Antioxidant alloy copper foil adhesive tape

Abstract

The utility model provides an anti-oxidation alloy copper foil adhesive tape. The anti-oxidation alloy copper foil adhesive tape comprises a release film layer, an acrylic pressure-sensitive adhesive layer, a first anti-oxidation layer, an alloy copper foil layer and a second anti-oxidation layer which are sequentially arranged, the first anti-oxidation layer and the second anti-oxidation layer respectively and independently comprise a chromium plating layer and a zinc plating layer which are laminated. The anti-oxidation alloy copper foil adhesive tape has the advantages of excellent mechanical properties, high elastic modulus, high tensile strength and good anti-oxidation performance, and can be widely applied to the field of electronic products.

Description

Technical Field

[0001] This utility model relates to the field of composite material technology, and in particular to an antioxidant alloy copper foil tape. Background Technology

[0002] Most existing copper foil tapes are made of pure copper foil, which has low tensile strength, low elastic modulus, and low hardness, making them unsuitable for the thinner and lighter requirements of electronic products. Existing alloy copper foil tapes lack surface anti-oxidation treatment and will oxidize severely under high temperature or high temperature and humidity conditions, failing to meet the reliability requirements of electronic products.

[0003] CN215327886U discloses a copper foil tape that is not easily broken, comprising a first copper foil layer, a crack-resistant layer, a conductive adhesive layer, a conductive film, and a second copper foil layer. The crack-resistant layer is fixedly mounted on the upper surface of the first copper foil layer, the conductive adhesive layer is disposed on the upper surface of the crack-resistant layer, the conductive film is mounted on the upper surface of the conductive adhesive layer, and the second copper foil layer is fixedly mounted on the upper surface of the conductive film. The crack-resistant layer is made of carbon fiber. By setting the first copper foil layer, crack-resistant layer, conductive adhesive layer, conductive film, and second copper foil layer, the thickness of the copper foil tape is increased, while simultaneously improving the crack resistance, flexibility, tensile properties, and tensile strength of the copper foil tape. Furthermore, by setting an anti-oxidation coating, the anti-oxidation and anti-corrosion effects of the copper foil tape are improved, extending the service life of the copper foil tape.

[0004] CN218144946U discloses an anti-oxidation copper foil tape, including a fixing frame. A left limiting seat and a right limiting seat are fixedly connected to the inner side of the fixing frame. A left connecting seat and a right connecting seat are fixedly connected to the inner sides of the left and right limiting seats, respectively. A tape body is rotatably connected between the left and right connecting seats. A first fixing rod and a second fixing rod are fixedly connected to the outer sides of the left and right limiting seats, respectively. A cutting blade is fixedly connected to the top of the fixing frame. The tape body consists of an adhesive layer, a base film, a copper foil layer, and a protective layer. The adhesive layer is disposed at the lower end of the base film, the copper foil layer is disposed at the upper end surface of the base film, and the protective layer is disposed at the upper end surface of the copper foil layer. This anti-oxidation copper foil tape, by providing a protective layer, seamlessly covers the copper foil layer, preventing oxidation caused by contact with air, thus giving the copper foil tape excellent anti-oxidation effects.

[0005] CN208562214U discloses an electromagnetically shieldable copper foil conductive tape, comprising a copper foil substrate layer, a conductive adhesive shielding layer coated on the upper surface of the copper foil substrate layer, a release film layer adhered to the upper surface of the conductive adhesive shielding layer, an adhesive layer coated on the lower surface of the copper foil substrate layer, an antistatic layer adhered to the lower surface of the adhesive layer, an anti-oxidation coating coated on the lower surface of the anti-oxidation coating, and a composite reinforcing film layer adhered to the lower surface of the anti-oxidation coating. This electromagnetically shieldable copper foil conductive tape achieves good electromagnetic shielding through the interaction between the conductive adhesive shielding layer and the copper foil substrate layer, and the interaction between the antistatic layer, the anti-oxidation coating, and the composite reinforcing film layer gives the conductive tape excellent antistatic properties, anti-oxidation properties, and surface bonding strength.

[0006] However, the tensile strength and oxidation resistance of the aforementioned copper foil tape still need further improvement. Utility Model Content

[0007] In view of the problems existing in the prior art, this utility model provides an anti-oxidation alloy copper foil tape, which has an anti-oxidation layer on both sides of the alloy copper foil layer with excellent mechanical properties. This can significantly improve the bending performance, stress relaxation resistance and anti-oxidation performance of the alloy copper foil tape, thus meeting the needs of electronic products for thinness and high quality.

[0008] To achieve this objective, the present invention adopts the following technical solution:

[0009] This utility model provides an anti-oxidation alloy copper foil tape, which includes a release film layer, an acrylic pressure-sensitive adhesive layer, a first anti-oxidation layer, an alloy copper foil layer and a second anti-oxidation layer arranged sequentially; the first anti-oxidation layer and the second anti-oxidation layer each independently include a chromium plating layer and a zinc plating layer stacked together.

[0010] The antioxidant alloy copper foil tape of this invention improves the anti-oxidation performance of the alloy copper foil tape by setting chromium-plated and zinc-plated layers on both sides of the alloy copper foil layer. Furthermore, compared to pure copper layers, the alloy copper foil layer has higher tensile strength, higher elastic modulus, and higher hardness, exhibiting excellent bending performance and resistance to stress relaxation. The antioxidant alloy copper foil tape also includes an acrylic pressure-sensitive adhesive layer, providing superior adhesion at both room and high temperatures, good initial tack, ultra-high cohesive strength, effectively preventing delamination, and exhibiting good 90° holding power.

[0011] In this invention, the order of the chromium plating layer and the zinc plating layer in the first and second antioxidant layers is not strictly limited. The layer in direct contact with the alloy copper foil layer can be either the chromium plating layer or the zinc plating layer.

[0012] Preferably, the release film layer comprises a PET substrate release film layer. PET is polyethylene terephthalate.

[0013] Preferably, the thickness of the release film layer is 25 to 75 μm, for example, it can be 25 μm, 30 μm, 35 μm, 40 μm, 50 μm, 60 μm, 70 μm or 75 μm, but it is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0014] Preferably, the acrylic pressure-sensitive adhesive layer comprises an acrylic pressure-sensitive adhesive layer, which includes an acrylic pressure-sensitive adhesive, a crosslinking agent, and a tackifying resin, and has excellent adhesion.

[0015] Preferably, the thickness of the acrylic pressure-sensitive adhesive layer is 10 to 50 μm, for example, it can be 10 μm, 15 μm, 20 μm, 30 μm, 35 μm, 40 μm, 45 μm or 50 μm, but it is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0016] Preferably, the thickness of the chromium plating layer is 0.2 to 0.5 nm, for example, it can be 0.2 μm, 0.25 μm, 0.3 μm, 0.35 μm, 0.4 μm, 0.45 μm, 0.48 μm or 0.5 μm, but it is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0017] The preferred thickness of the chromium plating layer in this invention is 0.2–0.5 nm. When the chromium plating layer is too thin, the oxidation resistance of the alloy copper foil tape will be reduced; when the chromium plating layer is too thick, the manufacturing cost of the alloy copper foil tape will be increased.

[0018] Preferably, the thickness of the zinc plating layer is 2 to 5 nm, for example, it can be 2 μm, 2.5 μm, 3 μm, 3.5 μm, 4 μm, 4.5 μm, 4.7 μm or 5 μm, but it is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0019] The preferred thickness of the zinc plating layer in this invention is 2-5 nm. When the zinc plating layer is too thin, the oxidation resistance of the alloy copper foil tape will be reduced; when the zinc plating layer is too thick, the manufacturing cost of the alloy copper foil tape will be increased.

[0020] Preferably, the thickness of the alloy copper foil layer is 12 to 50 μm, for example, it can be 12 μm, 15 μm, 20 μm, 25 μm, 30 μm, 35 μm, 40 μm or 50 μm, but it is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0021] Preferably, the alloy copper foil layer has a nickel content of <5%, for example, it can be 4.9%, 4.5%, 4.3%, 4%, 3.5%, 3% or 1%, etc., but is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0022] The silicon content is <1%, for example, it can be 0.99%, 0.8%, 0.5%, 0.3%, 0.2%, 0.1% or 0.01%, but it is not limited to the listed values. Other unlisted values ​​within this range also apply.

[0023] Alloy copper foil layers with a magnesium content of <0.5% by mass can be, for example, 0.49%, 0.45%, 0.42%, 0.4%, 0.3%, 0.2%, or 0.1%, but are not limited to the listed values; other unlisted values ​​within this range also apply.

[0024] The preferred alloy copper foil layer of this invention comprises an alloy copper foil layer with a nickel content of <5%, a silicon content of <1%, and a magnesium content of <0.5%, which gives the alloy copper foil tape excellent mechanical properties, high elastic modulus, and high tensile strength.

[0025] Preferably, the total thickness of the anti-oxidation alloy copper foil tape is 47 to 175 μm, for example, it can be 47 μm, 50 μm, 80 μm, 100 μm, 130 μm, 150 μm, 170 μm or 175 μm, but it is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0026] The antioxidant alloy copper foil tape described in this invention has excellent mechanical properties, high elastic modulus, high tensile strength, and good antioxidant properties, and can be widely used in mobile phones, laptops, and other digital electronic products.

[0027] Compared with the prior art, the present invention has at least the following beneficial effects:

[0028] The anti-oxidation alloy copper foil tape provided by this utility model has excellent anti-oxidation performance under conditions of 60℃, 90%RH and 85℃, 85%RH; elastic modulus > 100GPa; tensile strength > 700MPa; HV hardness > 180, which meets the requirements of electronic products for thinness and high quality, and is suitable for large-scale promotion and application. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the structure of the anti-oxidation alloy copper foil tape provided in Embodiment 1 of this utility model.

[0030] In the diagram: 10 - Second chromium plating layer; 20 - Second zinc plating layer; 30 - Alloy copper foil layer; 40 - First zinc plating layer; 50 - First chromium plating layer; 60 - Acrylic pressure-sensitive adhesive layer; 70 - Release film layer. Detailed Implementation

[0031] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.

[0032] The present invention will now be described in further detail. However, the examples described below are merely simplified examples of the present invention and do not represent or limit the scope of protection of the present invention. The scope of protection of the present invention shall be determined by the claims.

[0033] It should be understood that in the description of this utility model, the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used solely for the convenience of describing this utility model and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0034] It should be noted that, in the description of this utility model, unless otherwise explicitly specified and limited, the terms "set," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0035] Example 1

[0036] This embodiment provides an antioxidant alloy copper foil tape, the structural schematic diagram of which is shown below. Figure 1 As shown.

[0037] The antioxidant alloy copper foil tape includes, from bottom to top, a release film layer 70, an acrylic pressure-sensitive adhesive layer 60, a first antioxidant layer, an alloy copper foil layer 30, and a second antioxidant layer;

[0038] The first antioxidant layer includes a first chromium plating layer 50 and a first zinc plating layer 40 disposed sequentially from bottom to top;

[0039] The second antioxidant layer includes a second zinc plating layer 20 and a second chromium plating layer 10 arranged sequentially from bottom to top.

[0040] The release film layer 70 includes a PET substrate release film layer. The thickness of the release film layer 70 is 50 μm.

[0041] The acrylic pressure-sensitive adhesive layer 60 comprises an acrylic-based pressure-sensitive adhesive layer. The thickness of the acrylic pressure-sensitive adhesive layer 60 is 20 μm.

[0042] The thickness of the first chromium plating layer 50 and the thickness of the second chromium plating layer 10 are both 0.4 nm.

[0043] The thickness of the first zinc plating layer 40 and the thickness of the second zinc plating layer 20 are both 4 nm.

[0044] The thickness of the alloy copper foil layer 30 is 40 μm.

[0045] The alloy copper foil layer 30 comprises an alloy copper foil layer with a nickel content of 1.5%, a silicon content of 0.5%, and a magnesium content of 0.3%.

[0046] The total thickness of the antioxidant alloy copper foil tape is 118.8 μm.

[0047] Example 2

[0048] This embodiment provides an anti-oxidation alloy copper foil tape, which includes, from bottom to top, a release film layer, an acrylic pressure-sensitive adhesive layer, a first anti-oxidation layer, an alloy copper foil layer, and a second anti-oxidation layer;

[0049] The first antioxidant layer includes a first zinc plating layer and a first chromium plating layer disposed sequentially from bottom to top;

[0050] The second antioxidant layer includes a second zinc plating layer and a second chromium plating layer arranged sequentially from bottom to top.

[0051] The release film layer includes a PET substrate release film layer. The thickness of the release film layer is 75 μm.

[0052] The acrylic pressure-sensitive adhesive layer comprises an acrylic-based pressure-sensitive adhesive layer. The thickness of the acrylic pressure-sensitive adhesive layer is 10 μm.

[0053] The thickness of the first chromium plating layer is 0.2 nm; the thickness of the second chromium plating layer is 0.5 nm.

[0054] The thickness of the first zinc plating layer is 5 nm; the thickness of the second zinc plating layer is 2 nm.

[0055] The thickness of the alloy copper foil layer is 12 μm.

[0056] The alloy copper foil layer comprises an alloy copper foil layer with a nickel content of 3%, a silicon content of 0.3%, and a magnesium content of 0.2%.

[0057] The total thickness of the antioxidant alloy copper foil tape is 104.7 μm.

[0058] Example 3

[0059] This embodiment provides an anti-oxidation alloy copper foil tape, which includes, from bottom to top, a release film layer, an acrylic pressure-sensitive adhesive layer, a first anti-oxidation layer, an alloy copper foil layer, and a second anti-oxidation layer;

[0060] The first antioxidant layer includes a first zinc plating layer and a first chromium plating layer disposed sequentially from bottom to top;

[0061] The second antioxidant layer includes a second chromium plating layer and a second zinc plating layer arranged sequentially from bottom to top.

[0062] The release film layer includes a PET substrate release film layer. The thickness of the release film layer is 25 μm.

[0063] The acrylic pressure-sensitive adhesive layer comprises an acrylic-based pressure-sensitive adhesive layer. The thickness of the acrylic pressure-sensitive adhesive layer is 50 μm.

[0064] The thickness of the first chromium plating layer is 0.5 nm; the thickness of the second chromium plating layer is 0.4 nm.

[0065] The thickness of the first zinc plating layer is 2.5 nm; the thickness of the second zinc plating layer is 3 nm.

[0066] The thickness of the alloy copper foil layer is 50 μm.

[0067] The alloy copper foil layer comprises an alloy copper foil layer with a nickel content of 2%, a silicon content of 0.1%, and a magnesium content of 0.2%.

[0068] The total thickness of the antioxidant alloy copper foil tape is 131.4 μm.

[0069] As can be seen from Examples 1-3, the anti-oxidation alloy copper foil tape provided by this utility model has excellent mechanical properties: elastic modulus > 100 GPa; tensile strength > 700 MPa; HV hardness > 180; no obvious oxidation occurs after being placed at 60℃ and 90% RH for 10 days; no obvious oxidation occurs after being placed at 85℃ and 85% RH for 10 days; and no obvious oxidation occurs after being placed at 160℃ for 30 minutes.

[0070] Example 4

[0071] This embodiment provides an antioxidant alloy copper foil tape, which is the same as that in Embodiment 1 except that the thickness of the first chromium plating layer and the thickness of the second chromium plating layer are both 0.1 nm.

[0072] Example 5

[0073] This embodiment provides an antioxidant alloy copper foil tape, which is the same as that in Embodiment 1 except that the thickness of the first zinc plating layer and the thickness of the second zinc plating layer are both 1 nm.

[0074] It can be seen from the combined examples 1 and 4-5 that the chromium plating layer is thinner in example 4 and in example 5, which both lead to a decrease in the oxidation resistance of the alloy copper foil tape. Significant oxidation occurs after being placed at 60°C and 90%RH for 1 day; significant oxidation occurs after being placed at 85°C and 85%RH for 1 day; and significant oxidation occurs after being placed at 160°C for 30 minutes.

[0075] Comparative Example 1

[0076] This comparative example provides a copper foil tape, which is the same as in Example 1 except that the alloy copper foil layer is replaced with a pure copper layer with a purity of 99.9%.

[0077] As can be seen from the comparison of Example 1 and Comparative Example 1, the pure copper layer with a purity of 99.9% was set in Comparative Example 1, and the elastic modulus of the copper foil tape was only 70 GPa; the tensile strength was only 420 MPa; and the HV hardness was only 100, which could not meet the requirements for thinner and lighter electronic products.

[0078] Comparative Example 2

[0079] This comparative example provides an antioxidant alloy copper foil tape, which is the same as Example 1 except that it does not have a first antioxidant layer.

[0080] Comparative Example 3

[0081] This comparative example provides an antioxidant alloy copper foil tape, which is the same as Example 1 except that it does not have a second antioxidant layer.

[0082] Comparative Example 4

[0083] This comparative example provides an antioxidant alloy copper foil tape, which is the same as Example 1 except that the first chromium plating layer is not provided in the first antioxidant layer.

[0084] Comparative Example 5

[0085] This comparative example provides an antioxidant alloy copper foil tape, which is the same as Example 1 except that the first zinc plating layer is not provided in the first antioxidant layer.

[0086] As can be seen from Example 1 and Comparative Examples 2-5, the absence of a first antioxidant layer, the absence of a second antioxidant layer, the absence of a first chromium plating layer in the first antioxidant layer, and the absence of a first zinc plating layer in the first antioxidant layer all lead to a significant reduction in the antioxidant performance of the copper foil tape.

[0087] The applicant declares that the detailed structural features of this utility model are illustrated through the above embodiments, but this utility model is not limited to the above detailed structural features, that is, it does not mean that this utility model must rely on the above detailed structural features to be implemented. Those skilled in the art should understand that any improvements to this utility model, equivalent substitutions of selected components, additions of auxiliary components, and selection of specific methods, etc., all fall within the protection and disclosure scope of this utility model.

[0088] The preferred embodiments of the present invention have been described in detail above. However, the present invention is not limited to the specific details of the above embodiments. Within the scope of the technical concept of the present invention, various simple modifications can be made to the technical solution of the present invention, and these simple modifications all fall within the protection scope of the present invention.

Claims

1. An anti-oxidation alloy copper foil tape, characterized in that, The antioxidant alloy copper foil tape includes a release film layer, an acrylic pressure-sensitive adhesive layer, a first antioxidant layer, an alloy copper foil layer, and a second antioxidant layer arranged sequentially; the first antioxidant layer and the second antioxidant layer each independently include a chromium plating layer and a zinc plating layer stacked together.

2. The anti-oxidation alloy copper foil tape according to claim 1, characterized in that, The release film layer includes a PET substrate release film layer.

3. The antioxidant alloy copper foil tape according to claim 1, characterized in that, The thickness of the release film is 25~75μm.

4. The anti-oxidation alloy copper foil tape according to claim 1, characterized in that, The acrylic pressure-sensitive adhesive layer includes an acrylic-based pressure-sensitive adhesive layer.

5. The anti-oxidation alloy copper foil tape according to claim 1, characterized in that, The thickness of the acrylic pressure-sensitive adhesive layer is 10~50μm.

6. The anti-oxidation alloy copper foil tape according to claim 1, characterized in that, The thickness of the chromium plating layer is 0.2~0.5 nm.

7. The antioxidant alloy copper foil tape according to claim 1, characterized in that, The thickness of the zinc plating layer is 2~5nm.

8. The anti-oxidation alloy copper foil tape according to claim 1, characterized in that, The thickness of the alloy copper foil layer is 12~50μm.

9. The anti-oxidation alloy copper foil tape according to claim 1, characterized in that, The total thickness of the antioxidant alloy copper foil tape is 47~175μm.

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