Vacuum suction crimping structure for automatic test of semiconductor device

Abstract

The utility model provides a vacuum suction crimping structure for automatic testing of a semiconductor device, which belongs to the technical field of testing of the semiconductor device and comprises a clamp body, a center hole is arranged in the middle of the clamp body, and a vacuum suction pipe for vacuum suction of a cap surface of the semiconductor device is arranged in the center hole. The clamp body is also provided with two groups of elastic crimping assemblies used for crimping the pins of the semiconductor device, and the two groups of elastic crimping assemblies are arranged in an axial symmetry manner by taking the central hole as the center. According to the utility model, the suction of the semiconductor device is facilitated, the reliability of vacuum suction is ensured, and the phenomenon that the semiconductor device falls off in the transportation process after suction is avoided; the elastic crimping has adjustment and adaptability, and can adapt to crimping of semiconductor devices of different models, so that the overall universality of the structure is improved, and the use cost can also be reduced; and the elastic crimping has a buffer effect, so that the damage to the pins during pressing can be avoided.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor device testing technology, specifically relating to a vacuum suction and pressing structure for automatic testing of semiconductor devices with side-extended leads. Background Technology

[0002] Semiconductor devices are electronic devices whose conductivity lies between that of a good conductor and an insulator. They utilize the unique electrical properties of semiconductor materials to perform specific functions, such as generating, controlling, receiving, converting, and amplifying signals, and performing energy conversion. With the rapid development of microwave communication technology, microwave semiconductor devices have been widely used in systems such as air defense and anti-missile systems, due to their excellent performance, small size, light weight, and low power consumption.

[0003] With the development of 5G technology, the market demand for semiconductor devices is increasing. The production speed of semiconductor devices has become a key focus for major manufacturers, and increasing the number of equipment is their primary choice. A large number of bonding machines, placement machines, and sorting machines have entered the market, solving most production problems. Currently, sorting machines for GaN RF power devices and special-packaged semiconductor devices with side-extended leads are still in their infancy, and the technology is relatively immature. The testing structures typically have the following drawbacks:

[0004] (1) During transportation, the test equipment pick-up tip has poor adaptability and matching ability with the product: GaN RF power devices are relatively large in size and weight, and the product has pins on the side and is often irregular in shape, which is not easy to pick up. They often fall off during transportation and require manual intervention, which affects the continuity of testing and the utilization rate of the equipment is low.

[0005] (2) During the crimping process, there is a risk that the crimping head of the test equipment may not be tightly crimped with the product: During the test, the product needs to be in close contact with the test fixture to ensure good grounding and power supply. Therefore, high requirements are placed on the test crimping. Due to the protruding pins on the side of the product and the fact that the pins are not at the same height as the product cap, and the fact that the pressure of the crimping head is not adjustable, it is easy to cause poor crimping and abnormal power supply during the test, which can burn out the product and the test board, resulting in huge losses.

[0006] (3) In the semiconductor device finished product testing stage, the finished products need to be picked up, transported, tested and pressed on the sorting machine equipment. Due to the large differences in the appearance of the finished products (the volume of the finished product itself, the number of pins, the shape of the pins, the position of the pins, etc.), and the different requirements for pressing pressure, picking method and test base plate, the cost of equipping each model with a dedicated test structure is high, the model switching time is long, and the versatility is poor. Utility Model Content

[0007] This utility model provides a vacuum pick-up and press-fit structure for automatic testing of semiconductor devices, aiming to solve the problems of inconvenience in picking up and pressing of special packaged semiconductor devices with side-extended leads during automatic testing and transportation, as well as the problems of loose pressing and poor versatility during the pressing process.

[0008] To achieve the above objectives, the technical solution adopted by this utility model is as follows: a vacuum suction and pressing structure for automatic testing of semiconductor devices is provided, comprising: a clamp body, wherein a central hole is provided in the middle of the clamp body, a vacuum suction tube for vacuum suction of the cap surface of a semiconductor device is provided in the central hole, and an elastic pressing assembly for pressing the pins of the semiconductor device is also provided on the clamp body, wherein there are two sets of elastic pressing assemblies, which are arranged symmetrically about the central hole.

[0009] In one possible implementation, the clamp is provided with a mounting hole corresponding to the elastic pressing assembly. The elastic pressing assembly includes a pin pressure head and a first spring. The first spring is located inside the mounting hole and connected between the bottom of the mounting hole and the pin pressure head. The upper part of the pin pressure head is located inside the mounting hole and slides in cooperation with the mounting hole.

[0010] In one possible implementation, the mounting hole is a through hole extending vertically, with a pressing adjustment screw screwed to the upper end of the mounting hole, and the upper end of the first spring abutting against the lower end of the pressing adjustment screw.

[0011] In one possible implementation, the lower end of the mounting hole is provided with a tightening hole with a reduced diameter, and the tightening hole and the mounting hole form a limiting step; the pin pressure head has a support portion and a pressure head, the support portion of the pin pressure head is limited on the limiting step, and the pressure head of the pin pressure head extends downward and is exposed outside the tightening hole.

[0012] In one possible implementation, the mounting hole is a circular hole; the support portion of the pin pressure head is a disk adapted to the circular hole, and the pressure head of the pin pressure head is a cuboid.

[0013] In one possible implementation, a suction adjustment screw is provided at the upper end of the central hole, and a second spring is provided between the suction adjustment screw and the vacuum nozzle at the lower end of the vacuum suction tube. The suction adjustment screw has a through hole through which the vacuum suction tube passes. When the vacuum nozzle is pressed against the cap surface of the semiconductor device, the second spring is compressed, and the vacuum nozzle retracts into the central hole. The lower surface of the vacuum nozzle is flush with the lower surface of the clamping body.

[0014] In one possible implementation, a guide tube is provided inside the central hole, and a limiting shoulder is provided radially on the guide tube. A radially extending support boss is provided inside the central hole, and the limiting shoulder of the guide tube is supported on the upper surface of the support boss. The vacuum suction tube passes through the hollow hole of the guide tube, and a conical cavity adapted to the vacuum nozzle is provided at the lower end of the guide tube. The vacuum nozzle is partially inside the conical cavity and partially exposed outside the conical cavity.

[0015] In one possible implementation, the central hole is a circular hole; the guide tube is a cylinder that slides within the circular hole.

[0016] The vacuum suction and pressing structure for automatic testing of semiconductor devices provided by this utility model has the following advantages compared with the prior art:

[0017] (1) A vacuum suction tube is set at the center of the clamping body to contact the cap surface of the semiconductor device. The outer edge of the vacuum suction tube is completely located on the upwardly protruding cap surface of the semiconductor device. The vacuum suction tube will not form a gap with the pin of the semiconductor device. This can ensure the effective adsorption area of ​​the vacuum suction tube, thereby ensuring the strength of vacuum adsorption, the strength and reliability of vacuum suction. It not only facilitates the adsorption of semiconductor devices, but also ensures the reliability of vacuum suction and avoids the phenomenon of semiconductor devices falling off during transportation after adsorption.

[0018] (2) During the crimping process, since the upper surface of the semiconductor device pins is not coplanar with the upper surface of the cap, the cap and pins are crimped separately. As the clamping body is pressed down continuously, the vacuum suction tube contacts the cap, and the pin pressure head elastically contacts and presses the pins. Finally, the semiconductor cap and pin positions are reliably in contact with the test board, thus ensuring the stability of the test and avoiding the loss caused by improper crimping during the test, which could lead to abnormal power-on and burn out the product and test board.

[0019] (3) The elastic crimping has the ability to adjust and adapt to different types of semiconductor devices, thereby improving the overall versatility of the structure and reducing the cost of use; while the elastic crimping has the buffering effect, it can also avoid damage to the pins when pressing down. Attached Figure Description

[0020] Figure 1 A schematic diagram of the vacuum suction and pressing structure for automatic testing of semiconductor devices provided in this embodiment of the present utility model (original state before suction, with each spring naturally extended).

[0021] Figure 2 A schematic diagram of the suction state structure of the vacuum suction and pressing structure for automatic testing of semiconductor devices provided in this embodiment of the utility model;

[0022] Figure 3 This is a schematic diagram of the press-fit test state structure of the vacuum suction press-fit structure for automatic testing of semiconductor devices provided in this embodiment of the utility model;

[0023] Figure 4 This is a schematic diagram of the front view structure of the semiconductor device under test provided in an embodiment of the present invention;

[0024] Figure 5 A top view of the semiconductor device under test provided in an embodiment of this utility model;

[0025] Figure 6 This is a schematic diagram of the main structure of the test board provided in an embodiment of the present utility model;

[0026] Explanation of reference numerals in the attached figures:

[0027] 10. Semiconductor device; 101. Pin; 102. Cap; 103. Shell; 20. Test board; 30. Clamp body; 301. Support boss; 302. Press-fit adjustment screw; 303. Second spring; 304. Vacuum suction tube; 305. Pick-up adjustment screw; 306. First spring; 307. Pin pressure head; 308. Limiting step; 309. Vacuum nozzle; 310. Guide tube. Detailed Implementation

[0028] To make the technical problems, technical solutions, and beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0029] Please refer to the following: Figures 1 to 6 The present invention provides a vacuum suction and pressing structure for automatic testing of semiconductor devices. The vacuum suction and pressing structure for automatic testing of semiconductor devices includes: a clamping body 30, a central hole in the middle of the clamping body 30, a vacuum suction tube 304 for vacuum suction of the cap surface 102 of the semiconductor device 10 within the central hole, and two sets of elastic pressing components for pressing the leads 101 of the semiconductor device 10 on the clamping body 30, arranged symmetrically about the central hole.

[0030] The vacuum suction and pressing structure for automatic testing of semiconductor devices 10 provided by this utility model has the following advantages compared with the prior art:

[0031] (1) A vacuum suction tube 304 is provided at the center of the clamping body 30 to contact the cap surface 102 of the semiconductor device 10. The outer edge of the vacuum suction tube 304 is completely located on the upwardly protruding cap surface 102 of the semiconductor device 10. The vacuum suction tube 304 will not form a gap-to-gap situation with the pins 101 of the semiconductor device 10. This can ensure the effective adsorption area of ​​the vacuum suction tube 304, thereby ensuring the strength of vacuum adsorption, the strength and reliability of vacuum suction. It not only facilitates the adsorption of the semiconductor device 10, but also ensures the reliability of vacuum suction, and avoids the phenomenon of the semiconductor device 10 falling off during transportation after adsorption.

[0032] (2) During the crimping process, since the upper surface of the pin 101 of the semiconductor device 10 is not coplanar with the upper surface of the cap 102, the cap 102 and the pin 101 are crimped separately. As the clamp 30 is pressed down, the vacuum tube 304 contacts the cap 102, and the pin press head 307 elastically contacts the pin 101 and elastically presses the pin 101. Finally, the cap 102 and the pin 101 of the semiconductor device are reliably in contact with the test board 20, thereby ensuring the stability of the test and avoiding the loss caused by the abnormal power-on and burning of the product and the test board 20 due to the crimping not being solid during the test.

[0033] (3) The elastic pressing has the ability to adjust and adapt to different types of semiconductor devices 10, thereby improving the overall versatility of the structure and reducing the cost of use; while the elastic pressing has the buffering effect, it can also avoid damage to the pins 101 when pressing down.

[0034] It should be explained that the special packaged semiconductor device 10 referred to in this application is a semiconductor device 10 with side-extended leads 101, such as GaN RF power devices. GaN power amplifier products are relatively large in size and weight, and have leads 101 on the side, often with irregular shapes, making them inconvenient for conventional handling and transportation. However, the cap surface 102 of the product is flat, and the larger the product is, the larger the cap surface 102 is. The specification of this application uses the example of the cap surface 102 and the leads 101 of the semiconductor device 10 not being coplanar to explain and illustrate this. However, since the elastic pressing component and the vacuum nozzle 309 of the vacuum suction tube 304 both have a certain degree of elasticity for extension and retraction, this application is also applicable to semiconductor devices 10 with the cap surface 102 and the leads 101 being coplanar.

[0035] Understandably, since the pins 101 of the semiconductor device 10 are distributed differently, for example, some semiconductor devices 10 have pins 101 symmetrically arranged, and some semiconductor devices 10 have pins 101 around all four sides. Therefore, for semiconductor devices 10 with pins 101 leading out around all four sides, the corresponding pin pressure heads 307 are also symmetrically arranged in two pairs with the center hole as the center.

[0036] The sorting machine is used in the testing stage after chip packaging and is a downstream testing device that provides chip screening and classification functions. The structure provided in this application is applied to the sorting machine and is responsible for transporting the input chips to the test module for stress testing according to the pick-and-place transportation method designed by the system. In this step, the sorting machine sorts the circuits based on the test results.

[0037] In some embodiments, see Figures 1 to 3 The clamp body 30 is provided with a mounting hole corresponding to the elastic pressing component. The elastic pressing component includes a pin pressing head 307 and a first spring 306. The first spring 306 is located in the mounting hole and is connected between the bottom of the mounting hole and the pin pressing head 307. The upper part of the pin pressing head 307 is located in the mounting hole and slides in cooperation with the mounting hole.

[0038] During crimping, since the cap 102 and pin 101 of the tested semiconductor device 10 are not on the same plane, the cap 102 and pin 101 are crimped separately. As the structure is continuously pressed down, the vacuum nozzle 309 begins to retract into the central hole until the lower surface of the vacuum nozzle 309 is flush with the lower surface of the clamping body 30. At the same time, the pin pressing head 307 begins to contact the pin 101. Finally, the lower surface of the clamping body 30 is in close contact with the cap 102, and the pin pressing head 307 is in close contact with the pin 101, completing the crimping. Since different models of semiconductor devices 10 have different pressure requirements for the pin 101, the pressure of the spring can be adjusted by adjusting the clamping force of the first spring 306 on the pin pressing head 307, thereby achieving the universality of this application. Moreover, since the heights of the cap 102 and pin 101 of different models of semiconductor devices 10 are different, they can also be pressed by the self-adaptation of the first spring 306 and the second spring 303, thereby also achieving the universality of this application.

[0039] In some embodiments, see Figures 1 to 3 The mounting hole is a through hole extending vertically. A pressing adjustment screw 302 is screwed to the upper end of the mounting hole, and the upper end of the first spring 306 abuts against the lower end of the pressing adjustment screw 302. This application utilizes the pressing adjustment screw 302 to adjust the pressure, ensuring proper grounding and power application, thus avoiding problems such as improper pressing and abnormal power application during testing, which could burn out the product and test board 20.

[0040] When it is necessary to adjust the pressure for different models of semiconductor devices 10, simply rotate the adjusting screw 302 clockwise or counterclockwise, which is simple and convenient.

[0041] The pressure regulation in this application uses a combination of a set screw and a spring to adjust the pressure of the pin pressure head 307. In other embodiments, it can also be replaced with a currently mature pressure regulation module.

[0042] In some embodiments, see Figures 1 to 3 The lower end of the mounting hole is provided with a tightening hole with a reduced diameter, forming a limiting step 308 between the tightening hole and the mounting hole. The pin pressure head 307 has a support part and a pressure head. The support part of the pin pressure head 307 is limited on the limiting step 308, and the pressure head of the pin pressure head 307 extends downward and protrudes outside the tightening hole. The tightening hole with a smaller diameter at the lower end of the mounting hole can axially limit the pin pressure head 307 and prevent the pin pressure head 307 from coming out of the mounting hole.

[0043] In some embodiments, see Figures 1 to 3 The mounting hole is a circular hole; the support part of the pin pressure head 307 is a disc adapted to the circular hole, and the crimping head of the pin pressure head 307 is a cuboid. The bottom of the pin pressure head 307 is the crimping plane for crimping the pin 101, ensuring that the pin pressure head 307 is horizontally pressed onto the pin 101, ensuring that each pin 101 fully contacts the test board 20, thereby ensuring the accuracy of the test results.

[0044] In some embodiments, see Figures 1 to 3 A suction adjustment screw 305 is provided at the upper end of the central hole. A second spring 303 is provided between the suction adjustment screw 305 and the vacuum nozzle 309 at the lower end of the vacuum suction tube 304. A through hole is provided on the suction adjustment screw 305 through which the vacuum suction tube 304 passes. When the vacuum nozzle 309 is pressed against the cap surface 102 of the semiconductor device 10, the second spring 303 is compressed, and the vacuum nozzle 309 retracts into the central hole. The lower surface of the vacuum nozzle 309 is flush with the lower surface of the clamp body 30.

[0045] When picking up and transporting products, the vacuum nozzle 309 is slightly longer and retractable to ensure that it does not interfere with the protruding pins 101 of the semiconductor device 10 during the picking process. When pressing, the vacuum nozzle 309 elastically retracts but can still maintain close contact with the cap surface 102 to keep adsorbed. After pressing is completed, as the structure is lifted, the vacuum nozzle 309 extends under the reset of the second spring 303 and returns to its original length, keeping only contact with the cap surface 102 and not being interfered with by other positions, thereby realizing the transport of the semiconductor device 10.

[0046] Similarly, the set screw and spring here can also be replaced with a currently mature pressure adjustment module.

[0047] In some embodiments, see Figures 1 to 3A guide tube 310 is provided in the center hole, and a limiting shoulder is provided radially in the guide tube 310. A support boss 301 is provided radially in the center hole, and the limiting shoulder of the guide tube 310 is supported on the upper surface of the support boss 301. A vacuum suction tube 304 passes through the hollow hole of the guide tube 310. A conical cavity adapted to a vacuum nozzle 309 is provided at the lower end of the guide tube 310. Part of the vacuum nozzle 309 is inside the conical cavity, and part of it is exposed outside the conical cavity. When pressed onto the semiconductor device 10, the vacuum nozzle 309 first contacts the cap surface 102 and continues to be pressed into the conical cavity. As the clamp body 30 is pressed down, the guide tube 310 contacts the cap surface 102 and compresses the second spring 303. The guide tube 310 retracts into the central hole until the lower surface of the clamp body 30 contacts the cap surface 102. When the clamp body 30 is raised, the second spring 303 resets, ejects the vacuum nozzle 309 outward, and continues to pick up the semiconductor device 10. At this time, the pin pressure heads 307 around the vacuum nozzle 309 do not interfere with the semiconductor device 10, thus enabling the transport of the semiconductor device 10.

[0048] In some embodiments, the central hole is a circular hole; the guide tube 310 is a cylinder that slides within the circular hole.

[0049] The specific actions involved in the testing process using this application are as follows:

[0050] (1) No suction action. At this time, the first spring 306 is not compressed, and the vacuum suction tube 304 has no suction action. See Figure 1 .

[0051] (2) Figure 2 During the suction and transportation process, the vacuum nozzle 309 is in close contact with the product cap 102, and the vacuum tube 304 draws in air to form a closed vacuum cavity above the cap 102, which tightly adsorbs the product. At this time, the first spring 306 is not compressed, and the pin pressure head 307 is not in contact with the product.

[0052] (3) See Figure 3 During crimping, the vacuum nozzle 309 picks up the product, contacts the test plate 20, and gradually retracts into the center hole of the clamp body 30. The pin pressure head 307 contacts the product pin 101, and the first spring 306 deforms. Finally, the product pin 101 is in close contact with the test plate 20, and the product cap 102 is pressed so that the product shell 103 is in close contact with the metal gasket in the groove of the test plate 20. At this time, the vacuum tube 304 continues to suck air to maintain the adsorption of the product. The first spring 306 is compressed to provide the pressure required for crimping the pin 101. The clamp body 30 directly contacts the product cap 102 to provide the pressure required for the shell 103.

[0053] (4) When taking it away, as the pin pressure head 307 is continuously lifted, the first spring 306 returns to its original length, the second spring 303 returns to its original length, and the vacuum nozzle 309 extends. At this time, the pin pressure head 307 separates from the product pin 101, the lower surface of the clamp body 30 separates from the product cap surface 102, and the vacuum nozzle 309 is in close contact with the product cap surface 102 for transportation.

[0054] This application solves the transportation problem of products entering and leaving the test board 20 and the crimping problem during the testing process, and realizes highly adaptable, adjustable and efficient testing of semiconductor device 10 products where the pins 101 and the cap surface 102 are not coplanar.

[0055] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail or recorded in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0056] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A vacuum pick-and-place structure for automatic testing of semiconductor devices, characterized in that, include: The clamp body (30) has a central hole in the middle, and a vacuum suction tube (304) for vacuum suction of the cap surface (102) of the semiconductor device (10) is provided in the central hole. The clamp body (30) is also provided with an elastic pressing assembly for pressing the pins (101) of the semiconductor device (10). There are two sets of elastic pressing assemblies, which are arranged symmetrically about the central hole.

2. The vacuum suction and pressing structure for automatic testing of semiconductor devices as described in claim 1, characterized in that, The clamping body (30) is provided with a mounting hole corresponding to the elastic pressing component. The elastic pressing component includes a pin pressing head (307) and a first spring (306). The first spring (306) is located in the mounting hole and is connected between the bottom of the mounting hole and the pin pressing head (307). The upper part of the pin pressing head (307) is located in the mounting hole and slides with the mounting hole.

3. The vacuum suction and pressing structure for automatic testing of semiconductor devices as described in claim 2, characterized in that, The mounting hole is a through hole that extends vertically. A pressing adjustment screw (302) is screwed to the upper end of the mounting hole, and the upper end of the first spring (306) abuts against the lower end of the pressing adjustment screw (302).

4. The vacuum suction and pressing structure for automatic testing of semiconductor devices as described in claim 3, characterized in that, The lower end of the mounting hole is provided with a tightening hole with a reduced diameter, and the tightening hole and the mounting hole form a limiting step (308); the pin pressure head (307) has a support part and a pressure head, the support part of the pin pressure head (307) is limited on the limiting step (308), and the pressure head of the pin pressure head (307) extends downward and is exposed outside the tightening hole.

5. The vacuum suction and pressing structure for automatic testing of semiconductor devices as described in claim 4, characterized in that, The mounting hole is a circular hole; the support part of the pin pressure head (307) is a disk adapted to the circular hole, and the pressure head of the pin pressure head (307) is a cuboid.

6. The vacuum suction and pressing structure for automatic testing of semiconductor devices as described in claim 1, characterized in that, A suction adjustment screw (305) is provided at the upper end of the central hole. A second spring (303) is provided between the suction adjustment screw (305) and the vacuum nozzle (309) at the lower end of the vacuum tube (304). A through hole is provided on the suction adjustment screw (305) through which the vacuum tube (304) passes. When the vacuum nozzle (309) is pressed against the cap surface (102) of the semiconductor device (10), the second spring (303) is compressed, and the vacuum nozzle (309) retracts into the central hole. The lower surface of the vacuum nozzle (309) is flush with the lower surface of the clamping body (30).

7. The vacuum suction and pressing structure for automatic testing of semiconductor devices as described in claim 6, characterized in that, A guide tube (310) is provided inside the central hole. A limiting shoulder is provided radially on the guide tube (310). A radially extending support boss (301) is provided inside the central hole. The limiting shoulder of the guide tube (310) is supported on the upper surface of the support boss (301). The vacuum suction tube (304) passes through the hollow hole of the guide tube (310). A conical cavity adapted to the vacuum nozzle (309) is provided at the lower end of the guide tube (310). Part of the vacuum nozzle (309) is inside the conical cavity and part is exposed outside the conical cavity.

8. The vacuum suction and pressing structure for automatic testing of semiconductor devices as described in claim 7, characterized in that, The central hole is a circular hole; the guide tube (310) is a cylinder that slides within the circular hole.

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