Substrate positioning device for chip mounting

Abstract

The utility model discloses a substrate positioning device for chip mounting, which belongs to the technical field of substrate positioning and comprises a supporting cylinder, a supporting ring is connected to the outer wall of the supporting cylinder, a plurality of side supports are connected to the outer wall of the supporting ring, the substrate positioning device further comprises a clamping device, the clamping device is mounted in the supporting cylinder, and a plurality of laminating devices are arranged at the top of the clamping device. According to the device, the clamping device is arranged, the electric push rod drives the circular block to move, the circular block drives the sliding ring to move through the connecting block, then the sliding ring drives one side of the hinged plate to move downwards through the hinged seat, and therefore the other side of the hinged plate drives the hinged block to move inwards; and a hinge block drives an upper supporting plate to move through a lower supporting plate and a sliding block, so that the upper supporting plate drives a laminating device to move inwards, the clamping inner diameter is adjusted, circular substrates of different sizes are clamped, and the application range of the device is widened.

Description

Technical Field

[0001] This utility model belongs to the field of substrate positioning technology, and in particular relates to a substrate positioning device for chip mounting. Background Technology

[0002] A chip substrate is a high-density, high-precision circuit board, usually made of materials such as organic resin, ceramic or glass. It directly carries the bare chip in the packaging process and realizes signal transmission between the chip and the printed circuit board through micro interconnect technology. When the chip is mounted on the top of the substrate, a clamping mechanism is required to clamp and fix the substrate.

[0003] Chinese utility model application No. 202223315130.3 discloses a circular substrate center positioning device, relating to the field of semiconductor processing technology. It includes a mounting base with a mounting bracket mounted on its upper end. A fixed base plate is fixedly sleeved on the outer surface of the mounting bracket. Three pneumatic sliding modules are mounted on the upper end of the fixed base plate, arranged in a circular array. Each of the three pneumatic sliding modules has an arc-shaped positioning plate mounted on its upper end. A positioning limiting plate with a circular structure is mounted on the upper end of the mounting bracket, with the three arc-shaped positioning plates located outside the positioning limiting plate. A sensing probe module is mounted on the upper end of the fixed base plate, and a sensing probe detection port is opened on the upper end of the positioning limiting plate. However, in actual use, due to different substrate usage environments or the different machinery used, the size of the circular substrate varies. This device requires changing different bases when clamping circular substrates of different sizes, resulting in low practicality and affecting work efficiency. Utility Model Content

[0004] The purpose of this invention is to provide a substrate positioning device for chip mounting, in order to solve the problem that traditional substrate clamping mechanisms cannot adjust and fix circular substrates of different sizes.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a substrate positioning device for chip mounting, comprising a support cylinder, a support ring connected to the outer wall of the support cylinder, a plurality of side brackets connected to the outer wall of the support ring, and a clamping device installed inside the support cylinder, wherein the top of the clamping device is provided with a plurality of bonding devices.

[0006] The clamping device includes an electric push rod, multiple sliding grooves, and multiple connecting grooves. The bottom of the electric push rod is installed and connected to the bottom of the inner wall of the support cylinder, and the top of the electric push rod is connected to an upper support plate. The top of the upper support plate is in contact with the bottom of the bonding device. The electric push rod moves the bonding device through the upper support plate to adjust the clamping inner diameter.

[0007] As a further description of the above technical solution:

[0008] The electric push rod is connected to a circular block. Multiple connecting blocks are connected to the outer wall of the circular block, and the outer side of the multiple connecting blocks is connected to the same sliding ring. The inner wall of the sliding ring is in contact with and slidably connected to the outer wall of the support cylinder. Multiple hinge seats are connected to the outer wall of the sliding ring. A hinge plate is hinged inside the hinge seat. A hinge block is hinged to the other side of the hinge plate. A lower support plate is connected to the top of the hinge block. A sliding block is connected to the top of the lower support plate. An upper support plate is connected to the top of the sliding block.

[0009] As a further description of the above technical solution:

[0010] The connecting groove is formed on the side wall of the support cylinder, and one side of the connecting block extends out of the support cylinder through the connecting groove. The outer wall of the connecting block is in contact with and slidably connected to the inner wall of the connecting groove. The sliding groove is formed inside the side bracket, and the outer wall of the sliding block is in contact with and slidably connected to the inner wall of the sliding groove.

[0011] As a further description of the above technical solution:

[0012] The outer wall of the support cylinder is connected to a mounting flange, and the mounting flange has multiple mounting holes. A floppy disk is connected to the top of the support cylinder.

[0013] As a further description of the above technical solution:

[0014] The bonding device includes a base plate, a support frame connected to the top of the base plate, and multiple moving grooves on both sides of the inner wall of the support frame. Moving blocks are slidably connected in the moving grooves, and fixed rollers are connected between two corresponding moving blocks. A spring is connected to one side of the moving block, and the other end of the spring is connected to one side of the inner wall of the moving groove. A sliding sleeve is embedded in the moving block, and a support rod is slidably connected to the sliding sleeve with damping. The two ends of the support rod are respectively connected to the two sides of the inner wall of the moving groove, and the spring is sleeved on the outside of the support rod.

[0015] As a further description of the above technical solution:

[0016] The bottom of the base plate has a rotating groove, and the top of the upper support plate is connected to a rotating block. The outer wall of the rotating block is rotatably connected to the inner wall of the rotating groove.

[0017] As a further description of the above technical solution:

[0018] The bottom of the base plate is connected to two travel blocks, and the top of the upper support plate has two travel grooves, with the outer wall of the travel blocks slidingly connected to the inner wall of the travel grooves.

[0019] In summary, due to the adoption of the above technical solution, the beneficial effects of this utility model are:

[0020] 1. In this utility model, by setting up a clamping device, the circular block is moved by an electric push rod, which causes the circular block to move the sliding ring through the connecting block. The sliding ring then causes one side of the hinge plate to move downward through the hinge seat, which in turn causes the other side of the hinge plate to move the hinge block inward. The hinge block then causes the upper support plate to move through the lower support plate and the sliding block, which in turn causes the bonding device to move inward, thereby adjusting the clamping inner diameter and clamping circular substrates of different sizes, thus improving the applicability of the device.

[0021] 2. In this utility model, by setting up a bonding device, the upper support plate drives the bottom plate to move, the bottom plate drives the support frame to move, so that the support frame drives the fixed roller on one side to move, so that the surface of the fixed roller contacts the side wall of the circular substrate, so that the middle fixed roller is forced to move inward, and then the fixed rollers on both sides contact the side of the circular substrate, thereby making multiple fixed rollers bond to the side wall of the circular substrate, thereby improving the stability of the clamping of the circular substrate. Attached Figure Description

[0022] Figure 1 This is a three-dimensional structural diagram of a substrate positioning device for chip mounting proposed in this utility model;

[0023] Figure 2 This is a three-dimensional cross-sectional structural diagram of a substrate positioning device for chip mounting proposed in this utility model;

[0024] Figure 3 This is a schematic diagram of the clamping device structure of a substrate positioning device for chip mounting proposed in this utility model;

[0025] Figure 4 This is a schematic diagram of the bonding device structure of a substrate positioning device for chip mounting proposed in this utility model;

[0026] Figure 5 This utility model proposes a substrate positioning device for chip mounting. Figure 4 Enlarged structural diagram of section A.

[0027] Legend: 1. Floppy disk; 2. Support ring; 3. Support cylinder; 4. Mounting flange; 5. Side bracket; 6. Clamping device; 601. Upper support plate; 602. Sliding block; 603. Lower support plate; 604. Hinge plate; 605. Hinge seat; 606. Sliding ring; 607. Electric push rod; 608. Connecting block; 609. Round block; 610. Connecting groove; 611. Hinge block; 612. Sliding groove; 613. Rotating block; 614. Stroke groove; 7. Fitting device; 701. Support frame; 702. Base plate; 703. Stroke block; 704. Rotating groove; 705. Fixed roller; 706. Moving block; 707. Support rod; 708. Spring; 709. Moving groove. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0029] Please see Figures 1-5 This utility model provides a technical solution: a substrate positioning device for chip mounting, including a support cylinder 3, a support ring 2 connected to the outer wall of the support cylinder 3, and multiple side brackets 5 connected to the outer wall of the support ring 2. It also includes a clamping device 6, which is installed inside the support cylinder 3. The clamping device 6 has multiple bonding devices 7 on its top. The clamping device 6 includes an electric push rod 607, multiple sliding grooves 612, and multiple connecting grooves 610. The bottom of the electric push rod 607 is connected to the bottom of the inner wall of the support cylinder 3, and the top of the electric push rod 607 is connected to an upper support plate 601. The top of the upper support plate 601 is in contact with the bottom of the bonding device 7. The electric push rod 607 moves the bonding device 7 through the upper support plate 601 to adjust the clamping inner diameter. The electric push rod 607 is connected to a round block 609, and multiple connecting blocks 608 are connected to the outer wall of the round block 609. The outer sides of the multiple connecting blocks 608 are connected to the same sliding groove. The moving ring 606 and the sliding ring 606 have their inner walls in contact with and slidably connected to the outer wall of the support cylinder 3. Multiple hinge seats 605 are connected to the outer wall of the sliding ring 606. A hinge plate 604 is hinged to each hinge seat 605. A hinge block 611 is hinged to the other side of the hinge plate 604. A lower support plate 603 is connected to the top of the hinge block 611. A sliding block 602 is connected to the top of the lower support plate 603. An upper support plate 601 is connected to the top of the sliding block 602. A connecting groove 610 is open. A connecting block 608 is located on the side wall of the support cylinder 3, and one side of the connecting block 608 extends out of the support cylinder 3 through the connecting groove 610. The outer wall of the connecting block 608 is attached to and slidably connected with the inner wall of the connecting groove 610. The sliding groove 612 is opened in the side bracket 5, and the outer wall of the sliding block 602 is attached to and slidably connected with the inner wall of the sliding groove 612. The outer wall of the support cylinder 3 is connected to a mounting flange 4, and multiple mounting holes are opened in the mounting flange 4. The top of the support cylinder 3 is connected to a floppy disk 1.

[0030] In a specific implementation, by setting up a clamping device 6, the electric push rod 607 drives the circular block 609 to move, which in turn drives the connecting block 608 to move. This causes the connecting block 608 to move the sliding ring 606, which in turn causes the sliding ring 606 to move the hinge seat 605 downward. The hinge seat 605 then drives one side of the hinge plate 604 downward. Subsequently, by pulling the other side of the hinge plate 604, the other side of the hinge plate 604 drives the hinge block 611 to move inward. This causes the hinge block 611 to move the lower support plate 603, which in turn drives the sliding block 602 to move. The sliding block 602 then drives the upper support plate 601 to move, which in turn causes the upper support plate 601 to move the fixed roller 705 in the support frame 701 inward. This adjusts the clamping inner diameter between the multiple fixed rollers 705, thereby clamping circular substrates of different sizes and improving the applicability of the device.

[0031] The bonding device 7 includes a base plate 702, with a support frame 701 connected to the top of the base plate 702. Multiple movable grooves 709 are formed on both sides of the inner wall of the support frame 701. Movable blocks 706 are slidably connected within the movable grooves 709, and fixed rollers 705 are connected between two corresponding movable blocks 706. A spring 708 is connected to one side of each movable block 706, and the other end of the spring 708 is connected to one side of the inner wall of the movable groove 709. A sliding sleeve is embedded within each movable block 706, and a support rod 7 is slidably connected within the sliding sleeve with damping. 07. The two ends of the support rod 707 are respectively connected to the two sides of the inner wall of the moving groove 709, and the spring 708 is sleeved on the outside of the support rod 707. The bottom of the base plate 702 is provided with a rotating groove 704, and the top of the upper support plate 601 is connected with a rotating block 613. The outer wall of the rotating block 613 is rotatably connected to the inner wall of the rotating groove 704. The bottom of the base plate 702 is connected with two stroke blocks 703, and the top of the upper support plate 601 is provided with two stroke grooves 614, and the outer wall of the stroke block 703 is slidably connected to the inner wall of the stroke groove 614.

[0032] In a specific implementation, by setting up a bonding device 7, the upper support plate 601 drives the bottom plate 702 to move inward, causing the bottom plate 702 to drive the support frame 701 to move, which in turn drives the moving block 706 in the moving groove 709 to move. The moving block 706 then drives the fixed roller 705 to move, causing the surface of the fixed roller 705 to contact the sidewall of the circular substrate. This causes the middle fixed roller 705 to be forced inward, moving the moving block 706 and compressing the spring 708. 708 generates a rebound force, which causes the fixing rollers 705 on both sides to contact the side of the circular substrate, thereby making the multiple fixing rollers 705 adhere to the side wall of the circular substrate, thus improving the stability of clamping the circular substrate. After the surface of the middle fixing roller 705 contacts the inner wall of the support frame 701, the middle spring 708 will not be over-compressed to the limit and thus damaged. When the middle fixing roller 705 is in contact with the inner wall of the support frame 701, the springs 708 on both sides are in a semi-compressed state, thereby making the fixing rollers 705 on both sides clamp and fix the circular substrate.

[0033] Working principle: In use, the device is fixed in the desired position using the mounting flange 4. Then, the circular base plate is placed on top of the floppy disk 1. Subsequently, the electric push rod 607 pushes the circular block 609 downward, causing the circular block 609 to move the connecting block 608. The connecting block 608 moves the sliding ring 606, which in turn moves the hinge seat 605. The hinge seat 605 moves the hinge plate 604, which in turn moves the hinge block 611 downward. The hinge block 611 moves the lower support plate 603, and the lower support plate 603 moves the upper support plate 601 inward via the sliding block 602. This causes the upper support plate 601 to move the base plate 702, which in turn moves the support frame 701. The support frame 701 then moves the moving block 706 within the moving groove 709. The moving block 706 moves the fixed roller 705, causing the middle fixed roller 705 to contact the side wall of the circular substrate. This causes the middle fixed roller 705 to retract inward, allowing the fixed rollers 705 on both sides to contact the substrate, thus fixing the circular substrate. Furthermore, by moving multiple fixed rollers 705, the clamping inner diameter between them can be adjusted to meet the clamping requirements for circular substrates of different sizes.

[0034] In this utility model, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance; the term "multiple" refers to two or more unless otherwise explicitly defined. The terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; "linking" can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0035] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A substrate positioning device for chip mounting, comprising a support cylinder (3), wherein a support ring (2) is connected to the outer wall of the support cylinder (3), and a plurality of side supports (5) are connected to the outer wall of the support ring (2), characterized in that, Also includes: Clamping device (6), the clamping device (6) is installed inside the support cylinder (3), and the top of the clamping device (6) is provided with multiple fitting devices (7); The clamping device (6) includes an electric push rod (607), multiple sliding grooves (612) and multiple connecting grooves (610). The bottom of the electric push rod (607) is connected to the bottom of the inner wall of the support cylinder (3), and the top rod of the electric push rod (607) is connected to the upper support plate (601). The top of the upper support plate (601) is in contact with the bottom of the bonding device (7). The electric push rod (607) drives the bonding device (7) to move and adjust the clamping inner diameter through the upper support plate (601).

2. The substrate positioning device for chip mounting according to claim 1, characterized in that, The electric push rod (607) is connected to a round block (609). The outer wall of the round block (609) is connected to multiple connecting blocks (608), and the outer side of the multiple connecting blocks (608) is connected to the same sliding ring (606). The inner wall of the sliding ring (606) is in contact with the outer wall of the support cylinder (3) and is slidably connected. The outer wall of the sliding ring (606) is connected to multiple hinge seats (605). The hinge seat (605) is hinged to a hinge plate (604). The other side of the hinge plate (604) is hinged to a hinge block (611). The top of the hinge block (611) is connected to a lower support plate (603). The top of the lower support plate (603) is connected to a sliding block (602). The top of the sliding block (602) is connected to an upper support plate (601).

3. The substrate positioning device for chip mounting according to claim 1, characterized in that, The connecting groove (610) is opened on the side wall of the support cylinder (3), and one side of the connecting block (608) extends out of the support cylinder (3) through the connecting groove (610). The outer wall of the connecting block (608) is attached to and slidably connected with the inner wall of the connecting groove (610). The sliding groove (612) is opened in the side bracket (5), and the outer wall of the sliding block (602) is attached to and slidably connected with the inner wall of the sliding groove (612).

4. The substrate positioning device for chip mounting according to claim 1, characterized in that, The outer wall of the support cylinder (3) is connected to the mounting flange (4), and the mounting flange (4) has multiple mounting holes, and the top of the support cylinder (3) is connected to a floppy disk (1).

5. The substrate positioning device for chip mounting according to claim 1, characterized in that, The bonding device (7) includes a base plate (702), a support frame (701) is connected to the top of the base plate (702), and multiple moving grooves (709) are provided on both sides of the inner wall of the support frame (701). Moving blocks (706) are slidably connected in the moving grooves (709), and fixed rollers (705) are connected between two corresponding moving blocks (706). A spring (708) is connected to one side of the moving block (706), and the other end of the spring (708) is connected to one side of the inner wall of the moving groove (709). A sliding sleeve is embedded in the moving block (706), and a support rod (707) is slidably connected in the sliding sleeve. The two ends of the support rod (707) are respectively connected to the two sides of the inner wall of the moving groove (709), and the spring (708) is sleeved on the outside of the support rod (707).

6. The substrate positioning device for chip mounting according to claim 5, characterized in that, The bottom of the base plate (702) is provided with a rotating groove (704), and the top of the upper support plate (601) is connected to a rotating block (613). The outer wall of the rotating block (613) is rotatably connected to the inner wall of the rotating groove (704).

7. A substrate positioning device for chip mounting according to claim 5, characterized in that, The bottom of the base plate (702) is connected to two travel blocks (703), and the top of the upper support plate (601) is provided with two travel grooves (614), and the outer wall of the travel block (703) is slidably connected to the inner wall of the travel groove (614).

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