Intelligent terminal core board heat dissipation device

Abstract

The utility model relates to the technical field of intelligent terminal core board heat dissipation, in particular to an intelligent terminal core board heat dissipation device which comprises a core board, an interface board, a heat dissipation piece, a heat dissipation support and a shell. An interface board is arranged above the core board, a wiring mode of the core board and the interface board adopts stamp hole packaging, a heat dissipation piece and a heat dissipation support are arranged at the bottom of the core board, and the heat dissipation support extends to the bottom of the shell; according to the intelligent terminal core board heat dissipation device provided by the utility model, the temperature of the core board can be quickly conducted to the surface of a whole machine, and the core temperature of the CPU of the core board is effectively reduced, so that the heat dissipation effect is enhanced. The interface of the core board is designed by adopting the stamp hole, so that the automatic production of the core board is facilitated, the product reliability and the production efficiency are improved, the production time is reduced, the effective heat dissipation area of the core board is synchronously increased, and the temperature of the core board is further reduced to achieve the heat dissipation effect.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology for smart terminal core boards, and in particular to a heat dissipation device for smart terminal core boards. Background Technology

[0002] Existing core boards only use heatsinks for heat dissipation, which does not optimize CPU temperature reduction. Since the entire system lacks convection vents, simply adding heatsinks cannot transfer heat to the terminal casing, resulting in insignificant heat dissipation. Furthermore, the existing core board and interface board use a socket interface design, which is not conducive to automated production and increases the risk of product failure. The low heat dissipation efficiency is also detrimental to core board heat dissipation. Patent application number 202121991485.7 discloses a core board with heat dissipation function, which discloses a heat dissipation layer including a heatsink, heatsink strips, and a heat sink, using heatsink strips for heat dissipation. However, this method cannot effectively reduce the CPU temperature of the core board. Utility Model Content

[0003] In order to solve the problems existing in the prior art, this utility model provides a heat dissipation device for the core board of a smart terminal.

[0004] To achieve the above objectives, this utility model proposes a heat dissipation device for a smart terminal core board, comprising: a core board, an interface board, a heat sink, a heat dissipation bracket, and a housing; the interface board is located on top of the core board, and the connection between the core board and the interface board is achieved through a stamp-hole encapsulation; the heat sink and the heat dissipation bracket are located at the bottom of the core board, with the heat dissipation bracket extending to the bottom of the housing. By setting up the heat sink and heat dissipation bracket, the temperature of the core board can be quickly conducted to the surface of the entire device, thereby reducing the core temperature of the CPU more quickly and effectively, thus enhancing the heat dissipation effect. Furthermore, the use of stamp-hole encapsulation facilitates automated production of the core board, improving product reliability and production efficiency, reducing production time, and simultaneously increasing the effective heat dissipation area of ​​the core board, further reducing the temperature of the core board to achieve the desired heat dissipation effect.

[0005] As an optional implementation, in the heat dissipation device for the core board of the intelligent terminal provided by this utility model, the heat dissipation bracket is connected to the outer shell by screws. The heat dissipation bracket is fixed to the outer shell to provide a fixing function.

[0006] As an optional implementation, in the heat dissipation device for the core board of the intelligent terminal provided by this utility model, a shielding cover is provided on the core board. By setting the shielding cover, the protection performance of the core board is enhanced.

[0007] As an optional implementation, in the heat dissipation device for the core board of the smart terminal provided by this utility model, the heat dissipation component includes a plurality of vertically arranged heat dissipation fins to enhance the heat dissipation effect.

[0008] As an optional implementation, in the heat dissipation device for the core board of the intelligent terminal provided by this utility model, the core board is provided with multiple peripheral interfaces, which can connect more functional modules and realize more functional requirements.

[0009] As an optional implementation, in the heat dissipation device for the core board of the intelligent terminal provided by this utility model, the outer shell is provided with multiple interface cards, which are used to install and fix the interface board.

[0010] Compared with existing technologies, the beneficial effects of this utility model's technical solution are as follows: The intelligent terminal core board heat dissipation device provided by this utility model has an interface board on top of the core board and a heat sink and heat dissipation bracket at the bottom of the core board. The heat dissipation bracket extends to the bottom of the outer casing, accelerating the heat dissipation of the core board's temperature to the terminal casing. It can quickly conduct the core board's temperature to the entire surface of the device, rapidly and effectively reducing the core temperature of the CPU on the core board, thereby enhancing the heat dissipation effect. In addition, the wiring method between the core board and the interface board adopts stamp hole encapsulation. Compared with the use of a socket method, the stamp hole design of the core board's interface is conducive to the automated production of the core board, improving product reliability and production efficiency, reducing production time, and simultaneously increasing the effective heat dissipation area of ​​the core board, further reducing the core board's temperature to achieve the heat dissipation effect. Attached Figure Description

[0011] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0012] Figure 1 A schematic diagram of the heat dissipation device for the core board of the intelligent terminal provided by this utility model;

[0013] Figure 2 A schematic diagram showing the connection between the core board and the interface board of the heat dissipation device for the core board of the intelligent terminal provided by this utility model.

[0014] [Explanation of Labels in the Attached Image]

[0015] 1. Core board; 2. Interface board; 3. Heat sink; 31. Heat sink; 4. Heat sink bracket; 5. Outer shell; 6. Stamp hole. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0017] It should be noted that all directional indications in this utility model embodiment, such as first, second, up, down, left, right, front, back, etc., are only used to explain the relative positional relationship and movement of the components in a specific posture as shown in the attached figure. If the specific posture changes, the directional indication will also change accordingly.

[0018] Furthermore, the technical solutions of the various embodiments of this utility model can be combined with each other, but only if they are based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0019] This utility model provides a heat dissipation device for the core board of a smart terminal, such as... Figure 1 and Figure 2 As shown, it includes: a core board 1, an interface board 2, a heat sink 3, a heat sink bracket 4, and a housing 5. The interface board is located on top of the core board, and the connection between the core board and the interface board is sealed using a stamp hole. The heat sink and the heat sink bracket are located at the bottom of the core board, and the heat sink bracket extends to the bottom of the housing 5. By setting the heat sink 3 and the heat sink bracket 4, with the heat sink bracket 4 extending to the bottom of the housing 5, the temperature of the core board 1 can be quickly conducted to the surface of the entire machine, which can more quickly and effectively reduce the core temperature of the CPU on the core board, thereby enhancing the heat dissipation effect. In addition, the stamp hole sealing method for the connection between the core board and the interface board is conducive to the automated production of the core board 1, improving product reliability and production efficiency, reducing production time, and simultaneously increasing the effective heat dissipation area of ​​the core board 1, further reducing the temperature of the core board 1 to achieve the heat dissipation effect. The new heat dissipation method reduces the core temperature of the CPU on the core board. The use of the stamp hole 6 interface facilitates the automated production of the core board 1, improves product reliability and production efficiency, reduces production time, and simultaneously increases the heat dissipation area of ​​the core board 1, effectively reducing the temperature rise of the core board 1.

[0020] like Figure 1 As shown, in the heat dissipation device for the core board of the intelligent terminal provided by this utility model, the heat dissipation bracket 4 is connected to the outer shell 5 by screws. The heat dissipation bracket 4 is fixed to the outer shell 5 to provide a fixing function.

[0021] Furthermore, in the heat dissipation device for the core board of the intelligent terminal provided by this utility model, a shielding cover is provided on the core board 1. By setting the shielding cover, the protective performance of the core board 1 is enhanced.

[0022] like Figure 1 As shown, in the heat dissipation device for the core board of the smart terminal provided by this utility model, the heat dissipation component 3 includes a plurality of vertically arranged heat dissipation fins 31 to enhance the heat dissipation effect.

[0023] In addition, in the heat dissipation device of the core board of the smart terminal provided by this utility model, the core board 1 is provided with multiple peripheral interfaces, which can connect more functional modules and realize more functional requirements.

[0024] Furthermore, in the heat dissipation device for the core board of the intelligent terminal provided by this utility model, the outer shell 5 is provided with a plurality of interface cards, which are used to install and fix the interface board 2.

[0025] It should be understood that the above description of the specific embodiments of this utility model is only for illustrating the technical route and features of this utility model, and its purpose is to enable those skilled in the art to understand the content of this utility model and implement it accordingly. However, this utility model is not limited to the specific embodiments described above. All changes or modifications made within the scope of the claims of this utility model should be covered by the protection scope of this utility model.

Claims

1. A heat dissipation device for a smart terminal core board, characterized in that, It includes a core board (1), an interface board (2), a heat sink (3), a heat sink bracket (4), and a housing (5); the interface board (2) is provided on the top of the core board (1), the connection between the core board (1) and the interface board (2) is sealed with a stamp hole, the heat sink and the heat sink bracket (4) are provided at the bottom of the core board (1), and the heat sink bracket (4) extends to the bottom of the housing (5).

2. The heat dissipation device for the core board of the intelligent terminal according to claim 1, characterized in that, The heat dissipation bracket (4) is connected to the outer shell (5) by screws.

3. The heat dissipation device for the core board of the intelligent terminal according to claim 1, characterized in that, The core board (1) is provided with a shielding cover.

4. The heat dissipation device for the core board of the intelligent terminal according to claim 1, characterized in that, The heat sink (3) includes a plurality of vertically arranged heat sinks (31).

5. The heat dissipation device for the core board of a smart terminal according to claim 1, characterized in that, The core board (1) is equipped with multiple peripheral interfaces.

6. The heat dissipation device for the core board of a smart terminal according to claim 1, characterized in that, The outer shell (5) is provided with multiple interface cards, which are used to install and fix the interface board (2).

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