Pre-punching device for PDMS chip
By designing a pre-drilling device for PDMS chips, and utilizing the elastic connection and guiding structure of the substrate and embedded parts, the problems of low accuracy and high cost of manual drilling of PDMS chips are solved, achieving efficient and low-cost hole forming and hole diameter selection.
Patent Information
- Application Number
- CN202423278269.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-30
- Publication Date
- 2025-12-05
- Estimated Expiration
- 2034-12-30
AI Technical Summary
Existing manual drilling tools for PDMS chips suffer from problems such as low precision, unstable drilling quality, short lifespan, and high operating costs.
Design a pre-drilling device for PDMS chips, including a substrate and several embedded parts. The embedded parts are connected to the substrate through elastic elements and can move elastically in the vertical direction. The movement is restricted by a guide structure. The embedded parts are prepared by photopolymerization 3D printing or other methods to achieve the forming of holes.
It achieves high-precision and stable hole forming, reduces debris residue, lowers costs, improves production efficiency, and supports multi-hole forming and free selection of hole diameter.
Smart Images
Figure CN223630515U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The application relates to the chip punching technology field, in particular to a pre-punching device for a PDMS chip. BACKGROUND
[0002] At present, the punching mode of the PDMS chip is generally manual punching by using a special puncher. The punching mode has some defects: firstly, the precision of manual punching and the high time cost problem exist; secondly, the service life of the manual puncher is short, and the problems of easy damage and easy deformation of the needle exist, and after being used for a period of time, the quality of the punched holes is often low, and the residual debris in the holes easily affects the use of the PDMS chip. In addition, the puncher has high cost, and the maintenance and replacement are relatively troublesome. Therefore, a new design scheme is needed to solve the technical problems of low precision, unstable punching quality, short service life and high use cost of the manual punching of the puncher. CONTENT OF THE UTILITY MODEL
[0003] Therefore, the application aims to provide a pre-punching device for a PDMS chip to solve the technical problems of low precision, unstable punching quality, short service life and high use cost of the manual punching of the puncher.
[0004] To achieve the above technical purpose, the application provides a pre-punching device for a PDMS chip, which comprises a substrate and a plurality of embedded parts.
[0005] The plurality of embedded parts are installed on the substrate and are arranged perpendicularly to the substrate.
[0006] The embedded part is provided with a forming part for forming a hole.
[0007] Further, each embedded part is connected to the substrate by an elastic member to be elastically movable in a direction perpendicular to the substrate.
[0008] Further, the substrate is provided with a guide structure.
[0009] The guide structure is connected to the elastic member to limit the expansion and contraction of the elastic member in a direction perpendicular to the substrate, or the guide structure is connected to the embedded part to limit the movement of the embedded part in a direction perpendicular to the substrate.
[0010] Further, the guide structure is a guide groove.
[0011] Further, the elastic member, the embedded part and the substrate are integrally formed.
[0012] Further, the embedded part and the substrate are integrally formed or detachably connected.
[0013] Further, the embedded part is a pin-shaped ejector pin, and a top pin part of the ejector pin forms the forming part.
[0014] Further, the embedded part is a detachable needle, and a needle part of the needle forms the forming part.
[0015] Further, the base plate is connected with L-shaped fixing plates on two sides.
[0016] The vertical plate part of the fixing plate is provided with a threaded hole penetrating through the fixing plate.
[0017] The threaded hole is provided with a fastener which is threadedly connected with the threaded hole.
[0018] The fasteners of the two fixing plates form a clamping space between the fasteners.
[0019] Further, the embedded part is prepared by using a light-curing 3D printing method.
[0020] From the above technical solution, it can be seen that the pre-punching device for the PDMS chip designed in the present application has the following beneficial effects:
[0021] 1. The base plate provided with the embedded part is inverted on the PDMS chip forming mold, and the forming part of the embedded part enables the formed PDMS chip to directly have a hole. After the PDMS chip is formed, the embedded part is removed, and the required hole structure is completed. Time and labor cost are effectively saved, and multiple holes can be formed at one time.
[0022] 2. The hole is made in a pre-embedded manner, which is low in cost and convenient to make.
[0023] 3. The hole debris is effectively reduced, and the success rate of the PDMS chip is improved.
[0024] 4. By changing the forming part of the corresponding diameter, the hole of the corresponding hole diameter can be made, and the requirement of freely selecting the hole diameter is met. BRIEF DESCRIPTION OF DRAWINGS
[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiment or prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.
[0026] Figure 1 It is a structural schematic view of the first design structure of the pre-punching device for the PDMS chip provided in the present application.
[0027] Figure 2 A structural schematic diagram of a second design structure of a pre-punching device for a PDMS chip provided in the present application;
[0028] Figure 3 A structural schematic diagram of a pre-embedded part and an elastic part of a pre-punching device for a PDMS chip provided in the present application assembled together through 3D printing;
[0029] Figure 4 A structural schematic diagram of a third design structure of a pre-punching device for a PDMS chip provided in the present application;
[0030] In the figure: 1, base plate; 11, guide structure; 12, fixed plate; 13, threaded hole; 2, pre-embedded part; 21, shaped part; 3, elastic part; 4, 3D printing mold; 41, assembly gap. DETAILED DESCRIPTION
[0031] The technical solutions of the embodiments of the present application will be described clearly and completely below with reference to the drawings. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.
[0032] In the description of the embodiments of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only used to facilitate the description of the embodiments of the present application and simplify the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the embodiments of the present application. In addition, the terms "first", "second", "third" are only for descriptive purposes and cannot be understood as indicating or implying relative importance.
[0033] In the description of the embodiments of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connection" should be understood broadly, for example, it can be fixed connection, or replaceable connection, or integral connection, it can be mechanical connection, or electrical connection, it can be direct connection, or indirect connection through an intermediate medium, or internal communication of two elements. For those skilled in the art, the specific meaning of the above terms in the embodiments of the present application can be understood according to the specific circumstances.
[0034] The embodiments of the present application disclose a pre-punching device for a PDMS chip.
[0035] Please refer toFigure 1 One embodiment of the pre-punching device for PDMS chip provided in the embodiments of the present application comprises:
[0036] The substrate 1 and the plurality of embedded parts 2.
[0037] The plurality of embedded parts 2 are installed on the substrate 1 and arranged perpendicularly to the substrate 1.
[0038] The embedded part 2 is provided with a forming part 21 for forming a hole, one embedded part 2 is used to form one hole, the number of embedded parts 2 is arranged according to the number of holes to be formed, and each embedded part 2 is arranged according to the distribution of holes to be formed, such as a rectangular array, without limitation.
[0039] The shape of the forming part 21 is designed according to the shape of the hole to be formed, such as a cylindrical hole corresponding to a cylindrical forming part 21 and a conical hole corresponding to a conical forming part 21, without limitation.
[0040] The pre-punching device for PDMS chip designed in the present application has the following beneficial effects:
[0041] 1. The base provided with the embedded part 2 is inverted on the PDMS chip forming mold, the forming part 21 of the embedded part 2 enables the formed PDMS chip to have holes directly, the embedded part 2 is removed after the PDMS chip is formed, and the required hole structure is completed, which effectively saves time and labor cost and enables multiple holes to be formed at one time.
[0042] 2. The holes are made in a pre-embedded manner, which is low in cost and convenient to make.
[0043] 3. The hole debris is effectively reduced, and the success rate of the PDMS chip is improved.
[0044] 4. By changing the forming part 21 with a corresponding diameter, holes with a corresponding hole diameter can be made to meet the demand of freely selecting the hole diameter.
[0045] It should be noted that the PDMS chip, i.e. the polydimethylsiloxane chip, can be used as a microfluidic chip.
[0046] The above is embodiment one of the pre-punching device for PDMS chip provided in the embodiments of the present application, and the following is embodiment two of the pre-punching device for PDMS chip provided in the embodiments of the present application, which is specifically described in Figures 1 to 4 .
[0047] Based on the scheme of the above embodiment one:
[0048] Further, as Figure 4As shown, each embedded part 2 is connected with the base plate 1 through the elastic member 3, so as to be elastically movable along the direction perpendicular to the base plate 1.
[0049] By arranging the elastic member 3, each embedded part 2 has a certain range of movement, and has a force to contact the surface of the PDMS chip forming mold (so that the forming part 21 can tightly contact the surface of the PDMS chip forming mold), which can solve the problem that the embedded part and the mold surface may not be flat.
[0050] The elastic member 3 can be a spring or other deformation material instead, such as silicone, TPU, PDMS, etc.
[0051] Further, the base plate 1 is provided with a guide structure 11; the guide structure 11 is connected with the elastic member 3, for limiting the elastic member 3 to stretch and contract along the direction perpendicular to the base plate 1; or the guide structure 11 is connected with the embedded part 2, for limiting the embedded part 2 to move along the direction perpendicular to the base plate 1.
[0052] Designing the guide structure 11 can avoid the movement of the embedded part 2 from deviating, so as to avoid the deformation of the formed hole.
[0053] Further, as shown, Figure 4 The guide structure 11 can be a guide groove, for example, the first design way is that the elastic member 3 is installed in the guide groove and is limited in the stretching and contracting direction by the guide groove, so as to limit the moving direction of the embedded part 2; the second design way is that part of the structure of the embedded part 2 extends into the guide groove and is slidingly matched with the guide groove, the elastic member 3 is sleeved on the embedded part 2 and is connected with the stop flange structure on the embedded part 2 and the base plate 1; the third way is that the elastic member 3 is installed in the guide groove, and part of the structure of the embedded part 2 extends into the guide groove and is slidingly matched with the guide groove. Of course, it is not limited to the above three ways, and those skilled in the art can make appropriate changes and designs based on the above, and the specific design is not limited.
[0054] The elastic member 3 can be connected with the base plate 1 and the embedded part 2 by welding or bonding. As shown in Figure 3 Reserve an assembly hole in the 3D printing mold 4, insert the embedded part 2 into the assembly hole, then print the elastic member 3 on the embedded part 2, or directly print the embedded part 2 and the elastic member 3 in the assembly hole.
[0055] It can also be printed by 3D printing, and the base plate 1, the elastic member 3 and the embedded part 2 are printed at one time, so as to realize the integrated molding of the elastic member 3, the embedded part 2 and the base plate 1.
[0056] The elastic member 3 can be a spring, or other deformation material instead, such as silicone, TPU, PDMS, etc.
[0057] Further, in the design without the elastic member 3, the embedded member 2 is integrally formed with the substrate 1 or detachably connected with the substrate 1.
[0058] Taking the integral connection of the embedded member 2 with the substrate 1 as an example, it can be directly printed and formed in a 3D printing manner as shown in the figure. Figure 1 The rod section of the embedded member 2 on the substrate 1 can be used as the forming part 21.
[0059] Further, as shown in the figures, Figure 3 and Figure 4 Taking the connection with the elastic member 3 as an example, the embedded member 2 can be designed as a pin-shaped needle, and the needle part forms the forming part 21.
[0060] Further, taking the detachable connection of the embedded member 2 with the substrate 1 as an example, the embedded member 2 is a detachable needle, and the needle part forms the forming part 21.
[0061] The substrate 1 can be provided with a protrusion (not shown in the figure), and the detachable needle is detachably connected by being inserted into the protrusion.
[0062] Of course, the structure of the embedded member 2 is not limited to the two structures mentioned above, and those skilled in the art can make changes and designs according to actual needs.
[0063] Further, as shown in the figure, Figure 2 The two sides of the substrate 1 are connected with L-shaped fixing plates 12; the vertical plate part of the fixing plate 12 is provided with a threaded hole 13 penetrating through itself; the threaded hole 13 is provided with a fastener (not shown in the figure) which is threadedly connected with the threaded hole 13 (the fastener can be a screw or a bolt, without limitation); the fasteners of the two fixing plates 12 form a clamping space.
[0064] The substrate 1 is inverted on the PDMS chip forming mold, and after the forming part 21 contacts the surface of the mold, the PDMS chip forming mold can be clamped by rotating the fastener, so that the substrate 1 is reliably fixed on the PDMS chip forming mold.
[0065] The fixing plate 12 can be integrally formed with the substrate 1, without limitation.
[0066] Further, the embedded member 2 is prepared by light-curing 3D printing. It is found through research that if the embedded member 2 is printed by light-curing 3D printing, the embedded member 2 will also have a certain inhibitory effect on the solidification of PDMS, so that the embedded member 2 can be better demolded; if the embedded member 2 is prepared by other methods, UV glue, photosensitive resin or other methods can be used to realize rapid demolding on the forming part 21 of the embedded member 2.
[0067] In addition, in order to solve the problem of surface tension protrusion caused by direct embedding, the upper surface of the PDMS can also be in contact with a piece of surface to avoid the protrusion. Specifically, the pre-punching device designed in the application is directly placed into the PDMS chip forming mold, so that the upper surface of the PDMS repeatedly contacts the upper surface of the mold and the lower surface of the inverted substrate 1. After curing, the surrounding waste PDMS is cut off, and then the pre-punching device is removed. The pre-punching device in this application can be prepared by metal CNC processing.
[0068] The pre-punching device for the PDMS chip provided in the application is described in detail above. For those skilled in the art, according to the idea of the embodiments of the application, there will be changes in the specific implementation and application range. In summary, the content of the specification should not be understood as a limitation of the application.
Claims
1. A pre-punching device for a PDMS chip, characterized in that, The base plate (1) and several embedded parts (2) are included. The embedded parts (2) are installed on the base plate (1) and are arranged perpendicularly to the base plate (1). The embedded parts (2) are provided with a forming part (21) for forming a hole.
2. The pre-punching device for PDMS chip according to claim 1, wherein, Each embedded part (2) is connected to the base plate (1) by an elastic part (3) to be elastically movable along a direction perpendicular to the base plate (1).
3. The pre-punching device for PDMS chip according to claim 2, wherein, The base plate (1) is provided with a guide structure (11). The guide structure (11) is connected to the elastic part (3) to limit the elastic part (3) to be telescopically movable along a direction perpendicular to the base plate (1), or the guide structure (11) is connected to the embedded part (2) to limit the embedded part (2) to be movable along a direction perpendicular to the base plate (1).
4. The pre-punching device for PDMS chip according to claim 3, wherein, The guide structure (11) is a guide groove.
5. The pre-punching device for PDMS chip according to claim 2, wherein, The elastic part (3), the embedded part (2), and the base plate (1) are integrally formed.
6. The pre-punching device for PDMS chip according to claim 2, wherein, The embedded part (2) is integrally formed with the base plate (1) or is detachably connected to the base plate (1).
7. The pre-punching device for PDMS chip according to claim 1, wherein, The embedded part (2) is a pin-shaped thimble, and a thimble part of the embedded part (2) forms the forming part (21).
8. The pre-punching device for PDMS chip according to claim 1, wherein, The embedded part (2) is a detachable needle, and a needle part of the embedded part (2) forms the forming part (21).
9. The pre-punching device for PDMS chip according to claim 1, wherein, L-shaped fixing plates (12) are connected to both sides of the base plate (1). Vertical plate parts of the fixing plates (12) are provided with threaded holes (13) penetrating through the fixing plates (12). Fasteners are arranged in the threaded holes (13) and are threadedly connected to the threaded holes (13). Clamping spaces are formed between the fasteners of two fixing plates (12).
10. The pre-punching device for PDMS chip according to claim 1, wherein, The embedded part (2) is prepared by using a light-cured 3D printing method.