Bearing disc for semiconductor wafer storage

Abstract

The utility model discloses a bearing plate for semiconductor wafer storage, which relates to the field of semiconductor wafers and comprises a placing plate, a circular hole is formed in the middle of the placing plate, a threaded cover is mounted in the circular hole, a cushion is mounted at the upper end of the placing plate, and limiting grooves are formed in the left end and the right end of the placing plate. A protective cover is installed at the upper end of the containing disc, movable grooves are formed in the left end and the right end of the protective cover, sliding ways are formed in the left end and the right end of the protective cover, a clamping groove is formed in one end of each sliding way, and a buckle is installed at one end of the protective cover. Through the arrangement of the placing disc, the soft cushion, the limiting groove, the protective cover and the buckle, the placing disc attached with the soft cushion in the device can be used for placing the stored semiconductor wafers, and meanwhile, the protective cover installed in the device is fixed with the placing disc through the buckle, so that the semiconductor wafers can be better protected when being stored; and the storage safety is kept, and the carrying is convenient.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor wafers, specifically to a carrier disk for semiconductor wafer storage. Background Technology

[0002] A wafer refers to a silicon chip used in the fabrication of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer. Wafers are the carriers used in the production of integrated circuits. Generally speaking, wafers often refer to single-crystal silicon wafers. Single-crystal silicon wafers are made by drawing and refining ordinary silicon sand, and then dissolving, purifying, and distilling them to produce single-crystal silicon rods. After polishing and slicing, the single-crystal silicon rods become wafers. When storing semiconductor wafers, a carrier disk is required for storage. Therefore, a carrier disk for storing semiconductor wafers is needed.

[0003] An existing semiconductor wafer storage carrier disk cannot maintain the security of storing semiconductor wafers during operation, and it is inconvenient to carry the stored semiconductor wafers and it is not easy to retrieve the stored semiconductor wafers. Therefore, there is an urgent need for a semiconductor wafer storage carrier disk. Utility Model Content

[0004] Based on this, the purpose of this utility model is to provide a carrier disk for semiconductor wafer storage, so as to solve the problems that existing carrier disks for semiconductor wafer storage cannot maintain the security of storage when storing semiconductor wafers, are inconvenient to carry the stored semiconductor wafers, and cannot easily retrieve the stored semiconductor wafers.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a carrier disk for semiconductor wafer storage, comprising a placement disk, a circular hole in the center of the placement disk, a threaded cap installed inside the circular hole, a soft pad installed on the upper end of the placement disk, limit grooves on both the left and right ends of the placement disk, a protective cover installed on the upper end of the placement disk, movable grooves on both the left and right ends of the protective cover, slides on both the left and right ends of the protective cover, a locking groove at one end of the slide, and a buckle installed at one end of the protective cover.

[0006] Preferably, the threaded cap is threadedly connected to the placement tray, and the placement tray has an open design.

[0007] Preferably, the placement tray is in close contact with the soft pad, and the soft pad is distributed in a ring array with respect to the placement tray.

[0008] Preferably, the protective cover is engaged with the placement tray, and the inner wall size of the protective cover is the same as the outer wall size of the placement tray.

[0009] Preferably, the buckle forms a sliding structure with the protective cover via a slide rail, and the buckle is engaged with the protective cover via a slot.

[0010] Compared with the prior art, the beneficial effects of this utility model are:

[0011] 1. This utility model, through the setting of a placement tray, soft pad, limiting groove, protective cover and buckle, allows the placement tray with soft pad attached to the device to place the stored semiconductor wafers. At the same time, the protective cover installed in the device is fixed to the placement tray by the buckle, which can better protect the semiconductor wafers during storage, maintain the storage safety, and facilitate portability.

[0012] 2. This utility model features a placement plate, a round hole, and a threaded cover. The threaded cover installed in the device can be unscrewed and opened to be taken out from the round hole. After the protective cover is opened, the stored semiconductor wafer can be taken out from the round hole, which facilitates the removal of the semiconductor wafer. Attached Figure Description

[0013] Figure 1 This is a front view structural diagram of the present utility model;

[0014] Figure 2 This is a frontal sectional view of the structure of this utility model;

[0015] Figure 3 This is a schematic diagram of the structure of the tray of this utility model;

[0016] Figure 4 This is a schematic diagram of the structure of the parts for placing the disc and the threaded cap of this utility model.

[0017] In the diagram: 1. Placement tray; 2. Round hole; 3. Threaded cap; 4. Soft pad; 5. Limiting groove; 6. Protective cover; 7. Movable groove; 8. Slide rail; 9. Card slot; 10. Buckle. Detailed Implementation

[0018] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0019] The embodiments of this utility model will be described below based on its overall structure.

[0020] Please see Figure 1-4A semiconductor wafer storage carrier disk includes a placement disk 1 with a circular hole 2 in the center. A threaded cap 3 is installed inside the circular hole 2 and is threadedly connected to the placement disk 1. The placement disk 1 has an open-hole design. After the threaded cap 3 is unscrewed and opened, the semiconductor wafer stored in the placement disk 1 can be easily removed. A soft pad 4 is installed on the upper end of the placement disk 1, and the placement disk 1 and the soft pad 4 are in close contact. The soft pad 4 is arranged in a ring array around the placement disk 1. The soft pad 4 in the device can cushion the stored semiconductor wafer and keep it in place. To ensure safety, the placement tray 1 has limit grooves 5 on both the left and right ends, and a protective cover 6 is installed on the top of the placement tray 1. The protective cover 6 has movable grooves 7 on both the left and right ends, and slide rails 8 on both the left and right ends. A slot 9 is provided at one end of the slide rail, and a buckle 10 is installed at one end of the protective cover 6. The buckle 10 forms a sliding structure with the protective cover 6 through the slide rail 8, and the buckle 10 is engaged with the protective cover 6 through the slot 9. The protective cover 6 installed in the device can work with the buckle 10 to fix the stored semiconductor wafers, thereby improving the stability of the semiconductor wafer storage.

[0021] Working principle: In use, the semiconductor wafer to be stored can be placed on the placement tray 1. After placing the semiconductor wafer, the threaded cap 3 can be screwed into the round hole 2. After screwing, the movable groove 7 of the protective cover 6 is aligned with the limiting grooves 5 opened at both ends of the placement tray 1. After alignment, the buckle 10 in the device passes through the sliding track 8 on the protective cover 6 from the inside of the limiting groove 5 and the movable groove 7. After passing through, it is fixed to one end of the protective cover 6. After fixing, the semiconductor wafer stored in the placement tray 1 can be fixed. Finally, when it is necessary to take out the semiconductor wafer, the threaded cap 3 can be screwed off by the device, the protective cover 6 can be opened, and the semiconductor wafer can be lifted out through the round hole 2 opened at the lower end of the placement tray 1. This completes the use of the device. The contents not described in detail in this specification are existing technologies known to those skilled in the art.

[0022] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A carrier disk for semiconductor wafer storage, comprising a placement disk (1), characterized in that: The placement tray (1) has a round hole (2) in the middle, and a threaded cap (3) is installed inside the round hole (2). A soft pad (4) is installed on the upper end of the placement tray (1). Limiting grooves (5) are opened on both the left and right ends of the placement tray (1). A protective cover (6) is installed on the upper end of the placement tray (1). Movable grooves (7) are opened on both the left and right ends of the protective cover (6). Slides (8) are opened on both the left and right ends of the protective cover (6). A slot (9) is opened at one end of the slide (8). A buckle (10) is installed at one end of the protective cover (6).

2. The semiconductor wafer storage carrier disk according to claim 1, characterized in that: The threaded cap (3) is threadedly connected to the placement plate (1), and the placement plate (1) is designed with an opening.

3. The semiconductor wafer storage carrier disk according to claim 1, characterized in that: The placement tray (1) is in close contact with the soft pad (4), and the soft pad (4) is arranged in a ring array with respect to the placement tray (1).

4. The semiconductor wafer storage carrier disk according to claim 1, characterized in that: The protective cover (6) is engaged with the placement tray (1), and the inner wall size of the protective cover (6) is the same as the outer wall size of the placement tray (1).

5. A semiconductor wafer storage carrier disk according to claim 1, characterized in that: The buckle (10) forms a sliding structure with the protective cover (6) through the slide (8), and the buckle (10) is engaged with the protective cover (6) through the slot (9).

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