Circuit board structure and multilayer circuit board

Abstract

The utility model relates to the technical field of circuit boards, and particularly discloses a circuit board structure and a multilayer circuit board, the circuit board structure comprises a circuit layer and a flow choking block; the plurality of choked flow blocks are arranged on the circuit layer, the plurality of choked flow blocks are arranged in a honeycomb structure, a flow guide groove is formed between every two adjacent choked flow blocks, and the choked flow blocks are of a hexagonal structure. According to the multilayer circuit board provided by the utility model, in the pressing process, the hexagonal flow choking blocks on the circuit layer can stop the colloid forming the glue filling layer, so that the colloid flows in a honeycomb shape along the flow guide grooves, the colloid is prevented from overflowing everywhere irregularly, the problem that the glue filling layer is too thin is prevented, and the overall thickness of the glue filling layer is uniform.

Description

TECHNICAL FIELD

[0001] The utility model relates to circuit board technical field especially relates to a circuit board structure and multilayer circuit board. BACKGROUND

[0002] Circuit board is an important electronic component, is the support body and electrical connection carrier of electronic component, circuit board gradually develops from single layer to double-sided board, multilayer board, and constantly develops to high precision, high density and high reliability, multilayer circuit board is generally bonded together through prepreg between adjacent circuit layers.

[0003] At present, in the pressing process of circuit board, prepreg will flow, and in order to prevent glue flow, flow resistance block is designed on the circuit layer. The flow resistance block in the prior art is trapezoidal copper skin structure, but the structure design has defects, which causes the glue filling layer between two circuit layers to be prone to uneven dielectric thickness and thin dielectric thickness, thereby affecting the production quality of products. UTILITY MODEL CONTENT

[0004] The utility model aims at providing a circuit board structure and multilayer circuit board to solve the problem that the glue filling layer between two circuit layers in the prior art is prone to uneven dielectric thickness and thin dielectric thickness, thereby affecting the production quality of products.

[0005] In order to achieve the above purpose, the utility model adopts the following technical scheme:

[0006] On the one hand, the utility model provides a circuit board structure, which comprises:

[0007] Circuit layer;

[0008] Flow resistance block, the flow resistance block is arranged on the circuit layer;The flow resistance block is provided with a plurality of, a plurality of flow resistance blocks are arranged in a honeycomb structure, and a flow guide groove is formed between adjacent two flow resistance blocks;Wherein, the flow resistance block is a hexagonal structure.

[0009] As an optional scheme of the above circuit board structure, the side length of the flow resistance block is 80mil.

[0010] As an optional scheme of the above circuit board structure, the width of the flow guide groove is 10mil.

[0011] As an optional scheme of the above circuit board structure, the circuit layer is further provided with a glue flow channel, and the glue flow channel penetrates through a plurality of flow resistance blocks.

[0012] As an optional scheme of the above circuit board structure, the glue flow channel is arranged at an angle with the edge of the circuit layer.

[0013] As an optional solution of the circuit board structure, the glue flow channel has a width of 40 mil.

[0014] As an optional solution of the circuit board structure, the circuit layer has a rectangular structure.

[0015] As an optional solution of the circuit board structure, the plurality of flow resistance blocks are arranged around the outer periphery of the circuit layer.

[0016] As an optional solution of the circuit board structure, the circuit layer is a thick copper core board.

[0017] In another aspect, the utility model provides a multilayer circuit board which comprises the circuit board structure.

[0018] The utility model has the advantages of:

[0019] The circuit board structure comprises a circuit layer and flow resistance blocks. The flow resistance blocks are arranged on the circuit layer, and the flow resistance blocks are arranged in a honeycomb structure, and a flow guide groove is formed between two adjacent flow resistance blocks. The flow resistance blocks are hexagonal, so that the hexagonal flow resistance blocks on the circuit layer can stop the glue in the filling glue layer during the pressing process, and the glue flows in a honeycomb shape along the flow guide groove, avoiding irregular overflow of the glue, preventing the filling glue layer from being too thin, and making the overall thickness of the filling glue layer uniform. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 The utility model provides a partial structure schematic view of the circuit board structure.

[0021] In the drawings:

[0022] 1, circuit layer; 11, glue flow channel; 2, flow resistance block; 21, flow guide groove. DETAILED DESCRIPTION

[0023] The technical scheme of the utility model will be described clearly and completely below in conjunction with the drawings. Obviously, the described embodiments are part of the embodiments of the utility model and not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the protection scope of the utility model.

[0024] In the description of the utility model, it needs to explain, the term "center", "upper", "lower", "left", "right", "vertical", "horizontal", "internal", "external" and so on indicate the orientation or position relation based on the orientation or position relation shown in the drawing, only for the convenience of describing the utility model and simplifying the description, and cannot understand as the restriction to the utility model of indicating or implying the device or element must have a particular orientation, construct and operate in a particular orientation, therefore cannot be understood as the restriction to the utility model.In addition, the term "first", "second" is only for the purpose of description, and cannot be understood as indicating or implying relative importance.Among them, the term "first position" and "second position" are two different positions, and moreover, the first feature is "above", "upper" and "upper" of the second feature, including the first feature is directly above and obliquely above the second feature, or just indicates that the horizontal height of the first feature is higher than the second feature.The first feature is "below", "below" and "below" of the second feature, including the first feature is directly below and obliquely below the second feature, or just indicates that the horizontal height of the first feature is less than the second feature.

[0025] In the description of the utility model, it needs to explain, unless another explicit provision and limitation, the term "installation", "connection", "connection" should be broad sense, for example, can be fixed connection, can also be detachable connection, or integrally connected;Can be mechanical connection, can also be electrical connection;It can be directly connected, can also be indirectly connected through the intermediate medium, can be the communication inside two elements.Understand the specific meaning of the above-mentioned terms in the utility model for the ordinary skilled in the art.

[0026] The embodiments of the utility model are described in detail below, and the examples of the embodiments are shown in the drawings, wherein the same or similar reference signs represent the same or similar elements or elements with the same or similar functions throughout the drawings.The embodiments described below by referring to the drawings are exemplary, only for explaining the utility model, and cannot be understood as the limitation to the utility model.

[0027] As Figure 1 Indicated, the embodiment provides a circuit board structure.

[0028] The circuit board structure includes a circuit layer 1 and a choke block 2.The choke block 2 is arranged on the circuit layer 1, and the choke block 2 is provided with a plurality of choke blocks 2, and the plurality of choke blocks 2 are arranged in a honeycomb structure, and a flow guide groove 21 is formed between the adjacent two choke blocks 2, wherein the choke block 2 is a hexagonal structure, so that in the pressing process, the hexagonal choke block 2 on the circuit layer 1 can stop the glue in the glue filling layer, so that the glue flows in the honeycomb type along the flow guide groove 21, avoids the irregular overflow of the glue, prevents the problem of thin glue filling layer, and makes the overall thickness of the glue filling layer uniform.

[0029] Wherein, several flow blocks 2 are arranged around the outer periphery of the circuit layer 1, so that the flow blocks 2 can stop the glue from flowing out of the circuit layer 1 directly.

[0030] Further, the edge length of the flow block 2 is 80 mil, so that the size of the flow block 2 is moderate, and the uniformity of the overall thickness of the glue filling layer can be ensured. Meanwhile, the width of the flow guide groove 21 is 10 mil, so that the glue can flow in the flow guide groove 21 with a width of 10 mil, and the flow requirement is met.

[0031] Further, the glue flow channel 11 is further arranged on the circuit layer 1, and the glue flow channel 11 penetrates through the several flow blocks 2, so that the glue flow can be adjusted through the glue flow channel 11, the air bubbles can be discharged, and the thickness uniformity of the formed glue filling layer can be improved. Wherein, the glue flow channel 11 is arranged at an angle with the edge of the circuit layer 1, so that the glue flow channel 11 is arranged obliquely relative to the edge of the circuit layer 1, the glue flow direction of the glue flow channel 11 can be adjusted according to the actual requirement, and the thickness uniformity of the formed glue filling layer can be improved. Optionally, the width of the glue flow channel 11 is 40 mil, so that the glue can flow in the glue flow channel 11 with a width of 40 mil, and the flow requirement is met.

[0032] Optionally, the circuit layer 1 is in a rectangular structure, so as to facilitate the production and processing, and the production efficiency is improved, the production cost is reduced, and the structure is more regular, and the installation and transportation are facilitated. Of course, the circuit layer 1 can also be in other structures, and the embodiment is not limited in this regard. Further optionally, the circuit layer 1 is a thick copper core plate, and the thick copper core plate can significantly reduce the resistance of the circuit board, so as to reduce the power consumption generated when the current passes through, and the current carrying capacity can also be improved.

[0033] The embodiment further provides a multilayer circuit board comprising the circuit board structure as described above, and the multilayer circuit board can make the glue flow in a honeycomb type along the flow guide groove 21 in the pressing process by using the circuit board structure as described above, the glue is prevented from overflowing irregularly, the problem of the glue filling layer being too thin is prevented, the overall thickness of the glue filling layer is uniform, the first-time yield of the delivery inspection is improved, and the product quality requirement is ensured under the condition that the production cycle requirement is met.

[0034] Obviously, the above embodiment of the utility model is only for clear illustration of the utility model, and is not a limitation on the implementation mode of the utility model. For ordinary skilled persons in the art, other different forms of changes or variations can be made on the basis of the above description. Here, all the implementation modes are not enumerated. Any modification, equivalent replacement and improvement made within the spirit and principle of the utility model should be included in the protection scope of the utility model claim.

Claims

1. A wiring board structure, characterized by, Comprising: a circuit layer (1); a flow resistance block (2) arranged on the circuit layer (1); the flow resistance block (2) is provided with a plurality of flow resistance blocks (2) arranged in a honeycomb structure, a flow guide groove (21) is formed between two adjacent flow resistance blocks (2); wherein the flow resistance block (2) is a hexagonal structure.

2. The wiring board structure according to claim 1, wherein The side length of the flow resistance block (2) is 80 mil.

3. The wiring board structure according to claim 1, wherein The width of the flow guide groove (21) is 10 mil.

4. The wiring board structure according to claim 1, wherein The circuit layer (1) is also provided with a glue flow channel (11), and the glue flow channel (11) penetrates through a plurality of flow resistance blocks (2).

5. The wiring board structure according to claim 4, wherein The glue flow channel (11) is arranged at an angle with the edge of the circuit layer (1).

6. The wiring board structure according to claim 4, wherein The width of the glue flow channel (11) is 40 mil.

7. The wiring board structure according to any one of claims 1 to 6, characterized by The circuit layer (1) is a rectangular structure.

8. The wiring board structure according to any one of claims 1 to 6, characterized by A plurality of flow resistance blocks (2) are arranged around the outer periphery of the circuit layer (1).

9. The wiring board structure according to any one of claims 1 to 6, characterized by The circuit layer (1) is a thick copper core board.

10. A multilayer circuit board, characterized by, A circuit board structure according to any one of claims 1-9.

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