Distribution box with good heat insulation property and high cooling efficiency

Abstract

The utility model discloses a distribution box with good heat insulation performance and high cooling efficiency, and relates to the field of distribution boxes. The heat dissipation device comprises an outer shell and an inner shell, a back plate is arranged on one side of the inner shell, a heat dissipation mechanism is arranged on one side of the back plate, the heat dissipation mechanism, a second fan and the refrigeration face of a semiconductor radiator directly act on the back plate, and the heat dissipation efficiency is improved through efficient heat conduction. Heat on the back plate and the inner shell tightly connected with the back plate is rapidly absorbed and transferred, local rapid cooling is achieved, meanwhile, gas self-circulation flowing is formed in the inner shell through rotation of the second fan, and the cooling efficiency is improved by avoiding local excessive refrigeration and uneven temperature in a traditional heat conduction mode. The refrigeration uniformity and the refrigeration effect in the inner shell are remarkably improved, the self-circulation flow also enhances the air flow around the power distribution device, the effective control of the working temperature of the power distribution device is further improved, and the stable operation of the power distribution box in a high-temperature environment is ensured.

Description

Technical Field

[0001] This utility model relates to the field of distribution boxes, specifically a distribution box with good heat insulation and high cooling efficiency. Background Technology

[0002] As a key component of electrical equipment, the distribution box integrates switches, meters, and other devices, responsible for the control, distribution, and protection of electrical equipment. It is classified in various ways according to its purpose and installation environment. When selecting a distribution box, factors such as equipment type, power, and control requirements must be considered. The distribution box should be installed in a suitable environment, and wiring and grounding should follow electrical safety regulations. During use, operating procedures must be strictly followed, and regular maintenance and inspections must be performed to ensure normal operation. A search revealed announcement number CN216720654U, entitled "A Distribution Box with Good Thermal Insulation and High Cooling Efficiency," which describes a new type of distribution box including an outer cabinet, an inner cabinet, and heat dissipation fins. It also includes a heat exchange copper plate, an exhaust vent, and an exhaust fan. The inner cabinet is welded to one end of the outer cabinet, and heat dissipation fins are welded to the back of the inner cabinet. A heat exchange copper plate is bolted to one side of the heat dissipation fins, and a semiconductor cooling chip is provided on one side of the heat exchange copper plate. A fiberglass pad is glued to the inner wall of the outer cabinet. The overall distribution box has good thermal insulation and high cooling efficiency, which can greatly ensure the stability of the distribution box. While reducing the conduction of external heat to the cabinet in hot weather, it can ensure the heat dissipation from the cabinet to the outside, making it highly practical.

[0003] One problem exists: the semiconductor heat sink cools the copper plate, while the heating side transfers heat to the heat sink fins and uses an exhaust fan to remove the heat, thus achieving a cooling effect inside the distribution box. However, the cooling side of the semiconductor heat sink only achieves cooling through heat conduction, which undoubtedly reduces the cooling effect of the semiconductor heat sink. Therefore, the inventor urgently needs to design a distribution box with a stronger semiconductor cooling effect to improve the cooling efficiency of the distribution box. Utility Model Content

[0004] Therefore, the purpose of this utility model is to provide a distribution box with good heat insulation and high cooling efficiency, so as to solve the technical problem of poor internal cooling effect in the existing distribution box technology.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a distribution box with good heat insulation and high cooling efficiency, comprising an outer shell and an inner shell, a back plate provided on one side of the inner shell, a heat dissipation mechanism provided on one side of the back plate, the heat dissipation mechanism comprising a semiconductor heat sink, a mounting frame provided on the outer side of the semiconductor heat sink, a plurality of heat dissipation fins fixedly provided on the inner side of the mounting frame, and the heat dissipation fins abutting against the heating surface of the semiconductor heat sink, ventilation slots being provided on both the upper and lower surfaces of the mounting frame, two sets of first fans being mounted on the mounting frame, and a second fan being mounted on the inner side of the back plate;

[0006] The outer shell is a composite frame of fiberglass and polyester plastic.

[0007] By adopting the above technical solution, this distribution box effectively improves its heat insulation performance through a double-layer structure design of outer shell and inner shell. The outer shell adopts a composite frame of fiberglass and polyester plastic, which is both lightweight and has good heat insulation effect.

[0008] Furthermore, the mounting frame extends through the back of the outer casing via a through groove, which is adapted to the mounting frame and is sealed.

[0009] By adopting the above technical solution, the heat dissipation mechanism can be tightly installed on the outer casing, ensuring the stability of the structure. At the same time, the sealing treatment effectively prevents external dust and moisture from entering the distribution box.

[0010] Furthermore, the semiconductor heat sink is provided in a plurality of units, arranged in an equidistant rectangular array, and the cooling surface of the semiconductor heat sink is bonded and fixed to the back plate by thermally conductive silicone grease.

[0011] By adopting the above technical solution, this layout can ensure that the cooling effect is evenly distributed across the entire backplate, avoiding local overheating. At the same time, the cooling surface of the semiconductor heat sink is fixed to the backplate by thermal grease, and the good thermal conductivity of the thermal grease can further improve the heat transfer efficiency.

[0012] Furthermore, the back plate is made of copper plate, and the inner shell is fixedly connected to the outer shell through a fixing plate.

[0013] By adopting the above technical solution, copper material has good thermal conductivity, which can quickly transfer the cooling effect of semiconductor heat sink to the entire back plate, thereby achieving a uniform reduction in the internal temperature of the distribution box. At the same time, the inner shell is fixedly connected to the outer shell through a fixing plate. This connection method not only ensures the stability between the inner shell and the outer shell, but also facilitates disassembly and maintenance, making the distribution box more convenient and reliable in use.

[0014] Furthermore, multiple through holes are provided on the upper and lower sides of both the outer and inner shells to provide connection holes for external power lines and signal lines, and these holes are sealed.

[0015] By adopting the above technical solution, the through holes facilitate the connection of external power lines and signal lines, enabling the distribution box to be easily connected to other equipment or systems. At the same time, the through holes are sealed to effectively prevent harmful substances such as dust and moisture from entering the distribution box, thus protecting the safe operation of the internal power distribution components.

[0016] Furthermore, the plurality of heat dissipation fins are arranged longitudinally and are equidistantly distributed in the transverse direction, and the ventilation slots are rectangular through slots and are perpendicular to the plurality of heat dissipation fins.

[0017] By adopting the above technical solution, this layout can maximize the heat dissipation area and improve the heat dissipation efficiency. At the same time, the ventilation slot has a rectangular through-slot structure and is perpendicular to multiple heat dissipation fins, so that air can flow smoothly through the gaps between the heat dissipation fins, take away the heat, and through the exhaust action of the first fan, the hot air is discharged outside the distribution box, forming an effective heat dissipation cycle.

[0018] Furthermore, a side door is rotatably provided on one side of the outer shell, and a mounting bracket is installed on the inner side of the inner shell for installing power distribution devices.

[0019] By adopting the above technical solution, the maintenance of the distribution box is made more convenient. The internal components can be inspected or replaced without disassembling the entire outer shell. At the same time, a mounting bracket is installed on the inner side of the inner shell for installing the distribution components. This installation method saves space and ensures the stability and safety of the distribution components.

[0020] Furthermore, the first fan, the semiconductor heat sink, and the second fan are all electrically connected to an external power supply via a controller.

[0021] By adopting the above technical solution, intelligent control of the heat dissipation system inside the distribution box is realized. Through the controller, the fan speed and the cooling power of the semiconductor heat sink can be automatically adjusted according to the temperature change inside the distribution box, which not only ensures the cooling effect but also avoids energy waste.

[0022] In summary, the present invention has the following main advantages:

[0023] 1. This utility model utilizes a heat dissipation mechanism and a second fan. The cooling surface of the semiconductor heat sink directly acts on the back plate. Through efficient heat conduction, the heat on the back plate and the inner shell closely connected to it is quickly absorbed and transferred, achieving rapid local cooling. At the same time, the rotation of the second fan creates a self-circulating airflow inside the inner shell. This flow not only accelerates the air renewal inside the inner shell but also allows the cooling effect of the semiconductor heat sink to be more evenly distributed throughout the entire inner shell space. By avoiding excessive local cooling and temperature unevenness under traditional heat conduction methods, the cooling uniformity and cooling effect inside the inner shell are significantly improved. This self-circulating flow also enhances the airflow around the power distribution components, further improving the effective control of the operating temperature of the power distribution components and ensuring the stable operation of the distribution box in high-temperature environments.

[0024] 2. This utility model, by setting up an installation frame, ventilation slots, a first fan, and heat dissipation fins, creates a negative pressure environment inside the installation frame through the rotation of the first fan. This negative pressure environment generates a strong suction force, effectively drawing in outside air. The air flows smoothly through the ventilation slots into the gaps between adjacent heat dissipation fins, allowing the air to fully contact and flow over the surface of the heat dissipation fins. At the same time, as the air flows over the heat dissipation fins, it carries away the heat from the fins, which is transferred from the heating surface of the semiconductor heat sink through heat conduction. Subsequently, the heated air is further drawn in by the first fan and discharged outside the distribution box, forming a highly efficient heat dissipation cycle. This not only helps to quickly remove the heat from the heating surface of the semiconductor heat sink, preventing overheating and affecting the cooling effect, but also greatly improves the performance of the semiconductor heat sink, ensuring its stable operation and long service life in high-temperature environments. Attached Figure Description

[0025] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0026] Figure 2 This is a schematic diagram of the back structure of this utility model;

[0027] Figure 3 This is a side sectional view of the present invention.

[0028] Figure 4 This is a schematic diagram of the structure of the inner shell and the mounting frame of this utility model;

[0029] Figure 5 This is a schematic diagram of the installation layout of the semiconductor heat sink of this utility model.

[0030] In the diagram: 1. Outer shell; 2. Inner shell; 3. Side door; 4. Mounting bracket; 5. Back panel; 6. Heat dissipation mechanism; 601. Semiconductor heat sink; 602. Mounting frame; 603. Ventilation slot; 604. First fan; 605. Heat dissipation fins; 606. Second fan; 7. Through hole; 8. Fixing plate. Detailed Implementation

[0031] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0032] Example 1:

[0033] A type of distribution box with good thermal insulation and high cooling efficiency, such as Figures 1-5 As shown, it includes an outer shell 1 and an inner shell 2. A back plate 5 is provided on one side of the inner shell 2, and a heat dissipation mechanism 6 is provided on one side of the back plate 5. The heat dissipation mechanism 6 includes a semiconductor heat sink 601. A mounting frame 602 is provided on the outer side of the semiconductor heat sink 601. Several heat dissipation fins 605 are fixedly provided on the inner side of the mounting frame 602, and the heat dissipation fins 605 abut against the heating surface of the semiconductor heat sink 601. Ventilation slots 603 are provided on both the upper and lower surfaces of the mounting frame 602. Two sets of first fans 604 are installed on the mounting frame 602, and a second fan 606 is installed on the inner side of the back plate 5.

[0034] The outer shell 1 is a composite frame of fiberglass and polyester plastic. This distribution box effectively improves its heat insulation performance through the double-layer structure design of the outer shell 1 and the inner shell 2. The outer shell adopts a composite frame of fiberglass and polyester plastic, which is both lightweight and has a good heat insulation effect. At the same time, the back plate 5 and heat dissipation mechanism 6 set on one side of the inner shell 2, especially the combination of semiconductor heat sink 601 and heat dissipation fins 605, can quickly dissipate internal heat. Through the synergistic action of the first fan 604 and the second fan 606, efficient cooling is achieved, ensuring the internal temperature of the distribution box is stable and improving the working efficiency and life of the power distribution components.

[0035] See Figure 1 , Figure 2 , Figure 4 The mounting frame 602 passes through the back of the outer casing 1 via a through slot, and the through slot is adapted to the mounting frame 602 and sealed, so that the heat dissipation mechanism 6 can be tightly installed on the outer casing 1, while ensuring the stability of the structure. At the same time, the sealing treatment effectively prevents external dust and moisture from entering the inside of the distribution box, protecting the safe operation of the internal power distribution components, and avoiding the decrease in heat dissipation efficiency caused by dust accumulation, further improving the cooling efficiency and heat insulation performance of the distribution box.

[0036] See Figure 1 , Figure 2 , Figure 3 , Figure 5 Several semiconductor heat sinks 601 are provided and arranged in an equidistant rectangular array. The cooling surface of the semiconductor heat sink 601 is bonded and fixed to the back plate 5 with thermally conductive silicone grease. This layout can ensure that the cooling effect is evenly distributed on the entire back plate 5, avoiding the occurrence of local overheating. At the same time, the good thermal conductivity of the thermally conductive silicone grease can further improve the heat conduction efficiency, so that the cooling effect of the semiconductor heat sink 601 can be fully utilized, effectively reducing the internal temperature of the distribution box and ensuring that the power distribution devices work in a suitable temperature environment.

[0037] See Figure 1 , Figure 3 The back plate 5 is made of copper plate. The inner shell 2 is fixedly connected to the outer shell 1 through the fixing plate 8. Copper has good thermal conductivity, which can quickly transfer the cooling effect of the semiconductor heat sink 601 to the entire back plate 5, thereby achieving a uniform reduction in the internal temperature of the distribution box. At the same time, the inner shell 2 is fixedly connected to the outer shell 1 through the fixing plate 8. This connection method not only ensures the stability between the inner shell 2 and the outer shell 1, but also facilitates disassembly and maintenance, making the distribution box more convenient and reliable in use. In addition, the copper plate back plate 5 also has a certain degree of corrosion resistance, which can extend the service life of the distribution box.

[0038] See Figure 1 , Figure 2 , Figure 4 , Figure 5 Multiple through holes 7 are provided on the upper and lower sides of both the outer shell 1 and the inner shell 2 to provide connection holes for external power lines and signal lines. These holes are sealed to facilitate the connection of external power lines and signal lines, allowing the distribution box to be easily connected to other equipment or systems. At the same time, the sealing treatment at the through holes 7 effectively prevents harmful substances such as dust and moisture from entering the distribution box, protecting the safe operation of the internal power distribution components. This ensures both the connectivity of the distribution box and its sealing and protection level, thereby improving the overall performance and reliability of the distribution box.

[0039] Example 2:

[0040] See Figure 1 , Figure 2 , Figure 3 , Figure 4Multiple heat dissipation fins 605 are arranged longitudinally and equidistantly along the transverse direction. The ventilation slots 603 are rectangular through-slots and are perpendicular to the multiple heat dissipation fins 605. This layout maximizes the heat dissipation area and improves heat dissipation efficiency. At the same time, the rectangular through-slot structure of the ventilation slots 603 and their perpendicularity to the multiple heat dissipation fins 605 allow air to flow smoothly through the gaps between the heat dissipation fins 605, carrying away heat. The hot air is then exhausted outside the distribution box by the exhaust action of the first fan 604, forming an effective heat dissipation cycle. This heat dissipation structure design not only improves the cooling efficiency of the distribution box but also ensures the uniform and stable temperature inside the distribution box, providing a good working environment for the power distribution devices.

[0041] See Figure 1 , Figure 2 , Figure 3 The outer shell 1 has a rotating side door 3 on one side, and the inner shell 2 has a mounting bracket 4 installed on the inside for installing power distribution components. This makes the maintenance of the power distribution box more convenient, allowing for internal inspection or replacement of power distribution components without disassembling the entire outer shell. At the same time, the mounting bracket 4 installed on the inside of the inner shell 2 saves space and ensures the stability and safety of the power distribution components. In addition, the rotating design of the side door 3 facilitates cleaning and maintenance of the inside of the power distribution box, extending the service life and performance stability of the power distribution box.

[0042] See Figure 1 , Figure 2 , Figure 3 , Figure 4 The first fan 604, the semiconductor heat sink 601, and the second fan 606 are all electrically connected to an external power supply through a controller, realizing intelligent control of the internal heat dissipation system of the distribution box. Through the controller, the fan speed and the cooling power of the semiconductor heat sink 601 can be automatically adjusted according to the temperature change inside the distribution box, which not only ensures the cooling effect but also avoids energy waste. At the same time, intelligent control also makes the distribution box safer and more reliable during use, avoiding failures or accidents caused by overheating, and improving the overall performance and reliability of the distribution box.

[0043] The implementation principle of this utility model is as follows: When high temperatures occur, in order to reduce the internal temperature of the distribution box, firstly, the first fan 604, the second fan 606, and several semiconductor heat sinks 601 are activated. The cooling surface of the semiconductor heat sink 601 cools the back plate 5 and the inner shell 2. At the same time, the rotation of the second fan 606 causes the gas inside the inner shell 2 to circulate, thereby avoiding localized cooling and poor traditional heat conduction, improving the cooling uniformity and cooling effect inside the inner shell 2, and improving the effective control of the operating temperature of the power distribution components. Meanwhile, the rotation of the first fan 604 causes a negative pressure to be formed inside the mounting frame 602, causing outside air to flow from the ventilation slot 603 into the gap between adjacent heat sink fins 605, and then be discharged through the first fan 604, forming a highly efficient heat dissipation system of semiconductor heat sink 601 and heat sink fins 605, which helps to quickly remove the heat from the heating surface of the semiconductor heat sink 601 and improve the performance of the semiconductor heat sink 601.

[0044] All parts not covered in this utility model are the same as or can be implemented using existing technologies, and will not be described in detail here.

[0045] Although embodiments of the present invention have been shown and described, these specific embodiments are merely explanations of the present invention and are not intended to limit the invention. The specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions, and variations to the embodiments as needed without departing from the principles and spirit of the present invention, provided that such modifications, substitutions, and variations are within the scope of the claims of the present invention and are protected by patent law.

Claims

1. A distribution box with good thermal insulation and high cooling efficiency, characterized in that: The device includes an outer shell (1) and an inner shell (2). A back plate (5) is provided on one side of the inner shell (2). A heat dissipation mechanism (6) is provided on one side of the back plate (5). The heat dissipation mechanism (6) includes a semiconductor heat sink (601). A mounting frame (602) is provided on the outer side of the semiconductor heat sink (601). A plurality of heat dissipation fins (605) are fixedly provided on the inner side of the mounting frame (602), and the heat dissipation fins (605) abut against the heating surface of the semiconductor heat sink (601). Ventilation slots (603) are provided on the upper and lower surfaces of the mounting frame (602). Two sets of first fans (604) are installed on the mounting frame (602). A second fan (606) is installed on the inner side of the back plate (5). The outer shell (1) is a composite frame of glass fiber and polyester plastic.

2. The distribution box with good thermal insulation and high cooling efficiency according to claim 1, characterized in that: The mounting frame (602) extends through the back of the outer shell (1) via a through groove, and the through groove is adapted to the mounting frame (602) and is sealed.

3. The distribution box with good thermal insulation and high cooling efficiency according to claim 1, characterized in that: The semiconductor heat sink (601) is provided in a plurality of units and arranged in an equidistant rectangular array. The cooling surface of the semiconductor heat sink (601) is bonded and fixed to the back plate (5) by thermally conductive silicone grease.

4. The distribution box with good thermal insulation and high cooling efficiency according to claim 1, characterized in that: The back plate (5) is made of copper plate, and the inner shell (2) is fixedly connected to the outer shell (1) through the fixing plate (8).

5. The distribution box with good thermal insulation and high cooling efficiency according to claim 1, characterized in that: Multiple through holes (7) are provided on the upper and lower sides of the outer shell (1) and the inner shell (2) to provide connection through holes for external power lines and signal lines, and to be sealed.

6. The distribution box with good thermal insulation and high cooling efficiency according to claim 1, characterized in that: The multiple heat dissipation fins (605) are arranged longitudinally and are equidistantly arranged in the transverse direction. The ventilation slot (603) has a rectangular through-slot structure and is perpendicular to the multiple heat dissipation fins (605).

7. The distribution box with good thermal insulation and high cooling efficiency according to claim 1, characterized in that: A side door (3) is rotatably provided on one side of the outer shell (1), and a mounting bracket (4) is installed on the inner side of the inner shell (2) for installing power distribution devices.

8. The distribution box with good thermal insulation and high cooling efficiency according to claim 1, characterized in that: The first fan (604), the semiconductor heat sink (601), and the second fan (606) are all electrically connected to an external power supply via a controller.

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