Shielding case

Abstract

The embodiment of the utility model provides a shielding case. The shield case includes: a substrate; a through hole is formed in the substrate; a plurality of side plates; the side plates are arranged along the circumferential edge of the base plate and protrude out of the surface of the base plate. The substrate and the plurality of side plates are enclosed to form an accommodating space, and the at least one electronic component is accommodated in the accommodating space, so that the at least one electronic component is covered; the through hole is communicated with the accommodating space, so that one part of the electronic element accommodated in the accommodating space penetrates through the through hole and extends out of the accommodating space; a plurality of groups of grounding parts; the plurality of groups of grounding components are arranged along the circumferential edge of the through hole and abut against the circumferential side surface of the electronic component accommodated in the accommodating space. The grounding component of the shielding case is abutted against the side surface of the electronic component accommodated in the accommodating space, so that the electronic component is grounded, the shielding case can realize grounding protection, and the electronic component is prevented from being damaged due to no grounding.

Description

Technical Field

[0001] This utility model relates to the field of shielding technology, and in particular to a shielding cover that uses a contact spring to abut the side of an electronic component to achieve grounding, thereby providing grounding protection for the electronic component. Background Technology

[0002] Shielding covers are mainly used in electronic products such as mobile phones and GPS devices to prevent electromagnetic interference and to shield electronic components on PCB boards (Printed Circuit Boards).

[0003] Currently, traditional shielding covers only serve a basic protective function, which includes at least: preventing electromagnetic interference (for example, shielding covers can shield electronic components on PCBs), preventing electronic components from being damaged by external forces (i.e., most electronic components are very fragile and therefore easily damaged by external forces; while shielding covers are generally made of metal, so they usually have excellent toughness and impact resistance, thus effectively preventing electronic components from being damaged by external forces), and preventing electronic components from being damaged by stress (the shielding cover has a supporting function, which can prevent stress factors from damaging electronic components).

[0004] In existing technologies, there is no contact between the traditional shielding cover and the electronic components, resulting in the electronic components not being grounded. This can cause damage to the electronic components due to discharge, short circuits, and other reasons, thereby reducing the reliability of the entire PCB board. Utility Model Content

[0005] The shielding cover provided by this utility model aims to solve at least some of the defects of existing shielding covers.

[0006] This utility model provides a shielding cover. The shielding cover is disposed on a PCB board having a plurality of electronic components; the shielding cover includes:

[0007] Substrate; the substrate has through holes;

[0008] A plurality of side plates; the plurality of side plates are disposed along the circumferential edge of the substrate and protrude from the surface of the substrate; the end of the side plate away from the substrate abuts against the surface of the PCB board;

[0009] The substrate and the plurality of the side plates enclose a receiving space, and at least one of the electronic components is housed inside the receiving space so that at least one of the electronic components is covered.

[0010] The through hole is connected to the receiving space so that a portion of the electronic component housed inside the receiving space extends through the through hole to the outside of the receiving space;

[0011] Several sets of grounding components; several sets of said grounding components are arranged along the circumferential edge of said through hole and abut against the circumferential side surface of the electronic component housed inside said receiving space.

[0012] In some embodiments, the plurality of side plates and the plurality of grounding components are all formed by stamping at least a portion of the substrate and are integral with the substrate.

[0013] In some embodiments, each of the electronic components has a mounting portion and a contact portion; one end of the mounting portion abuts against the surface of the PCB board, and the other end abuts against the contact portion;

[0014] The end of the contact portion away from the mounting portion extends through the through hole toward the outside of the receiving space.

[0015] In some embodiments, the through-hole has a shape and size adapted to the contact portion of an electronic component housed within the receiving space.

[0016] In some embodiments, each group of grounding components includes:

[0017] A plurality of contact springs; one end of each contact spring is connected to the edge of the through hole, and the other end abuts against the contact portion of an electronic component housed within the receiving space;

[0018] The contact spring has an elastic force, and the elastic force can restrict the other end of the contact spring from moving toward the edge of the through hole.

[0019] In some embodiments, when the contact spring provides the elastic force, the other end of the contact spring may be in close contact with the side of the contact portion of the electronic component housed within the receiving space.

[0020] In some embodiments, the contact spring includes:

[0021] First bend, elastic arm, second bend, and contact arm;

[0022] One end of the first bend is connected to the edge of the through hole, and the other end is connected to the elastic arm;

[0023] The end of the elastic arm away from the first bending portion extends away from the substrate and away from the side plate, and extends into the receiving space;

[0024] One end of the second bend is connected to the end of the elastic arm away from the first bend, and the other end is connected to the contact arm;

[0025] The end of the contact arm away from the second bend extends in a direction away from the substrate and close to the side plate, and is located inside the receiving space.

[0026] In some embodiments, both the elastic arm and the contact arm are straight, and both the first bend and the second bend are arc-shaped.

[0027] In some embodiments, the first bending portion has a first arc surface and a second arc surface;

[0028] The first arc surface has a first radial dimension, and the second arc surface has a second radial dimension; the first radial dimension is smaller than the second radial dimension;

[0029] The first arc surface is connected to the inner surface of the substrate, and the second arc surface is connected to the outer surface of the substrate;

[0030] The inner surface of the substrate is located inside the receiving space, and the outer surface of the substrate is located outside the receiving space.

[0031] In some embodiments, the second bending portion has a third arc surface and a fourth arc surface;

[0032] The third arc surface has a third radial dimension, and the fourth arc surface has a fourth radial dimension; the third radial dimension is smaller than the fourth radial dimension.

[0033] The third arc surface is located on the same side as the first arc surface, and the fourth arc surface is located on the same side as the second arc surface.

[0034] At least one beneficial effect of the shielding cover provided by this utility model embodiment is: a novel shielding cover is proposed, which incorporates a grounding component in its structural design, and the grounding component abuts against the side of the electronic component housed inside the containment space, so that the electronic component is grounded. This allows the shielding cover to not only prevent the electronic component from being affected by electromagnetic interference and avoid damage to the electronic component from external forces, but also to achieve grounding protection, thereby preventing damage to the electronic component due to lack of grounding, and thus improving the reliability of the entire PCB board. Attached Figure Description

[0035] One or more embodiments are illustrated by way of example with reference to the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements having the same reference numerals in the drawings are designated as the same elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0036] Figure 1 A schematic diagram of the structure when the shielding cover provided in this embodiment of the utility model is connected to the PCB board;

[0037] Figure 2 A cross-sectional view of the shielding cover connected to the PCB board according to an embodiment of this utility model;

[0038] Figure 3 A schematic diagram of the structure of the shielding cover provided in the embodiment of this utility model;

[0039] Figure 4 Provided for the embodiments of this utility model Figure 2 A magnified view of a portion at point A.

[0040] Figure label:

[0041] 100. Shielding cover; 1001. Accommodating space; 1. Substrate; 101. Through hole; 102. Inner surface; 103. Outer surface; 2. Side plate; 3. Grounding component; 31. Contact spring; 311. First bend; 312. Elastic arm; 313. Second bend; 314. Contact arm; 3111. First arc surface; 3112. Second arc surface; 3131. Third arc surface; 3132. Fourth arc surface;

[0042] 200. PCB board; 2001. Electronic components; 2002. Mounting part; 2003. Contact part. Detailed Implementation

[0043] The present invention will now be described in detail with reference to specific embodiments. It should be emphasized that the following description is merely exemplary and is not intended to limit the scope and application of the present invention.

[0044] It should be noted that, unless otherwise expressly specified and limited, the terms “axial,” “radial,” “detach,” “through,” “toward,” “along,” “extend,” “extend to,” etc., used in this specification indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. The terms "installation," "fitting," "connection," and "fixing" should be interpreted broadly. For example, "connection" can be a fixed connection or a detachable connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. "Fixing" can be bolt fixing, snap-fit ​​fixing, or glue fixing. The terms "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first," "second," "third," and "fourth" may explicitly or implicitly include one or more of that feature. "A plurality" or "several" means two or more. In addition, "and / or" includes any and all combinations of one or more of the related listed items. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances.

[0045] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0046] In this embodiment, the specific implementation of the "shielding cover" is not limited, and those skilled in the art can selectively use any suitable implementation method according to actual needs.

[0047] Figure 1 This is a schematic diagram of the structure when the shielding cover provided in this embodiment of the present invention is connected to the PCB board. Figure 2 This is a cross-sectional view of the shielding cover connected to the PCB board in an embodiment of the present invention. Figure 3 This is a schematic diagram of the structure of the shielding cover provided in an embodiment of the present utility model. Figure 4 Provided for the embodiments of this utility model Figure 2 A magnified view of a portion at point A.

[0048] Please see Figures 1-4 The shield 100 is disposed on a PCB board 200 having a plurality of electronic components 2001, and can cover at least one electronic component 2001.

[0049] Generally speaking, existing shielding covers can protect the electronic components they cover. For example, existing shielding covers can shield electronic components to prevent electromagnetic interference from adversely affecting them. Furthermore, existing shielding covers are usually made of metal, giving them excellent toughness and impact resistance, thus effectively preventing damage to electronic components caused by external forces. Additionally, existing shielding covers can also serve as support structures, increasing the mechanical strength of the PCB board and preventing damage to electronic components due to stress. In addition to the above-mentioned protective functions, this shielding cover 100 can also provide grounding protection to prevent damage to the electronic component 2001 due to the lack of grounding.

[0050] The aforementioned shield 100 includes: a base plate 1, several side plates 2, and several sets of grounding components 3.

[0051] The substrate 1 has through holes 101; several side plates 2 are arranged along the circumferential edge of the substrate 1 and protrude from the surface of the substrate 1; the end of the side plate 2 away from the substrate 1 abuts against the surface of the PCB board 200.

[0052] In addition, the substrate 1 and a plurality of side plates 2 enclose a receiving space 1001, and at least one electronic component 2001 is housed inside the receiving space 1001 so that at least one electronic component 2001 is covered.

[0053] Furthermore, the through hole 101 is connected to the receiving space 1001 so that a portion of the electronic component 2001 housed inside the receiving space 1001 extends through the through hole 101 to the outside of the receiving space 1001.

[0054] Specifically, several sets of grounding components 3 are arranged along the circumferential edge of the through hole 101 and abut against the circumferential side of the electronic component 2001 housed inside the receiving space 1001.

[0055] In some embodiments, such as Figure 1 , Figure 3 and Figure 4 As shown, several side plates 2 and several sets of grounding components 3 are all formed by stamping at least a portion of the substrate 1, and are integral with the substrate 1.

[0056] In some embodiments, combined with Figure 1 , Figure 2 and Figure 4 It is known that each electronic component 2001 has a mounting portion 2002 and a contact portion 2003; one end of the mounting portion 2002 abuts against the surface of the PCB board 200, and the other end abuts against the contact portion 2003.

[0057] It should be noted that the end of the contact portion 2003 away from the mounting portion 2002 extends through the through hole 101 toward the outside of the receiving space 1001.

[0058] In some embodiments, according to Figures 1-4 It is understood that the through hole 101 has a shape and size that are adapted to the contact portion 2003 of the electronic component 2001 housed inside the accommodating space 1001.

[0059] In some embodiments, by Figures 1-4 It can be seen that each group of grounding components 3 includes: several contact springs 31.

[0060] In each contact spring 31, one end is connected to the edge of the through hole 101, and the other end abuts against the contact portion 2003 of the electronic component 2001 housed inside the receiving space 1001.

[0061] In addition, the contact spring 31 has an elastic force, and the elastic force can restrict the other end of the contact spring 31 from moving toward the edge of the through hole 101.

[0062] In some embodiments, refer to Figure 1 , Figure 3 and Figure 4 It is known that when the contact spring 31 provides elastic force, the other end of the contact spring 31 can be closely attached to the side of the contact portion 2003 of the electronic component 2001 housed inside the receiving space 1001.

[0063] In some embodiments, please refer to Figure 3 and Figure 4 The contact spring 31 includes: a first bending portion 311, an elastic arm 312, a second bending portion 313, and a contact arm 314.

[0064] Understandably, one end of the first bend 311 is connected to the edge of the through hole 101, and the other end is connected to the elastic arm 312.

[0065] Specifically, the end of the elastic arm 312 away from the first bending portion 311 extends away from the substrate 1 and away from the side plate 2, and extends into the receiving space 1001.

[0066] It should be noted that one end of the second bend 313 is connected to the end of the elastic arm 312 away from the first bend 311, and the other end is connected to the contact arm 314.

[0067] To further explain, the end of the contact arm 314 away from the second bend 313 extends in a direction away from the substrate 1 and close to the side plate 2, and is located inside the receiving space 1001.

[0068] In this embodiment, the contact spring 31 has the aforementioned elastic force, so at least a portion of the contact arm 314 and at least a portion of the second bend 313 of the contact spring 31 can be tightly attached to the side of the contact portion 2003, so that the contact between the two is reliable, thereby improving the grounding reliability of the electronic component 2001, thereby providing more reliable grounding protection for the electronic component 2001, so as to avoid damage to the electronic component 2001 due to discharge, short circuit or other reasons, and thus improving the reliability of the entire PCB board 200.

[0069] In some embodiments, such as Figure 4 As shown, both the elastic arm 312 and the contact arm 314 are straight, and both the first bend 311 and the second bend 313 are arc-shaped.

[0070] In some embodiments, please refer to Figure 4 The first bending portion 311 has a first arc surface 3111 and a second arc surface 3112.

[0071] The first arc surface 3111 has a first radial dimension, and the second arc surface 3112 has a second radial dimension; the first radial dimension is smaller than the second radial dimension.

[0072] In addition, the first arc surface 3111 is connected to the inner surface 102 of the substrate 1, and the second arc surface 3112 is connected to the outer surface 103 of the substrate 1.

[0073] Furthermore, the inner surface 102 of the substrate 1 is located inside the receiving space 1001, and the outer surface 103 of the substrate 1 is located outside the receiving space 1001.

[0074] In some embodiments, please continue reading Figure 4 The second bending portion 313 has a third arc surface 3131 and a fourth arc surface 3132.

[0075] It is understandable that the third arc surface 3131 has a third radial dimension, and the fourth arc surface 3132 has a fourth radial dimension; the third radial dimension is smaller than the fourth radial dimension.

[0076] It should be noted that the third arc surface 3131 and the first arc surface 3111 are located on the same side, and the fourth arc surface 3132 and the second arc surface 3112 are located on the same side.

[0077] In summary, the shielding cover provided by this utility model, through the structural design of incorporating a grounding component that abuts against the side of the electronic component housed within the containment space, grounds the electronic component. This allows the shielding cover to not only prevent electromagnetic interference and damage to the electronic component from external forces, but also provide grounding protection, thus preventing damage to the electronic component due to lack of grounding and improving the overall reliability of the PCB board. Therefore, the shielding cover provided by this utility model is novel compared to traditional shielding covers.

[0078] The above description, in conjunction with specific / preferred embodiments, provides a further detailed explanation of the present invention. It should not be construed that the specific implementation of the present invention is limited to these descriptions. Those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and all of these fall within the protection scope of the present invention.

Claims

1. A shielding cover, disposed on a PCB board having a plurality of electronic components; characterized in that, include: Substrate; the substrate has through holes; A plurality of side plates; the plurality of side plates are disposed along the circumferential edge of the substrate and protrude from the surface of the substrate; the end of the side plate away from the substrate abuts against the surface of the PCB board; The substrate and the plurality of the side plates enclose a receiving space, and at least one of the electronic components is housed inside the receiving space so that at least one of the electronic components is covered. The through hole is connected to the receiving space so that a portion of the electronic component housed inside the receiving space extends through the through hole to the outside of the receiving space; Several sets of grounding components; several sets of said grounding components are arranged along the circumferential edge of said through hole and abut against the circumferential side surface of the electronic component housed inside said receiving space.

2. The shielding cover according to claim 1, characterized in that, Several of the side plates and several sets of grounding components are formed by stamping at least a portion of the substrate and are integral with the substrate.

3. The shielding cover according to claim 1, characterized in that, Each of the electronic components has a mounting portion and a contact portion; one end of the mounting portion abuts against the surface of the PCB board, and the other end abuts against the contact portion; The end of the contact portion away from the mounting portion extends through the through hole toward the outside of the receiving space.

4. The shielding cover according to claim 3, characterized in that, The through-hole has a shape and size adapted to the contact portion of the electronic component housed within the receiving space.

5. The shielding cover according to claim 3, characterized in that, Each group of grounding components includes: A plurality of contact springs; one end of each contact spring is connected to the edge of the through hole, and the other end abuts against the contact portion of an electronic component housed within the receiving space; The contact spring has an elastic force, and the elastic force can restrict the other end of the contact spring from moving toward the edge of the through hole.

6. The shielding cover according to claim 5, characterized in that, When the contact spring provides the elastic force, the other end of the contact spring can be in close contact with the side of the contact portion of the electronic component housed inside the receiving space.

7. The shielding cover according to claim 5, characterized in that, The contact spring includes: First bend, elastic arm, second bend, and contact arm; One end of the first bend is connected to the edge of the through hole, and the other end is connected to the elastic arm; The end of the elastic arm away from the first bending portion extends away from the substrate and away from the side plate, and extends into the receiving space; One end of the second bend is connected to the end of the elastic arm away from the first bend, and the other end is connected to the contact arm; The end of the contact arm away from the second bend extends in a direction away from the substrate and close to the side plate, and is located inside the receiving space.

8. The shielding cover according to claim 7, characterized in that, Both the elastic arm and the contact arm are straight, and both the first bent portion and the second bent portion are arc-shaped.

9. The shielding cover according to claim 7, characterized in that, The first bending portion has a first arc surface and a second arc surface; The first arc surface has a first radial dimension, and the second arc surface has a second radial dimension; the first radial dimension is smaller than the second radial dimension; The first arc surface is connected to the inner surface of the substrate, and the second arc surface is connected to the outer surface of the substrate; The inner surface of the substrate is located inside the receiving space, and the outer surface of the substrate is located outside the receiving space.

10. The shielding cover according to claim 9, characterized in that, The second bending portion has a third arc surface and a fourth arc surface; The third arc surface has a third radial dimension, and the fourth arc surface has a fourth radial dimension; the third radial dimension is smaller than the fourth radial dimension. The third arc surface is located on the same side as the first arc surface, and the fourth arc surface is located on the same side as the second arc surface.

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