Linear scanning light source

By employing a bonding structure of a semiconductor cooling plate, a heat-conducting plate, and a strip lamp plate in the online scanning light source, combined with a heat dissipation fin assembly and a cooling fan, the problem of low cooling efficiency of the online scanning light source is solved, and efficient lamp plate heat dissipation is achieved.

CN223649258UActive Publication Date: 2025-12-09GUANGDONG AOPUTE TECH CO LTD
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Patent Information

Application Number
CN202520268371.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-02-19
Publication Date
2025-12-09
Estimated Expiration
2035-02-19

AI Technical Summary

Technical Problem

Existing line scan light sources have low cooling efficiency, making it difficult to meet the heat dissipation requirements of high-power lamp panels.

Method used

It adopts a structure that combines a semiconductor cooling plate with a heat-conducting plate and a strip light plate, along with a heat dissipation fin assembly and a cooling fan. Heat is exchanged between the semiconductor cooling plate and the strip light plate, and the heat is dissipated to the outside through the heat-conducting plate and the heat dissipation fin assembly.

Benefits of technology

It significantly improves the cooling efficiency of the lamp panel, keeps the lamp panel within a suitable temperature range, and enhances the heat dissipation effect.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of light source structures, and discloses a line scanning light source which comprises a heat conduction plate. The strip-shaped lamp panel is fixedly connected with the heat conducting plate; the side face of one side of the semiconductor refrigeration plate is attached to the heat conduction plate, the side face of the other side of the semiconductor refrigeration plate is attached to the strip-shaped lamp panel, and the strip-shaped lamp panel emits light towards the side away from the semiconductor refrigeration plate. According to the linear scanning light source, the cooling efficiency of the lamp panel can be improved.
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Description

Technical Field

[0001] This utility model relates to the field of light source structure technology, and in particular to a line scan light source. Background Technology

[0002] A line scan light source is a light source that forms a linear light spot, which is projected onto the surface of a workpiece to facilitate camera inspection of surface defects. Existing line scan light sources typically involve directly attaching the lamp panel to the housing, with heat sink fins mounted on the housing to cool the lamp panel. However, this method of cooling the lamp panel has low efficiency and is insufficient to meet the light output requirements of high-power lamp panels.

[0003] Therefore, it is necessary to design a line scan light source that can improve the cooling efficiency of the lamp panel.

[0004] The above information is provided as background information only to aid in understanding this disclosure and does not constitute an assertion or admission that any of the above content can be used as prior art relative to this disclosure. Utility Model Content

[0005] This invention provides a line scan light source that can improve the cooling efficiency of the lamp panel.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A line scan light source, comprising:

[0008] Heat-conducting plate;

[0009] A strip light panel is fixedly connected to the heat-conducting plate;

[0010] A semiconductor cooling plate has a heat-conducting plate attached to one side and a strip light panel attached to the other side, with the strip light panel emitting light away from the semiconductor cooling plate.

[0011] Optionally, the line scan light source also includes a heat sink assembly and a cooling fan, wherein the heat sink assembly is attached to the side of the heat-conducting plate away from the semiconductor cooling plate;

[0012] The heat dissipation fin assembly includes a plurality of heat dissipation fins spaced apart. The cooling fan is mounted on the top of the heat dissipation fin assembly away from the heat conduction plate, and the cooling fan is used to blow cooling gas into the heat dissipation gaps between the heat dissipation fins.

[0013] Optionally, the heat-conducting plate is connected to a heat-conducting copper pipe, which passes through the heat dissipation fin assembly.

[0014] Optionally, the line scan light source also includes several temperature detectors;

[0015] The semiconductor cooling plates are arranged in several intervals. Each of the semiconductor cooling plates has a temperature detector in the strip light panel area cooled by each semiconductor cooling plate, and the temperature detector is electrically connected to the corresponding semiconductor cooling plate.

[0016] Optionally, the heat dissipation fins are perpendicular to the heat-conducting plate;

[0017] The cooling fans are spaced at least four apart, and the airflow direction of the cooling fans is parallel to the heat dissipation fins.

[0018] Optionally, the line scan light source also includes a focusing rod installed on the light-emitting side of the strip light panel;

[0019] The focusing rod is parallel to the strip light panel, and the cross-section of the focusing rod is circular.

[0020] Optionally, the focusing rod is a glass rod.

[0021] Optionally, the heat dissipation fins are serpentine in a direction away from the heat conduction plate, and adjacent heat dissipation fins are parallel to each other.

[0022] Optionally, the strip light panel includes a strip circuit board and LED beads arranged at intervals along the central direction of the strip circuit board.

[0023] Optionally, each of the aforementioned semiconductor cooling plates is individually connected to a set of control modules.

[0024] Compared with the prior art, the present invention has the following beneficial effects:

[0025] The line scan light source provided by this utility model, by attaching a heat-conducting plate to one side of a semiconductor cooling plate and a strip light panel to the other side, achieves heat exchange between the side of the semiconductor cooling plate attached to the strip light panel and the strip light panel, effectively improving heat exchange and cooling efficiency and maintaining the temperature of the high-power strip light panel within a suitable range. The semiconductor cooling plate then transfers the high-temperature heat to the heat-conducting plate, which dissipates it to the outside environment.

[0026] This invention has other features and advantages that will be apparent from or will be set forth in detail in the accompanying drawings and the following detailed description, which together serve to explain the particular principles of this invention. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a schematic diagram of the installation structure of the line scan light source under the hidden housing provided in this embodiment of the utility model;

[0029] Figure 2 This is a front view schematic diagram of the line scan light source provided in this embodiment of the present invention under the hidden housing;

[0030] Figure 3 This is an installation diagram of the second type of line scan light source provided in this embodiment of the utility model;

[0031] Figure 4 This is an installation diagram of the third type of line scan light source provided in this embodiment of the utility model.

[0032] Reference numerals: 1. Heat-conducting plate; 11. Heat-conducting copper pipe; 2. Strip light panel; 3. Semiconductor cooling plate; 4. Heat dissipation fin assembly; 41. Heat dissipation fin; 5. Cooling fan; 6. Focusing rod. Detailed Implementation

[0033] To illustrate the possible application scenarios, technical principles, implementable specific solutions, and achievable objectives and effects of this application in detail, the following description, in conjunction with the listed specific embodiments and accompanying drawings, provides a detailed explanation. The embodiments described herein are merely illustrative of the technical solutions of this application and are therefore intended to limit the scope of protection of this application.

[0034] In this document, the term "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The term "embodiment" appearing in various places throughout the specification does not necessarily refer to the same embodiment, nor does it specifically limit its independence or connection with other embodiments. In principle, in this application, as long as there are no technical contradictions or conflicts, the technical features mentioned in each embodiment can be combined in any way to form corresponding implementable technical solutions.

[0035] Unless otherwise defined, the technical terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the use of related terms herein is merely for the purpose of describing particular embodiments and is not intended to limit this application.

[0036] In the description of this application, the term "and / or" is used to describe the logical relationship between objects, indicating that three relationships can exist. For example, A and / or B means: A exists, B exists, and A and B exist simultaneously. Additionally, the character " / " in this document generally indicates that the preceding and following objects have an "or" logical relationship.

[0037] In this application, terms such as “first” and “second” are used only to distinguish one entity or operation from another, and do not necessarily require or imply any actual quantity, hierarchy or order relationship between these entities or operations.

[0038] Unless otherwise specified, the use of terms such as “comprising,” “including,” “having,” or other similar expressions in this application is intended to cover non-exclusive inclusion, which does not exclude the presence of additional elements in a process, method, or product that includes the stated elements, such that a process, method, or product that includes a list of elements may include not only those defined elements but also other elements not expressly listed, or elements inherent to such a process, method, or product.

[0039] Similar to the understanding in the Examination Guidelines, in this application, expressions such as "greater than," "less than," and "exceeding" are understood to exclude the stated number; expressions such as "above," "below," and "within" are understood to include the stated number. Furthermore, in the description of the embodiments in this application, "multiple" means two or more (including two), and similar expressions related to "multiple" are also understood in this way, such as "multiple groups" and "multiple times," unless otherwise explicitly specified.

[0040] In the description of the embodiments of this application, the space-related expressions used, such as "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "vertical," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," indicate the orientation or positional relationship based on the orientation or positional relationship shown in the specific embodiments or drawings. They are only for the purpose of describing the specific embodiments of this application or for the reader's understanding, and do not indicate or imply that the device or component referred to must have a specific position, a specific orientation, or be constructed or operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0041] Unless otherwise expressly specified or limited, the terms "installation," "connection," "linking," "fixing," and "setting," as used in the description of the embodiments of this application, should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral setting; it can be a mechanical connection, an electrical connection, or a communication connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two components or the interaction between two components. For those skilled in the art to which this application pertains, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0042] In view of the deficiencies in the existing technology, the applicant, based on years of practical experience and professional knowledge in the design and manufacture of such products, and in conjunction with the application of theoretical principles, has actively conducted research and innovation in order to create a technology that can solve the deficiencies in the existing technology and make the line scan light source more practical. After continuous research, design, and repeated prototype production and improvement, this utility model with real practical value has finally been created.

[0043] Please refer to Figures 1 to 2 This utility model embodiment provides a line scan light source, including a heat-conducting plate 1, a strip lamp plate 2, and a semiconductor cooling plate 3.

[0044] The strip light panel 2 is fixedly connected to the heat-conducting plate 1; one side of the semiconductor cooling plate 3 is attached to the heat-conducting plate 1, and the other side is attached to the strip light panel 2, with the strip light panel 2 emitting light to the side away from the semiconductor cooling plate 3.

[0045] In this embodiment, the heat-absorbing side of the semiconductor cooling plate 3 is attached to the strip light panel 2 to absorb the heat emitted by the strip light panel 2; the heat-dissipating side of the semiconductor cooling plate 3 is attached to the heat-conducting plate 1 to transfer heat to the heat-conducting plate 1, and the heat-conducting plate 1 dissipates the high-temperature heat to the outside. Preferably, the heat-conducting plate 1 is a copper plate, as copper plates have better thermal conductivity.

[0046] In this embodiment, even if the temperature of the heat-conducting plate 1 is higher than that of the strip light panel 2, it can still maintain a good heat dissipation effect on the strip light panel 2. Existing methods that directly use heat dissipation fins cannot achieve the above effect.

[0047] The line scan light source in this embodiment has good heat dissipation effect, which can keep the strip light panel 2 within a reasonable temperature range. Compared with the line scan light source in the prior art, it significantly improves the cooling efficiency of the strip light panel 2.

[0048] Optionally, the line scan light source also includes a heat sink fin assembly 4 and a cooling fan 5. The heat sink fin assembly 4 is attached to the side of the heat conduction plate 1 away from the semiconductor cooling plate 3. The heat sink fin assembly 4 includes a plurality of heat sink fins 41 spaced apart. The cooling fan 5 is installed on the top of the heat sink fin assembly 4 away from the heat conduction plate 1, and the cooling fan 5 is used to blow cooling gas into the heat dissipation gaps between the heat sink fins 41.

[0049] Specifically, the heat from the heat-conducting plate 1 is transferred to the heat dissipation fins 41, and then the heat in the heat dissipation fins 41 is quickly dissipated to the outside under the cooling of the cooling fan 5.

[0050] Optionally, such as Figure 3 The heat-conducting plate 1 is connected to a heat-conducting copper pipe 11, which passes through the heat dissipation fin assembly 4. The heat-conducting copper pipe 11 can further improve the efficiency of heat transfer to the heat dissipation fin assembly 4, enabling the heat dissipation fin assembly 4 to cool the heat-conducting plate 1 more efficiently.

[0051] Optionally, the line scan light source also includes several temperature detectors; several semiconductor cooling plates 3 are spaced apart, and each area of ​​the strip light panel 2 cooled by a semiconductor cooling plate 3 is equipped with a temperature detector, and the temperature detector is electrically connected to the corresponding semiconductor cooling plate 3. Specifically, the temperature detector detects the temperature of the corresponding area. If the temperature of the corresponding area is too high, the cooling efficiency of the corresponding semiconductor cooling plate 3 is increased, thereby maintaining the strip light panel 2 within a reasonable temperature range.

[0052] Optionally, the heat dissipation fins 41 are perpendicular to the heat conduction plate 1; at least four cooling fans 5 are spaced apart, and the air outlet direction of the cooling fans 5 is parallel to the heat dissipation fins 41.

[0053] Optionally, the line scan light source also includes a focusing rod 6 mounted on the light-emitting side of the strip light panel 2; the focusing rod 6 is parallel to the strip light panel 2, and the cross-section of the focusing rod 6 is circular. The light emitted from the strip light panel 2 is focused by the focusing rod 6 to form a linear light spot on the workpiece surface. It should also be noted that the line scan light source also includes a housing, in which the focusing rod 6 and the strip light panel 2 are both mounted.

[0054] Optionally, the focusing rod 6 is a glass rod.

[0055] Optionally, such as Figure 4 The heat dissipation fins 41 are curved in a serpentine shape away from the heat conduction plate 1, and adjacent heat dissipation fins 41 are parallel to each other. Specifically, this can effectively increase the heat dissipation area, and together with the airflow from the cooling fan 5, it can effectively improve the heat dissipation effect.

[0056] Optionally, the strip light board 2 includes a strip circuit board and LED beads arranged at intervals along the central direction of the strip circuit board.

[0057] Optionally, each semiconductor cooling plate 3 is individually connected to a set of control modules.

[0058] Finally, it should be noted that although the above embodiments have been described in the text and drawings of this application, this should not limit the scope of patent protection of this application. Any technical solutions that are based on the essential concept of this application and utilize the content described in the text and drawings of this application, resulting in equivalent structural or procedural substitutions or modifications, as well as the direct or indirect application of the technical solutions of the above embodiments to other related technical fields, are all included within the scope of patent protection of this application.

Claims

1. A line scan light source, characterized in that, include: Heat-conducting plate (1); The strip light panel (2) is fixedly connected to the heat-conducting plate (1); The semiconductor cooling plate (3) has the heat-conducting plate (1) attached to one side and the strip light plate (2) attached to the other side, and the strip light plate (2) emits light to the side away from the semiconductor cooling plate (3).

2. The line scan light source according to claim 1, characterized in that, It also includes a heat dissipation fin assembly (4) and a cooling fan (5), wherein the heat dissipation fin assembly (4) is attached to the side of the heat-conducting plate (1) away from the semiconductor cooling plate (3); The heat dissipation fin assembly (4) includes a plurality of heat dissipation fins (41) spaced apart. The cooling fan (5) is installed on the top of the heat dissipation fin assembly (4) away from the heat conduction plate (1), and the cooling fan (5) is used to blow cooling gas into the heat dissipation gaps between the heat dissipation fins (41).

3. The line scan light source according to claim 1, characterized in that, The heat-conducting plate (1) is connected to a heat-conducting copper pipe (11), which is inserted through the heat dissipation fin assembly (4).

4. The line scan light source according to claim 1, characterized in that, It also includes several temperature detectors; The semiconductor cooling plate (3) is provided with several pieces at intervals. Each piece of the semiconductor cooling plate (3) has a temperature detector in the area of ​​the strip light plate (2) cooled by it, and the temperature detector is electrically connected to the corresponding semiconductor cooling plate (3).

5. The line scan light source according to claim 1, characterized in that, The heat dissipation fins (41) are perpendicular to the heat conduction plate (1); At least four cooling fans (5) are spaced apart, and the air outlet direction of the cooling fans (5) is parallel to the heat dissipation fins (41).

6. The line scan light source according to claim 1, characterized in that, It also includes a focusing rod (6) installed on the light-emitting side of the strip light panel (2); The focusing rod (6) is parallel to the strip light panel (2), and the cross-section of the focusing rod (6) is circular.

7. The line scan light source according to claim 1, characterized in that, The focusing rod (6) is a glass rod.

8. The line scan light source according to claim 2, characterized in that, The heat dissipation fins (41) are serpentine in the direction away from the heat conduction plate (1), and two adjacent heat dissipation fins (41) are parallel to each other.

9. The line scan light source according to claim 1, characterized in that, The strip light panel (2) includes a strip circuit board and LED beads that are spaced apart and installed on the strip circuit board along the central direction of the strip circuit board.

10. The line scan light source according to claim 1, characterized in that, Each of the aforementioned semiconductor cooling plates (3) is individually connected to a set of control modules.