Multi-layer laminated circuit board capable of preventing layer staggering

Abstract

The utility model discloses an anti-wrong layer multilayer laminated circuit board, which comprises a circuit board body and a mounting groove arranged in the circuit board body, a lower board body, a lower middle board body, an upper middle board body and an upper board body are arranged in the circuit board body, the lower middle board body is arranged at the upper end of the lower board body, the upper middle board body is arranged at the upper end of the lower middle board body, and the upper middle board body is arranged at the upper end of the upper middle board body. Meanwhile, an upper plate body is arranged at the upper end of the upper middle plate body, and limiting grooves and vent grooves are formed in the outer sides of the lower middle plate body, the upper middle plate body and the upper plate body. According to the multi-layer laminated circuit board capable of preventing layer staggering, accurate butt joint can be carried out in the process of press fit installation of the internal layer boards of the circuit board, the condition of layer staggering in press fit of the internal layer boards of the circuit board is avoided, accurate butt joint can be carried out between the upper board body and the lower board body through attraction force generated when the upper magnetic sheet and the lower magnetic sheet are close to each other, and the circuit board is more compact. And the upper and lower plate bodies are clamped with the arc-shaped blocks and the arc-shaped grooves before approaching, so that the accuracy of upper and lower pressing of the circuit board can be further ensured.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of circuit board, concretely to a multi -layer laminated circuit board of mistake -proof layer. BACKGROUND

[0002] Circuit board is a kind of board body shape electronic equipment, signal transmission can be carried out between electronic components installed on the board body top end, and circuit board can be divided into single layer and multilayer, and multilayer circuit board needs to press together multiple board bodies;

[0003] But the existing circuit board still has certain defects in the process of using, the existing circuit board is produced in the process, additionally increases the step of setting multiple inspection areas, and copper bar is set in the inspection area, which greatly improves the material cost;

[0004] Patent authorization announcement No. CN219478210U discloses a kind of mistake-proof multi -layer laminated circuit board of layer, by setting traceable two-dimensional code in each press layer, to be identified reading by scanner when pressing, not only can avoid misplacement, and the process of product can be traced back, wherein, product stacking upper and lower mistake-proof can be identified by two-dimensional code mark surface;The position of the mark position of two-dimensional code and the position of the visual window, bayonet can be used for left and right position mistake-proof;And two-dimensional code and bayonet position can also carry out layer-to-layer mistake-proof between upper and lower layers, the design of two-dimensional code and bayonet, without additional production steps, mistake-proof and traceability can be realized, the utility model has strong practicality, with strong popularization significance;

[0005] In the above-mentioned patent, the circuit board in the patent solves the problems mentioned above, but the circuit board still has the following problems, in the process of producing the circuit board, the press of multiple layers of board is needed, and in the process of pressing the board, the two-dimensional code on the top end of the board needs to be scanned by external scanning equipment, so that the press of multiple layers of circuit board can be carried out, and in the process of pressing the circuit board, external equipment is still needed for limiting to avoid the deviation of misplacement in the process of pressing, which leads to the fact that the circuit board cannot rely on itself to realize the effect of mistake-proof layer deviation.

[0006] In view of the above problems, it is urgent to make innovative design on the basis of the original circuit board structure. UTILITY MODEL CONTENTS

[0007] The utility model discloses a purpose lies in providing a kind of multi-layer laminated circuit board of mistake-proof layer to solve the process of pressing the layer plate in the background art proposed, need be scanned by external scanning equipment to the two-dimensional code on the upper end of layer plate, it can be pressed between multi-layer circuit board, still need external equipment to limit during the process of the circuit board pressing, avoid the deviation of mistake-proof layer in the process of pressing, lead to the problem that the circuit board cannot rely on self to realize mistake-proof layer deviation effect.

[0008] To achieve the above object, the utility model provides the following technical scheme: a kind of multi-layer laminated circuit board of mistake-proof layer, including circuit board body and installation slot being set up in the inside of circuit board body;

[0009] The inside of the circuit board body is provided with lower plate body, lower middle plate body, upper middle plate body and upper plate body, and the upper end of the lower plate body is provided with the lower middle plate body, and the upper end of the lower middle plate body is provided with the upper middle plate body, and the upper end of the upper middle plate body is provided with the upper plate body;

[0010] The outside of the lower middle plate body, upper middle plate body and upper plate body is provided with limiting slot and ventilation groove, the upper end of the lower plate body is fixedly installed with limiting piece, and the limiting piece is located in the inside of limiting slot;

[0011] The inside of the circuit board body is provided with positioning structure for controlling circuit board body pressing, and the lower end of the circuit board body is provided with heat dissipation structure for accelerating heat transfer of circuit board body.

[0012] Preferably, the positioning structure includes upper magnetic sheet and lower magnetic sheet, and the upper magnetic sheet is fixedly installed at the upper end of the lower plate body, the lower middle plate body and the upper middle plate body, and the lower magnetic sheet is fixedly installed at the lower end of the lower middle plate body, the upper middle plate body and the upper plate body.

[0013] Preferably, the upper magnetic sheet and the lower magnetic sheet are of different magnetic poles, the upper magnetic sheet is located at the upper end of the lower magnetic sheet, and the upper magnetic sheet is tightly attracted to the lower magnetic sheet.

[0014] Preferably, the positioning structure further includes arc-shaped block and arc-shaped groove, the arc-shaped block is fixedly installed at the lower end of the lower middle plate body, the upper middle plate body and the upper plate body, and the arc-shaped groove is provided at the upper end of the lower plate body, the lower middle plate body and the upper middle plate body.

[0015] Preferably, the arc-shaped block is connected with the arc-shaped groove in a clamping manner, the arc-shaped block is of a hemispherical structure, and the arc-shaped block is made of hard plastic material.

[0016] Preferably, the heat dissipation structure includes insulating block and heat dissipation plate, the insulating block is fixedly installed at the lower end of the lower plate body, the heat dissipation plate is fixedly installed at the lower end of the insulating block, and the heat dissipation plate is provided with heat dissipation groove in the inside.

[0017] Preferably, the heat dissipation grooves are equidistantly arranged in the interior of the heat dissipation plate, the front view of the heat dissipation plate is in a wavy structure, the heat dissipation plate is made of aluminum alloy, and the heat dissipation plate is located at the lower end of the lower plate body.

[0018] Compared with the prior art, the utility model has the beneficial effects that:

[0019] 1. Through the clamping of the limiting groove and the limiting piece, the internal layer plate of the circuit board can be accurately connected during the pressing and mounting process, so that the error layer pressing of the internal layer plate of the circuit board is avoided, and the accuracy of the internal pressing of the circuit board is ensured.

[0020] 2. Through the attraction of the upper magnetic sheet and the lower magnetic sheet when they are close, the upper and lower plate bodies can be accurately connected, and through the clamping of the arc-shaped block and the arc-shaped groove before the upper and lower plate bodies are close, the accuracy of the pressing of the circuit board can be further ensured.

[0021] 3. Further, the ventilation groove arranged in the internal of the circuit board can accelerate the heat dissipation of the circuit board, the heat dissipation plate can accelerate the heat transfer between the circuit board and the heat dissipation plate, and the heat dissipation groove in the internal of the heat dissipation plate can realize the rapid heat dissipation of the heat dissipation plate body, so that the heat dissipation effect of the circuit board is ensured. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 It is a three-dimensional structure schematic diagram of the utility model;

[0023] Figure 2 It is a three-dimensional structure schematic diagram of the utility model insulating block;

[0024] Figure 3 It is a three-dimensional structure schematic diagram of the utility model lower plate body section;

[0025] Figure 4 It is a three-dimensional structure schematic diagram of the utility model upper middle plate body section;

[0026] Figure 5 It is a three-dimensional structure schematic diagram of the utility model lower magnetic sheet;

[0027] Figure 6 It is a three-dimensional structure schematic diagram of the utility model heat dissipation plate;

[0028] Figure 7 It is a three-dimensional structure schematic diagram of the utility model upper magnetic sheet;

[0029] Figure 8 It is a three-dimensional structure schematic diagram of the utility model arc-shaped block.

[0030] In the figure: 1, circuit board body; 2, lower plate body; 3, lower middle plate body; 4, upper middle plate body; 5, upper plate body; 6, mounting groove; 7, air passage; 8, limiting groove; 9, limiting piece; 10, insulating block; 11, heat dissipation plate; 12, heat dissipation groove; 13, upper magnetic sheet; 14, lower magnetic sheet; 15, arc block; 16, arc groove. DETAILED DESCRIPTION

[0031] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.

[0032] In specific embodiments, as shown in Figures 1-2 , the basic production process of the circuit board is disclosed;

[0033] The circuit board body 1 and the mounting groove 6 opened in the inside of the circuit board body 1;

[0034] The inside of the circuit board body 1 is provided with the lower plate body 2, the lower middle plate body 3, the upper middle plate body 4 and the upper plate body 5, the upper end of the lower plate body 2 is provided with the lower middle plate body 3, the upper end of the lower middle plate body 3 is provided with the upper middle plate body 4, and the upper end of the upper middle plate body 4 is provided with the upper plate body 5;

[0035] The outside of the lower middle plate body 3, the upper middle plate body 4 and the upper plate body 5 is provided with the limiting groove 8 and the air passage 7, the upper end of the lower plate body 2 is fixedly installed with the limiting piece 9, and the limiting piece 9 is located in the inside of the limiting groove 8.

[0036] In the production process of the multi-layer superimposed circuit board of the error-proof layer, the lower middle plate body 3, the upper middle plate body 4 and the upper plate body 5 need to be installed in the upper end of the lower plate body 2 in the order of sequence, and the fixing and bonding between the plate bodies are carried out, after the bonding is completed, the insulating block 10 and the heat dissipation plate 11 can be installed in the lower end of the circuit board body 1, and then the lower end of the circuit board body 1 can be heat dissipated by the heat dissipation plate 11, so as to complete the production process of the circuit board.

[0037] In one of the specific embodiments, as shown in Figures 1-5 and Figures 7-8 , the process of pressing the circuit board up and down to avoid the occurrence of error layer is disclosed;

[0038] The inside of the circuit board body 1 is provided with a positioning structure for controlling the pressing of the circuit board body 1;

[0039] The positioning structure comprises the upper magnetic sheet 13 and the lower magnetic sheet 14, the upper magnetic sheet 13 is fixedly installed at the upper end of the lower plate body 2, the lower middle plate body 3 and the upper middle plate body 4, and the lower magnetic sheet 14 is fixedly installed at the lower end of the lower middle plate body 3, the upper middle plate body 4 and the upper plate body 5;

[0040] The upper magnetic sheet 13 and the lower magnetic sheet 14 are magnetic poles of different types, the upper magnetic sheet 13 is located at the upper end of the lower magnetic sheet 14, and the upper magnetic sheet 13 is closely attracted to the lower magnetic sheet 14;

[0041] The positioning structure further comprises the arc-shaped block 15 and the arc-shaped slot 16, the arc-shaped block 15 is fixedly installed at the lower end of the upper plate body 5 of the lower middle plate body 3 and the upper middle plate body 4, and the arc-shaped slot 16 is formed at the upper end of the upper middle plate body 4 of the lower plate body 2 and the lower middle plate body 3;

[0042] The arc-shaped block 15 is connected with the arc-shaped slot 16 in a clamping mode, the arc-shaped block 15 has a semi-spherical structure, and the arc-shaped block 15 is made of hard plastic material.

[0043] In the production of the multi-layer laminated circuit board with the error-proof layer, the limiting piece 9 needs to be in the clamping state with the limiting slot 8, the upper end of the limiting piece 9 is inclined, so that the limiting slot 8 and the limiting piece 9 are conveniently connected, then the upper magnetic sheet 13 is close to the lower magnetic sheet 14 and is attracted, thereby assisting the accurate connection between the upper and lower plate bodies, and before the upper magnetic sheet 13 contacts the lower magnetic sheet 14, the arc-shaped block 15 contacts and clamps the arc-shaped slot 16, so that the upper and lower plate bodies can be accurately connected, the error-proof connection is avoided, and the accuracy of the connection of the circuit board is ensured.

[0044] On the basis of the above embodiment, as shown in Figures 1-6 , a process of rapidly dissipating heat of the circuit board is disclosed;

[0045] The lower end of the circuit board body 1 is provided with a heat dissipation structure for accelerating heat transfer of the circuit board body 1;

[0046] The heat dissipation structure comprises the insulating block 10 and the heat dissipation plate 11, the insulating block 10 is fixedly installed at the lower end of the lower plate body 2, the lower end of the insulating block 10 is fixedly installed with the heat dissipation plate 11, and the inside of the heat dissipation plate 11 is provided with the heat dissipation slot 12;

[0047] The heat dissipation slot 12 is equidistantly formed in the inside of the heat dissipation plate 11, the front view of the heat dissipation plate 11 has a wave-shaped structure, the heat dissipation plate 11 is made of aluminum alloy, and the heat dissipation plate 11 is located at the lower end of the lower plate body 2.

[0048] When the multi-layer laminated circuit board with the error-proof layer is used, electronic components need to be installed at the upper end of the circuit board, and the electronic components generate heat during work, at this time, the circuit board absorbs the heat generated by the electronic components, thereby avoiding failure of the electronic components due to overheating of the internal temperature.

[0049] And in the process of using the circuit board, heat dissipation will be carried out through the air vent 7 opened in the inside, accelerating the heat transfer between the circuit board and electronic components, while the heat sink 11 at the lower end of the circuit board will absorb the heat inside the circuit board, further accelerating the heat loss inside the circuit board, while the heat sink 11 will accelerate the heat dissipation inside itself through the heat dissipation groove 12 during operation, thereby ensuring the heat dissipation effect of the circuit board, improving the stability of the use of the circuit board, and increasing the overall practicability.

[0050] The contents not described in detail in the specification belong to the prior art known to those skilled in the art.

[0051] Although the embodiments of the present application have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and modifications can be made to these embodiments without departing from the principles and spirits of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A multi-layer printed circuit board with error-proofing layers, comprising a printed circuit board body (1) and a mounting groove (6) formed in the printed circuit board body (1); characterized in that The printed circuit board body (1) is internally provided with a lower plate body (2), a lower middle plate body (3), an upper middle plate body (4) and an upper plate body (5), the upper end of the lower plate body (2) is provided with the lower middle plate body (3), the upper end of the lower middle plate body (3) is provided with the upper middle plate body (4), and the upper end of the upper middle plate body (4) is provided with the upper plate body (5); The outer side of the lower middle plate body (3), the upper middle plate body (4) and the upper plate body (5) is provided with a limiting groove (8) and a ventilation groove (7), the upper end of the lower plate body (2) is fixedly provided with a limiting piece (9), and the limiting piece (9) is located in the limiting groove (8); The printed circuit board body (1) is internally provided with a positioning structure for controlling the compression of the printed circuit board body (1), and the lower end of the printed circuit board body (1) is provided with a heat dissipation structure for accelerating the heat transfer of the printed circuit board body (1).

2. The multi-layered printed circuit board with a mistake-proofing layer according to claim 1, wherein: The positioning structure comprises an upper magnetic sheet (13) and a lower magnetic sheet (14), the upper magnetic sheet (13) is fixedly installed at the upper end of the lower plate body (2), the lower middle plate body (3) and the upper middle plate body (4), and the lower magnetic sheet (14) is fixedly installed at the lower end of the lower middle plate body (3), the upper middle plate body (4) and the upper plate body (5).

3. The multi-layered printed circuit board with a mistake-proofing layer according to claim 2, wherein: The upper magnetic sheet (13) and the lower magnetic sheet (14) are of different magnetic poles, the upper magnetic sheet (13) is located at the upper end of the lower magnetic sheet (14), and the upper magnetic sheet (13) is tightly attracted to the lower magnetic sheet (14).

4. The multi-layered printed circuit board with a mistake-proofing layer according to claim 1, wherein: The positioning structure further comprises an arc-shaped block (15) and an arc-shaped groove (16), the arc-shaped block (15) is fixedly installed at the lower end of the lower middle plate body (3), the upper middle plate body (4) and the upper plate body (5), and the arc-shaped groove (16) is formed at the upper end of the lower plate body (2), the lower middle plate body (3) and the upper middle plate body (4).

5. The multi-layered circuit board with a mistake-proofing layer according to claim 4, wherein: The arc-shaped block (15) is connected with the arc-shaped groove (16) in a clamping manner, the arc-shaped block (15) is in a semi-spherical structure, and the arc-shaped block (15) is made of hard plastic material.

6. The multi-layered circuit board with a mistake-proof layer according to claim 1, wherein: The heat dissipation structure comprises an insulating block (10) and a heat dissipation plate (11), the insulating block (10) is fixedly installed at the lower end of the lower plate body (2), the lower end of the insulating block (10) is fixedly provided with the heat dissipation plate (11), and the heat dissipation plate (11) is internally provided with a heat dissipation groove (12).

7. The multi-layered circuit board with a mistake-proofing layer according to claim 6, wherein: The heat dissipation grooves (12) are equidistantly formed in the heat dissipation plate (11), the front view of the heat dissipation plate (11) is in a wave-shaped structure, the heat dissipation plate (11) is made of aluminum alloy, and the heat dissipation plate (11) is located at the lower end of the lower plate body (2).

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