Flexible circuit board with heat dissipation flow channel

Abstract

The flexible circuit board comprises a circuit layer and an insulating layer which are arranged in a stacked mode and connected through a bonding layer, the circuit layer is provided with the through heat dissipation flow channel, the two ends of the heat dissipation flow channel are provided with a liquid inlet and a liquid outlet, and heat dissipation media flow into the heat dissipation flow channel through the liquid inlet and flow out of the liquid outlet. The purpose of cooling the flexible circuit board is achieved. The flexible circuit board is simple in structure, a heat dissipation layer or a heat conduction layer does not need to be additionally arranged, and the heat dissipation effect of the flexible circuit board can be improved.

Description

Technical Field

[0001] This utility model relates to the field of flexible circuit board technology, and specifically to a flexible circuit board with heat dissipation channels. Background Technology

[0002] With the continuous development of electronic devices, high-power, highly integrated electronic devices have increasingly stringent requirements for the heat dissipation performance of flexible printed circuit boards (FPCs).

[0003] Several invention patents have been issued to address the issue of improving the heat dissipation performance of electronic devices, thereby enhancing their performance and reliability. For example, patent CN109922599A discloses a circuit board and its manufacturing method, as well as electronic components and electronic devices including the circuit board. This patent adds a heat-conducting layer to the circuit board, and through the changes in the liquid and gas phases of the cooling medium within the heat-conducting layer, it can efficiently transfer heat from high-temperature areas to low-temperature areas, thus enhancing the heat transfer effect of the circuit board. CN207283913U discloses a microchannel heat dissipation circuit board. The front of the circuit board has a printed metal circuit layer, and the back is arranged correspondingly to the front of the heat dissipation board. The heat dissipation board has through-channel microchannels on its surface, and an encapsulation board is arranged on its back. The encapsulation board has inlet and outlet holes corresponding to the two ends of the microchannels on its surface. Existing solutions all require adding an additional heat-conducting or heat dissipation layer to achieve the heat dissipation effect, resulting in numerous processing steps and high costs.

[0004] In addition, traditional FPC heat dissipation methods have the following problems: Traditional FPCs have a short lifespan, are prone to delamination and disintegration of the insulation layer and copper circuit layer, leading to serious quality accidents such as coolant spraying; secondly, their heat transfer efficiency and uniformity are poor, making it difficult to meet the heat dissipation requirements of high-power, highly integrated electronic devices. The heat dissipation effect is unstable and cannot achieve continuous and uniform heat dissipation. Furthermore, existing FPC heat dissipation structures are complex and costly.

[0005] The aforementioned problems limit the heat dissipation performance of FPCs, thus affecting the overall performance and reliability of electronic devices. Therefore, developing a new type of FPC is of significant practical importance. Utility Model Content

[0006] In view of the shortcomings of the prior art, the purpose of this utility model is to design a flexible circuit board with heat dissipation channels. By designing a reasonable channel structure, the flow rate is increased and the cooling efficiency is improved; the corner structure of the channel is optimized to reduce resistance and increase flow velocity; and high-temperature resistant and chemically corrosion-resistant materials are used to extend service life and avoid coolant spraying accidents. Through the above technical means, the heat dissipation performance of electronic equipment can be effectively improved, thereby enhancing the overall performance and reliability of the equipment.

[0007] To achieve the above objectives, the technical solution provided by this utility model is as follows: a flexible circuit board with a heat dissipation channel, comprising a circuit layer and an insulating layer stacked together, wherein the insulating layer is disposed on two surfaces of the circuit layer and connected by an adhesive layer; the circuit layer has a through heat dissipation channel, and the two ends of the heat dissipation channel are respectively provided with an inlet and an outlet, wherein the heat dissipation channel is distributed in a continuous curved or zigzag pattern.

[0008] In one preferred embodiment, the cross-section of the heat dissipation channel is rectangular.

[0009] In one preferred embodiment, the cross-section of the heat dissipation channel is elliptical or arc-shaped.

[0010] Furthermore, the corners of the heat dissipation channel are chamfered. Preferably, the chamfer size is R0.5mm.

[0011] Furthermore, the insulating layer includes a first insulating layer and a second insulating layer, which are disposed opposite to each other on two surfaces of the circuit layer.

[0012] Furthermore, the insulating layer is a polyimide film; the circuit layer is a metal layer.

[0013] Furthermore, the insulating layer is provided with a protruding structure that matches the heat dissipation channel, and the upper and lower protruding structures form a receiving groove for accommodating the heat dissipation medium.

[0014] The main features of this utility model are as follows:

[0015] 1. This invention improves the heat dissipation performance of the FPC by designing heat dissipation channels in the circuit layer, thereby reducing the operating temperature and improving the reliability and stability of the equipment. At the same time, it maintains the flexibility and bendability of the FPC, ensuring its installation and use in electronic devices.

[0016] 2. Optimize the design of the new FPC structure, including the shape, size and layout of the flow channels to improve heat dissipation efficiency and reduce production costs.

[0017] 3. The FPC layers of this utility model have high adhesion and the joints are fully cured, preventing disintegration and delamination. Attached Figure Description

[0018] Figure 1 This is a perspective view of one embodiment of the present invention.

[0019] Figure 2 yes Figure 1 The exploded diagram.

[0020] Figure 3 yes Figure 1 Enlarged view of the heat dissipation channel port in section A.

[0021] Figure 4 This is a planar schematic diagram of the insulating layer.

[0022] Figure 5 This is a schematic diagram of the circuit layer.

[0023] Figure 6 This is a perspective view of another embodiment. The cross-section of the heat dissipation channel in the figure is rectangular.

[0024] Figure 7 yes Figure 6 Enlarged view of the heat dissipation channel port at point B.

[0025] Reference numerals: 100, flexible circuit board; 1, circuit layer; 2, insulating layer; 3, adhesive layer; 4, heat dissipation channel; 5, liquid inlet; 6, liquid outlet; 7, corner; 8, first insulating layer; 9, second insulating layer; 10, raised structure; 11, copper foil. Detailed Implementation

[0026] To better understand the technical solution of this utility model, the embodiments of this utility model are described in detail below with reference to specific examples. It should be understood that the described embodiments are merely some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0027] The terms "first" and "second" used in the embodiments are merely to distinguish similar objects and do not represent a specific ordering of objects. It is understood that "first" and "second" can be interchanged in a specific order or sequence where permissible. It should be understood that the objects distinguished by "first" and "second" can be interchanged where appropriate so that the embodiments described herein can be implemented in orders other than those illustrated or described herein.

[0028] like Figures 1 to 7 As shown, a flexible circuit board 100 with a heat dissipation channel 4 includes a stacked circuit layer 1 and an insulating layer 2. The insulating layer 2 is disposed on two surfaces of the circuit layer 1 and connected by an adhesive layer 3. The circuit layer 1 has a through heat dissipation channel 4, with an inlet 5 and an outlet 6 at each end of the heat dissipation channel 4. The insulating layer 2 is a polyimide film, including a first insulating layer 8 and a second insulating layer 9. The circuit layer 1 is a metal layer, such as copper foil 11. The first insulating layer 8 and the second insulating layer 9 are disposed opposite each other on the two surfaces of the circuit layer 1, enclosing the circuit layer 1 and forming a heat dissipation channel 4 that can accommodate the heat dissipation medium.

[0029] The heat dissipation channel 4 is formed on the circuit layer 1 by etching process, and is distributed in a continuous curved or zigzag pattern.

[0030] In one preferred embodiment, the heat dissipation channel 4 has a rectangular cross-section, such as... Figure 6 and Figure 7 As shown, Figure 7 yes Figure 6 Enlarged view of the heat dissipation channel port at point B.

[0031] Furthermore, to increase the flow rate of the heat dissipation medium and accelerate heat dissipation, the insulating layer 2 is provided with a protruding structure 10 that matches the heat dissipation channel 4, and the upper and lower layers of the protruding structures 10 form a receiving groove for accommodating the heat dissipation medium. For example... Figure 1 and Figure 5 As shown, the cross-section of the heat dissipation channel 4 is elliptical. Figure 3 yes Figure 1 Enlarged view of the heat dissipation channel port in section A. More heat dissipation medium passes through the cross-section per unit time.

[0032] As one preferred embodiment Figure 4 and Figure 5 The corner 7 of the heat dissipation channel 4 is chamfered. Preferably, the chamfer size is R0.5mm.

[0033] During use, the heat dissipation medium is injected into the heat dissipation channel 4. The heat dissipation medium can be water, ethylene glycol, or an aqueous solution of ethylene glycol. When the heat dissipation medium flows in the heat dissipation channel 4, due to the optimized design of the channel structure, the flow rate is large and the flow velocity is fast, which can promptly displace the heat in the heat-generating area.

[0034] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A flexible circuit board with heat dissipation channels, characterized in that, It includes a stacked circuit layer and an insulating layer. The insulating layer is disposed on two surfaces of the circuit layer and connected by an adhesive layer. The circuit layer has a through heat dissipation channel with an inlet and an outlet at each end. The heat dissipation channel is distributed in a continuous curved or zigzag pattern.

2. The flexible circuit board with heat dissipation channels according to claim 1, characterized in that, The cross-section of the heat dissipation channel is rectangular, arc-shaped, or elliptical.

3. The flexible circuit board with heat dissipation channels according to claim 1, characterized in that, The corners of the heat dissipation channel are chamfered.

4. The flexible circuit board with heat dissipation channels according to claim 3, characterized in that, The chamfer dimension is R0.5mm.

5. The flexible circuit board with heat dissipation channels according to claim 1, characterized in that, The insulating layer includes a first insulating layer and a second insulating layer, which are disposed opposite to each other on two surfaces of the circuit layer.

6. The flexible circuit board with heat dissipation channels according to claim 5, characterized in that, The first insulating layer and the second insulating layer are provided with protrusions that match the heat dissipation channels, and the protrusions on the upper and lower layers opposite each other form a receiving groove for accommodating the heat dissipation medium.

7. The flexible circuit board with heat dissipation channels according to claim 1, characterized in that, The insulating layer is a polyimide film.

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