Totally-closed liquid crystal display adopting conduction heat dissipation
By employing conductive heat dissipation in the LCD display, utilizing structures such as an aluminum alloy frame and thermally conductive silicone, heat is rapidly conducted and dissipated from the heat-generating components. This solves the problems of low efficiency and high noise in traditional heat dissipation methods in dusty and humid environments, achieving efficient, stable, and low-cost heat dissipation.
Patent Information
- Application Number
- CN202422452432.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-11
- Publication Date
- 2025-12-05
- Estimated Expiration
- 2034-10-11
AI Technical Summary
Traditional heat dissipation methods are prone to clogging in dusty and humid environments, affecting heat dissipation efficiency, increasing the risk of equipment failure, noise and energy consumption, and resulting in high maintenance costs.
Employing the principle of conductive heat dissipation, the high thermal conductivity aluminum alloy frame and back plate, combined with thermally conductive silicone and heat sinks, enable heat to be quickly conducted from the heat-generating components to the casing and dissipated over a large area, preventing dust and moisture from entering.
It achieves efficient heat dissipation, avoids dust and moisture damage, reduces noise and energy consumption, extends equipment life, and reduces maintenance needs and failure risks.
Smart Images
Figure CN223638079U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to liquid crystal display technical field especially relates to a kind of full-enclosed liquid crystal display using conduction heat dissipation. BACKGROUND
[0002] In the field of high-power full-enclosed module, the traditional heat dissipation method often relies on heat dissipation fan and convection cooling hole, which removes the heat generated inside the equipment through air flow. However, in a dusty environment, the heat dissipation fan and the cooling hole are prone to accumulate dust, causing the air duct to be blocked and the air flow to be poor, thereby significantly reducing the heat dissipation efficiency. This not only raises the temperature inside the equipment, but also can affect the performance and lifespan of the equipment. The traditional heat dissipation method is easily affected in a humid environment. Moisture can penetrate into the interior of the equipment through the cooling hole, causing a short circuit or corrosion of the circuit. In addition, changes in humidity can also cause changes in thermal stress of the internal components of the equipment, increasing the risk of failure. The heat dissipation fan generates noise and vibration during operation, affecting the user's experience. Especially in situations that require a quiet environment (such as monitoring and command centers), the noise problem is particularly prominent. The heat dissipation fan needs to consume additional power to drive, increasing the energy consumption and cost of the equipment. At the same time, the maintenance and replacement of the fan also require certain cost and time investment. Therefore, the utility model provides a full-enclosed liquid crystal display using conduction heat dissipation to meet the needs. SUMMARY
[0003] To solve the above technical problems, the utility model provides the following technical scheme:
[0004] A full-enclosed liquid crystal display using conduction heat dissipation, comprising an aluminum alloy display screen main body, a power module, a liquid crystal display control mainboard, a display module, and a display rear shell. The aluminum alloy display screen main body is wrapped around the display module by a heat-conducting silicone adhesive between the aluminum alloy frame and the backplate. The metal shell of the display module is adhered to the display screen backplate with heat-conducting silicone. The display screen backplate conducts the heat generated by the display module's backlight to the backplate and frame for heat dissipation. The power module and the liquid crystal display control mainboard are fixedly connected to the display screen main body backplate. The power module conducts the heat generated by the power supply to the display screen main body backplate through a protective steel cover. The liquid crystal display control mainboard has a liquid crystal display control chip on its top. The main heat source of the liquid crystal display control mainboard is concentrated on the liquid crystal display control chip. The top of the chip is provided with a heat sink adhered to the display rear shell with heat-conducting silicone. One side of the rear shell is provided with a wire butt joint socket.
[0005] Optionally, the back of the aluminum alloy display screen main body is provided with two mounting cavities, and each mounting cavity has a power supply main body and a liquid crystal display control mainboard fixedly connected inside.
[0006] Optionally, the back of the display screen back plate is bolted with a power protection steel cover, a plurality of through holes are formed in the top of the power protection steel cover, and the power supply body is located in the power protection steel cover.
[0007] Optionally, the back of the aluminum alloy display screen body is bolted with a display rear shell, and the display rear shell is provided with sound holes on both sides.
[0008] Optionally, a sealing material is arranged in the gap between the aluminum alloy display screen body and the display rear shell, and the heat dissipation fins of the mainboard chip are bonded to the rear display rear shell to form heat conduction and heat dissipation.
[0009] Optionally, the back of the aluminum alloy display screen body is provided with a heat dissipation medium for reducing thermal resistance.
[0010] Compared with the prior art, the utility model has at least the following beneficial effects:
[0011] In the above scheme, based on the conduction heat dissipation principle, heat is spontaneously transferred from a high-temperature object to a low-temperature object. In the high-power fully enclosed module, the heat generated by the heating element is rapidly conducted to the chassis back plate and the frame through the heat conduction medium (such as heat-conducting silicone grease and heat-conducting pad). Since the chassis back plate and the frame are made of metal materials with high thermal conductivity and have a large heat dissipation area, they can rapidly dissipate heat to the air, thereby achieving good heat dissipation effect. The module encloses the liquid crystal display screen module in a high-efficiency heat-conducting aluminum alloy chassis body, the display screen back plate is pasted with the chassis back plate by using heat-conducting silicone, the display screen backlight heat is conducted to the large chassis back plate, the power protection steel cover is in convection with the heat, the protection steel cover is fixed around the chassis, and the power supply is conducted to the chassis. The mainboard heat is mainly concentrated in the graphic control chip, the heat sink is installed on the chip, the heat sink is pasted with the large back plate by using heat-conducting silicone, and the heat is directly conducted to the chassis back plate and the frame. In this way, the heat is absorbed and dissipated by the large-area high-efficiency heat-conducting aluminum alloy. BRIEF DESCRIPTION OF DRAWINGS
[0012] The drawings incorporated herein and forming part of the specification show embodiments of the present application and, together with the specification, further serve to explain the principles of the present application and to enable one skilled in the relevant art to practice and use the present application.
[0013] Fig. 1 It is a schematic diagram of the full-enclosed liquid crystal display three-dimensional structure for adopting conduction heat dissipation.
[0014] Fig. 2 It is a schematic diagram of the full-enclosed liquid crystal display three-dimensional structure for adopting conduction heat dissipation.
[0015] Fig. 3 It is a schematic diagram of the full-enclosed liquid crystal display three-dimensional structure for adopting conduction heat dissipation.
[0016] [Reference signs]
[0017] 1, aluminum alloy display screen main body; 2, display back shell; 201, sound hole; 3, power module; 4, liquid crystal display control mainboard; 5, chip; 6, power protection steel cover; 601, flow-through hole; 7, power main body.
[0018] As shown in the drawings, in order to clearly realize the structure of the embodiments of the utility model, specific structures and devices are marked in the drawings, but this is only for the need of illustration, and is not intended to limit the utility model in the specific structure, device and environment. According to the specific needs, those skilled in the art can adjust or modify these devices and environment. DETAILED DESCRIPTION
[0019] The full-closed liquid crystal display using conduction heat dissipation provided by the utility model is described in detail below in combination with the drawings and specific embodiments. It should be noted that in order to make the embodiments more detailed, the following embodiments are the best, preferred embodiments, and other alternative ways can also be used by those skilled in the art to implement some known technologies; and the drawings are only used to more specifically describe the embodiments, and are not intended to specifically limit the utility model.
[0020] It should be noted that in the specification, "one embodiment", "embodiment", "exemplary embodiment", "some embodiments" and the like indicate that the described embodiments can include specific features, structures or characteristics, but not necessarily every embodiment includes the specific features, structures or characteristics. In addition, when describing specific features, structures or characteristics in combination with embodiments, it should be within the knowledge of those skilled in the related art to realize such features, structures or characteristics in combination with other embodiments (whether or not explicitly described).
[0021] Generally, the terms can be understood at least in part from the usage in context. For example, depending at least in part on the context, the term "one or more" as used herein can be used to describe any feature, structure, or characteristic in the singular or can be used to describe combinations of features, structures, or characteristics that are combinable into one or more instances. In addition, the term "based on" can be understood as not necessarily intended to convey a set of exclusive factors, but can instead, depending at least in part on the context, allow for the existence of other factors that are not necessarily explicitly described.
[0022] It is to be understood that the terms "on", "above", and "upper" in the present application should be interpreted in the broadest context, such that "on" not only means "directly on" but also includes the meaning of "on" with intervening characteristics or layers therebetween, and "above" or "upper" not only means "above" or "upper" but also can include the meaning of "above" or "upper" with no intervening characteristics or layers therebetween.
[0023] In addition, spatially relative terms, such as "beneath", "below", "lower", "above", "upper", and the like, can be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientations depicted in the figures. The devices can be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
[0024] As Figs. 1-3The utility model discloses an embodiment provides a kind of totally enclosed liquid crystal display using conduction heat dissipation, including aluminium alloy display screen main body 1, power module 3, liquid crystal display control mainboard 4, display module and display rear shell 2, aluminium alloy display screen main body 1 is by aluminium alloy frame and backplate and is wrapped display module by heat-conducting silica gel bonding, the metal shell of display module is bonded with display screen backplate by heat-conducting silica gel, and display screen backplate conducts display module backlight heat to backplate and frame and radiates heat.A power module 3 and an LCD control motherboard 4 are fixedly connected to the back panel of the display body. The power module 3 conducts heat dissipation to the back panel of the display body through a protective steel cover. An LCD control chip 5 is located on the top of the LCD control motherboard 4. The main heat generation of the LCD control motherboard 4 is concentrated on the LCD control chip 5. A heat sink is located on the top of the chip 5 and is bonded to the back cover 2 of the display via thermally conductive silicone. A wire connection port is located on one side of the back cover 2. Two mounting cavities are located on the back of the aluminum alloy display body 1, and each mounting cavity contains a power supply unit 7 and an LCD control motherboard 4 fixedly connected. The back of the display body has screws... A power protection steel cover 6 is bolted to the back of the aluminum alloy display screen body 1. The top of the power protection steel cover 6 has densely arranged flow holes 601. The power supply body 7 is located inside the power protection steel cover 6. A display back cover 2 is bolted to the back of the aluminum alloy display screen body 1. The display back cover 2 has sound holes 201 on both sides. A heat dissipation medium to reduce thermal resistance is provided on the back of the aluminum alloy display screen body 1. When the display module inside the aluminum alloy display screen body 1 starts working, it displays images or information. During operation, the display module, LCD display control chip 5, and power module 3 generate heat. The metal casing of the display module is tightly connected to the display screen back panel through thermally conductive silicone, transferring the heat to the back panel. The heat from the back panel of the display screen is further conducted to the aluminum alloy frame, where the excellent thermal conductivity of aluminum alloy facilitates heat dissipation. The heat sink on the LCD control chip 5 is tightly connected to the back shell 2 of the display screen via thermally conductive silicone, transferring the heat generated by the chip 5 to the back shell. The power module 3 conducts heat to the back panel of the display screen through a protective steel cover (with ventilation holes 601). Simultaneously, the ventilation holes 601 promote airflow and assist in heat dissipation. The aluminum alloy frame and back shell dissipate heat into the environment through natural convection or, where possible, auxiliary cooling methods such as fans. The ventilation holes 601 on the power protection steel cover 6 increase airflow, which helps the power module 3... The heat dissipation of the display employs conductive cooling, utilizing an aluminum alloy frame, backplate, and heat sinks to effectively conduct and dissipate heat generated by internal components into the environment, ensuring stable operation of the monitor. The overall design maintains the monitor's complete enclosure, preventing damage to internal components from dust, moisture, and other external factors, thus improving the monitor's reliability and lifespan. Through a rational structural design, components such as the power module 3 and the LCD control motherboard 4 are compactly installed inside the display body, reducing the monitor's size and weight. The backplate of the display is equipped with a heat-dissipating medium (such as thermally conductive silicone) to reduce thermal resistance, further improving heat conduction efficiency.
[0025] like Figs. 1-3 As shown, the large surface area of the aluminum alloy display screen body 1 dissipates heat into the surrounding air through natural convection and radiation. At the same time, the heat generated by the power supply body 7 is dissipated through the flow holes 601 of the power supply protection steel cover 6, further reducing the power supply temperature.
[0026] As shown in Figs. 1-3 The gap between the display rear shell 2 and the aluminum alloy display screen body 1 is sealed by the sealing material, preventing dust and moisture from entering, ensuring the cleanliness and dryness of the internal environment, quickly dispersing and dissipating heat through multiple heat conduction paths, significantly improving the heat dissipation efficiency, and effectively preventing dust and moisture from entering through the application of a fully enclosed structure and sealing material, protecting the internal electronic components from damage, eliminating the need for a heat dissipation fan, eliminating operating noise, improving user experience, reducing the energy consumption and operating cost of the device without the need for additional power to drive the heat dissipation fan, reducing the maintenance requirements for vulnerable components such as fans, reducing maintenance costs and time investment, and effectively reducing the internal temperature of the device, reducing the risk of performance degradation and failure caused by high temperatures, improving the stability and reliability of the device, and prolonging the service life of the device by protecting the internal electronic components from dust, moisture and high temperatures.
[0027] The working principle of the utility model provides, the display module in aluminum alloy display screen body 1 starts to work, and display image or information, display module, liquid crystal display control chip 5 and power module 3 will produce heat in the working process, the metal shell of display module is connected closely with display screen backplate through heat-conducting silica gel, and heat is conducted to backplate, and the heat is further conducted to aluminum alloy frame on display screen backplate, and heat is dissipated by the good heat conductivity of aluminum alloy, and the fin on liquid crystal display control chip 5 is connected closely with display rear shell 2 through heat-conducting silica gel, and the heat generated by chip 5 is conducted to the rear shell, and power module 3 is conducted to the display screen body backplate through the protection steel cover (with flow hole 601), and the flow hole 601 promotes air circulation, and assists heat dissipation, and the aluminum alloy frame and the rear shell are connected closely through natural convection or possible fan auxiliary heat dissipation means, and heat is dissipated to the environment, and the flow hole 601 on the power protection steel cover 6 increases air circulation, which helps the heat dissipation of power module 3, and the conduction heat dissipation mode is adopted, and the heat generated by internal components is effectively conducted and dissipated to the environment through the structure of aluminum alloy frame, backplate and fin, ensuring the stable operation of the display, and the heat generated by power supply body 7 is convected and dissipated through the flow hole 601 of the power protection steel cover 6, further reducing the temperature of the power supply.
[0028] The utility model covers any alternative, modification, equivalent method and scheme in the essence and range of the utility model. In order to make the public have the thorough understanding of the utility model, the specific details are explained in the following preferred embodiments of the utility model, and the utility model can also be completely understood without the description of these details for those skilled in the art. In addition, in order to avoid unnecessary confusion to the essence of the utility model, well-known methods, processes, flows, elements and circuits are not described in detail.
[0029] The above merely is preferred implementation manner of the present application, it should be pointed out, for ordinary skilled person in the technical field, on the premise of not departing from the principle of the present application, can also make several improvements and refinements, these improvements and refinements also should be regarded as the protection scope of the present application.
Claims
1. A totally-enclosed liquid crystal display using conduction heat dissipation, comprising an aluminum alloy display screen main body (1), a power module (3), a liquid crystal display control main board (4), a display module and a display rear shell (2), characterized in that, The aluminum alloy display screen body (1) is wrapped with a display module by a heat-conducting silica gel adhesive through an aluminum alloy frame and a back plate, the metal shell of the display module is adhered with a display screen back plate through a heat-conducting silica gel adhesive, the display screen back plate conducts the display module backlight heat to the back plate and the frame for heat dissipation; the display screen body back plate is fixedly connected with a power module (3) and a liquid crystal display control mainboard (4), the power module (3) conducts the power heat dissipation to the display screen body back plate through a protective steel cover, the top of the liquid crystal display control mainboard (4) is provided with a liquid crystal display control chip (5), the main heat of the liquid crystal display control mainboard (4) is concentrated on the liquid crystal display control chip (5), the top of the chip (5) is provided with a cooling fin and is adhered with a display rear shell (2) through a heat-conducting silica gel, one side of the display rear shell (2) is provided with a wire butt joint socket.
2. The totally-enclosed liquid crystal display employing conduction cooling according to claim 1, wherein, The back of the aluminum alloy display screen body (1) is provided with two installation cavities, and the inside of each installation cavity is fixedly connected with a power main body (7) and a liquid crystal display control mainboard (4).
3. The totally-enclosed liquid crystal display employing conduction cooling according to claim 2, wherein, The back of the display screen back plate is bolted with a power protection steel cover (6), the top of the power protection steel cover (6) is provided with a plurality of through holes (601), and the power main body (7) is located in the inside of the power protection steel cover (6).
4. The totally-enclosed liquid crystal display employing conduction cooling according to claim 1, wherein, The back of the aluminum alloy display screen body (1) is bolted with a display rear shell (2), and the display rear shell (2) has sound holes (201) on both sides.
5. The totally-enclosed liquid crystal display employing conduction cooling according to claim 4, wherein, The gap between the aluminum alloy display screen body (1) and the display rear shell (2) is provided with a sealing material.
6. The totally-enclosed liquid crystal display employing conduction cooling of claim 1, wherein, The back of the aluminum alloy display screen body (1) is provided with a heat dissipation medium for reducing thermal resistance.