Photovoltaic silicon wafer anti-line-bow high-precision cutting device
By introducing an adjustment mechanism into the photovoltaic silicon wafer cutting device to adjust the distance between the auxiliary roller and the main roller, the bowing problem caused by the fixed roller was solved, achieving high-precision cutting and high yield.
Patent Information
- Application Number
- CN202422577648.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-09
- Publication Date
- 2025-12-02
- Estimated Expiration
- 2035-09-09
AI Technical Summary
Existing photovoltaic silicon wafer cutting equipment uses fixed positions and numbers of rollers when cutting silicon wafers of different specifications. This makes it impossible to adjust the support force of the rollers on the diamond wire, resulting in different degrees of wire bowing and limited applicability.
A high-precision cutting device for photovoltaic silicon wafers with anti-gluing features is designed. By setting an adjustment mechanism, including an adjustment frame and an adjustment motor, inside the cutting wire chamber, the height of the auxiliary roller and the spacing between the main rollers can be adjusted according to the size of the gluing formed by the diamond wire, ensuring that the diamond wire is effectively supported and avoiding wire skipping and large gluing.
It improves cutting accuracy, reduces jumper frequency, ensures cutting yield, expands the applicability of the device, and adapts to the cutting needs of silicon wafers of different specifications.
Smart Images
Figure CN223617979U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the technical field of high-precision cutting device for photovoltaic silicon wafer defense line bow, specifically relating to a high-precision cutting device for photovoltaic silicon wafer defense line bow. Background Technology
[0002] The photovoltaic silicon wafer cutting high-precision cutting device is an advanced piece of equipment used in silicon wafer processing in the photovoltaic industry. This device employs high-precision cutting technology, which improves production efficiency while ensuring cutting quality. Its design typically includes an automated control system to achieve precise cutting angles and depths, reducing material waste and ensuring the integrity and performance of the silicon wafers. Through this high-precision cutting device, the production process of photovoltaic silicon wafers becomes more efficient and stable, contributing to improved overall quality and market competitiveness of photovoltaic products.
[0003] In existing technologies, to address the issue of large wire bowing, two support rollers are placed between the two main rollers to support the suspended portion of the wire mesh, preventing wire skipping and further avoiding large wire bowing. However, in practical applications, the degree of wire bowing varies when cutting silicon wafers of different specifications. Since the position and number of support rollers are fixed, the support force of the support rollers on the diamond wire cannot be adjusted in different applications, resulting in poor applicability. Utility Model Content
[0004] The purpose of this invention is to provide a high-precision cutting device for photovoltaic silicon wafers to prevent wire bowing. This addresses the problem in the prior art mentioned in the background section, where two support rollers are placed between two main rollers to support the suspended portion of the wire mesh, preventing wire skipping and further avoiding large wire bowing. However, in practical applications, the degree of wire bowing varies when cutting silicon wafers of different specifications. Because the position and number of support rollers are fixed, the support force of the support rollers on the diamond wire cannot be adjusted in different applications, resulting in poor applicability.
[0005] To achieve the above objectives, this utility model provides the following technical solution: a high-precision cutting device for photovoltaic silicon wafer anti-bow, comprising a cutting wire chamber body, multiple mounting seats installed at the upper end of the cutting wire chamber body, an adjusting motor installed at the upper end of the mounting seats, a guide rail installed on the inner side of the cutting wire chamber body, an adjusting frame installed on the inner side of the guide rail, a roller seat provided on the inner side of the adjusting frame, a main roller frame installed at the lower position on the inner side of the cutting wire chamber body, a main roller seat provided at the upper end of the main roller frame, a main roller body provided on the inner side of the main roller seat, a diamond wire sleeved on the outer wall of the main roller body, a pre-tightening bolt provided at the upper end of the main roller seat, a slot provided on the inner wall of the main roller seat, and a rubber plug engaged inside the slot.
[0006] Preferably, a plurality of adjusting auxiliary rollers are arranged at intervals between the main roller body and another main roller body.
[0007] Preferably, the adjusting auxiliary roller is installed on the inner side of the adjusting frame, and the adjusting frame can move up and down along the guide rail.
[0008] Preferably, the adjusting frame is designed as an inverted U-shaped structure, and the adjusting auxiliary roller and the idler roller seat rotate at the inner position of the adjusting frame.
[0009] Preferably, when the diamond wire is wire-cut on the low-silicon wafer, the adjusting frame drives the adjusting auxiliary roller to move up and down to support the diamond wire according to the size of the wire bow formed by the diamond wire.
[0010] Preferably, the output end of the regulating motor is connected to an regulating screw, and the regulating screw is connected to a thread at the middle position of the upper end of the regulating frame.
[0011] Preferably, when the adjusting motor rotates, the adjusting frame can move up and down along the guide rail by means of a threaded mechanism between the adjusting screw and the adjusting frame.
[0012] Preferably, the pre-tightening bolt can be adapted to the pre-tightening screw hole provided on the positioning bottom wall, and the pre-tightening bolt compresses the rubber plug when the screw hole is drilled.
[0013] Compared with the prior art, this utility model provides a high-precision cutting device for photovoltaic silicon wafer anti-bow, which has the following beneficial effects:
[0014] 1. This device includes a wire cutting chamber body, within which a cutting space is formed. The cutting space is equipped with horizontally spaced main rollers for the diamond wire to pass over. Between the two main rollers are several spaced-apart adjusting rollers. The wire cutting chamber body contains an adjusting mechanism for mounting the adjusting rollers, allowing each adjusting roller to move vertically up and down. The adjusting mechanism includes an inverted U-shaped adjusting frame. At the bottom of both ends of the adjusting frame are roller supports that rotatably engage with the ends of the adjusting rollers. The two sides of the adjusting frame slide against guide rails located on the inner wall of the wire cutting chamber body, allowing each adjusting frame to independently move its corresponding adjusting roller up and down. During the wire cutting of the silicon wafer with diamond wire, according to... The size of the wire bow formed by the diamond wire is determined by adjusting the number of adjusting auxiliary rollers upwards. These rollers support the diamond wire, preventing skipping. Because the suspended portion of the diamond wire mesh is supported, the frequency of skipping is reduced, preventing the formation of large wire bows and improving cutting accuracy, thus ensuring a higher yield rate for subsequent cuts. In practical applications, to automatically adjust the height of each adjusting auxiliary roller, an adjusting motor is installed at the top of the cutting wire magazine. The output of the motor is connected to an adjusting screw, which engages with a threaded connection at the center of the upper part of the adjusting frame. Thus, when the adjusting motor rotates... The adjusting frame moves up and down along the guide rail using the threaded structure between the adjusting screw and the adjusting frame. A stepper motor can be used for the adjusting motor, controlled by a corresponding controller to precisely control the height of the adjusting auxiliary roller. Since the motor is mounted on the upper part of the wire cutting chamber body, a mounting base can be installed on the upper part of the wire cutting chamber body. As mentioned earlier, roller supports with rotatable engagement with the ends of the adjusting auxiliary roller are located at the bottom of both ends of the adjusting frame. To achieve this rotatable engagement, bearing structures for mounting the adjusting auxiliary roller are installed on the roller supports. In addition, main roller supports are located on the inner wall of the wire cutting chamber body corresponding to the two ends of the main roller, and these main roller supports also have bearing structures. In practical applications, when diamond wire cuts silicon wafers of different specifications, the two main rollers... The spacing between them varies, and excessive spacing can easily cause wire bowing. Therefore, this technical solution has a horizontally arranged main roller frame on the inner wall of the cutting wire compartment. The upper end of the main roller frame has several horizontally equidistant positioning grooves. The main roller seat can be inserted into each positioning groove. When the main roller seats at both ends of the main roller are inserted into the corresponding positioning groove, the spacing between the two main rollers increases or decreases accordingly, thereby adjusting the spacing between the two main rollers. In order to ensure that the main roller seat remains stable after being in a certain positioning groove, a pre-tightening bolt is provided at the upper end of the main roller seat. The pre-tightening bolt can be matched with the pre-tightening screw hole provided on the bottom wall of the positioning. With the fixation of the pre-tightening bolt, the main roller seat can be stably fixed when it is in each positioning groove.
[0015] 2. This device has a slot on the inner wall of the main roller seat. The slot engages with the rubber plug. When the pre-tightening bolt enters the threaded hole of the main roller seat, it compresses the rubber plug. At this time, the rubber plug is tightly attached to the outer wall of the pre-tightening bolt, which increases the firmness of the pre-tightening bolt. Attached Figure Description
[0016] Figure 1 This is a schematic diagram of the structure of a high-precision cutting device for photovoltaic silicon wafer anti-barrier.
[0017] Figure 2 This is a front view structural diagram of a high-precision cutting device for photovoltaic silicon wafer anti-barrier, according to the present invention.
[0018] Figure 3 This is a schematic cross-sectional view of the main roller seat of a high-precision cutting device for photovoltaic silicon wafer anti-bow.
[0019] In the diagram: 1. Cutting wire compartment body; 2. Main roller body; 3. Adjusting auxiliary roller; 4. Adjusting frame; 5. Idler roller seat; 6. Guide rail; 7. Adjusting motor; 8. Adjusting screw; 9. Mounting seat; 10. Main roller seat; 11. Main roller frame; 12. Pre-tightening bolt; 13. Diamond wire; 14. Rubber plug; 15. Slot. Detailed Implementation
[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.
[0021] The utility model provides, for example Figure 1-3 The high-precision cutting device for photovoltaic silicon wafers includes a cutting wire chamber body 1. Multiple mounting seats 9 are installed at the upper end of the cutting wire chamber body 1. An adjusting motor 7 is installed at the upper end of each mounting seat 9. A guide rail 6 is installed on the inner side of the cutting wire chamber body 1. An adjusting frame 4 is installed on the inner side of the guide rail 6. A roller seat 5 is located on the inner side of the adjusting frame 4. A main roller frame 11 is installed at the lower position on the inner side of the cutting wire chamber body 1. A main roller seat 10 is located at the upper end of the main roller frame 11. A main roller body 2 is located on the inner side of the main roller seat 10. A diamond wire 13 is sleeved on the outer wall of the main roller body 2. A pre-tightening bolt 12 is located at the upper end of the main roller seat 10. A slot 15 is located on the inner wall of the main roller seat 10. A rubber plug 14 is engaged inside the slot 15.
[0022] When the diamond wire 13 cuts silicon wafers of different specifications, the distance between the two main rollers is different. If the distance is too large, wire bowing is also likely to occur. Therefore, this technical solution provides a horizontally arranged main roller frame 11 on the inner side wall of the wire cutting chamber body 1. The upper end of the main roller frame 11 is provided with several horizontally equidistant positioning grooves. The main roller seat 10 can be inserted into each positioning groove. When the main roller seats 10 at both ends of the main roller are inserted into the corresponding positioning groove, the distance between the two main rollers increases or decreases accordingly, thereby adjusting the distance between the two main rollers. In order to ensure that the main roller seat 10 remains stable after being in a certain positioning groove, a pre-tightening bolt 12 is provided at the upper end of the main roller seat 10. The pre-tightening bolt 12 can be matched with the pre-tightening screw hole provided on the positioning bottom wall. With the fixation of the pre-tightening bolt 12, the main roller seat 10 can be stably fixed when it is in each positioning groove.
[0023] like Figure 1 and Figure 2 As shown, multiple adjusting auxiliary rollers 3 are arranged at intervals between the main roller body 2 and another main roller body 2. The adjusting auxiliary rollers 3 are installed on the inner side of the adjusting frame 4. The adjusting frame 4 can move up and down along the guide rail 6. The adjusting frame 4 is designed with an inverted U-shaped structure. The adjusting auxiliary rollers 3 and the support roller seat 5 cooperate to rotate on the inner side of the adjusting frame 4. When the diamond wire 13 is wire-cut on the low silicon wafer, the adjusting frame 4 drives the adjusting auxiliary rollers 3 to move up and down to support the diamond wire 13 according to the size of the wire bow formed by the diamond wire 13. The output end of the adjusting motor 7 is connected to the adjusting screw 8. The adjusting screw 8 is connected to the thread at the middle position of the upper end of the adjusting frame 4. When the adjusting motor 7 rotates, the thread mechanism between the adjusting screw 8 and the adjusting frame 4 allows the adjusting frame 4 to move up and down along the guide rail 6. The pre-tightening bolt 12 can be matched with the pre-tightening screw hole provided on the positioning bottom wall. When the pre-tightening bolt 12 is screwed, it compresses the rubber plug 14.
[0024] The adjustment mechanism includes an inverted U-shaped adjustment frame 4. At the bottom of both ends of the adjustment frame 4 are roller supports 5 that rotatably engage with the ends of the adjustment auxiliary rollers 3. The two sides of the adjustment frame 4 are slidably engaged with guide rails 6 located on the inner wall of the wire cutting chamber body 1. This allows each adjustment frame 4 to independently drive the corresponding adjustment auxiliary roller 3 to move up and down when moving up and down. When the diamond wire 13 performs wire cutting on the silicon wafer, the corresponding number of adjustment auxiliary rollers 3 are adjusted upwards according to the size of the wire bow formed by the diamond wire 13. This allows the adjustment auxiliary rollers 3 to support the diamond wire 13. Under the support and tension of the adjustment auxiliary rollers 3, the diamond wire 13 avoids skipping. Because the suspended portion of the diamond wire 13 mesh is supported, the frequency of skipping can be avoided or reduced, preventing the formation of large wire bows and thus avoiding their generation. Simultaneously, it can improve cutting accuracy and ensure the yield rate of subsequent cutting.
[0025] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A high-precision cutting device for photovoltaic silicon wafer anti-bow, characterized in that, The device includes a wire cutting chamber body (1), with multiple mounting seats (9) installed at the upper end of the wire cutting chamber body (1). An adjusting motor (7) is installed at the upper end of each mounting seat (9). A guide rail (6) is installed on the inner side of the wire cutting chamber body (1), and an adjusting frame (4) is installed on the inner side of the guide rail (6). A roller seat (5) is provided on the inner side of the adjusting frame (4). The inner side of the wire cutting chamber body (1) is equipped with a roller seat (5) at the lower position. There is a main roller frame (11), a main roller seat (10) is provided at the upper end of the main roller frame (11), a main roller body (2) is provided at the inner side of the main roller seat (10), a diamond wire (13) is sleeved on the outer wall of the main roller body (2), a pre-tightening bolt (12) is provided at the upper end of the main roller seat (10), a slot (15) is provided at the inner wall of the main roller seat (10), and a rubber plug (14) is engaged inside the slot (15).
2. The high-precision cutting device for photovoltaic silicon wafer anti-bow as described in claim 1, characterized in that: Multiple adjusting auxiliary rollers (3) are arranged at intervals between the main roller body (2) and another main roller body (2).
3. The photovoltaic silicon wafer anti-bow high-precision cutting device according to claim 2, characterized in that: The adjusting auxiliary roller (3) is installed on the inner side of the adjusting frame (4), and the adjusting frame (4) can move up and down along the guide rail (6).
4. The high-precision cutting device for photovoltaic silicon wafer anti-bow as described in claim 3, characterized in that: The adjustment frame (4) is designed with an inverted U-shaped structure. The adjustment auxiliary roller (3) and the roller seat (5) are located on the inner side of the adjustment frame (4) and rotate.
5. The high-precision cutting device for photovoltaic silicon wafer anti-bow as described in claim 1, characterized in that: When the diamond wire (13) is wire-cut on a low-silicon wafer, the adjusting frame (4) drives the adjusting auxiliary roller (3) to move up and down to support the diamond wire (13) according to the size of the wire bow formed by the diamond wire (13).
6. The high-precision cutting device for photovoltaic silicon wafer anti-bow as described in claim 1, characterized in that: The output end of the regulating motor (7) is connected to an regulating screw (8), which is connected to the thread at the middle position of the upper end of the regulating frame (4).
7. The high-precision cutting device for photovoltaic silicon wafer anti-bow as described in claim 6, characterized in that: When the regulating motor (7) rotates, the threaded mechanism between the regulating screw (8) and the regulating frame (4) allows the regulating frame (4) to move up and down along the guide rail (6).
8. The high-precision cutting device for photovoltaic silicon wafer anti-bow as described in claim 1, characterized in that: The pre-tightening bolt (12) can be adapted to the pre-tightening screw hole provided on the positioning bottom wall, and the pre-tightening bolt (12) squeezes the rubber plug (14) when the screw hole is made.