Shielding case
By incorporating a grounding component on the PCB board, the problem of grounding components of electronic components in existing technologies being in contact with the side of the electronic components is solved, thus addressing the issue of damage caused by the lack of grounding and improving the reliability of the PCB board.
Patent Information
- Application Number
- CN202423113899.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-16
- Publication Date
- 2025-12-02
- Estimated Expiration
- 2034-12-16
AI Technical Summary
The existing shielding cover does not make contact with the electronic components, which can lead to damage to the electronic components under conditions such as discharge or short circuit, reducing the reliability of the PCB board.
Grounding components are welded onto the shielding frame to make them contact the sides of the electronic components, forming a grounding structure to prevent damage to the electronic components due to lack of grounding.
It improves the grounding protection of electronic components, prevents electromagnetic interference and external damage, and enhances the reliability of PCB boards.
Smart Images

Figure CN223626223U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of shielding technology, and in particular to a shielding cover in which a grounding component is welded to the shielding cover frame, and at least a portion of the grounding component can abut against the side of the electronic component to ground the electronic component, thereby providing ground protection for the electronic component. Background Technology
[0002] Shielding covers are mainly used in electronic products such as mobile phones and GPS devices to prevent electromagnetic interference and to shield electronic components on PCB boards (Printed Circuit Boards).
[0003] Currently, traditional shielding covers only serve a basic protective function, which includes at least: preventing electromagnetic interference (for example, shielding covers can shield electronic components on PCBs), preventing electronic components from being damaged by external forces (i.e., most electronic components are very fragile and therefore easily damaged by external forces; while shielding covers are generally made of metal, so they usually have excellent toughness and impact resistance, thus effectively preventing electronic components from being damaged by external forces), and preventing electronic components from being damaged by stress (the shielding cover has a supporting function, which can prevent stress factors from damaging electronic components).
[0004] In existing technologies, there is no contact between the traditional shielding cover and the electronic components, resulting in the electronic components not being grounded. This can cause damage to the electronic components due to discharge, short circuits, and other reasons, thereby reducing the reliability of the entire PCB board. Utility Model Content
[0005] The shielding cover provided by this utility model aims to solve at least some of the defects of existing shielding covers.
[0006] This utility model provides a shielding cover. The shielding cover is disposed on a PCB board having a plurality of electronic components; the shielding cover includes:
[0007] A shielding frame; the shielding frame is fixedly mounted on the PCB board, and an accommodating space is formed inside the shielding frame;
[0008] At least one of the electronic components is housed within the receiving space such that at least one of the electronic components is covered;
[0009] The shielding frame has a through hole at one end away from the PCB board, and the through hole is connected to the receiving space, so that a portion of the electronic components housed inside the receiving space can extend through the through hole to the outside of the receiving space.
[0010] Several grounding components are welded to the shielding frame along the circumferential edge of the through hole and located outside the receiving space; at least a portion of the grounding components may abut against the circumferential side of the electronic components housed inside the receiving space.
[0011] In some embodiments, the shielding frame includes:
[0012] A mounting plate and several upright plates; the several upright plates protrude from the surface of the mounting plate;
[0013] The through hole is formed on the mounting plate, and several of the grounding components are welded to the mounting plate;
[0014] The end of the upright plate away from the mounting plate abuts against the surface of the PCB board; the mounting plate and the several upright plates enclose the receiving space.
[0015] In some embodiments, several uprights are formed by stamping at least a portion of the mounting plate and are integral with the mounting plate.
[0016] In some embodiments, each of the electronic components has a mounting portion and a contact portion; one end of the mounting portion abuts against the surface of the PCB board, and the other end abuts against the contact portion;
[0017] The end of the contact portion away from the mounting portion extends through the through hole toward the outside of the receiving space.
[0018] In some embodiments, the through-hole has a shape and size adapted to the contact portion of an electronic component housed within the receiving space.
[0019] In some embodiments, the grounding component includes:
[0020] A base plate and several grounding springs; the base plate is welded to the mounting plate, and the several grounding springs are all connected to the base plate;
[0021] At least a portion of the grounding spring can abut against the side of the contact portion of the electronic component housed within the receiving space;
[0022] Each of the aforementioned grounding springs is formed by at least partial stamping of the base plate, and is an integral structure with the base plate.
[0023] In some embodiments, the grounding spring includes:
[0024] The first bend, the first elastic arm, the second bend, the second elastic arm, the third bend, and the third elastic arm;
[0025] One end of the first bent portion is connected to the side of the base plate near the edge of the through hole, and the other end is connected to the first elastic arm;
[0026] The end of the first elastic arm away from the first bend extends away from the bottom plate and away from the edge of the through hole, and is connected to the second bend.
[0027] The end of the second bend away from the first elastic arm is connected to the second elastic arm;
[0028] The end of the second elastic arm away from the second bend extends away from the base plate and close to the edge of the through hole, and is connected to the third bend.
[0029] The end of the third bend away from the second elastic arm is connected to the third elastic arm; the end of the third elastic arm away from the third bend extends toward the bottom plate and toward the edge of the through hole.
[0030] In some embodiments, at least a portion of the first elastic arm, at least a portion of the second bend, and a portion of the second elastic arm may abut against the contact side of an electronic component housed within the receiving space.
[0031] In some embodiments, the first elastic arm, the second elastic arm, and the third elastic arm are all straight; the first bend, the second bend, and the third bend are all arc-shaped.
[0032] The first bending portion has a first arc surface and a second arc surface; the second bending portion has a third arc surface and a fourth arc surface; the third bending portion has a fifth arc surface and a sixth arc surface;
[0033] The first arc surface has a first radial dimension, and the second arc surface has a second radial dimension; the third arc surface has a third radial dimension, and the fourth arc surface has a fourth radial dimension; the fifth arc surface has a fifth radial dimension, and the sixth arc surface has a sixth radial dimension;
[0034] The first radial dimension is smaller than the second radial dimension; the third radial dimension is smaller than the fourth radial dimension; and the fifth radial dimension is smaller than the sixth radial dimension.
[0035] In some embodiments, the first arc surface is connected to the first surface of the base plate, and the second arc surface is connected to the second surface of the base plate;
[0036] The fifth arc surface, the third arc surface, and the first arc surface are located on the same side, and the sixth arc surface, the fourth arc surface, and the second arc surface are located on the same side;
[0037] The first surface and the second surface are two opposing surfaces of the base plate in the thickness direction, and the second surface abuts against the surface of the PCB board.
[0038] At least one beneficial effect of the shielding cover provided by this utility model embodiment is: it proposes a novel shielding cover, which, through the structural design of incorporating a grounding component, is welded to the shielding cover frame along the edge of the through hole and abuts against the side of the electronic component housed inside the containment space, so that the electronic component is grounded. Thus, this shielding cover can not only prevent the electronic component from being affected by electromagnetic interference and avoid damage to the electronic component from external forces, but also achieve grounding protection, thereby preventing damage to the electronic component due to lack of grounding, and thus improving the reliability of the entire PCB board. Attached Figure Description
[0039] One or more embodiments are illustrated by way of example with reference to the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements having the same reference numerals in the drawings are designated as the same elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.
[0040] Figure 1 A schematic diagram of the structure when the shielding cover provided in this embodiment of the utility model is connected to the PCB board;
[0041] Figure 2 A cross-sectional view of the shielding cover connected to the PCB board according to an embodiment of this utility model;
[0042] Figure 3 A schematic diagram of the structure of the shielding cover provided in the embodiment of this utility model;
[0043] Figure 4 Provided for the embodiments of this utility model Figure 2 A magnified view of a portion at point A;
[0044] Figure 5 This is a schematic diagram of the grounding component provided in an embodiment of the present utility model.
[0045] Figure label:
[0046] 100. Shielding cover; 1001. Accommodation space; 1. Shielding cover frame; 11. Mounting plate; 12. Vertical plate; 111. Through hole; 2. Grounding assembly; 21. Base plate; 22. Grounding spring; 211. First surface; 212. Second surface; 221. First bend; 222. First elastic arm; 223. Second bend; 224. Second elastic arm; 225. Third bend; 226. Third elastic arm; 2211. First arc surface; 2212. Second arc surface; 2231. Third arc surface; 2232. Fourth arc surface; 2251. Fifth arc surface; 2252. Sixth arc surface;
[0047] 200. PCB board; 2001. Electronic components; 2002. Mounting part; 2003. Contact part. Detailed Implementation
[0048] The present invention will now be described in detail with reference to specific embodiments. It should be emphasized that the following description is merely exemplary and is not intended to limit the scope and application of the present invention.
[0049] It should be noted that, unless otherwise expressly specified and limited, the terms “circumferential,” “radial,” “through,” “toward,” “along,” “extend,” “extend to,” “reach into,” “vertical,” etc., used in this specification to indicate the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. The terms "installation," "fitting," "connection," and "fixing" should be interpreted broadly. For example, "connection" can be a fixed connection or a detachable connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. "Fixing" can be bolt fixing, snap-fit fixing, or glue fixing. The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of that feature. "A plurality" or "several" means two or more. In addition, "and / or" includes any and all combinations of one or more of the related listed items. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances.
[0050] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be described in detail below with reference to the accompanying drawings and specific embodiments.
[0051] In this embodiment, the specific implementation of the "shielding cover" is not limited, and those skilled in the art can selectively use any suitable implementation method according to actual needs.
[0052] Figure 1 This is a schematic diagram of the structure when the shielding cover provided in this embodiment of the present invention is connected to the PCB board. Figure 2 This is a cross-sectional view of the shielding cover connected to the PCB board in an embodiment of the present invention. Figure 3 This is a schematic diagram of the structure of the shielding cover provided in an embodiment of the present utility model.
[0053] Figure 4 Provided for the embodiments of this utility model Figure 2 A magnified view of a portion at point A. Figure 5 This is a schematic diagram of the grounding component provided in an embodiment of the present utility model.
[0054] Please see Figures 1-5 The shield 100 is disposed on a PCB board 200 having a plurality of electronic components 2001, and can cover at least one electronic component 2001.
[0055] Generally speaking, existing shielding covers can protect the electronic components they cover. For example, existing shielding covers can shield electronic components to prevent electromagnetic interference from adversely affecting them. Furthermore, existing shielding covers are usually made of metal, giving them excellent toughness and impact resistance, thus effectively preventing damage to electronic components caused by external forces. Additionally, existing shielding covers can also serve as support structures, increasing the mechanical strength of the PCB board and preventing damage to electronic components due to stress. In addition to the above-mentioned protective functions, this shielding cover 100 can also provide grounding protection to prevent damage to the electronic component 2001 due to the lack of grounding.
[0056] The aforementioned shield 100 includes: a shield frame 1 and several grounding components 2.
[0057] The shielding frame 1 is fixedly installed on the PCB board 200, and the shielding frame 1 forms an accommodating space 1001 inside.
[0058] In addition, at least one electronic component 2001 is housed inside the housing space 1001 so that at least one electronic component 2001 is covered.
[0059] In addition, a through hole 111 is provided at one end of the shielding frame 1 away from the PCB board 200, and the through hole 111 is connected to the receiving space 1001 so that a part of the electronic component 2001 housed inside the receiving space 1001 extends through the through hole 111 to the outside of the receiving space 1001.
[0060] It should be noted that several grounding components 2 are welded to the shielding frame 1 along the circumferential edge of the through hole 111 and are located outside the receiving space 1001; at least a portion of the grounding components 2 can abut against the circumferential side of the electronic component 2001 housed inside the receiving space 1001.
[0061] In some embodiments, such as Figures 1-3 As shown, the shielding frame 1 includes: a mounting plate 11 and several upright plates 12.
[0062] Specifically, several upright plates 12 protrude from the surface of the mounting plate 11; through holes 111 are formed on the mounting plate 11, and several grounding components 2 are welded to the mounting plate 11.
[0063] To further explain, the end of the upright plate 12 away from the mounting plate 11 abuts against the surface of the PCB board 200; the mounting plate 11 and several upright plates 12 enclose and form an accommodating space 1001.
[0064] In some embodiments, combined with Figure 1 and Figure 3 It can be seen that each of the several upright plates 12 is formed by stamping at least a portion of the mounting plate 11, and is an integral structure with the mounting plate 11.
[0065] In some embodiments, according to Figure 1 and Figure 2 It is known that each electronic component 2001 has a mounting portion 2002 and a contact portion; one end of the mounting portion 2002 abuts against the surface of the PCB board 200, and the other end abuts against the contact portion.
[0066] In this embodiment, the end of the contact portion away from the mounting portion 2002 extends through the through hole 111 toward the outside of the receiving space 1001.
[0067] In some embodiments, by Figures 1-4 It is understood that the through hole 111 has a shape and size that are adapted to the contact portion of the electronic component 2001 housed inside the housing space 1001.
[0068] In some embodiments, refer to Figure 4 and Figure 5 It can be seen that the grounding component 2 includes: a base plate 21 and several grounding springs 22.
[0069] The base plate 21 is welded to the mounting plate 11, and several grounding springs 22 are connected to the base plate 21.
[0070] In addition, at least a portion of the grounding spring 22 may abut against the side of the contact portion of the electronic component 2001 housed inside the receiving space 1001.
[0071] In addition, several grounding springs 22 are formed by at least partial stamping of the base plate 21, and are integral with the base plate 21.
[0072] In some embodiments, combined with Figure 4 and Figure 5 It is known that the grounding spring 22 includes: a first bending portion 221, a first elastic arm 222, a second bending portion 223, a second elastic arm 224, a third bending portion 225, and a third elastic arm 226.
[0073] Specifically, one end of the first bent portion 221 is connected to the side of the base plate 21 near the edge of the through hole 111, and the other end is connected to the first elastic arm 222.
[0074] It is understood that the end of the first elastic arm 222 away from the first bend 221 extends away from the bottom plate 21 and away from the edge of the through hole 111, and is connected to the second bend 223.
[0075] It should be noted that the end of the second bend 223 that is away from the first elastic arm 222 is connected to the second elastic arm 224.
[0076] To further explain, the end of the second elastic arm 224 away from the second bend 223 extends away from the base plate 21 and close to the edge of the through hole 111, and is connected to the third bend 225.
[0077] In this embodiment, the end of the third bend 225 away from the second elastic arm 224 is connected to the third elastic arm 226; the end of the third elastic arm 226 away from the third bend 225 extends toward the bottom plate 21 and toward the edge of the through hole 111.
[0078] In some embodiments, such as Figure 4 and Figure 5 As shown, at least a portion of the first elastic arm 222, at least a portion of the second bent portion 223, and a portion of the second elastic arm 224 may abut against the contact side of the electronic component 2001 housed inside the receiving space 1001.
[0079] In some embodiments, according to Figure 4 and Figure 5It can be seen that the first elastic arm 222, the second elastic arm 224 and the third elastic arm 226 are all straight; the first bending part 221, the second bending part 223 and the third bending part 225 are all arc-shaped.
[0080] The first bending portion 221 has a first arc surface 2211 and a second arc surface 2212; the second bending portion 223 has a third arc surface 2231 and a fourth arc surface 2232; and the third bending portion 225 has a fifth arc surface 2251 and a sixth arc surface 2252.
[0081] In addition, the first arc surface 2211 has a first radial dimension, and the second arc surface 2212 has a second radial dimension; the third arc surface 2231 has a third radial dimension, and the fourth arc surface 2232 has a fourth radial dimension; the fifth arc surface 2251 has a fifth radial dimension, and the sixth arc surface 2252 has a sixth radial dimension.
[0082] Furthermore, the first radial dimension is smaller than the second radial dimension; the third radial dimension is smaller than the fourth radial dimension; and the fifth radial dimension is smaller than the sixth radial dimension.
[0083] In some embodiments, please refer to Figures 1-5 The first arc surface 2211 is connected to the first surface 211 of the base plate 21, and the second arc surface 2212 is connected to the second surface 212 of the base plate 21.
[0084] It should be noted that the fifth arc surface 2251, the third arc surface 2231 and the first arc surface 2211 are located on the same side, and the sixth arc surface 2252, the fourth arc surface 2232 and the second arc surface 2212 are located on the same side.
[0085] Specifically, the first surface 211 and the second surface 212 are two opposing surfaces of the base plate 21 in the thickness direction, and the second surface 212 abuts against the surface of the PCB board 200.
[0086] It is understood that the grounding spring 22 has an elastic force, and this elastic force can limit the movement of the second bent portion 223 toward the base plate 21; wherein, when the grounding spring 22 provides the above-mentioned elastic force, at least a portion of the first elastic arm 222 of the grounding spring 22, at least a portion of the second bent portion 223, and a portion of the second elastic arm 224 can be tightly attached to the side of the contact portion 2003 to improve the grounding reliability of the electronic component 2001, thereby providing more reliable grounding protection for the electronic component 2001, so as to avoid damage to the electronic component 2001 due to discharge, short circuit, etc., and thus improve the reliability of the entire PCB board 200.
[0087] In summary, the shielding cover provided by this utility model embodiment, through the structural design of incorporating a grounding component, with the grounding component welded along the edge of the through-hole to the shielding cover frame and abutting against the side of the electronic components housed within the containment space, grounds the electronic components. This allows the shielding cover to not only prevent electromagnetic interference and damage to the electronic components from external forces, but also provide grounding protection, thus preventing damage to the electronic components due to lack of grounding and improving the overall reliability of the PCB board. Therefore, the shielding cover provided by this utility model embodiment has a certain novelty compared to traditional shielding covers.
[0088] The above description, in conjunction with specific / preferred embodiments, provides a further detailed explanation of the present invention. It should not be construed that the specific implementation of the present invention is limited to these descriptions. Those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and all of these fall within the protection scope of the present invention.
Claims
1. A shielding cover, disposed on a PCB board having a plurality of electronic components; characterized in that, include: Shielding frame; The shielding frame is fixedly mounted on the PCB board, and an accommodating space is formed inside the shielding frame; At least one of the electronic components is housed within the receiving space such that at least one of the electronic components is covered; The shielding frame has a through hole at one end away from the PCB board, and the through hole is connected to the receiving space, so that a portion of the electronic components housed inside the receiving space can extend through the through hole to the outside of the receiving space. Several grounding components are welded to the shielding frame along the circumferential edge of the through hole and are located outside the receiving space; At least a portion of the grounding component may abut against the circumferential side of an electronic component housed within the containment space.
2. The shielding cover according to claim 1, characterized in that, The shielding frame includes: A mounting plate and several upright plates; the several upright plates protrude from the surface of the mounting plate; The through hole is formed on the mounting plate, and several of the grounding components are welded to the mounting plate; The end of the upright plate away from the mounting plate abuts against the surface of the PCB board; the mounting plate and the several upright plates enclose the receiving space.
3. The shielding cover according to claim 2, characterized in that, Several upright plates are formed by stamping at least a portion of the mounting plate, and are integral with the mounting plate.
4. The shielding cover according to claim 2, characterized in that, Each of the electronic components has a mounting portion and a contact portion; one end of the mounting portion abuts against the surface of the PCB board, and the other end abuts against the contact portion; The end of the contact portion away from the mounting portion extends through the through hole toward the outside of the receiving space.
5. The shielding cover according to claim 4, characterized in that, The through-hole has a shape and size adapted to the contact portion of the electronic component housed within the receiving space.
6. The shielding cover according to claim 4, characterized in that, The grounding component includes: A base plate and several grounding springs; the base plate is welded to the mounting plate, and the several grounding springs are all connected to the base plate; At least a portion of the grounding spring can abut against the side of the contact portion of the electronic component housed within the receiving space; Each of the aforementioned grounding springs is formed by at least partial stamping of the base plate, and is an integral structure with the base plate.
7. The shielding cover according to claim 6, characterized in that, The grounding spring includes: The first bend, the first elastic arm, the second bend, the second elastic arm, the third bend, and the third elastic arm; One end of the first bent portion is connected to the side of the base plate near the edge of the through hole, and the other end is connected to the first elastic arm; The end of the first elastic arm away from the first bend extends away from the bottom plate and away from the edge of the through hole, and is connected to the second bend. The end of the second bend away from the first elastic arm is connected to the second elastic arm; The end of the second elastic arm away from the second bend extends away from the base plate and close to the edge of the through hole, and is connected to the third bend. The end of the third bend away from the second elastic arm is connected to the third elastic arm; the end of the third elastic arm away from the third bend extends toward the bottom plate and toward the edge of the through hole.
8. The shielding cover according to claim 7, characterized in that, At least a portion of the first elastic arm, at least a portion of the second bend, and a portion of the second elastic arm may abut against the contact side of an electronic component housed within the receiving space.
9. The shielding cover according to claim 7, characterized in that, The first elastic arm, the second elastic arm, and the third elastic arm are all straight; the first bend, the second bend, and the third bend are all arc-shaped. The first bending portion has a first arc surface and a second arc surface; the second bending portion has a third arc surface and a fourth arc surface; the third bending portion has a fifth arc surface and a sixth arc surface; The first arc surface has a first radial dimension, and the second arc surface has a second radial dimension; the third arc surface has a third radial dimension, and the fourth arc surface has a fourth radial dimension; the fifth arc surface has a fifth radial dimension, and the sixth arc surface has a sixth radial dimension; The first radial dimension is smaller than the second radial dimension; the third radial dimension is smaller than the fourth radial dimension; and the fifth radial dimension is smaller than the sixth radial dimension.
10. The shielding cover according to claim 9, characterized in that, The first arc surface is connected to the first surface of the base plate, and the second arc surface is connected to the second surface of the base plate; The fifth arc surface, the third arc surface, and the first arc surface are located on the same side, and the sixth arc surface, the fourth arc surface, and the second arc surface are located on the same side; The first surface and the second surface are two opposing surfaces of the base plate in the thickness direction, and the second surface abuts against the surface of the PCB board.