Press-fit cover and packaging structure

Abstract

The utility model provides a pressing cover and a packaging structure, and relates to the technical field of semiconductor packaging. The press-fit cover comprises a plurality of press-fit parts and connecting ribs. Each pressing part comprises a first section and a second section which are connected with each other, and the first section and the second section are connected with each other at an angle. And a bending part is arranged at one end, far away from the first section, of the second section. The bending part is used for pressing and holding a substrate, and the first subsection is used for pressing and holding a plastic package body. And the connecting ribs are arranged between the pressing parts, are connected with the pressing parts, and are used for connecting the pressing parts into a whole. According to the press-fit cover, by arranging the first subsection for pressing and holding the plastic package body and the bending part for pressing and holding the substrate, buckling deformation of the package structure can be effectively prevented, and the connection stability of the package structure is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor packaging, especially to a compression cover and packaging structure. BACKGROUND

[0002] With the rapid development of the semiconductor industry, in the SIP system-in-package, after the chip is attached to the substrate, plastic packaging is carried out by using a plastic package body to realize the protection of the chip by the plastic package body. Due to the inconsistent thermal expansion coefficients of various materials such as the chip, the substrate and the plastic package body, the warpage of the packaging structure is increased. When the packaging structure is attached to the PCB after being completed, the warpage deformation will be more serious under the condition of high-temperature welding, which may cause the separation of the substrate pad and the welding position of the PCB, resulting in electrical connection failure. SUMMARY

[0003] The utility model discloses a compression cover and packaging structure, which is beneficial to alleviate the warpage deformation of the packaging structure, reduce the risk of welding failure and improve the reliability of the packaging structure.

[0004] In a first aspect, the utility model provides a compression cover, which comprises:

[0005] A plurality of compression parts, each compression part comprising a first segment and a second segment connected in series, wherein the first segment and the second segment are connected at an angle; a bending part is arranged at the end of the second segment away from the first segment, and the bending part is used for holding the substrate; and the first segment is used for holding the plastic package body.

[0006] A connecting rib is arranged between the compression parts and connected with the compression parts, and the connecting rib is used for connecting the plurality of compression parts into one body.

[0007] In an optional embodiment, the first segment and the second segment are connected at an angle of 80 to 100 degrees.

[0008] In an optional embodiment, the bending part comprises a third segment and a fourth segment, wherein the third segment and the second segment are connected at the end away from the first segment; the fourth segment is connected at the end of the third segment away from the second segment, and the third segment and the fourth segment are connected at an angle.

[0009] In an optional embodiment, the extension direction of the third segment is opposite to the extension direction of the first segment.

[0010] In an optional embodiment, the extension direction of the fourth segment is consistent with the extension direction of the second segment.

[0011] In an optional embodiment, the first segment is provided with a heat dissipation groove and / or a heat dissipation through hole.

[0012] In an optional embodiment, the tie beam is provided with heat dissipation grooves and / or heat dissipation through holes.

[0013] In an optional embodiment, the plurality of pressing portions includes four pressing portions, the four pressing portions are arranged at four corners of the rectangle, the tie beam is connected between two adjacent pressing portions, and the four pressing portions and the four tie beams enclose a heat dissipation area.

[0014] In a second aspect, the utility model provides a packaging structure, including chip, plastic package body, base plate and the pressing cover of any one of preceding embodiments, the chip is attached on the base plate, the plastic package body covers the chip, the pressing cover covers the plastic package body, and the pressing cover is connected with the base plate.

[0015] In an optional embodiment, the first segment is pressed on the plastic package body, and the bending portion is connected with the base plate.

[0016] The pressing cover and the packaging structure provided by the embodiments of the utility model have the beneficial effects that:

[0017] The pressing cover provided by the embodiments of the utility model is provided with the first segment for pressing the plastic package body and the bending portion for pressing the base plate, which can effectively prevent the warping deformation of the packaging structure and improve the stability of the connection of the packaging structure.

[0018] The packaging structure provided by the embodiments of the utility model includes the above pressing cover, which can alleviate the warping deformation of the packaging structure and improve the stability and reliability of the connection of the packaging structure. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical scheme in the specific embodiments of the utility model or the prior art, the drawings needed in the specific embodiments or the prior art description will be briefly introduced as follows, and obviously, the drawings in the following description are some embodiments of the utility model, and those skilled in the art can also obtain other drawings according to these drawings without creative labor.

[0020] Figure 1 The schematic diagram of the packaging structure including the pressing cover provided by the embodiments of the utility model is shown in the figure.

[0021] Figure 2 The structure schematic diagram of another view of the packaging structure is shown in the figure. Figure 1

[0022] Figure 3 ​A structure schematic view of the compression cover provided by the utility model embodiment;

[0023] Figure 4 Another structure schematic view of the compression cover provided by the utility model embodiment.

[0024] Icon: 100-compression cover;110-compression part;111-first section;112-second section;113-bent part;114-third section;115-fourth section;120-heat dissipation through hole;130-continuous rib;200-encapsulation structure;210-substrate;220-chip;230-plastic encapsulation body. DETAILED DESCRIPTION

[0025] In order that the objects, technical solutions and advantages of the utility model embodiments are more apparent, the following will combine the drawings in the utility model embodiments to make a clear and complete description of the technical solutions in the utility model embodiments. Obviously, the described embodiments are part of the embodiments of the utility model, rather than all the embodiments. The components of the utility model embodiments described and shown in the drawings can be arranged and designed in various different configurations.

[0026] Therefore, the following detailed description of the embodiments of the utility model provided in the drawings is not intended to limit the scope of the claimed utility model, but only represents selected embodiments of the utility model. Based on the embodiments in the utility model, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of protection of the utility model.

[0027] It should be noted that: similar labels and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0028] In the description of the utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship commonly placed when the utility model product is used, and are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the utility model. In addition, the terms "first", "second", "third" and the like are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0029] In addition, the terms "horizontal", "vertical", "overhang" and the like do not mean that the components must be absolutely horizontal or overhanging, but can be slightly inclined. For example, "horizontal" only means that it is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0030] In the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "set", "install", "connect" and "connect" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be connected inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0031] Some embodiments of the present application will be described in detail below with reference to the accompanying drawings. In the case of no conflict, the following examples and features in the examples can be combined with each other.

[0032] In combination Figures 1 to 4 The compression cover 100 provided by the embodiment of the present application is used in the packaging structure 200 of the semiconductor chip 220. The compression cover 100 is used to press and hold the plastic package 230 and the substrate 210, thereby reducing the warping deformation of the plastic package 230 and the substrate 210 in the packaging process, and improving the connection stability and reliability of the packaging structure 200.

[0033] The compression cover 100 comprises a plurality of compression parts 110 and a connecting rib 130. Each compression part 110 comprises a first segment 111 and a second segment 112 connected together, and the first segment 111 and the second segment 112 are connected at an angle. The second segment 112 is provided with a bending part 113 at one end away from the first segment 111. The bending part 113 is used to press and hold the substrate 210, and the first segment 111 is used to press and hold the plastic package 230. The connecting rib 130 is arranged between the compression parts 110 and connected with the compression parts 110, and the connecting rib 130 is used to connect the plurality of compression parts 110 together. The compression cover 100 can effectively prevent the warping deformation of the packaging structure 200 by arranging the first segment 111 to press and hold the plastic package 230 and arranging the bending part 113 to press and hold the substrate 210, thereby improving the connection stability of the packaging structure 200. Furthermore, the plurality of compression parts 110 are connected together by arranging the connecting rib 130, which is convenient for mounting, and is also conducive to improving the structural strength of the compression cover 100, the pressing effect is better, which is conducive to reducing the warping deformation of the packaging structure 200, and improving the connection stability and reliability of the packaging structure 200.

[0034] The first segment 111 and the second segment 112 form an angle of 80 to 100 degrees. For example, the first segment 111 and the second segment 112 form an angle of 80 degrees, 85 degrees, 88 degrees, 90 degrees, 93 degrees, 95 degrees, 98 degrees or 100 degrees. Of course, the angle can also be any angle value in the range of 80 to 100 degrees. In the embodiment, the first segment 111 and the second segment 112 form an angle of 90 degrees, which is more reliable in clamping force and better in warpage prevention.

[0035] Optionally, the bending part 113 includes a third segment 114 and a fourth segment 115. The third segment 114 is connected to the second segment 112 away from the first segment 111. The fourth segment 115 is connected to the third segment 114 away from the second segment 112, and the third segment 114 and the fourth segment 115 are connected at an angle. Optionally, the third segment 114 extends in a direction opposite to the first segment 111. Optionally, the fourth segment 115 extends in a direction consistent with the second segment 112. In other words, the third segment 114 and the fourth segment 115 form an angle of about 90 degrees. Of course, the angle formed by the third segment 114 and the fourth segment 115 can also be any angle value in the range of 80 to 100 degrees. The second segment 112 and the third segment 114 form an angle of about 90 degrees. Of course, the angle formed by the second segment 112 and the third segment 114 can also be any angle value in the range of 80 to 100 degrees. Here, no specific limitation is made.

[0036] It can be understood that the first segment 111 is attached to the upper surface of the plastic package 230 to clamp the upper surface of the plastic package 230. The second segment 112 is attached to the side surface of the plastic package 230. The third segment 114 is attached to the upper surface of the substrate 210 to clamp the upper surface of the substrate 210. The fourth segment 115 is attached to the side surface of the substrate 210. In this way, the warpage deformation of the plastic package 230 and the substrate 210 in the process of the packaging structure 200 can be prevented. Thus, the warpage deformation of the plastic package 230 and the substrate 210 can be avoided, which can improve the reliability of the packaging structure 200 and the structural reliability of the packaging structure 200 after being mounted on the PCB circuit board.

[0037] Optionally, the plurality of pressing portions 110 includes four pressing portions 110, which are arranged at four corners of the rectangle, and the connecting ribs 130 are connected between two adjacent pressing portions 110, and the four pressing portions 110 and the four connecting ribs 130 enclose the heat dissipation area. In this embodiment, the number of the pressing portions 110 is four, and the number of the connecting ribs 130 is four. The arrangement of the connecting ribs 130 is beneficial to improve the structural strength of the pressing cover 100, and the connecting ribs 130 are also used to apply pressure to the upper surface of the plastic package 230 to improve the pressing effect. In this embodiment, the two ends of the connecting rib 130 are connected with the first segments 111 of the two pressing portions 110, respectively. In other embodiments, the two ends of the connecting rib 130 can be connected with the second segments 112 of the two pressing portions 110, respectively. Alternatively, the connecting ribs 130 are connected between the first segments 111 of the two pressing portions 110 and between the second segments 112 of the two pressing portions 110, respectively. Here, no specific limitation is made.

[0038] After the pressing portions 110 and the connecting ribs 130 are connected, the plurality of pressing portions 110 forms a hollow heat dissipation area, which includes but is not limited to the upper surface and the side surface of the plastic package 230. This is beneficial to improve the contact area between the plastic package 230 and the air, thereby improving the heat dissipation performance.

[0039] It can be understood that in other embodiments, the number of the pressing portions 110 is not limited and can be one, two, three, five, six or more. The number and distribution of the connecting ribs 130 can also be designed flexibly according to actual needs, and here, no specific limitation is made.

[0040] Optionally, the first segment 111 is provided with a heat dissipation portion, which includes heat dissipation grooves and / or heat dissipation through holes 120, to further improve the heat dissipation performance. The first segment 111 can be provided with only the heat dissipation grooves, only the heat dissipation through holes 120, or both the heat dissipation grooves and the heat dissipation through holes 120. The number and shape of the heat dissipation grooves and the heat dissipation through holes 120 are not limited. In this embodiment, the heat dissipation portion on the first segment 111 includes the heat dissipation through holes 120. The cross-sectional shape of the heat dissipation through holes 120 can be rectangular, circular, elliptical, crescent or any other shape.

[0041] Similarly, the connecting rib 130 is provided with a heat dissipation portion. The heat dissipation portion includes heat dissipation grooves and / or heat dissipation through holes 120. The connecting rib 130 can be provided with only the heat dissipation grooves, only the heat dissipation through holes 120, or both the heat dissipation grooves and the heat dissipation through holes 120. The number of the connecting ribs 130 is a plurality, and some of the connecting ribs 130 can be provided with the heat dissipation portion, or all of the connecting ribs 130 can be provided with the heat dissipation portion, and here, no specific limitation is made.

[0042] In some other embodiments, the second segment 112, the third segment 114 and the fourth segment 115 can also be selectively provided with heat dissipation parts, including at least one of heat dissipation grooves and heat dissipation through holes 120.

[0043] Optionally, the pressing parts 110 and the connecting ribs 130 can be integrally formed or fixedly connected in a split manner. In the embodiment, the pressing parts 110 and the connecting ribs 130 are integrally formed, which is convenient for manufacturing, transportation and mounting, and is conducive to improving the packaging efficiency and mounting precision. The material of the pressing cover 100 in the embodiment includes any one or any multiple of metal, ceramic, wood and silicon wafer.

[0044] The utility model embodiment further provides a packaging structure 200, including chip 220, plastic package body 230, base plate 210 and preceding pressing cover 100, chip 220 is mounted on base plate 210, plastic package body 230 covers chip 220, and pressing cover 100 covers plastic package body 230, and pressing cover 100 is connected with base plate 210. Optionally, the first segment 111 is pressed on the plastic package body 230, and the bending part 113 is connected with the base plate 210. It is easy to understand that the pressing cover 100 can be fixedly connected with the base plate 210 by bonding or clamping and the like. Optionally, heat dissipation glue or the like can be selectively arranged between the pressing cover 100 and the plastic package body 230. Heat dissipation glue or the like can be selectively arranged between the pressing cover 100 and the base plate 210.

[0045] In summary, the pressing cover 100 and the packaging structure 200 provided by the utility model embodiment have the following beneficial effects, including:

[0046] The pressing cover 100 provided by the utility model embodiment is provided with the first segment 111 for pressing the plastic package body 230 and the bending part 113 for pressing the base plate 210, which can effectively prevent the warping deformation of the packaging structure 200 and improve the stability of the connection of the packaging structure 200. Furthermore, the plurality of pressing parts 110 are connected together by the connecting ribs 130, which is convenient for mounting and is conducive to improving the structural strength of the pressing cover 100, the pressing effect is better, and the warping deformation of the packaging structure 200 is alleviated, and the stability and reliability of the connection of the packaging structure 200 are improved.

[0047] The packaging structure 200 provided by the utility model embodiment includes the above-described pressing cover 100, which can alleviate the warping deformation of the packaging structure 200 and improve the stability and reliability of the connection of the packaging structure 200.

[0048] Finally, it should be noted that: the above embodiments are used to illustrate the technical solutions of the present application, but not limited to them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement to part or all of the technical features; any modification, equivalent replacement, improvement, etc. made should be included in the protection scope of the present application.

Claims

1. A press-fit cover, characterized by, The application relates to a compression cover for a plastic package, which comprises: a plurality of compression parts, each of which comprises a first segment and a second segment connected in series, the first segment and the second segment being connected at an angle; a bending part is arranged at one end of the second segment away from the first segment, the bending part being used for compressing a substrate, and the first segment being used for compressing a plastic package; a connecting rib arranged between the compression parts and connected with the compression parts, the connecting rib being used for connecting the plurality of compression parts into one body.

2. The press-on lid of claim 1, wherein The first segment and the second segment are connected at an angle of 80-100 degrees.

3. The press-on lid of claim 1, wherein The bending part comprises a third segment and a fourth segment, one end of the third segment away from the first segment being connected with the second segment; the fourth segment is connected at one end of the third segment away from the second segment, and the third segment and the fourth segment are connected at an angle.

4. The press-on lid of claim 3, wherein The extending direction of the third segment is opposite to the extending direction of the first segment.

5. The press-on lid of claim 3, wherein The extending direction of the fourth segment is consistent with the extending direction of the second segment.

6. The press-on lid of claim 1, wherein The first segment is provided with a heat dissipation groove and / or a heat dissipation through hole.

7. The press-on lid of claim 1, wherein The connecting rib is provided with a heat dissipation groove and / or a heat dissipation through hole.

8. The press-on lid of claim 1, wherein, The plurality of compression parts comprises four compression parts, the four compression parts being arranged at four corners of a rectangle, the connecting rib being connected between two adjacent compression parts, and the four compression parts and the four connecting ribs being used for forming a heat dissipation area.

9. A package structure, characterized by, The application further relates to a device comprising a chip, a plastic package, a substrate and the compression cover according to any one of claims 1-8, the chip being attached to the substrate, the plastic package being used for covering the chip, the compression cover being used for covering the plastic package, and the compression cover being connected with the substrate.

10. The package structure of claim 9, wherein, The first segment is used for compressing the plastic package, and the bending part is connected with the substrate.

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