Storage device for semiconductor element

Abstract

The utility model relates to the technical field of semiconductor storage, and discloses a semiconductor element storage device which comprises a box body, a weight sensor and a controller, a reciprocating assembly is connected to the inner wall of the box body, a monitoring assembly is connected to the top in the box body, and an adjusting assembly is connected to the interior of the box body. Compared with the prior art, the semiconductor element storage device has the advantages that in the semiconductor element storage device, the reciprocating assembly is used for conveniently driving the cooling fan to air-dry and dehumidify damp air in the box body, the dehumidification range and effect are increased, storage of semiconductor elements is more beneficial, and the service life of the semiconductor element storage device is prolonged. The monitoring assembly is used for conveniently monitoring the amount of a drying agent in the dehumidification box, a new dehumidification box can be conveniently replaced in time to maintain the dehumidification performance in the box body, the adjusting assembly is used for conveniently adjusting the position of the supporting plate according to semiconductor elements of different sizes, and the operation is more flexible.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor storage, especially to a semiconductor component storage device. BACKGROUND

[0002] In today's era of rapid development of science and technology, the semiconductor industry has become the core driving force of modern information technology. In the entire life cycle of semiconductor components, the storage link is crucial. From temporary storage after manufacturing, to protection during transportation, to inventory management before delivery to customers, reliable storage devices are needed to ensure their performance, quality and reliability are not damaged.

[0003] The existing semiconductor component storage device is inconvenient to dry the internal humid air during use, which can easily affect the semiconductor components. When using a desiccant box for dehumidification, the desiccant in the desiccant box cannot be replaced in time after it is used up, affecting the subsequent dehumidification effect. It is not convenient to adjust the position of the storage support plate according to the size of the semiconductor components, and the flexibility is low, so the device has certain deficiencies. UTILITY MODEL CONTENT

[0004] The utility model aims at solving the shortcomings in the prior art and provides a semiconductor component storage device.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a semiconductor component storage device, comprising a box, a weight sensor and a controller, the inner wall of the box is connected with a reciprocating assembly, the inner top of the box is connected with a monitoring assembly, and the inner part of the box is connected with an adjusting assembly.

[0006] The reciprocating assembly comprises a fixed plate and a drive motor, the fixed plate is fixedly connected to the inner wall of the box, the drive motor is fixedly connected to the outer wall of the box, the output end of the drive motor penetrates through the box and the fixed plate and is fixedly connected with a turntable, the side of the turntable away from the center of the circle is fixedly connected with a fixed rod, the side of the fixed plate is rotatably connected with a drive plate, the drive plate is provided with a through slot, the fixed rod slides in the through slot, one end of the drive plate is rotatably connected with a driven plate, one end of the fixed plate is fixedly connected with a connecting plate, the connecting plate is provided with a sliding groove, a sliding plate is slidably connected in the sliding groove, and the sliding plate is rotatably connected with one end of the driven plate.

[0007] Further description of the above technical scheme:

[0008] The monitoring assembly comprises a support frame, the support frame is fixedly connected to the inner top of the box, the weight sensor is connected to the inner bottom of the support frame, the controller is connected to the top of the box, the weight sensor is connected with a desiccant box at the top, and the weight sensor and the controller are electrically connected.

[0009] As a further description of the above technical solutions:

[0010] The adjusting assembly comprises a support plate, the box is provided with a limiting groove, the limiting groove is provided with a plurality of groups, the support plate is slidably connected in the limiting groove, the support plate is provided with a plurality of groups of ventilation holes, and the ventilation holes are provided with a plurality of groups.

[0011] As a further description of the above technical solutions:

[0012] The side of the box is connected with a box door.

[0013] As a further description of the above technical solutions:

[0014] The inner wall of the box and the inner wall of the box door are both provided with a plurality of groups of through holes, and the through holes are connected with filter screens.

[0015] As a further description of the above technical solutions:

[0016] The side of the slide plate is fixedly connected with a connecting frame, and the side of the connecting frame is fixedly connected with a cooling fan.

[0017] As a further description of the above technical solutions:

[0018] The slide plate and the slide groove are both L-shaped.

[0019] The utility model has the advantages of the following beneficial effects:

[0020] 1. In the semiconductor component storage device, the reciprocating assembly is used to drive the cooling fan to dry and dehumidify the humid air in the box, thereby increasing the dehumidification range and effect, and being more beneficial to the storage of semiconductor components.

[0021] 2. In the semiconductor component storage device, the monitoring assembly is used to monitor the amount of drying agent in the dehumidification box, so that the new dehumidification box can be replaced in time to maintain the dehumidification performance of the box.

[0022] 3. In the semiconductor component storage device, the adjusting assembly is used to adjust the position of the support plate according to different sizes of semiconductor components, and is more flexible. DRAWINGS

[0023] Figure 1 The utility model provides a kind of whole structure schematic for semiconductor component storage device Figure One ;

[0024] Figure 2 The utility model provides a kind of whole structure schematic for semiconductor component storage device Figure Two ;

[0025] Figure 3 A local structure diagram for a semiconductor element storage device is provided in the utility model Figure One ;

[0026] Figure 4 A local structure diagram for a semiconductor element storage device is provided in the utility model Figure Two .

[0027] Legend:

[0028] 1, box; 2, box door; 3, fixed plate; 4, connecting plate; 5, sliding groove; 6, drive motor; 7, rotary disc; 8, fixed rod; 9, drive plate; 10, through slot; 11, driven plate; 12, sliding plate; 13, connecting frame; 14, cooling fan; 15, support frame; 16, weight sensor; 17, dehumidification box; 18, controller; 19, limiting groove; 20, support plate; 21, ventilation hole; 22, through hole. Specific embodiments

[0029] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the scope of protection of the utility model.

[0030] With reference to Figures 1-4 , the utility model provides an embodiment: a semiconductor element storage device, including box 1, weight sensor 16 and controller 18, the reciprocating assembly is connected to the inner wall of box 1, the monitoring assembly is connected to the top of the inner wall of box 1, the adjusting assembly is connected to the inner wall of box 1;

[0031] The reciprocating assembly includes fixed plate 3 and drive motor 6, and the fixed plate 3 is fixedly connected to the inner wall of the box 1, and the drive motor 6 is fixedly connected to the outer wall of the box 1, and the output end of the drive motor 6 passes through the box 1 and the fixed plate 3 and is fixedly connected with the rotary disc 7, and the rotary disc 7 is fixedly connected with the fixed rod 8 away from the position of the center of the side edge, and the fixed plate 3 is rotatably connected with the drive plate 9 on the side edge, and the through slot 10 is formed in the drive plate 9, and the fixed rod 8 slides in the through slot 10, and the drive plate 9 is rotatably connected with the driven plate 11 at one end, and the connecting plate 4 is fixedly connected with the fixed plate 3 at one end, and the sliding groove 5 is formed in the connecting plate 4, and the sliding plate 12 is slidably connected in the sliding groove 5, and the sliding plate 12 is rotatably connected with the driven plate 11 at one end, and the driven plate 11 drives the sliding plate 12 to slide in the sliding groove 5.

[0032] The monitoring assembly comprises a support frame 15 fixedly connected to the inner top of the box body 1, a weight sensor 16 connected to the inner bottom of the support frame 15, a controller 18 connected to the top of the box body 1, a desiccator 17 connected to the top of the weight sensor 16, and the weight sensor 16 and the controller 18 being electrically connected; the adjusting assembly comprises a support plate 20, a plurality of limiting grooves 19 formed in the box body 1, and the support plate 20 being slidingly connected in the limiting grooves 19, the support plate 20 being provided with a plurality of ventilation holes 21, and the box body 1 being provided with a box door 2; a plurality of through holes 22 are formed in the inner walls of the box body 1 and the box door 2, and a filter screen is connected in the through holes 22; the connecting frame 13 is fixedly connected to the side of the sliding plate 12, and the heat dissipation fan 14 is fixedly connected to the side of the connecting frame 13; the sliding plate 12 and the sliding groove 5 are both L-shaped, so as to facilitate the movement of the heat dissipation fan 14.

[0033] Working principle: in the semiconductor component storage device, the driving motor 6 is started to drive the rotating disc 7 to rotate, the rotating disc 7 drives the fixed rod 8 to move, the fixed rod 8 slides in the through slot 10, thereby driving the driving plate 9 to swing, the driving plate 9 drives the driven plate 11 to rotate, the driven plate 11 drives the sliding plate 12 to slide in the sliding groove 5, thereby facilitating the heat dissipation fan 14 to dry and dehumidify the humid air in the box body 1, and the dehumidification range and effect are increased, which is more beneficial to the storage of semiconductor components; the monitoring assembly is used to monitor the amount of desiccant in the desiccator 17, when the desiccant in the desiccator 17 is used up, the weight sensor 16 can monitor the weight change of the desiccator 17, and a signal can be sent to the controller 18, so as to remind the staff to replace the new desiccator 17 in time to maintain the dehumidification performance of the box body 1; the sliding support plate 20 is in the corresponding limiting groove 19, so as to adjust the position of the support plate 20 according to different sizes of semiconductor components, and the support plate 20 is more flexible.

[0034] The electrical components in the text are all connected with the main controller and 220V mains electricity, and the main controller can be a conventional known device such as a computer, and the detailed description of the known functions and known components is omitted in the specific embodiments of the disclosure. In order to ensure the compatibility of the device, the operation means adopted is consistent with the parameters of the market appliances.

[0035] Finally, it should be pointed out that the above-mentioned is only the preferred embodiment of the present application, and is not used to limit the present application, although the present application has been described in detail with reference to the foregoing embodiments, for those skilled in the art, the technical solutions recorded in the foregoing embodiments can be modified, or some technical features can be replaced, any modification, equivalent replacement, improvement, etc. within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A storage device for semiconductor components comprising a housing (1), a weight sensor (16) and a controller (18), characterized in that: The inner wall of the box (1) is connected with a reciprocating assembly, the inner top of the box (1) is connected with a monitoring assembly, and the inner wall of the box (1) is connected with an adjusting assembly. The reciprocating assembly comprises a fixed plate (3) and a drive motor (6), the fixed plate (3) is fixedly connected to the inner wall of the box (1), the drive motor (6) is fixedly connected to the outer wall of the box (1), the output end of the drive motor (6) penetrates through the box (1) and the fixed plate (3) and is fixedly connected with a rotating disc (7), the side edge of the rotating disc (7) away from the center position is fixedly connected with a fixed rod (8), the side edge of the fixed plate (3) is rotatably connected with a driving plate (9), the driving plate (9) is provided with a through slot (10), the fixed rod (8) slides in the through slot (10), one end of the driving plate (9) is rotatably connected with a driven plate (11), one end of the fixed plate (3) is fixedly connected with a connecting plate (4), the connecting plate (4) is provided with a sliding groove (5), the sliding groove (5) is slidably connected with a sliding plate (12), and the sliding plate (12) is rotatably connected with one end of the driven plate (11).

2. A semiconductor device storage apparatus according to claim 1, wherein: The monitoring assembly comprises a support frame (15), the support frame (15) is fixedly connected to the inner top of the box (1), the weight sensor (16) is connected to the inner bottom of the support frame (15), the controller (18) is connected to the top of the box (1), the weight sensor (16) is connected with a dehumidification box (17) at the top, and the weight sensor (16) and the controller (18) are electrically connected.

3. A semiconductor memory device according to claim 1, wherein: The adjusting assembly comprises a support plate (20), the box (1) is provided with a limiting groove (19), the limiting groove (19) is provided with a plurality of groups, the support plate (20) is slidably connected in the limiting groove (19), the support plate (20) is provided with a ventilation hole (21), and the ventilation hole (21) is provided with a plurality of groups.

4. A semiconductor memory device according to claim 1, wherein: The side of the box (1) is connected with a box door (2).

5. A semiconductor device storage apparatus according to claim 1, wherein: The inner wall of the box (1) and the inner wall of the box door (2) are both provided with a through hole (22), the through hole (22) is provided with a plurality of groups, and the through hole (22) is connected with a filter screen.

6. A semiconductor device storage apparatus according to claim 1, wherein: The side of the sliding plate (12) is fixedly connected with a connecting frame (13), and the side of the connecting frame (13) is fixedly connected with a cooling fan (14).

7. A semiconductor memory device according to claim 1, wherein: The sliding plate (12) and the sliding groove (5) are both L-shaped.

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