Circuit board testing device
By employing a stacked floating connection structure of fixed and movable plates in the circuit board testing device, the problem of circuit board damage caused by top plate position deviation is solved, achieving accurate docking between electrical test components and circuit boards and reducing the risk of circuit board damage.
Patent Information
- Application Number
- CN202422787485.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-14
- Publication Date
- 2025-12-02
- Estimated Expiration
- 2034-11-14
AI Technical Summary
In existing technologies, deviations in the top plate position during circuit board testing can cause misalignment between the ejector pins and the circuit board, resulting in a high risk of the circuit board being damaged.
Design a circuit board testing device that employs a stacked and floatingly connected fixed plate and movable plate structure. The electrical test components on the movable plate can move in a plane perpendicular to the stacking direction to correct positional deviations and ensure that the electrical test components are aligned with the circuit board.
By correcting positional deviations, the risk of circuit boards being damaged during testing is reduced, thus improving the accuracy and reliability of the tests.
Smart Images

Figure CN223624261U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of circuit board testing technology, and in particular to a circuit board testing device. Background Technology
[0002] After the circuit board is designed, it needs to be tested before it can be put into production. During the testing process, the circuit board to be tested is placed on a base, and then a top plate with ejector pins is driven to move toward the circuit board to be tested, so that the ejector pins make contact with the corresponding electrical connection points of the circuit board to be tested and conduct electricity.
[0003] In the prior art, as the test proceeds, the top plate is continuously raised and lowered, causing a positional deviation in its planar direction. The pins on the top plate are no longer aligned with the corresponding positions of the circuit board under test, resulting in the circuit board under test being damaged. Utility Model Content
[0004] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes a circuit board testing device that can correct positional deviations of electrical test components during testing, reducing the risk of the circuit board under test being damaged.
[0005] This utility model provides a circuit board testing device, which includes a base and a pressure testing mechanism. The base is used to support the circuit board to be tested. The pressure testing mechanism includes a stacked fixed plate and a movable plate, which are floatingly connected in a plane perpendicular to the stacking direction. The movable plate is located on the side of the fixed plate facing the base, and an electrical test piece is provided on the movable plate. The fixed plate is used to drive the movable plate to move towards the base so that the electrical test piece makes electrical contact with the circuit board to be tested.
[0006] The circuit board testing device provided by this utility model has at least the following beneficial effects:
[0007] By setting up a fixed plate and a movable plate that are stacked and floatingly connected, the movable plate can move relative to the fixed plate in a plane perpendicular to the stacking direction to correct the positional deviation that occurs during the test. The electrical test pieces on the movable plate can be aligned with the corresponding positions of the circuit board under test for testing, reducing the risk of the circuit board under test being damaged by impact.
[0008] In one embodiment of this implementation, the pressure testing mechanism includes a connecting component, the fixed plate has a first connecting hole, the movable plate has a second connecting hole, and the connecting component passes through the first connecting hole and the second connecting hole; the connecting component has a spaced distance from the inner wall of the first connecting hole, and / or the connecting component has a spaced distance from the inner wall of the second connecting hole.
[0009] In one embodiment of this implementation, the connecting component includes a connector and a mating member. The mating member is disposed in the second connecting hole, and the connector is disposed in the first connecting hole, with one end extending into the second connecting hole and connected to the mating member. The mating member has a spaced distance from the inner wall of the second connecting hole.
[0010] In one embodiment of this implementation, the connector abuts against the top side of the fixed plate, and the mating member is opposite to or abuts against the bottom side of the movable plate to limit the relative position of the fixed plate and the movable plate in the stacking direction.
[0011] In one embodiment of this implementation, the pressure testing mechanism includes a pressure plate and an elastic element. The pressure plate is located on the side of the movable plate facing away from the fixed plate and is connected to the movable plate through the elastic element. When the fixed plate drives the movable plate to move toward the base, the pressure plate can abut against the circuit board to be tested and compress the elastic element.
[0012] In one embodiment of this implementation, the pressure testing mechanism includes a mounting component, the fixed plate has a third connecting hole, the movable plate has a fourth connecting hole, one end of the mounting component is located in the third connecting hole and has a spaced distance from the inner wall of the third connecting hole, and the other end of the mounting component passes through the fourth connecting hole and is connected to the pressure plate.
[0013] In one embodiment of this implementation, the mounting component is slidably engaged with the fourth connecting hole.
[0014] In one embodiment of this implementation, the pressure plate has a through hole, and at least a portion of the electrical test piece extends into the through hole.
[0015] In one embodiment of this implementation, the pressure testing mechanism includes a guide post disposed on the movable plate, and the base has a guide hole, with the guide post slidingly engaging with the guide hole.
[0016] In one embodiment of this implementation, the fixed plate has a through hole, and one end of the electrical test piece passes through the through hole and protrudes from the surface of the fixed plate opposite to the movable plate.
[0017] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description
[0018] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:
[0019] Figure 1 This is a three-dimensional structural schematic diagram of a circuit board testing device according to one embodiment of the present invention;
[0020] Figure 2 yes Figure 1 A three-dimensional structural diagram of part of the pressure testing mechanism of the circuit board testing device;
[0021] Figure 3 yes Figure 2 A cross-sectional view of part of the pressure testing mechanism along the direction passing through the connecting components;
[0022] Figure 4 yes Figure 3 A magnified structural diagram of region A;
[0023] Figure 5 yes Figure 2 A cross-sectional view of part of the pressure testing mechanism along the direction passing through the mounting component;
[0024] Figure 6 yes Figure 5 A magnified structural diagram of region B.
[0025] Figure label:
[0026] Base 10; Guide hole 101; Pressure testing mechanism 20; Fixing plate 21; First connecting hole 211; Third connecting hole 212; Through hole 213; Movable plate 22; Electrical test piece 221; Second connecting hole 222; Fourth connecting hole 223; Mounting plate 23; Connecting assembly 24; Connector 241; Mating piece 242; Pressure plate 25; Elastic block 251; Through hole 252; Mounting piece 26; Guide post 27. Detailed Implementation
[0027] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.
[0028] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0029] In the description of this utility model, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.
[0030] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.
[0031] In the description of this utility model, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0032] Please see Figure 1 and Figure 2 , Figure 1 This is a three-dimensional structural schematic diagram of a circuit board testing device according to one embodiment of the present invention; Figure 2 yes Figure 1 A three-dimensional structural diagram of the pressure testing mechanism 20 of a circuit board testing device. This utility model provides a circuit board testing device, which includes a base 10 and a pressure testing mechanism 20. The base 10 is used to support the circuit board to be tested. The pressure testing mechanism 20 includes a stacked fixed plate 21 and a movable plate 22. The movable plate 22 and the fixed plate 21 are floatingly connected in a plane perpendicular to the stacking direction. The movable plate 22 is located on the side of the fixed plate 21 facing the base 10. The movable plate 22 is provided with an electrical test piece 221. The fixed plate 21 is used to drive the movable plate 22 towards the base 10 so that the electrical test piece 221 makes electrical contact with the circuit board to be tested.
[0033] Specifically, the tests performed on the circuit board to be tested can include open circuit testing, short circuit testing, resistance testing, capacitance testing, diode testing, transistor testing, field-effect transistor testing, IC pin testing, etc.
[0034] Specifically, the pressure testing mechanism 20 includes a driving component (not shown) and a mounting plate 23. A fixed plate 21 is fixedly connected to the mounting plate 23, and the driving component is connected to the mounting plate 23, which can drive the mounting plate 23 to move the fixed plate 21 and the movable plate 22 toward or away from the base 10. In this embodiment, the pressure testing mechanism 20 is disposed above the base 10. The driving component drives the mounting plate 23 to move in a vertical direction. The stacking direction of the fixed plate 21 and the movable plate 22 is vertical. The plane perpendicular to the stacking direction is a horizontal plane, and the direction perpendicular to the stacking direction is a horizontal direction.
[0035] Specifically, the electrical test piece 221 is a pin that can make electrical contact with pin sleeves, solder joints, etc. on the circuit board under test to achieve conductivity. The electrical test piece 221 is fixedly connected to the movable plate 22, meaning that the electrical test piece 221 and the movable plate 22 can move synchronously.
[0036] By setting up a fixed plate 21 and a movable plate 22 that are stacked and floatingly connected, the movable plate 22 can move relative to the fixed plate 21 in a plane perpendicular to the stacking direction to correct the positional deviation generated during the test. The electrical test piece 221 on the movable plate 22 can be aligned with the corresponding position of the circuit board under test for testing, reducing the risk of the circuit board under test being damaged.
[0037] In one embodiment of this implementation, please refer to Figure 3 and Figure 4 , Figure 3 yes Figure 2 A cross-sectional view of part of the pressure testing mechanism 20 along the direction passing through the connecting component 24; Figure 4 yes Figure 3 An enlarged structural diagram of region A is shown. The pressure testing mechanism 20 includes a connecting component 24. The fixed plate 21 has a first connecting hole 211, and the movable plate 22 has a second connecting hole 222. The connecting component 24 passes through the first connecting hole 211 and the second connecting hole 222. The connecting component 24 is spaced apart from the inner wall of the first connecting hole 211, and / or, the connecting component 24 is spaced apart from the inner wall of the second connecting hole 222. This arrangement provides suitable movement space between the movable plate 22 and the fixed plate 21 to facilitate the correction of positional deviations.
[0038] In this embodiment, the connecting component 24 is fitted against the inner wall of the first connecting hole 211, and the connecting component 24 is spaced apart from the inner wall of the second connecting hole 222. In some other embodiments, the connecting component 24 may also be spaced apart from the inner wall of the first connecting hole 211, and fitted against the inner wall of the second connecting hole 222. In some other embodiments, the connecting component 24 may also be spaced apart from the inner wall of the first connecting hole 211, and spaced apart from the inner wall of the second connecting hole 222.
[0039] In one embodiment of this implementation, please refer to Figure 3 and Figure 4 The connecting assembly 24 includes a connector 241 and a mating member 242. The mating member 242 is located in the second connecting hole 222, and the connector 241 is located in the first connecting hole 211, with one end extending into the second connecting hole 222 and connecting to the mating member 242. The mating member 242 and the inner wall of the second connecting hole 222 are spaced apart. This arrangement simplifies the assembly of the fixed plate 21 and the movable plate 22, thus reducing costs.
[0040] In one embodiment of this implementation, please refer to Figure 3 and Figure 4 The connecting piece 241 abuts against the top side of the fixed plate 21, and the mating piece 242 is opposite to or abuts against the bottom side of the movable plate 22 to limit the relative position of the fixed plate 21 and the movable plate 22 in the stacking direction. This arrangement allows the fixed plate 21 to drive the movable plate 22 to move to complete the test.
[0041] In this embodiment, the connector 241 is a screw, and the mating part 242 is a nut. The head of the screw abuts against the surface of the fixed plate 21 facing away from the movable plate 22. The screw shank passes through the first connecting hole 211 and extends into the second connecting hole 222 to be threadedly connected to the nut. The bottom of the nut has a boss, and the bottom of the second connecting hole 222 has a corresponding annular groove. The boss is located in the annular groove and has a gap between it and the inner wall of the annular groove. With this configuration, the fixed plate 21 and the movable plate 22 can be installed using the connector 241 and the mating part 242, while providing space for the movable plate 22 to move relative to the fixed plate 21.
[0042] In one embodiment of this implementation, please refer to Figure 1 and Figure 5 , Figure 5 yes Figure 2 The diagram shows a cross-sectional view of the pressure testing mechanism 20 along the direction passing through the mounting member 26. The pressure testing mechanism 20 includes a pressure plate 25 and an elastic element (not shown). The pressure plate 25 is located on the side of the movable plate 22 facing away from the fixed plate 21 and is connected to the movable plate 22 via the elastic element. When the fixed plate 21 moves the movable plate 22 toward the base 10, the pressure plate 25 abuts against the circuit board to be tested and compresses the elastic element. Specifically, the elastic element can be a spring, leaf spring, or other elastic device. The pressure plate 25 has multiple elastic blocks 251, which abut against the circuit board to be tested. The positions of the multiple elastic blocks 251 are adjustable to avoid components on the circuit board. This configuration allows the circuit board to be pressed firmly by the pressure plate 25 and the elastic element for testing. Simultaneously, the presence of the elastic element reduces the risk of the pressure plate 25 damaging the circuit board.
[0043] In one embodiment of this implementation, please refer to Figure 1 and Figure 5 The pressure plate 25 has a through hole 252, into which at least a portion of the electrical test piece 221 extends. During testing, as the fixed plate 21 is pressed down, the pressure plate 25 abuts against the circuit board under test and compresses the elastic element. The distance between the pressure plate 25 and the movable plate 22 decreases, allowing the electrical test piece 221 to extend out of the through hole 252 and make electrical contact with the circuit board under test, thus completing the test. The through hole 252 on the pressure plate 25 facilitates smooth electrical contact between the electrical test piece 221 on the movable plate 22 and the circuit board under test.
[0044] In one embodiment of this implementation, please refer to Figure 1 and Figure 5 The fixed plate 21 has a through hole 213, and one end of the electrical test piece 221 passes through the through hole 213 and protrudes from the surface of the fixed plate 21 away from the movable plate 22. This arrangement facilitates the connection of the electrical test piece 221 to devices such as cables.
[0045] In one embodiment of this implementation, please refer to Figure 1 , Figure 5 and Figure 6 , Figure 6 yes Figure 5 An enlarged structural diagram of region B is shown. The pressure testing mechanism 20 includes a mounting member 26, which connects the fixed plate 21 and the pressure plate 25. The mounting member 26 and the fixed plate 21 are spaced apart in a plane perpendicular to the stacking direction. Specifically, the fixed plate 21 has a third connecting hole 212, and the movable plate 22 has a fourth connecting hole 223. One end of the mounting member 26 is located in the third connecting hole 212 and is spaced apart from the inner wall of the third connecting hole 212. The other end of the mounting member 26 passes through the fourth connecting hole 223 and connects to the pressure plate 25. This configuration allows for the installation of the fixed plate 21 and the pressure plate 25 via the mounting member 26, while also providing space for the pressure plate 25 to move relative to the fixed plate 21 in a plane perpendicular to the stacking direction.
[0046] In this embodiment, the elastic element is a spring, which is sleeved on the outer periphery of the mounting member 26, and the two ends of the spring abut against the movable plate 22 and the pressure plate 25 respectively.
[0047] In one embodiment of this implementation, please refer to Figure 1 , Figure 5 and Figure 6The mounting component 26 slides into the fourth connecting hole 223. This arrangement allows the pressure plate 25 to move relative to the movable plate 22. During the downward pressing of the movable plate 22 driven by the fixed plate 21, the pressure plate 25 can elastically press the circuit board to be tested, while also facilitating the extension of the electrical test component 221 through the through hole 252 of the pressure plate 25. Specifically, the inner walls of the mounting component 26 and the fourth connecting hole 223 are fitted together to restrict the relative position of the pressure plate 25 and the movable plate 22 on a plane perpendicular to the stacking direction.
[0048] In this embodiment, there are multiple connecting components 24 and mounting components 26, thereby improving the stability of the installation of the fixed plate 21, the movable plate 22 and the pressure plate 25.
[0049] In one embodiment of this implementation, please refer to Figure 1 The pressure testing mechanism 20 includes guide posts 27, which are disposed on the movable plate 22. The base 10 has guide holes 101, and the guide posts 27 are slidably engaged with the guide holes 101. Specifically, there are multiple guide posts 27 and guide holes 101, with each guide post 27 slidably engaged with a corresponding guide hole 101. In this embodiment, the inner walls of the guide posts 27 and guide holes 101 have gaps to provide space for movement between the fixed plate 21 and the movable plate 22.
[0050] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention. Furthermore, the embodiments of the present invention and the features thereof can be combined with each other unless otherwise specified.
Claims
1. A circuit board testing device, characterized in that, include: A base platform is used to support the circuit board to be tested. The pressure testing mechanism includes a stacked fixed plate and a movable plate, the movable plate and the fixed plate being floatingly connected in a plane perpendicular to the stacking direction, the movable plate being located on the side of the fixed plate facing the base, the movable plate being provided with an electrical test piece, and the fixed plate being used to drive the movable plate to move toward the base so that the electrical test piece makes electrical contact with the circuit board to be tested.
2. The circuit board testing device according to claim 1, characterized in that, The pressure testing mechanism includes a connecting component. The fixed plate has a first connecting hole, and the movable plate has a second connecting hole. The connecting component passes through the first connecting hole and the second connecting hole. The connecting component has a gap distance from the inner wall of the first connecting hole, and / or the connecting component has a gap distance from the inner wall of the second connecting hole.
3. The circuit board testing device according to claim 2, characterized in that, The connecting assembly includes a connector and a mating member. The mating member is disposed in the second connecting hole, and the connector is disposed in the first connecting hole, with one end extending into the second connecting hole and connecting to the mating member. The mating member has a spaced distance from the inner wall of the second connecting hole.
4. The circuit board testing apparatus according to claim 3, characterized in that, The connector abuts against the top side of the fixed plate, and the mating member is opposite to or abuts against the bottom side of the movable plate to limit the relative position of the fixed plate and the movable plate in the stacking direction.
5. The circuit board testing apparatus according to claim 1, characterized in that, The pressure testing mechanism includes a pressure plate and an elastic element. The pressure plate is located on the side of the movable plate facing away from the fixed plate and is connected to the movable plate through the elastic element. When the fixed plate drives the movable plate to move toward the base, the pressure plate can abut against the circuit board to be tested and compress the elastic element.
6. The circuit board testing apparatus according to claim 5, characterized in that, The pressure testing mechanism includes a mounting component. The fixed plate has a third connecting hole, and the movable plate has a fourth connecting hole. One end of the mounting component is located in the third connecting hole and has a gap distance from the inner wall of the third connecting hole. The other end of the mounting component passes through the fourth connecting hole and is connected to the pressure plate.
7. The circuit board testing apparatus according to claim 6, characterized in that, The mounting component slides into the fourth connecting hole.
8. The circuit board testing apparatus according to claim 5, characterized in that, The pressure plate has a through hole, and at least a portion of the electrical test piece extends into the through hole.
9. The circuit board testing apparatus according to claim 5, characterized in that, The pressure testing mechanism includes a guide post, which is disposed on the movable plate. The base has a guide hole, and the guide post slides in conjunction with the guide hole.
10. The circuit board testing apparatus according to claim 1, characterized in that, The fixed plate has a through hole, and one end of the electrical test piece passes through the through hole and protrudes from the surface of the fixed plate opposite to the movable plate.