Terminal and electronic assembly structure

Abstract

The utility model discloses a terminal and an electronic assembly structure. The electronic assembly structure comprises a circuit board and at least one terminal. The circuit board includes a top surface and a bottom surface opposite to each other. The at least one terminal is arranged on the circuit board, wherein the at least one terminal comprises a platform, a first pin and a second pin. The platform is arranged above the top surface of the circuit board. The first pin is connected with one end of the platform and extends downwards from the platform to penetrate through the top surface and the bottom surface of the circuit board. The second pin is connected with the other end of the platform, extends downwards from the platform to the top surface of the circuit board, and comprises an attaching part which extends along the top surface of the circuit board and is attached to the top surface of the circuit board.

Description

Technical Field

[0001] This case relates to a terminal structure, particularly a terminal for inputting or outputting high voltage and its applicable electronic assembly structure, which facilitates the mounting of electronic components on the circuit board by bending a single pin without penetrating the circuit board. Background Technology

[0002] Electronic devices typically have multiple terminals on their internal circuit boards for power input and output. Power cables are routed from outside the device to these terminals and then electrically connected to the circuit board. Therefore, the terminals used for high-voltage input and output must provide sufficient structural strength when located on the circuit board.

[0003] Traditionally, terminals used for high-voltage input or output are fixed by having pins pass through the circuit board, occupying wiring area on the top and bottom surfaces. If other electronic components need to be placed on the circuit board, safety distances must be considered, preventing them from being too close to the terminals. Furthermore, for heat-sensitive electronic devices, the distance between them and the terminals must be considered, making optimized wiring design difficult.

[0004] In view of this, it is necessary to provide a terminal for input or output high voltage and a suitable electronic assembly structure thereof, which facilitates the mounting of electronic components on the circuit board by bending a single pin without penetrating the circuit board, and solves the deficiencies of known technologies. Utility Model Content

[0005] The purpose of this invention is to provide a terminal for inputting or outputting high voltage and a suitable electronic assembly structure thereof, which facilitates the mounting of electronic components on the circuit board by bending a single pin without penetrating the circuit board.

[0006] Another objective of this invention is to provide a terminal for inputting or outputting high voltage and its applicable electronic assembly structure. For two pins extending downwards from both ends of the terminal platform, one pin is fixed through the circuit board, while the other pin is bent and attached to the top surface of the circuit board without penetrating it. This provides sufficient space on the bottom surface of the circuit board relative to the bent pin for mounting specific electronic components, such as positive temperature coefficient (PTC) or negative temperature coefficient (NTC) thermistors for terminal temperature sensing, thus optimizing the application setup. The attachment portion of the bent pin can be fixed by pads on the top surface of the circuit board. Combined with the fixing and support of the through pin, this provides sufficient structural support for the platform, facilitating the locking seat on the platform to secure the high-voltage power line for high-voltage power transmission to the terminal. The bent pin forming the attachment portion can extend from its bottom end toward the other pin or from its bottom end away from the other pin. Furthermore, mounting electronic components on the bottom surface of the circuit board relative to the bent pin also provides sufficient safety clearance between the two pins of the terminal. Furthermore, since the bent leads do not penetrate the circuit board, when the circuit board is a multilayer board, the intermediate conductive layer at the location of the bent leads can also be used to transmit signals at different potentials. Therefore, the electronic assembly structure in this case, with multiple terminals arranged on the circuit board architecture, not only transmits high-voltage power through the terminals but also facilitates optimized configuration of electronic components in conjunction with the circuit board, making it highly applicable to industrial applications.

[0007] To achieve the aforementioned objectives, this invention provides a terminal configuration disposed on a circuit board. The terminal includes a platform, a first pin, and a second pin. The platform is configured to be disposed above the top surface of the circuit board. The first pin is connected to one end of the platform and extends downward from the platform through the top and bottom surfaces of the circuit board. The second pin is connected to the other end of the platform, extends downward from the platform to the top surface of the circuit board, and includes a bonding portion extending along the top surface of the circuit board and bonding to the top surface of the circuit board.

[0008] In one embodiment, the platform includes a locking seat configured to lock a high-voltage power line.

[0009] In one embodiment, the bonding portion extends from the bottom of the second pin toward the first pin.

[0010] In one embodiment, the bonding portion extends from the bottom of the second pin in a direction away from the first pin.

[0011] In one embodiment, the bonding portion is connected to a solder pad, which is disposed on the top surface of the circuit board.

[0012] In one embodiment, the first pin includes a first through portion, a second through portion, and a support portion. The first through portion and the second through portion are located on both sides of the support portion, and the support portion abuts against the top surface of the circuit board. The first through portion and the second through portion penetrate the top and bottom surfaces of the circuit board through two holes in the circuit board, respectively.

[0013] In one embodiment, the first pin includes at least one first through portion and a support portion, the at least one first through portion and the support portion are connected to each other, the support portion abuts against the top surface of the circuit board, and the at least one first through portion penetrates the top and bottom surfaces of the circuit board through at least one hole in the circuit board.

[0014] To achieve the aforementioned objectives, this application also provides an electronic assembly structure including a circuit board and at least one terminal. The circuit board includes a top surface and a bottom surface opposite to each other. At least one terminal is disposed on the circuit board, wherein the at least one terminal includes a platform, a first pin, and a second pin. The platform is disposed above the top surface of the circuit board. The first pin is connected to one end of the platform and extends downward from the platform through the top and bottom surfaces of the circuit board. The second pin is connected to the other end of the platform, extends downward from the platform to the top surface of the circuit board, and includes a bonding portion extending along the top surface of the circuit board and bonding to the top surface of the circuit board.

[0015] In one embodiment, the platform includes a locking base configured to lock a high-voltage power line for the terminal to transmit high-voltage power.

[0016] In one embodiment, the bonding portion extends from the bottom of the second pin toward the first pin.

[0017] In one embodiment, the bonding portion extends from the bottom of the second pin in a direction away from the first pin.

[0018] In one embodiment, the electronic assembly structure includes an electronic component disposed on the bottom surface of a circuit board, spatially relative to the second pin.

[0019] In one embodiment, the electronic component is a positive temperature coefficient thermistor or a negative temperature coefficient thermistor.

[0020] In one embodiment, the circuit board includes pads disposed on the top surface, and the bonding portion of the terminal is bonded to the pads.

[0021] In one embodiment, the circuit board includes an intermediate conductive layer disposed between the top surface and the bottom surface, and the mating portions of the intermediate conductive layer corresponding to the terminals have different voltage values.

[0022] In one embodiment, the circuit board includes two holes arranged and extending spatially relative to the connection between the platform and the first pin. The first pin includes a first through portion, a second through portion, and a support portion. The first through portion and the second through portion are located on both sides of the support portion. The support portion abuts against the top surface of the circuit board and is located between the two holes. The first through portion and the second through portion penetrate the top and bottom surfaces of the circuit board through the two holes, respectively.

[0023] In one embodiment, the circuit board includes at least one hole extending spatially relative to the connection between the platform and the first pin, wherein the first pin includes at least one first through portion and a support portion, the at least one first through portion and the support portion are interconnected, the support portion abuts against the top surface of the circuit board, and the at least one first through portion penetrates the top and bottom surfaces of the circuit board through the at least one hole. Attached Figure Description

[0024] The following detailed description of the case and the schematic diagrams of the embodiments are intended to enable those skilled in the art to better understand the above content, and are not intended to limit the case.

[0025] Figure 1 The diagram shows a perspective view of the electronic assembly structure of the first embodiment of this invention from above.

[0026] Figure 2 A perspective view of the electronic assembly structure of the first embodiment of this case is shown from below.

[0027] Figure 3 An exploded view of the electronic assembly structure of the first embodiment of this case is shown.

[0028] Figure 4 A side view of the electronic assembly structure of the first embodiment of this case is shown.

[0029] Figure 5 The diagram shows a perspective view of the electronic assembly structure of the second embodiment of this invention from above.

[0030] Figure 6 A perspective view of the electronic assembly structure of the second embodiment of this case is shown from below.

[0031] Figure 7 An exploded view of the electronic assembly structure of the second embodiment of this case is shown.

[0032] Figure 8 A side view of the electronic assembly structure of the second embodiment of this case is shown.

[0033] Figure 9 A perspective view of the electronic assembly structure of the third embodiment of this case is shown from below.

[0034] Figure 10An exploded view of the electronic assembly structure of the third embodiment of this case is shown.

[0035] Figure 11 A side view of the electronic assembly structure of the fourth embodiment of this case is shown.

[0036] Figure 12 A perspective view of the electronic assembly structure of the fifth embodiment of this case is shown from above.

[0037] Figure 13 A perspective view of the electronic assembly structure of the fifth embodiment of this case is shown from below.

[0038] Figure 14 A side view of the electronic assembly structure of the fifth embodiment of this case is shown.

[0039] Explanation of reference numerals in the attached figures

[0040] 1, 1a, 1a', 1b, 1c: Electronic assembly structure,

[0041] 2, 2a, 2a', 2b: Terminals

[0042] 10, 10a: Circuit board,

[0043] 11: Top surface

[0044] 12: Bottom surface,

[0045] 13a, 13b: Holes,

[0046] 13c: solder pads,

[0047] 14: solder pads

[0048] 15a: First intermediate conductive layer

[0049] 15b: Second intermediate conductive layer

[0050] 20: Platform

[0051] 200: Locking seat,

[0052] 21: First pin

[0053] 211: First penetrating section

[0054] 212: Second penetrating section

[0055] 213: Support section

[0056] 22, 22a: Second pin,

[0057] 221, 222: Fitting parts

[0058] 3: Electronic components,

[0059] D, D1, D2: Interval distance

[0060] G: Interval distance

[0061] S: Interval distance

[0062] X, Y, Z: Axes. Detailed Implementation

[0063] Some typical embodiments embodying the features and advantages of this invention will be described in detail in the following description. It should be understood that this invention can have various variations in different forms, all of which do not depart from the scope of this invention, and the descriptions and drawings herein are for illustrative purposes only and not for limiting the invention. For example, if the following description of a first feature being disposed on or above a second feature indicates that it includes embodiments where the first and second features are in direct contact, as well as embodiments where additional features may be disposed between the first and second features, so that the first and second features may not be in direct contact. Furthermore, different embodiments in this disclosure may use repeated reference numerals and / or markings. These repetitions are for simplification and clarity and are not intended to limit the relationships between the various embodiments and / or the described appearance structures. Moreover, to facilitate the description of the relationship between one component or feature and another (or multiple) component or feature in the drawings, spatially related terms such as "upper," "lower," "top," "bottom," and similar terms may be used. In addition to the orientations illustrated in the accompanying drawings, spatially relevant terms are used to cover different orientations of the device in use or operation. The device may also be otherwise positioned (e.g., rotated 90 degrees or located in other orientations), and the descriptions of the spatially relevant terms used will be interpreted accordingly. Furthermore, when a component is referred to as "connected to" or "coupled to" another component, it may be directly connected to or coupled to the other component, or there may be intervening components. Although the numerical ranges and parameters of the broad scope of this disclosure are approximate, values ​​are stated as precisely as possible in specific examples. Additionally, it is understood that while terms such as "first," "second," etc., may be used in the claims to describe different components, these components should not be limited by these terms, and the components described accordingly in the embodiments are represented by different component symbols. These terms are used to distinguish different components. For example, a first component may be referred to as a second component, and similarly, a second component may be referred to as a first component without departing from the scope of the embodiments. The term "and / or" as thus used includes any or all combinations of one or more of the related listed items.

[0064] Figure 1 The diagram shows a perspective view of the electronic assembly structure of the first embodiment of this invention from above. Figure 2A perspective view of the electronic assembly structure of the first embodiment of this case is shown from below. Figure 3 An exploded view of the electronic assembly structure of the first embodiment of this case is shown. Figure 4 A side view of the electronic assembly structure according to the first embodiment of this case is shown. (See reference...) Figures 1 to 4 In this embodiment, a terminal 2 for inputting or outputting high voltage and an applicable electronic assembly structure 1 are provided. The electronic assembly structure 1 includes a circuit board 10 and at least one terminal 2. The circuit board 10 includes a top surface 11 and a bottom surface 12 opposite to each other. At least one terminal 2 is disposed on the circuit board 10. In this embodiment, the terminal 2 includes a platform 20, a first pin 21, and a second pin 22. The platform 20 is disposed above the top surface 11 of the circuit board 10, approximately parallel to the XY plane, and is spaced apart from the top surface 11 of the circuit board 10 by the first pin 21 and the second pin 22. In this embodiment, the first pin 21 is connected to one end of the platform 20 and extends downward from the platform 20 (along the reverse Z-axis direction) through the top surface 11 and the bottom surface 12 of the circuit board 10. The second pin 22 is connected to the other end of the platform 20 and extends downward from the platform 20 (along the reverse Z-axis direction) to the top surface 11 of the circuit board 10, but does not penetrate the circuit board 10. The second pin 22 also includes a bonding portion 221 that extends along the top surface 11 of the circuit board 10 and bonds to the top surface 11 of the circuit board 10.

[0065] In this embodiment, the platform 20 of terminal 2 includes a locking base 200, for example, having a screw hole, configured to lock a high-voltage power line (not shown) for terminal 2 to transmit high-voltage power, such as DC power, solar panel, battery input power, or grid, load, or refrigerator output power. Of course, this embodiment is not limited to this. In this embodiment, the electronic assembly structure 1 also includes an electronic component 3, wherein the electronic component 3 is disposed on the bottom surface 12 of the circuit board 10, spatially opposite the contact portion 221 of the second pin 22. In one embodiment, the electronic component 3 is, for example, a positive temperature coefficient thermistor or a negative temperature coefficient thermistor. Since terminal 2 may generate heat and experience temperature changes when used for inputting or outputting high voltage, temperature sensing via the electronic component 3 below the contact portion 221 provides optimal performance.

[0066] In this embodiment, the circuit board 10 includes two holes 13a and 13b and a pad 14. The two holes 13a are arranged and extend spatially relative to the connection between the platform 20 and the first pin 21, for example, arranged and extended along the Y-axis. In addition, in this embodiment, the first pin 21 also includes a first through-hole 211, a second through-hole 212, and a support portion 213. The first through-hole 211 and the second through-hole 212 are located on both sides of the support portion 213. When the terminal 2 is disposed on the circuit board 10, the support portion 213 abuts against the top surface 11 of the circuit board 10 and is located between the two holes 13a and 13b, and the first through-hole 211 and the second through-hole 212 penetrate the top surface 11 and the bottom surface 12 of the circuit board 10 through the two holes 13a and 13b, respectively. The two holes 13a and 13b are preferably elongated holes, but are not limited thereto. In this embodiment, the bonding portion 221 of the second pin 22 can be bonded to and fixed to the pad 14 by soldering. Thus, after the first pin 21 and the second pin 22 are fixed to the circuit board 10, sufficient structural support can be provided for the platform 20, which is beneficial for the locking seat 200 on the platform 20 to lock the high-voltage power line so that the terminal 2 can transmit high-voltage power. Of course, this embodiment is not limited to this.

[0067] It should be noted that, in this embodiment, the bonding portion 221 extends from the bottom end of the second pin 22 in a direction away from the first pin 21 (i.e., in the opposite X-axis direction), that is, it bends outward. On the top surface 11 of the circuit board 10, the gap distance D formed by the bonding portion 221 and the first pin 21 is equal to the horizontal length L of the platform 20 in the X-axis direction. Since the bonding portion 221 is fixed to the top surface 11 of the circuit board 10 by the solder pad 14. In addition, the electronic component 3 disposed on the bottom surface 12 of the circuit board 10 is isolated from the second pin 22 of the terminal 2 by the insulating layer of the circuit board 10. In other words, it is also beneficial for the electronic component 3 to maintain a safety distance relative to the first pin 21 and the second pin 22 of the terminal 2 by disposing of the electronic component 3 on the bottom surface 12 of the circuit board 10 directly below the bonding portion 221. Of course, this invention is not limited to this.

[0068] Figure 5 The diagram shows a perspective view of the electronic assembly structure of the second embodiment of this invention from above. Figure 6 A perspective view of the electronic assembly structure of the second embodiment of this case is shown from below. Figure 7 An exploded view of the electronic assembly structure of the second embodiment of this case is shown. Figure 8 A side view of the electronic assembly structure according to the second embodiment of this invention is shown. In this embodiment, the structures of the electronic assembly structure 1a and the terminal 2a are substantially similar to those of... Figures 1 to 4 The electronic assembly structure 1 and terminal 2 shown are labeled with the same component numbers to represent the same components, structures, and functions, and will not be described again here. Reference Figures 5 to 8In this embodiment, the bonding portion 222 extends from the bottom end of the second pin 22a toward the first pin 21 (i.e., the X-axis direction), that is, it bends inward. Since the bonding portion 222 is fixed to the top surface 11 of the circuit board 10 by the pad 14, the distance D between the bonding portion 222 and the first pin 21 is equal to the distance D1 between the pad 14 and the hole 13a or the distance D2 between the pad 14 and the hole 13b. Of course, in other embodiments, the two holes 13a and 13b are not limited to a straight line arrangement, and the positions of the first through portion 211 and the second through portion 212 of the first pin 21 can be adjusted corresponding to the positions of the two holes 13a and 13b. In addition, the size, shape and type of the extension of the bonding portion 222 after bending can be adjusted according to the actual application requirements, and this embodiment is not limited thereto. In this embodiment, the electronic component 3 disposed on the bottom surface 12 of the circuit board 10 is isolated from the second pin 22a of the terminal 2 by the insulating layer of the circuit board 10. In other words, placing the electronic component 3 directly below the mating portion 222 on the bottom surface 12 of the circuit board 10 also helps the electronic component 3 maintain the safety distance between the first pin 21 and the second pin 22a of the relative terminals 2. Of course, this case is not limited to this.

[0069] Figure 9 A perspective view of the electronic assembly structure of the third embodiment of this case is shown from below. Figure 10 An exploded view of the electronic assembly structure according to the third embodiment of this invention is shown. In this embodiment, the structures of the electronic assembly structure 1a' and the terminal 2a' are substantially similar to those of... Figures 5 to 8 The electronic assembly structure 1a and terminal 2a shown are identical, and the same component designations represent the same components, structures, and functions; therefore, they will not be described further here. (Reference) Figures 9 to 10 In this embodiment, the second through portion 212 of the first pin 21 is omitted from the terminal 2a', and the first through portion 211 penetrates the circuit board 10 only at the position corresponding to the hole 13a of the circuit board 10. The first through portion 211 and the support portion 213 are interconnected. In this embodiment, the support portion 213 of the first pin 21 can also be fixed to the top surface 11 of the circuit board 10 by the solder pad 13c, increasing the support force of the first pin 21. In other embodiments, the first pin 21 may also have an additional through portion or support portion. Of course, the range, quantity and size of the support portion 213 and the first through portion 211 of the first pin 21 can be adjusted according to actual application requirements, and this embodiment is not limited thereto.

[0070] Figure 11 A side view of the electronic assembly structure according to the third embodiment of this invention is shown. In this embodiment, the structures of the electronic assembly structure 1b and the terminal 2b are substantially similar to those of... Figures 1 to 4 The electronic assembly structure 1 and terminal 2 shown are labeled with the same component numbers to represent the same components, structures, and functions, and will not be described again here. Reference Figure 9In this embodiment, the circuit board 10a is, for example, a multilayer board structure, including a first intermediate conductive layer 15a and a second intermediate conductive layer 15b disposed between the top surface 11 and the bottom surface 12. Since the second pin 22 of the terminal 2b does not penetrate the circuit board 10a, the first intermediate conductive layer 15a and the second intermediate conductive layer 15b can make good use of the space below the bonding portion 221. In one embodiment, relative to the high voltage transmitted by the terminal 2b, the first intermediate conductive layer 15a and the second intermediate conductive layer 15b corresponding to the bonding portion 221 of the terminal 2b can have different voltage values ​​for transmitting signals at different potentials. For example, when the potential of the terminal 2b is PV+, the potential of the first intermediate conductive layer 15a can be PV-, while the second intermediate conductive layer 15b can be used for small signals or control signals. Of course, the arrangement and potential of the first intermediate conductive layer 15a and the second intermediate conductive layer 15b relative to the terminal 2b can be adjusted according to the actual application. This invention is not limited thereto.

[0071] Figure 12 The diagram shows a perspective view of the electronic assembly structure of the fourth embodiment of this invention from above. Figure 13 A perspective view of the electronic assembly structure of the fifth embodiment of this case is shown from below. Figure 14 A side view of the electronic assembly structure according to the fifth embodiment of this invention is shown. In this embodiment, the structures of the electronic assembly structure 1c and terminals 2 and 2a are substantially similar to those of... Figures 1 to 8 The electronic assembly structures 1 and 1a and terminals 2 and 2a shown are labeled with the same component numbers to represent the same components, structures, and functions, and will not be described again here. Reference Figures 10 to 12 In this embodiment, the electronic assembly structure 1c also includes multiple terminals 2 and 2a arranged on the circuit board 10. Since the second pin 22 of terminal 2 and the second pin 22a of terminal 2a do not penetrate the circuit board 10, the mating portions 221 and 222 are mated to the top surface 11 of the circuit board 10. By placing the electronic component 3 below the mating portions 221 and 222 and is isolated by the circuit board 10, it can be ensured that the spacing distance S between the electronic component 3 below the mating portion 221 of terminal 2a and the first pin 21 of terminal 2a is greater than the spacing distance G between the mating portion 221 of terminal 2 and the first pin 21 of terminal 2a, that is, greater than the spacing distance G between terminal 2 and terminal 2a. Therefore, the electronic assembly structure 1c of this embodiment, with multiple terminals 2 and 2a arranged on the circuit board 10, not only transmits high-voltage power through the terminals 2 and 2a, but also helps to optimize the configuration of the electronic component 3 in conjunction with the circuit board 10. Of course, this embodiment is not limited to this, and will not be elaborated further.

[0072] In summary, this invention provides a terminal for inputting or outputting high voltage and its applicable electronic assembly structure. The design, which bends a single pin without penetrating the circuit board, facilitates the mounting of electronic components on the circuit board. For the two pins extending downwards from both ends of the terminal platform, one pin penetrates and is fixed to the circuit board, while the other pin is bent and adheres to the top surface of the circuit board without penetrating it. This provides sufficient space on the bottom surface of the circuit board relative to the bent pin for mounting specific electronic components, such as positive temperature coefficient (PTC) or negative temperature coefficient (NTC) thermistors for terminal temperature sensing, thus optimizing the application setup. The adhered portion of the bent pin can be fixed by pads on the top surface of the circuit board. Combined with the fixing and support of the through pin, this provides sufficient structural support for the platform, facilitating the locking seat on the platform to secure the high-voltage power line for high-voltage power transmission to the terminal. The bent pin forming the adhered portion can extend from its bottom end toward the other pin or from its bottom end away from the other pin. On the other hand, placing electronic components on the bottom surface of the circuit board relative to the bent leads provides sufficient safety clearance between the two leads of the terminals. Furthermore, since the bent leads do not penetrate the circuit board, when the circuit board is multilayered, the intermediate conductive layer at the location of the bent leads can also be used to transmit signals at different potentials. Therefore, the electronic assembly structure of this invention, with multiple terminals arranged on the circuit board architecture, not only transmits high-voltage power through the terminals but also facilitates optimized configuration of electronic components in conjunction with the circuit board, making it highly applicable to industrial applications.

[0073] This case may be modified in various ways by a person skilled in the art, but all of them shall not deviate from the scope of protection sought by the appended patent application.

Claims

1. A terminal configured to be disposed on a circuit board, wherein, The terminal includes: A platform is configured to be positioned above a top surface of the circuit board; A first pin, connected to one end of the platform, extending downwards from the platform through the top and bottom surfaces of the circuit board; and A second pin is connected to the other end of the platform, extends downward from the platform to the top surface of the circuit board, and includes an adhesive portion extending along the top surface of the circuit board and adhering to the top surface of the circuit board.

2. The terminal according to claim 1, wherein, The platform includes a locking base configured to lock a high-voltage power line.

3. The terminal according to claim 1, wherein, The bonding portion extends from the bottom of the second pin toward the first pin.

4. The terminal according to claim 1, wherein, The bonding portion extends from the bottom of the second pin in a direction away from the first pin.

5. The terminal according to claim 1, wherein, The bonding portion is connected to a solder pad, which is located on the top surface of the circuit board.

6. The terminal according to claim 1, wherein, The first pin includes a first through portion, a second through portion, and a support portion. The first through portion and the second through portion are located on both sides of the support portion. The support portion abuts against the top surface of the circuit board. The first through portion and the second through portion pass through the top surface and the bottom surface of the circuit board through two holes in the circuit board, respectively.

7. The terminal according to claim 1, wherein, The first pin includes at least one first through portion and a support portion, the at least one first through portion and the support portion are connected to each other, the support portion abuts against the top surface of the circuit board, and the at least one first through portion passes through the top surface and the bottom surface of the circuit board through at least one hole in the circuit board.

8. An electronic assembly structure, wherein, include: A circuit board, comprising a top surface and a bottom surface that are opposite to each other; as well as At least one terminal is disposed on the circuit board, wherein the at least one terminal includes: A platform is positioned above the top surface of the circuit board; A first pin, connected to one end of the platform, extending downwards from the platform through the top and bottom surfaces of the circuit board; and A second pin is connected to the other end of the platform, extends downward from the platform to the top surface of the circuit board, and includes an adhesive portion extending along the top surface of the circuit board and adhering to the top surface of the circuit board.

9. The electronic assembly structure according to claim 8, wherein, The platform includes a locking base configured to lock a high-voltage power line for transmitting a high-voltage power supply to the terminal.

10. The electronic assembly structure according to claim 8, wherein, The bonding portion extends from the bottom of the second pin toward the first pin.

11. The electronic assembly structure according to claim 8, wherein, The bonding portion extends from the bottom of the second pin in a direction away from the first pin.

12. The electronic assembly structure according to claim 8, wherein, It includes an electronic component disposed on the bottom surface of the circuit board, spatially relative to the mating portion of the second pin.

13. The electronic assembly structure according to claim 12, wherein, The electronic component is a positive temperature coefficient thermistor or a negative temperature coefficient thermistor.

14. The electronic assembly structure according to claim 8, wherein, The circuit board includes a pad disposed on the top surface, and the bonding portion of the terminal is bonded to the pad.

15. The electronic assembly structure according to claim 8, wherein, The circuit board includes an intermediate conductive layer disposed between the top surface and the bottom surface, and the intermediate conductive layer has a different voltage value corresponding to the bonding portion of the terminal.

16. The electronic assembly structure according to claim 8, wherein, The circuit board includes two holes that are spatially arranged and extend relative to the connection between the platform and the first pin. The first pin includes a first through-hole, a second through-hole, and a support portion. The first through-hole and the second through-hole are located on opposite sides of the support portion. The support portion abuts against the top surface of the circuit board and is located between the two holes. The first through-hole and the second through-hole pass through the top and bottom surfaces of the circuit board, respectively.

17. The electronic assembly structure according to claim 8, wherein, The circuit board includes at least one hole that extends spatially relative to the connection between the platform and the first pin. The first pin includes at least one first through portion and a support portion. The at least one first through portion and the support portion are connected to each other. The support portion abuts against the top surface of the circuit board. The at least one first through portion passes through the top surface and the bottom surface of the circuit board through the at least one hole.

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