Copper deposition equipment for circuit board processing

Abstract

The utility model discloses copper deposition equipment for circuit board processing, which relates to the technical field of copper deposition equipment for circuit boards and comprises a deposition bin, a protective cover is arranged above the deposition bin, a stirring rod is arranged at the bottom end in the deposition bin, a plurality of groups of stirring blades are arranged on two sides of the stirring rod, and the stirring blades are arranged in the deposition bin. A movable plate is arranged at the top of the interior of the protective cover, a hanging frame is arranged below the movable plate, hanging plates are arranged on the two sides of the bottom of the hanging frame, limiting grooves are formed in the upper surfaces of the hanging plates, a movable groove is formed in the movable plate, and a movable seat is arranged in the movable groove; according to the scheme, the problem that the deposition quality is affected due to the fact that uneven conditions are prone to occurring in the deposition process of circuit board copper deposition equipment in the prior art is solved.

Description

Technical Field

[0001] This utility model relates to the technical field of copper plating equipment for circuit boards, specifically a copper plating equipment for circuit board processing. Background Technology

[0002] In the production process of printed circuit boards, vias need to be made to achieve interconnection between layers. The making of vias involves copper plating and electroplating processes. A copper plating equipment for circuit boards is a special equipment used to deposit a layer of copper on a circuit board.

[0003] For example, the Chinese authorized patent (Circuit Board Copper Plating Equipment) with announcement number CN220254795U includes a surface treatment assembly for surface treatment of circuit boards. The circuit board copper plating equipment also includes a feeding device disposed upstream of the surface treatment assembly. The feeding device includes a first frame, a pusher, and a first drive. The first frame is provided with a first unpowered roller track for transporting circuit boards. The pusher is movably disposed on the first frame and is provided with a limiting groove for side insertion of the circuit board, so that the circuit board can be driven by the pusher to move along the first unpowered roller track to feed into the surface treatment assembly. The first drive is mounted on the first frame and driven by the pusher, which can increase the feeding efficiency of the feeding device in the circuit board copper plating equipment.

[0004] However, the copper plating equipment for circuit boards mentioned above is prone to uneven deposition during the deposition process, which affects the deposition quality. Therefore, it does not meet the current requirements. In response, we propose a copper plating equipment for circuit board processing. Utility Model Content

[0005] The purpose of this invention is to provide a copper plating equipment for circuit board processing, so as to solve the problem mentioned in the background art that the copper plating equipment for circuit boards is prone to uneven deposition during the deposition process, thereby affecting the deposition quality.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a copper plating equipment for circuit board processing, including a deposition chamber, a protective cover above the deposition chamber, a stirring rod at the bottom inside the deposition chamber, stirring blades on both sides of the stirring rod, and several sets of stirring blades, a movable plate at the top inside the protective cover, a hanging frame below the movable plate, hanging plates on both sides of the bottom of the hanging frame, and a limit groove on the upper surface of the hanging plate.

[0007] Preferably, the movable plate has a movable groove inside, and the movable groove has a movable seat inside, with the movable seat slidably connected to the inside of the movable groove.

[0008] Preferably, a cylinder is provided above the movable seat, and a telescopic rod is provided at the bottom of the movable seat.

[0009] Preferably, the hanging plate is provided with a hanging basket, and both sides of the upper surface of the hanging basket are provided with hanging rods, which are inserted into the limiting groove.

[0010] Preferably, the hanging basket is provided with a support plate inside, and the front and rear end faces of the hanging basket are provided with limit plates.

[0011] Preferably, a motor is provided on one end face of the sedimentation chamber, a control panel is provided on the front end face of the sedimentation chamber, and two drain ports are provided on both sides of the bottom of the front end face of the sedimentation chamber.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] 1. This utility model incorporates a stirring rod and stirring blade at the bottom of the deposition chamber. A solution containing copper ions is poured into the chamber as a plating solution, and a reducing agent is added to trigger a redox reaction. The reducing agent reacts with the copper ions. Simultaneously, a motor drives the stirring rod and stirring blade to rotate, ensuring uniform mixing of the copper plating solution, removing air bubbles generated during the reaction, guaranteeing the quality of the copper plating, generating metallic copper, and depositing it onto the circuit board substrate. This ensures uniform distribution of copper ions in the copper plating solution, solving the problem of uneven deposition that easily occurs in existing circuit board copper plating equipment, thus affecting the deposition quality.

[0014] 2. By setting limiting grooves on the hanging plate of the hanger, the hanging basket is connected to the limiting grooves on the hanging plate by using the hanging rod, which ensures the stability of the hanging basket when it is hung. In addition, multiple sets of limiting grooves are set so that it can adapt to hanging baskets of various sizes. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of the copper plating equipment for circuit board processing according to this utility model;

[0016] Figure 2 This is an enlarged schematic diagram of the hanging frame structure of this utility model;

[0017] Figure 3 This is an enlarged schematic diagram of the stirring rod structure of this utility model;

[0018] Figure 4 This is an enlarged schematic diagram of the hanging basket structure of this utility model;

[0019] In the diagram: 1. Sedimentation chamber; 2. Protective cover; 3. Motor; 4. Drain outlet; 5. Control panel; 6. Movable plate; 7. Movable trough; 8. Movable seat; 9. Cylinder; 10. Telescopic rod; 11. Hanger; 12. Hanging plate; 13. Limiting groove; 14. Stirring rod; 15. Stirring blade; 16. Hanging basket; 17. Hanging rod; 18. Support plate; 19. Limiting plate. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0021] Please see Figure 1-4 This utility model provides an embodiment of a copper plating equipment for circuit board processing, including a deposition chamber 1, a protective cover 2 above the deposition chamber 1, a stirring rod 14 at the bottom inside the deposition chamber 1, stirring blades 15 on both sides of the stirring rod 14, and several sets of stirring blades 15. A movable plate 6 is provided at the top inside the protective cover 2, a hanger 11 is provided below the movable plate 6, and hanging plates 12 are provided on both sides of the bottom of the hanger 11. A limiting groove 13 is provided on the upper surface of the hanging plate 12. In use, because the stirring rod 14 and stirring blades 15 are provided at the bottom inside the deposition chamber 1, a solution containing copper ions is poured into the deposition chamber 1 as a plating solution, and a reducing agent is added to trigger a redox reaction. It reacts with copper ions. During the reaction, the motor 3 drives the stirring rod 14 and stirring blade 15 to rotate, ensuring that the copper plating solution is uniformly mixed, removing the bubbles generated by the reaction, ensuring the quality of copper plating, generating metallic copper and depositing it on the circuit board substrate, ensuring that the copper ions in the copper plating solution are uniformly distributed, and solving the problem that the existing circuit board copper plating equipment is prone to unevenness during the deposition process, thus affecting the deposition quality. In addition, by setting the limiting groove 13 on the hanging plate 12 of the hanging frame 11, the hanging basket 16 is connected to the limiting groove 13 on the hanging plate 12 by the hanging rod 17, ensuring the stability of the hanging basket 16 when hanging. Moreover, multiple sets of limiting grooves 13 are set so that it can adapt to hanging baskets 16 of various sizes.

[0022] Please see Figures 1-4 The movable plate 6 has a movable groove 7 inside, and the movable groove 7 has a movable seat 8 inside, which is slidably connected to the movable groove 7.

[0023] Please see Figures 1-4 A cylinder 9 is installed above the movable seat 8, and a telescopic rod 10 is installed at the bottom of the movable seat 8.

[0024] Please see Figures 1-4A hanging basket 16 is provided on the hanging plate 12, and hanging rods 17 are provided on both sides of the upper surface of the hanging basket 16. The hanging rods 17 are plugged into the limiting groove 13.

[0025] Please see Figures 1-4 The hanging basket 16 has a support plate 18 inside, and the front and rear end faces of the hanging basket 16 are provided with limit plates 19. The hanging basket 16 is connected to the limit groove 13 on the hanging plate 12 by the hanging rod 17, which ensures the stability of the hanging basket 16 when it is hung. In addition, multiple sets of limit grooves 13 are provided so that it can adapt to hanging baskets 16 of various sizes.

[0026] Please see Figures 1-4 A motor 3 is installed on one end face of the deposition chamber 1, and a control panel 5 is installed on the front end face of the deposition chamber 1. Drainage ports 4 are installed on both sides of the bottom of the front end face of the deposition chamber 1. There are two drainage ports 4. A solution containing copper ions is poured into the interior of the deposition chamber 1 as a plating solution, and a reducing agent is added to trigger a redox reaction. The reducing agent reacts with the copper ions. At the same time, the motor 3 drives the stirring rod 14 and the stirring blade 15 to rotate, ensuring that the copper plating solution is uniformly mixed, removing the bubbles generated by the reaction, ensuring the quality of copper plating, generating metallic copper and depositing it on the circuit board substrate, ensuring that the copper ions in the copper plating solution are uniformly distributed, and solving the problem that unevenness is easy to occur during the deposition process in the existing circuit board copper plating equipment, thus affecting the deposition quality.

[0027] Working Principle: During use, a stirring rod 14 and stirring blade 15 are installed at the bottom of the deposition chamber 1. A solution containing copper ions is poured into the deposition chamber 1 as the plating solution, and a reducing agent is added to trigger a redox reaction. The reducing agent reacts with the copper ions. Simultaneously, the motor 3 drives the stirring rod 14 and stirring blade 15 to rotate, ensuring uniform mixing of the copper plating solution, removing air bubbles generated during the reaction, ensuring the quality of the copper plating, generating metallic copper and depositing it on the circuit board substrate. This ensures uniform distribution of copper ions in the copper plating solution, solving the problem of uneven deposition that easily occurs during the deposition process in existing circuit board copper plating equipment, thus affecting the deposition quality. Furthermore, it also... By setting a limiting groove 13 on the hanging plate 12 of the hanging bracket 11, the hanging basket 16 is connected to the limiting groove 13 on the hanging plate 12 by using the hanging rod 17, which ensures the stability of the hanging basket 16 when it is hung. Moreover, multiple sets of limiting grooves 13 are set so that they can adapt to hanging baskets 16 of various sizes. The copper plating process forms a uniform copper layer on the substrate through a chemical reaction, which improves the conductivity and reliability of the circuit board. Furthermore, by using activated palladium as the copper bonding medium layer for the hole wall, copper ions are deposited by embedding in the hole wall, which increases the bonding force between the hole wall and the resin and the inner copper layer, improves the peel strength, and can withstand high temperature and wide temperature range environmental changes, ensuring smooth power transmission of the circuit board.

[0028] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A copper deposition apparatus for circuit board processing, comprising a deposition tank (1), characterized in that: A protective cover (2) is provided above the sedimentation chamber (1). A stirring rod (14) is provided at the bottom inside the sedimentation chamber (1). Stirring blades (15) are provided on both sides of the stirring rod (14). Several sets of stirring blades (15) are provided. A movable plate (6) is provided at the top inside the protective cover (2). A hanging frame (11) is provided below the movable plate (6). Hanging plates (12) are provided on both sides of the bottom of the hanging frame (11). A limit groove (13) is provided on the upper surface of the hanging plate (12).

2. The copper plating equipment for circuit board processing according to claim 1, characterized in that: The movable plate (6) has a movable groove (7) inside, and a movable seat (8) is provided inside the movable groove (7). The movable seat (8) is slidably connected to the movable groove (7).

3. The copper plating equipment for circuit board processing according to claim 2, characterized in that: A cylinder (9) is provided above the movable seat (8), and a telescopic rod (10) is provided at the bottom of the movable seat (8).

4. The copper plating equipment for circuit board processing according to claim 3, characterized in that: A hanging basket (16) is provided on the hanging plate (12), and hanging rods (17) are provided on both sides of the upper surface of the hanging basket (16). The hanging rods (17) are inserted into the limiting groove (13).

5. The copper plating equipment for circuit board processing according to claim 4, characterized in that: The hanging basket (16) is provided with a support plate (18) inside, and the front and rear end faces of the hanging basket (16) are provided with limit plates (19).

6. The copper plating equipment for circuit board processing according to claim 5, characterized in that: A motor (3) is provided on one end face of the sedimentation chamber (1), and a control panel (5) is provided on the front end face of the sedimentation chamber (1).

7. The copper plating equipment for circuit board processing according to claim 6, characterized in that: The sedimentation chamber (1) has two drain ports (4) on both sides of the bottom of the front end face.

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