Electrostatic adsorption structure and processing equipment
By designing the connection method of the substrate, dielectric layer and electrode in the electrostatic adsorption structure, the dielectric constant and electrostatic adsorption force are increased, which solves the problem of workpiece instability in the processing equipment and improves the processing reliability.
Patent Information
- Application Number
- CN202520015791.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-02
- Publication Date
- 2025-12-09
- Estimated Expiration
- 2035-01-02
AI Technical Summary
Electrostatic adsorption structures make it difficult to maintain the stability of workpieces in processing equipment, resulting in poor processing reliability.
Design an electrostatic adsorption structure including a substrate, a dielectric layer and electrodes. An adhesive is provided between the electrodes and the dielectric layer. No adhesive is provided in the edge area to increase the dielectric constant. The electrodes are in contact with the dielectric layer to shorten the distance. Positive and negative electrodes are used to improve the electrostatic adsorption force.
It improves electrostatic adsorption force and enhances the processing reliability of processing equipment.
Smart Images
Figure CN223643584U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of electrostatic adsorption technology, and in particular to an electrostatic adsorption structure and processing equipment. Background Technology
[0002] Electrostatic adsorption is widely used in processing equipment due to its advantages such as adjustable adsorption force, reversible adsorption force, wide range of adsorbable materials, and low equipment power.
[0003] In related technologies, when processing equipment performs operations such as cutting, drawing, and hot stamping on workpieces, the adsorption force of the electrostatic adsorption structure is difficult to maintain the stability of the workpiece, resulting in poor processing reliability. Utility Model Content
[0004] The main purpose of this invention is to propose an electrostatic adsorption structure, which aims to improve electrostatic adsorption force and enhance processing reliability.
[0005] To achieve the above objectives, the electrostatic adsorption structure proposed in this utility model includes:
[0006] substrate;
[0007] A dielectric layer is disposed at intervals on one side of the substrate;
[0008] An adhesive element, disposed between the substrate and the dielectric layer, is used to connect and fix the substrate and the dielectric layer; and
[0009] A plurality of electrodes are disposed between the substrate and the dielectric layer. The surface of the electrodes facing the dielectric layer has a central region and an edge region surrounding the central region. At least the edge region is not provided with the adhesive between it and the dielectric layer.
[0010] In one embodiment of this application, the electrode is in contact with the dielectric layer.
[0011] In one embodiment of this application, both the middle region and the edge region are in contact with the dielectric layer.
[0012] In one embodiment of this application, the adhesive is provided between the middle region and the dielectric layer, and the edge region is either in contact with or has a gap with the dielectric layer.
[0013] In one embodiment of this application, a plurality of electrodes are spaced apart, and the adhesive is filled between two adjacent electrodes.
[0014] In one embodiment of this application, the electrode is spaced apart from the substrate, and the adhesive fills the space between the electrode and the substrate.
[0015] In one embodiment of this application, the surface of the electrode facing away from the dielectric layer is in contact with the substrate.
[0016] In one embodiment of this application, a power supply device is also included, and the plurality of electrodes include positive electrodes and negative electrodes arranged at intervals, wherein the positive electrodes and the negative electrodes are respectively connected to the positive and negative terminals of the power supply device.
[0017] In one embodiment of this application, a substrate is further provided on the side of the substrate away from the dielectric layer, an electrode is provided between the substrate and the substrate, and an adhesive is provided between the substrate and the substrate;
[0018] The electrode located on one side of the substrate is the negative electrode, and the electrode located on the other side of the substrate is the positive electrode.
[0019] To achieve the above objectives, this application also provides a processing device, including a frame and the above-mentioned electrostatic adsorption structure, wherein the electrostatic adsorption structure is disposed on the frame.
[0020] In this electrostatic adsorption structure, dielectric layers are spaced apart on one side of a substrate, and several electrodes are disposed between the substrate and the dielectric layers. These electrodes are connected and fixed to the substrate by adhesive bonding. Furthermore, in this embodiment, the surfaces of the electrodes facing the dielectric layer have a central region and an edge region. At least the edge regions are not bonded to the dielectric layer, ensuring that the edge regions of the electrodes are not covered by adhesive bonding. This increases the dielectric constant between the electrodes and the dielectric layer, thereby increasing the electrostatic adsorption force of the structure. When applied to processing equipment, this improves the processing reliability of the equipment. Attached Figure Description
[0021] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.
[0022] Figure 1 This is a schematic diagram of an embodiment of the electrostatic adsorption structure of this utility model;
[0023] Figure 2 This is a schematic diagram of another embodiment of the electrostatic adsorption structure of this utility model;
[0024] Figure 3 This is a schematic diagram of another embodiment of the electrostatic adsorption structure of this utility model;
[0025] Figure 4This is a schematic diagram of another embodiment of the electrostatic adsorption structure of this utility model.
[0026] Explanation of icon numbers:
[0027] label name label name 1 substrate 32 Middle area 2 Dielectric layer 4 Adhesive components 3a positive electrode 5 Power supply device 3b negative electrode 6 base 31 Edge area 7 Adhesive joints
[0028] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation
[0029] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0030] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.
[0031] Meanwhile, the meaning of "and / or" or "and / or" appearing throughout the text is that it includes three options. Taking "A and / or B" as an example, it includes option A, option B, or an option that satisfies both A and B.
[0032] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of indicated technical features. Therefore, features defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.
[0033] In related technologies, electrostatic adsorption structures typically involve placing electrodes on a substrate, applying adhesive to the entire surface, and then covering the electrodes and substrate with a dielectric layer. This results in a relatively thick adhesive layer covering the electrodes. However, the large distance between the electrodes and the dielectric layer, coupled with the low dielectric constant of the adhesive, leads to weak adsorption forces in the electrostatic adsorption structure. When applied to processing equipment, during operations such as cutting, drawing, and hot stamping, the adsorption force of the electrostatic adsorption structure struggles to maintain the stability of the workpiece, resulting in poor processing reliability.
[0034] Therefore, this utility model proposes an electrostatic adsorption structure, which aims to improve the adsorption force of the electrostatic adsorption structure and enhance the processing reliability of the processing equipment.
[0035] In the embodiments of this utility model, such as Figures 1 to 4 As shown, the electrostatic adsorption structure includes a substrate 1, a dielectric layer 2, several electrodes (3a / 3b), and an adhesive 4. The dielectric layer 2 is spaced apart on one side of the substrate 1; the adhesive 4 is disposed between the substrate 1 and the dielectric layer 2 for connecting and fixing the substrate 1 and the dielectric layer 2; the several electrodes (3a / 3b) are disposed between the substrate 1 and the dielectric layer 2, and the surface of the electrodes (3a / 3b) facing the dielectric layer 2 has a central region 32 and an edge region 31 disposed around the central region 32, and at least the edge region 31 is not disposed between the dielectric layer 2 and the adhesive 4.
[0036] The substrate 1 serves to support and fix various components such as electrodes (3a / 3b) and dielectric layer 2, ensuring sufficient structural strength for the electrostatic adsorption structure and facilitating installation and application. Dielectric layer 2 is spaced apart on one side of the substrate 1, and several electrodes (3a / 3b) are positioned between the substrate 1 and dielectric layer 2. Understandably, dielectric layer 2 can be polarized under the electric field of the electrodes (3a / 3b), generating electrostatic adsorption force on its surface to adsorb objects. Simultaneously, dielectric layer 2 ensures that the adsorption force is evenly distributed on the surface of the adsorbed object, achieving a good adsorption effect. An adhesive 4 is provided between the substrate 1 and dielectric layer 2. This adhesive 4 connects and fixes the substrate 1 and dielectric layer 2, and simultaneously fixes the electrodes (3a / 3b) between the substrate 1 and dielectric layer 2, ensuring the structural reliability of the electrostatic adsorption structure.
[0037] In this embodiment, the surface of the electrode (3a / 3b) facing the dielectric layer 2 has a middle region 32 and an edge region 31. Considering that the discharge effect of the edge region 31 of the electrode (3a / 3b) is stronger than that of the middle region 32, in this embodiment, at least the edge region 31 is not provided with an adhesive 4 between it and the dielectric layer 2, so that the edge region 31 of the electrode is not covered by the adhesive 4. It can be understood that the edge region 31 is either in contact with the dielectric layer 2 or has a gap. Compared with the method in related technologies where the surface of the electrode (3a / 3b) facing the dielectric layer 2 is completely covered with adhesive, the dielectric constant between the electrode and the dielectric layer 2 is increased, thereby increasing the electrostatic adsorption force of the electrostatic adsorption structure. When applied to processing equipment, this can improve the processing reliability of the processing equipment.
[0038] In practical applications, the intermediate region 32 and the dielectric layer 2 can be connected by contact or by adhesive 4.
[0039] In practical applications, the specific structure of the adhesive 4 can be determined according to the actual situation. For example, it can be made of silicone resin composition, epoxy resin, thermally conductive adhesive, etc. The adhesive 4 is disposed between the substrate 1 and the dielectric layer 2 to connect and fix them. Understandably, the specific placement of the adhesive 4 can be determined according to the actual situation. For example, the adhesive 4 can fill the position between the substrate 1 and the dielectric layer 2 except for the electrodes (3a / 3b), or the adhesive 4 can be intermittently disposed at multiple points, or the adhesive 4 can also be disposed in part of the position between the electrodes (3a / 3b) and the dielectric layer 2, etc.
[0040] In one embodiment, the electrostatic adsorption structure further includes a power supply device 5, and a plurality of electrodes (3a / 3b) including a positive electrode 3a and a negative electrode 3b spaced apart, the positive electrode 3a and the negative electrode 3b being connected to the positive and negative terminals of the power supply device 5, respectively. Optionally, the power supply device 5 is a high-voltage generator.
[0041] In practical applications, the substrate 1 and the dielectric layer 2 can be made of the same or different materials. Optionally, the dielectric layer 2 can be made of aluminum nitride ceramic, alumina ceramic, polyimide (PI) dielectric material, etc.
[0042] Please see Figure 1 and Figure 2 In one embodiment of this application, the electrodes (3a / 3b) are in contact with the dielectric layer 2.
[0043] By connecting the electrodes (3a / 3b) to the dielectric layer 2 through contact, compared to the method in related technologies where an adhesive material is used between the electrodes (3a / 3b) and the dielectric layer 2, the distance between the electrodes (3a / 3b) and the dielectric layer 2 is shortened, thereby improving the electrostatic adsorption force of the dielectric layer 2. In practical applications, the electrodes (3a / 3b) and the dielectric layer 2 can be fully bonded or partially bonded.
[0044] As an example, as shown in the table below, under the same conditions (such as the same voltage and the same material structure of the dielectric layer 2), the electrostatic adsorption force of the electrostatic adsorption structure in this embodiment where the electrodes (3a / 3b) are in contact with the dielectric layer 2 (Scheme 1 is a scheme where the electrodes (3a / 3b) are spaced apart from the substrate 1, and Scheme 2 is a scheme where the electrodes (3a / 3b) are in contact with the substrate 1) and the electrostatic adsorption structure in related technologies where an adhesive material is provided between the electrodes (3a / 3b) and the dielectric layer 2 are present can be compared. It can be seen that the adsorption force of Scheme 1 is improved by 46.67% compared with the related technologies, and the adsorption force of Scheme 2 is improved by 43.33% compared with the related technologies.
[0045]
[0046] As can be seen, the electrostatic adsorption force of the electrostatic adsorption structure in this embodiment is effectively improved. Therefore, when applied to processing equipment, the adsorption force of the electrostatic adsorption structure on the workpiece is increased, which can improve the processing reliability.
[0047] Optionally, see Figure 1 and Figure 2 Both the central region 32 and the edge region 31 are in contact with the dielectric layer 2. This arrangement ensures complete adhesion between the electrodes (3a / 3b) and the dielectric layer 2, further reducing the distance between them and enhancing electrostatic adsorption. In practical applications, the electrodes (3a / 3b) can be fabricated on the dielectric layer 2 using printing processes such as screen printing or mesh printing, or by exposure, development, and etching.
[0048] Optionally, an adhesive 4 is provided between the middle region 32 and the dielectric layer 2, and the edge region 31 is in contact with the dielectric layer 2.
[0049] In this embodiment, an adhesive 4 is provided between the middle region 32 and the dielectric layer 2, and the edge region 31 is in contact with the dielectric layer 2. On the one hand, this can ensure a large electrostatic adsorption force, and on the other hand, it can increase the reliability of the connection between the dielectric layer 2 and the electrodes (3a / 3b).
[0050] Please see Figure 3 In one embodiment of this application, an adhesive 4 is provided between the middle region 32 and the dielectric layer 2, and a gap is provided between the edge region 31 and the dielectric layer 2.
[0051] This setup ensures both a strong electrostatic attraction force and increased reliability of the connection between dielectric layer 2 and electrodes (3a / 3b).
[0052] Please see Figures 1 to 4 In one embodiment of this application, a plurality of electrodes (3a / 3b) are arranged at intervals, and an adhesive 4 is filled between two adjacent electrodes (3a / 3b).
[0053] Understandably, the electrodes (3a / 3b) may include a number of positive electrodes 3a and a number of negative electrodes 3b, with the positive electrodes 3a and negative electrodes 3b spaced apart. By filling the space between two adjacent electrodes (3a / 3b) with adhesive 4, the bonding area between the substrate 1 and the dielectric layer 2 is increased, the bonding strength between the substrate 1 and the dielectric layer 2 is improved, and thus the overall structural strength of the electrostatic adsorption structure is enhanced.
[0054] Please see Figure 1 In one embodiment (as in Scheme 1 in the table above), the electrodes (3a / 3b) are spaced apart from the substrate 1, and the space between the electrodes (3a / 3b) and the substrate 1 is filled with adhesive 4.
[0055] In practical applications, this design allows the electrodes (3a / 3b) to be first placed on the dielectric layer 2, and then the electrodes (3a / 3b) and the dielectric layer 2 to the substrate 1 to be connected and fixed using the adhesive 4. Optionally, the surface of the electrodes (3a / 3b) facing away from the substrate 1 can be fully or partially bonded to the dielectric layer 2.
[0056] Please see Figure 2 In one embodiment (as in Scheme 2 in the table above), the surface of the electrode (3a / 3b) facing away from the dielectric layer 2 is in contact with the substrate 1.
[0057] In this design, the two opposing surfaces of the electrodes (3a / 3b) are in contact with the dielectric layer 2 and the substrate 1, respectively. The adhesive 4 is filled between adjacent electrodes (3a / 3b) to connect and fix the dielectric layer 2 and the substrate 1, ensuring the structural reliability of the electrostatic adsorption structure. Optionally, after the electrodes (3a / 3b) are placed on the dielectric layer 2, the adhesive 4 is filled between adjacent electrodes (3a / 3b) to connect the substrate 1 and the dielectric layer 2; or, optionally, after the electrodes (3a / 3b) are placed on the substrate 1, the adhesive 4 is filled between adjacent electrodes (3a / 3b) to connect the substrate 1 and the dielectric layer 2. Optionally, the surface of the electrodes (3a / 3b) facing away from the substrate 1 can be partially or completely bonded to the dielectric layer 2; the surface of the electrodes (3a / 3b) facing away from the dielectric layer 2 can be partially or completely bonded to the substrate 1.
[0058] Please see Figure 4In some other embodiments, the electrostatic adsorption structure further includes a substrate 6 spaced apart on the side of the substrate 1 away from the dielectric layer 2, an electrode is provided between the substrate 6 and the substrate 1, and an adhesive 7 is provided between the substrate 6 and the substrate 1; wherein the electrode located on one side of the substrate 1 is a negative electrode 3b, and the electrode located on the other side of the substrate 1 is a positive electrode 3a.
[0059] This design allows the substrate 1 to have a positive electrode 3a and a negative electrode 3b on opposite sides, resulting in a larger breakdown voltage between the positive and negative electrodes. This means that the power supply can provide a larger voltage, and the electrostatic adsorption force can be effectively improved.
[0060] Alternatively, the adhesive component 7 can be the same as the adhesive component 4.
[0061] Optionally, the substrate 1, the base 6, and the dielectric layer 2 can be made of the same or different materials.
[0062] This utility model also proposes a processing device, which includes a frame and an electrostatic adsorption structure. The specific structure of the electrostatic adsorption structure is as described in the above embodiments. Since this processing device adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here. The electrostatic adsorption structure is located on the frame.
[0063] Alternatively, the processing equipment can be cutting equipment, laser processing equipment, or other processing equipment.
[0064] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. All equivalent structural transformations made under the inventive concept of the present utility model using the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.
Claims
1. An electrostatic adsorption structure, characterized in that, include: substrate; A dielectric layer is disposed at intervals on one side of the substrate; An adhesive component is disposed between the substrate and the dielectric layer to connect and fix the substrate and the dielectric layer. as well as A plurality of electrodes are disposed between the substrate and the dielectric layer. The surface of the electrodes facing the dielectric layer has a central region and an edge region surrounding the central region. At least the edge region is not provided with the adhesive between it and the dielectric layer.
2. The electrostatic adsorption structure as described in claim 1, characterized in that, The electrode is in contact with the dielectric layer.
3. The electrostatic adsorption structure as described in claim 2, characterized in that, Both the middle region and the edge region are in contact with the dielectric layer.
4. The electrostatic adsorption structure as described in claim 1, characterized in that, The adhesive is provided between the middle region and the dielectric layer, and the edge region is either in contact with or has a gap with the dielectric layer.
5. The electrostatic adsorption structure according to any one of claims 1 to 4, characterized in that, The electrodes are spaced apart, and the adhesive is filled between two adjacent electrodes.
6. The electrostatic adsorption structure as described in claim 5, characterized in that, The electrode is spaced apart from the substrate, and the adhesive fills the space between the electrode and the substrate.
7. The electrostatic adsorption structure as described in claim 5, characterized in that, The surface of the electrode facing away from the dielectric layer is in contact with the substrate.
8. The electrostatic adsorption structure according to any one of claims 1 to 4, characterized in that, It also includes a power supply device, and the plurality of electrodes include positive electrodes and negative electrodes arranged at intervals, the positive electrodes and the negative electrodes being connected to the positive and negative terminals of the power supply device, respectively.
9. The electrostatic adsorption structure according to any one of claims 1 to 4, characterized in that, It also includes a substrate spaced apart on the side of the substrate away from the dielectric layer, an electrode is provided between the substrate and the substrate, and an adhesive is provided between the substrate and the substrate; The electrode located on one side of the substrate is the negative electrode, and the electrode located on the other side of the substrate is the positive electrode.
10. A processing device, characterized in that, It includes a frame and an electrostatic adsorption structure as described in any one of claims 1 to 9, wherein the electrostatic adsorption structure is disposed on the frame.