 are both high-strength die steel, and the hot-pressing die 7 is a prior art which will not be described here.

[0022] The upper end of the base 1 is provided with a buffer mechanism, and the buffer mechanism is provided with a load seat 8. The buffer mechanism comprises four mounting grooves 12 respectively arranged at the upper end of the base 1 close to the front and rear sides. The four mounting grooves 12 are respectively arranged close to the four supporting rods 3. The bottom of each of the four mounting grooves 12 is fixedly provided with a hydraulic buffer 13. The upper end of each of the four hydraulic buffers 13 is fixedly connected with the lower end of the load seat 8. The upper end of each of the four hydraulic buffers 13 is fixedly connected with the upper end of the base 1. The bottom of the load groove 9 is fixedly connected with a rectangular annular pad 15. The hydraulic buffers 13 and the buffer air bags 14 made of polyurethane rubber material provide buffer protection for the load seat 8, and the rectangular annular pad 15 made of polyurethane rubber material provides buffer protection for the pressure bearing seat 10, so as to prevent the load seat 8 and the pressure bearing seat 10 from being damaged in the long-term hot pressing process. The lower end of the pressure bearing seat 10 is in abutting contact with the upper end of the rectangular annular pad 15. The left and right inner walls of the load groove 9 at the center position are both provided with limiting grooves 16. The left and right ends of the pressure bearing seat 10 at the center position are both embedded with ball bearings 17. The two ball bearings 17 are respectively inserted into the two limiting grooves 16 and abut against each other in rolling. The material of the buffer air bags 14 and the rectangular annular pad 15 is polyurethane rubber. The pressure bearing seat 10 is inserted into the load groove 9 on the load seat 8, so that the ball bearings 17 embedded at the two ends of the pressure bearing seat 10 are respectively inserted into the limiting grooves 16 on the inner side of the load groove 9, and the lower end of the pressure bearing seat 10 is in abutting contact with the rectangular annular pad 15 made of polyurethane rubber. The cooperation of the ball bearings 17 and the limiting grooves 16 enables the pressure bearing seat 10 to move smoothly along the load groove 9.

[0023] The upper end of the load seat 8 is provided with a load groove 9. The load groove 9 is slidably connected with a pressure bearing seat 10. The bottom of the load groove 9 at the center position is provided with a rectangular opening 11. The upper end of the base 1 at the center position is provided with a jacking assembly. The jacking assembly is arranged opposite to the rectangular opening 11. The jacking assembly comprises a groove 18 arranged at the upper end of the base 1 at the center position. The bottom of the groove 18 is fixedly provided with a gas cylinder 19. The upper end of the piston rod of the gas cylinder 19 is fixedly connected with a jacking block 20. The jacking block 20 is arranged opposite to the rectangular opening 11. After the jacking block 20 penetrates through the rectangular opening 11, the pressure bearing seat 10 is jacked out by the gas cylinder 19 in the groove 18, so as to facilitate the hot-pressed multi-layer circuit board body 2 in the load seat 8 to be quickly taken out.

[0024] The utility model discloses a support seat 10 is inserted in the load groove 9 on the load seat 8 in using, make the ball 17 inlayed in the limiting groove 16 of load groove 9 respectively in the both ends of support seat 10, and make the lower end of support seat 10 and the rectangular ring gasket 15 of polyurethane rubber material contact, place multilayer circuit board body 2 in load groove 9 and place in the upper end of support seat 10, start hydraulic cylinder 5 on support seat 4 and drive horizontal slide 6 under the limiting action of four support rods 3 vertically drop, until the hot-pressing mould 7 of horizontal slide 6 lower end inserts in load groove 9 and carries out hot-pressing treatment to multilayer circuit board body 2 on support seat 10, and by several hydraulic buffers 13 cooperate the buffer air bag 14 of polyurethane rubber material provides the buffer protection to load seat 8, and by the rectangular ring gasket 15 of polyurethane rubber material provides the buffer protection to support seat 10, prevent long-term hot-pressing process to cause load seat 8 and support seat 10 damage, prolong the service life of load seat 8 and support seat 10, when hot-pressing is completed, start the cylinder 19 in recess 18 and drive jacking block 20 after penetrating rectangular opening 11 hot-pressing multilayer circuit board body 2 in load seat 8 is taken out conveniently and fast.

[0025] The above is only the preferred specific implementation of the utility model, but the protection scope of the utility model does not limit to this, any skilled person in the art in the technical range disclosed by the utility model, according to the technical scheme and utility model concept of the utility model, carries out equivalent replacement or change, should cover in the protection scope of the utility model.

Claims

1. A high-precision multilayer circuit board manufacturing hot pressing device, comprising a base (1) and a multilayer circuit board body (2), a support rod (3) is fixedly connected to the upper end of each corner of the base (1), a same support seat (4) is arranged at the upper end of the four support rods (3), a hydraulic cylinder (5) is fixedly installed at the upper end of the center position of the support seat (4), a horizontal sliding seat (6) is slidingly connected between the four support rods (3), and a hot pressing die (7) is arranged at the lower end of the horizontal sliding seat (6), characterized in that, The upper end of the base (1) is provided with a buffer mechanism, the buffer mechanism is provided with a load seat (8), the upper end of the load seat (8) is provided with a load groove (9), the load groove (9) is slidably connected with a pressure bearing seat (10), the bottom of the center position of the load groove (9) is provided with a rectangular opening (11), the upper end of the center position of the base (1) is provided with a jacking assembly, and the jacking assembly is arranged opposite to the rectangular opening (11).

2. The hot press device for manufacturing a high-precision multilayer circuit board according to claim 1, wherein The material of the hot-pressing die (7) and the pressure bearing seat (10) is high-strength die steel.

3. The hot press device for manufacturing a high-precision multilayer circuit board according to claim 1, wherein The buffer mechanism comprises four mounting grooves (12) arranged on the base (1) near the upper ends of the front and rear sides, respectively, the four mounting grooves (12) are arranged near the four supporting rods (3), respectively, the bottoms of the four mounting grooves (12) are all fixedly provided with hydraulic buffers (13), the upper ends of the four hydraulic buffers (13) are all fixedly connected with the lower end of the load seat (8), the upper ends of the four hydraulic buffers (13) are all fixedly connected with the buffer air bags (14), and the upper ends of the four buffer air bags (14) are all fixedly connected with the upper end of the base (1).

4. The hot press device for manufacturing a high-precision multilayer circuit board according to claim 3, wherein The bottom of the load groove (9) is fixedly connected with a rectangular annular pad plate (15), the lower end of the pressure bearing seat (10) is in abutting contact with the upper end of the rectangular annular pad plate (15), the inner walls of the left and right sides of the center position of the load groove (9) are both provided with limiting grooves (16), the left and right ends of the center position of the pressure bearing seat (10) are both embedded with ball bearings (17), and the two ball bearings (17) are respectively inserted into the two limiting grooves (16) and abut against each other in rolling.

5. The hot press device for manufacturing a high-precision multilayer circuit board according to claim 4, wherein The materials of the buffer air bags (14) and the rectangular annular pad plate (15) are polyurethane rubber.

6. The hot press device for manufacturing a high-precision multilayer circuit board according to claim 1, wherein The jacking assembly comprises a groove (18) arranged on the upper end of the center position of the base (1), the bottom of the groove (18) is fixedly provided with a gas cylinder (19), the upper end of the piston rod of the gas cylinder (19) is fixedly connected with a jacking block (20), and the jacking block (20) is arranged opposite to the rectangular opening (11).

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