Device for coating isolation adhesive film on circuit board

Abstract

The utility model relates to a device for coating an isolation adhesive film on a circuit board, which comprises a rack, a circuit board feeding mechanism, an isolation adhesive film feeding mechanism, a material taking and stacking mechanism and a board collecting mechanism, and the material taking and stacking mechanism comprises a manipulator connected with the rack and a material taking support connected with the manipulator. The first circuit board material taking assembly and the second circuit board material taking assembly are arranged on the material taking support, the material taking driving assembly is arranged on the material taking support, the first circuit board material taking assembly is connected with a first film taking assembly, and the second circuit board material taking assembly is connected with a second film taking assembly. According to the material taking and stacking mechanism, the circuit board can be grabbed from the circuit board feeding mechanism, then the isolation adhesive film is taken out from the isolation adhesive film feeding mechanism, and the circuit board and the isolation adhesive film are placed at the board collecting mechanism at the same time, so that the isolation adhesive film is placed in the board stacking process at the same time, manual operation is not needed, the working efficiency is improved, and the cost is reduced.

Description

Technical Field

[0001] This utility model relates to the field of circuit board manufacturing equipment technology, and specifically to a device for insulating adhesive film on circuit boards. Background Technology

[0002] PCB (Printed Circuit Board), also known as a printed circuit board or printed circuit board, is an important electronic component. It serves as the support for electronic components and provides the electrical connections between them. Because it is manufactured using electronic printing techniques, it is called a "printed" circuit board. Circuit boards are essential components in the modern electronics industry, used for the electrical connections of electronic components. The manufacturing process of circuit boards involves multiple steps, including material preparation, drilling, copper plating, image transfer, etching, testing, and screen printing. In the etching process, the circuit board's lines are exposed. During the transport and transfer process, the circuit boards are usually stacked together. To prevent damage to the surface circuitry due to friction, adjacent circuit boards need to be separated. The common practice is to add a layer of plastic insulating film between the two circuit boards. That is, an insulating film is placed after each circuit board is placed during the stacking process. In traditional operations, circuit boards are stacked using a stacking machine. However, stacking machines do not have the function of placing the insulating film. Therefore, placing the insulating film relies on manual operation. After each circuit board is stacked by the stacking machine, the operator places the insulating film on the circuit board, resulting in low overall efficiency. Utility Model Content

[0003] To address the aforementioned problems, this invention provides a device for applying an insulating adhesive film to a circuit board.

[0004] An adhesive film device for circuit boards, comprising:

[0005] frame;

[0006] A circuit board feeding mechanism is mounted on the frame;

[0007] A release liner feeding mechanism is provided on the frame and is located on one side of the circuit board feeding mechanism.

[0008] The material picking and stacking mechanism includes a robotic arm connected to the frame, a material picking bracket connected to the robotic arm, a first circuit board picking component and a second circuit board picking component disposed on the material picking bracket, and a material picking drive component disposed on the material picking bracket. The material picking drive component drives the first circuit board picking component and the second circuit board picking component to move closer to or further away from each other. The first circuit board picking component is connected to a first film picking component, and the second circuit board picking component is connected to a second film picking component.

[0009] Furthermore, both the first circuit board picking assembly and the second circuit board picking assembly include a first picking bracket connected to the picking drive assembly, a first profile connected to the first picking bracket, and a plurality of first suction nozzles disposed at the bottom of the first profile.

[0010] Furthermore, the first profile is provided with a first material picking drive, the output end of the first material picking drive is connected to a lifting bracket, the bottom of the lifting bracket is rotatably connected to a movable clamping member, and the lifting bracket is provided with a second material picking drive for driving the movable clamping member to rotate.

[0011] Furthermore, both the first film-taking assembly and the second film-taking assembly include a third material-taking drive, a second profile connected to the output end of the third material-taking drive, and a plurality of second suction nozzles disposed at the bottom of the second profile.

[0012] Furthermore, the circuit board isolation film device includes a board take-up mechanism, which includes a take-up conveyor roller group connected to the frame, a take-up drive assembly for driving the take-up conveyor roller group, and a take-up frame.

[0013] Furthermore, the circuit board feeding mechanism includes a feeding rack connected to the frame, a circuit board conveying assembly disposed on the feeding rack, and a conveying drive for driving the circuit board conveying wheel assembly.

[0014] Furthermore, the separator film feeding mechanism includes a feeding base connected to the frame, a lifting assembly disposed on the feeding base, a separator adsorption assembly disposed on both sides of the lifting assembly, a separator bearing assembly disposed on both sides of the lifting assembly, the separator bearing assembly and the feeding base being movably connected, and the feeding base being provided with a separator driving assembly for driving the separator bearing assembly to move.

[0015] Furthermore, the diaphragm adsorption assembly includes a first bracket disposed on the feeding base, a first suction cylinder disposed on the first bracket, a second suction cylinder connected to the output end of the first suction cylinder, and a third suction nozzle connected to the second suction cylinder.

[0016] Furthermore, the diaphragm support assembly includes a second bracket connected to the feeding base, a material support member disposed on the second bracket, and a suction cup disposed on the material support member.

[0017] Furthermore, the lifting assembly includes a fixed plate disposed on the base, a lifting platform movably connected to the fixed plate, and a lifting drive component disposed on the fixed plate for driving the lifting platform to move.

[0018] Compared with the prior art, the present invention has the following advantages:

[0019] This utility model's material handling and stacking mechanism can pick up circuit boards from the circuit board feeding mechanism, then remove the release liner from the release liner feeding mechanism, and simultaneously place the circuit board and release liner at the board receiving mechanism. This achieves simultaneous placement of the release liner during the stacking process, eliminating the need for manual operation, improving work efficiency, and reducing costs. Furthermore, the release liner feeding mechanism, in cooperation with the diaphragm support assembly, diaphragm support assembly, and lifting assembly, ensures that only one release liner is provided at a time, avoiding the situation of stacking multiple release liners at once. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of a circuit board isolation film device provided by this utility model.

[0021] Figure 2 This is a schematic diagram from another perspective of the present invention.

[0022] Figure 3 This is a schematic diagram of the material supply mechanism for the release film of this utility model.

[0023] Figure 4 This is a schematic diagram of the material handling and stacking mechanism of this utility model.

[0024] The image includes:

[0025] Frame 1, Circuit board feeding mechanism 2, Feeding rack 21, Circuit board conveying assembly 22, Conveying drive component 23, Separating film feeding mechanism 3, Feeding base 31, Lifting assembly 32, Fixing plate 321, Lifting platform 322, Lifting drive component 323, Diaphragm adsorption assembly 33, First support 331, First suction cylinder 332, Second suction cylinder 333, Third suction nozzle 334, Diaphragm bearing assembly 34, Second support 341, Material support component 342, Suction cup 343, Diaphragm driving assembly 35, Material picking and stacking mechanism 4, Robot arm 41 42. Material picking bracket, 43. First circuit board picking assembly, 431. First profile, 432. First suction nozzle, 433. First picking drive, 434. Movable clamping component, 435. Second picking drive, 436. Lifting bracket, 437. Second circuit board picking assembly, 44. Picking drive assembly, 45. First film picking assembly, 46. Third picking drive, 461. Second profile, 462. Second suction nozzle, 463. Second film picking assembly, 57. Plate collecting mechanism, 51. Plate collecting conveyor roller group, 52. Plate collecting drive assembly, 53. Plate collecting frame. Detailed Implementation

[0026] To facilitate understanding of this utility model by those skilled in the art, the present utility model will be further described in detail below with reference to specific embodiments and accompanying drawings.

[0027] Reference Figures 1 to 4 The present invention provides a circuit board isolation film device, comprising: a frame 1, a circuit board feeding mechanism 2, an isolation film feeding mechanism 3, a material picking and stacking mechanism 4, and a board collecting mechanism 5.

[0028] The circuit board feeding mechanism 2 is mounted on the frame 1. The circuit board feeding mechanism 2 includes a feeding rack 21 connected to the frame 1, a circuit board conveying assembly 22 mounted on the feeding rack 21, and a conveying drive component 23 for driving the circuit board conveying wheel assembly. In this embodiment, the circuit board conveying assembly 22 is a conveying wheel assembly, which can be connected to the circuit board conveyor line to receive circuit boards from other workstations. Additionally, the circuit board conveying assembly 22 can be equipped with a centering alignment component to push the circuit board to the center position, for example, by using a structure such as two opposing cylinders combined with a push rod.

[0029] The material handling and stacking mechanism 4 includes a robotic arm 41 connected to the frame 1, a material handling bracket 42 connected to the robotic arm 41, a first circuit board material handling assembly 43 and a second circuit board material handling assembly 44 disposed on the material handling bracket 42, and a material handling drive assembly 45 disposed on the material handling bracket 42. The material handling drive assembly 45 drives the first circuit board material handling assembly 43 and the second circuit board material handling assembly 44 to move closer to or further away from each other. In this embodiment, the material handling drive assembly 45 may be a double-ended lead screw. The first circuit board material handling assembly 43 is connected to a first film handling assembly 46, and the second circuit board material handling assembly 44 is connected to a second film handling assembly 47. The first circuit board picking assembly 43 and the second circuit board picking assembly 44 respectively pick up the circuit board on both sides of the circuit board. With the cooperation of the robot arm 41, the circuit board is picked up from the circuit board feeding mechanism 2 and transferred to the top of the isolation film feeding mechanism 3. The first film picking assembly 46 and the second film picking assembly 47 pick up the isolation film. At this time, the isolation film and the circuit board are picked up at the same time, and the isolation film is located below the circuit board. Then the stacking operation can be performed.

[0030] Both the first circuit board picking assembly 43 and the second circuit board picking assembly 44 include a first picking bracket 43142 connected to the picking drive assembly 45, a first profile 432 connected to the first picking bracket 43142, and a plurality of first suction nozzles 433 disposed at the bottom of the first profile 432. An air tube is provided inside the first profile 432, and the first suction nozzles 433 are connected to the air tube, which is in turn connected to an air pump.

[0031] The first profile 432 is provided with a first material-picking drive 434. The output end of the first material-picking drive 434 is connected to a lifting bracket 437. A movable clamping member 435 is rotatably connected to the bottom of the lifting bracket 437. The lifting bracket 437 is provided with a second material-picking drive 436 for driving the movable clamping member 435 to rotate. The lifting bracket 437 is also provided with a fixed clamping member that matches the movable clamping member 435. When the second material-picking drive 436 drives the movable clamping member 435 to rotate, the movable clamping member 435 moves closer to or away from the fixed clamping member, thereby realizing a clamping or releasing action. When removing the circuit board, it is first adsorbed by the first suction nozzle 433. Then, the entire circuit board leaves the circuit board feeding mechanism 2. The first picking drive 434 drives the lifting bracket 437 to move downward, and the second picking drive 436 drives the movable clamping member 435 to rotate toward the fixed clamping member, clamping the circuit board. At this time, the top surface of the circuit board is adsorbed by the first suction nozzle 433, and the edges are clamped by the fixed clamping member and the movable clamping member 435, making the circuit board more stable during movement and preventing it from falling off. The first picking drive 434, the lifting bracket 437, the movable clamping member 435, the second picking drive 436, and the fixed clamping member constitute a clamping assembly. In this embodiment, four clamping assemblies are provided. The first profile 432 of the first circuit board picking assembly 43 is provided with two clamping assemblies, and the first profile 432 of the second circuit board picking assembly 44 is provided with two clamping assemblies.

[0032] Both the first film-taking assembly 46 and the second film-taking assembly 47 include a third material-taking drive 461, a second profile 462 connected to the output end of the third material-taking drive 461, and a plurality of second suction nozzles 463 disposed at the bottom of the second profile 462. An air tube is pre-installed within the second profile 462, and the second suction nozzles 463 are connected to the air tube. In this embodiment, the third material-taking drive 461 is connected to the first profile 432. Two first film-taking assemblies 46 are disposed on the first profile 432, respectively located at both ends of the first profile 432 near the first circuit board material-taking assembly 43. The second film-taking assembly 47 is disposed similarly, thus corresponding to the four corners of the release liner and ensuring stable adsorption of the release liner.

[0033] The circuit board isolation film device includes a board take-up mechanism 5, which includes a take-up conveyor roller group 51 connected to the frame 1, a take-up drive assembly 52 for driving the take-up conveyor roller group 51, and a take-up frame 53. The take-up conveyor roller group 51 can be connected to a conveyor belt for easy transport of the take-up frame 53.

[0034] A release liner feeding mechanism 3 is mounted on the frame 1 and located on one side of the circuit board feeding mechanism 2. The release liner feeding mechanism 3 includes a feeding base 31 connected to the frame 1, a lifting assembly 32 mounted on the feeding base 31, membrane adsorption assemblies 33 on both sides of the lifting assembly 32, and membrane support assemblies 34 on both sides of the lifting assembly 32. The membrane support assemblies 34 are movably connected to the feeding base 31, and the feeding base 31 is provided with a membrane driving assembly 35 for driving the membrane support assemblies 34 to move.

[0035] The membrane adsorption assembly 33 includes a first support 331 mounted on the feeding base 31, a first suction cylinder 332 mounted on the first support 331, a second suction cylinder 333 connected to the output end of the first suction cylinder 332, and a third suction nozzle 334 connected to the second suction cylinder 333. The first suction cylinder 332 drives the second suction cylinder 333 to move towards the lifting assembly 32. Then, the output end of the second suction cylinder 333 moves downward, and the third suction nozzle 334 adsorbs the release liner. Afterward, the second suction cylinder 333 returns to its original position. The third suction nozzle 334 can be a shaking nozzle, which shakes during the adsorption of the release liner to prevent the release liner from sticking together and ensures that only one release liner is removed at a time.

[0036] The diaphragm support assembly 34 includes a second bracket 341 connected to the feeding base 31, a material support member 342 on the second bracket 341, and a suction cup 343 on the material support member 342. The diaphragm driving assembly 35 drives the second bracket 341 closer to the lifting assembly 32, so that the material support member 342 reaches below the third suction nozzle 334. At this time, the third suction nozzle 334 lowers the isolation film, the suction cup 343 picks up the isolation film, and then the first suction cylinder 332 resets, waiting for the material stacking mechanism 4 to remove the diaphragm.

[0037] The lifting assembly 32 includes a fixed plate 321 disposed on the base, a lifting platform 322 movably connected to the fixed plate 321, and a lifting drive component 323 disposed on the fixed plate 321 for driving the lifting platform 322 to move. An insulating film is stacked on the lifting platform 322; as the insulating film is gradually removed, the lifting drive component 323 gradually drives the lifting platform 322 to rise.

[0038] In actual operation, the circuit board feeding mechanism 2 conveys circuit boards to the pick-up point. The robotic arm 41 of the pick-up and stacking mechanism 4 controls the first circuit board pick-up component 43 and the second circuit board pick-up component 44 to pick up the circuit boards. At this time, the diaphragm adsorption component 33 of the release film feeding mechanism 3 picks up a sheet of release film and places it on the diaphragm carrying component 34. The robotic arm 41 controls the first film picking component 46 and the second film picking component 47 to move above the release film and adsorb it. Then, under the control of the robotic arm 41, the release film and the circuit board are transferred to the board receiving mechanism 5. First, the release film is placed on the board receiving rack 53, and then the circuit board is placed on the board receiving rack 53, completing one stacking of the release film and the circuit board. After that, the robotic arm 41 returns to the initial position and begins the next stacking action.

[0039] The material handling and stacking mechanism 4 of this invention can pick up the circuit board at the circuit board feeding mechanism 2, then remove the isolation film at the isolation film feeding mechanism 3, and simultaneously place the circuit board and isolation film at the board receiving mechanism 5. This achieves simultaneous placement of the isolation film during the stacking process, eliminating the need for manual operation, improving work efficiency, and reducing costs. Furthermore, with the cooperation of the diaphragm support assembly, diaphragm support assembly 34, and lifting assembly 32, the isolation film feeding mechanism 3 ensures that only one isolation film is provided at a time, avoiding the situation of stacking multiple isolation films at once.

[0040] In the description of this utility model, it should be understood that the indicated orientation or positional relationship is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this utility model and simplifying the description, and is not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0041] Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0042] In this utility model, unless otherwise explicitly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0043] Although the description of this utility model has been given in conjunction with the specific embodiments described above, it is obvious to those skilled in the art that many substitutions, modifications, and variations can be made based on the above description. Therefore, all such substitutions, modifications, and variations are included within the scope of the appended claims.

Claims

1. A device for applying a release liner on a circuit board, characterized in that, include: frame; A circuit board feeding mechanism is mounted on the frame; A release liner feeding mechanism is provided on the frame and is located on one side of the circuit board feeding mechanism. The material picking and stacking mechanism includes a robotic arm connected to the frame, a material picking bracket connected to the robotic arm, a first circuit board picking component and a second circuit board picking component disposed on the material picking bracket, and a material picking drive component disposed on the material picking bracket. The material picking drive component drives the first circuit board picking component and the second circuit board picking component to move closer to or further away from each other. The first circuit board picking component is connected to a first film picking component, and the second circuit board picking component is connected to a second film picking component.

2. The circuit board insulating film device according to claim 1, characterized in that, Both the first circuit board picking assembly and the second circuit board picking assembly include a first picking bracket connected to the picking drive assembly, a first profile connected to the first picking bracket, and a plurality of first suction nozzles disposed at the bottom of the first profile.

3. The circuit board insulating film device according to claim 2, characterized in that, The first profile is provided with a first material picking drive, the output end of the first material picking drive is connected to a lifting bracket, the bottom of the lifting bracket is rotatably connected to a movable clamping member, and the lifting bracket is provided with a second material picking drive for driving the movable clamping member to rotate.

4. The circuit board insulating film device according to claim 1, characterized in that, Both the first film-taking assembly and the second film-taking assembly include a third material-taking drive, a second profile connected to the output end of the third material-taking drive, and a plurality of second suction nozzles disposed at the bottom of the second profile.

5. The circuit board insulating film device according to claim 1, characterized in that, The circuit board isolation film device includes a board take-up mechanism, which includes a take-up conveyor roller group connected to the frame, a take-up drive assembly for driving the take-up conveyor roller group, and a take-up frame.

6. The circuit board insulating film device according to claim 1, characterized in that, The circuit board feeding mechanism includes a feeding rack connected to the frame, a circuit board conveying assembly disposed on the feeding rack, and a conveying drive for driving the circuit board conveying wheel assembly.

7. The circuit board insulating film device according to claim 1, characterized in that, The separating film feeding mechanism includes a feeding base connected to the frame, a lifting component disposed on the feeding base, a diaphragm adsorption component disposed on both sides of the lifting component, a diaphragm carrying component disposed on both sides of the lifting component, the diaphragm carrying component and the feeding base being movably connected, and the feeding base being provided with a diaphragm driving component for driving the diaphragm carrying component to move.

8. The circuit board insulating film device according to claim 7, characterized in that, The diaphragm adsorption assembly includes a first bracket disposed on the feeding base, a first suction cylinder disposed on the first bracket, a second suction cylinder connected to the output end of the first suction cylinder, and a third suction nozzle connected to the second suction cylinder.

9. The circuit board insulating film device according to claim 7, characterized in that, The diaphragm support assembly includes a second bracket connected to the feeding base, a material support member on the second bracket, and a suction cup on the material support member.

10. The circuit board insulating film device according to claim 7, characterized in that, The lifting assembly includes a fixed plate disposed on the base, a lifting platform movably connected to the fixed plate, and a lifting drive component disposed on the fixed plate for driving the lifting platform to move.

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