Vapor chamber and battery
By setting grooves on the heat spreader plate, the problem of solder overflow during welding is solved, which also solves the problem of solder overflow contaminating the internal structure, thereby improving the heat conduction effect and connection strength of the heat spreader plate.
Patent Information
- Application Number
- CN202422989763.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-04
- Publication Date
- 2025-12-09
- Estimated Expiration
- 2034-12-04
AI Technical Summary
When welding a heat spreader, solder overflows and contaminates the internal structure, leading to increased local thickness and reduced heat conduction.
Grooves are provided on the heat spreader plate, and solder is filled into the grooves to prevent solder from overflowing into the inner cavity and contaminating the internal structure, while also improving the connection strength.
It effectively avoids solder contamination of the inner cavity, maintains a consistent thickness of the heat spreader, and improves thermal conductivity and connection strength.
Smart Images
Figure CN223649758U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of battery technology, specifically to a heat spreader and a battery. Background Technology
[0002] A vapor chamber is a phase change heat transfer element that utilizes the latent heat of phase change of the working fluid to remove heat, making it a promising thermal management method for solving heat dissipation problems in products and equipment. Currently, vapor chambers are mainly used for heat dissipation in electronic equipment, offering excellent thermal conductivity, a large heat transfer area, and good temperature uniformity; they are also particularly thin, and their dimensions can be adjusted according to actual heat dissipation requirements. In related technologies, vapor chambers consist of an upper shell and a lower shell, which are connected by welding. During the welding process, solder can easily overflow and contaminate the internal liquid absorber and other structures of the vapor chamber. Furthermore, solder overflow can increase the local thickness of the vapor chamber, reducing its thermal conductivity. Utility Model Content
[0003] The present invention provides a heat spreader and a battery, and aims to solve the technical problem of solder overflow contaminating the internal structure during the welding of the heat spreader.
[0004] In a first aspect, embodiments of the present invention provide a heat spreader, comprising:
[0005] First plate;
[0006] The second plate is disposed opposite to the first plate, and the first plate and the second plate form an inner cavity. The first plate and / or the second plate are provided with grooves, which surround the inner cavity. The grooves are provided with solder for welding the first plate and the second plate.
[0007] In one embodiment, a first connecting wall is formed on the edge of the first plate, and the first connecting wall is adjacent to the inner cavity. The groove is provided on the side of the first connecting wall facing the second plate, and the second plate covers the groove.
[0008] In one embodiment, the groove has a first side near the inner cavity and a second side away from the inner cavity, the vertical distance from the first side to the second side is L1, the vertical distance from the first side to the edge of the inner cavity is L2, and the width of the first connecting wall is L4, wherein 0.05≤L1 / L4≤0.25.
[0009] In one embodiment, the vertical distance from the second side to the side of the first connecting wall away from the inner cavity is L3, where 0.9 ≤ L2 / L3 ≤ 1.1.
[0010] In one embodiment, a second connecting wall is formed on the edge of the second plate, and the second connecting wall is adjacent to the inner cavity. The second connecting wall corresponds to the first connecting wall, and a protrusion is provided on the side of the second connecting wall facing the first connecting wall. The protrusion is embedded in the groove.
[0011] In one embodiment, along the thickness direction of the first plate, the height of the protrusion is H1, the depth of the groove is H2, and H1 is less than H2, so that a receiving cavity is formed between the groove and the protrusion, and the solder is disposed in the receiving cavity.
[0012] In one embodiment, H2 = H1 + b1, where b1 is a first coefficient, and 0.05mm ≤ b1 ≤ 0.15mm.
[0013] In one embodiment, the thickness of the first connecting wall is H3, 0.06 ≤ H2 / H3 ≤ 0.7; and / or,
[0014] The thickness of the second connecting wall is H4, and 0.05≤H1 / H4≤0.6.
[0015] In one embodiment, the volume of the receiving cavity is V1, the volume of the solder is V2, and 0.65≤V2 / V1≤1.
[0016] In one embodiment, the groove width is B1, the protrusion width is B2, B1 = B2 + b2, b1 is a second coefficient, and 0.03mm ≤ b2 ≤ 0.05mm.
[0017] Secondly, embodiments of this utility model provide a battery including the aforementioned heat spreader.
[0018] The beneficial effects of the embodiments of this utility model are as follows:
[0019] In this utility model, a groove is provided on the first body and / or the second plate, and solder is provided in the groove. When welding the first plate and the second plate, the solder melts and fills the groove, which can prevent the solder from overflowing into the inner cavity and contaminating other structures in the inner cavity. At the same time, placing the solder in the groove can not only improve the connection strength between the first plate and the second plate, but also prevent the solder from overflowing during the welding process, ensuring that the thickness of the heat spreader is basically consistent and avoiding the local increase in thickness of the heat spreader caused by solder overflow, which would affect the heat conduction effect of the heat spreader. Attached Figure Description
[0020] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0021] Figure 1 This is a schematic diagram of the structure of an embodiment of the heat spreader provided by this utility model;
[0022] Figure 2 yes Figure 1 A schematic diagram of the structure of the first plate in the middle;
[0023] Figure 3 yes Figure 2 Enlarged view of point C in the middle;
[0024] Figure 4 yes Figure 1 Schematic diagram of the structure of the second plate in the middle;
[0025] Figure 5 yes Figure 4 Enlarged view of point D in the middle;
[0026] Figure 6 yes Figure 1 Cross-sectional view of the heat exchange plate;
[0027] Figure 7 yes Figure 6 Enlarged view of point E in the middle;
[0028] Figure 8 yes Figure 7 Enlarged view of point F in the middle;
[0029] Figure 9 This is a schematic diagram of another embodiment of the heat spreader provided by this utility model.
[0030] Figure 10 This is a schematic diagram of another embodiment of the heat spreader provided by this utility model.
[0031] Figure 11 This is a schematic diagram of another embodiment of the heat spreader provided by this utility model.
[0032] Explanation of icon numbers
[0033] label name label name 100 heat spreader 21 groove 1 Board body 1 211 First side 11 First plate 212 Second side 111 First receiving tank 22 protrusion 112 First connecting wall 23 Receiving cavity 12 Second plate 3 Liquid suction core 121 Second receiving tank 4 silk screen 122 Second connecting wall 5 Inlet 13 inner cavity Detailed Implementation
[0034] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present utility model. In addition, it should be understood that the specific embodiments described herein are only for illustration and explanation of the present utility model and are not intended to limit the present utility model. In the present utility model, unless otherwise stated, directional terms such as "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, specifically the drawing directions in the accompanying drawings; while "inner" and "outer" refer to the outline of the device.
[0035] A vapor chamber is a phase change heat transfer element that utilizes the latent heat of phase change of the working fluid to remove heat, making it a promising thermal management method for solving heat dissipation problems in products and equipment. Currently, vapor chambers are mainly used for heat dissipation in electronic equipment, offering excellent thermal conductivity, a large heat transfer area, and good temperature uniformity; they are also particularly thin, and their dimensions can be adjusted according to actual heat dissipation requirements. In related technologies, vapor chambers consist of an upper shell and a lower shell, which are connected by welding. During the welding process, solder can easily overflow and contaminate the internal liquid absorber and other structures of the vapor chamber. Furthermore, solder overflow can increase the local thickness of the vapor chamber, reducing its thermal conductivity.
[0036] In view of this, the present invention proposes a heat spreader 100. Figures 1 to 11 This is a schematic diagram of a structure of a heat spreader 100 provided by the present invention. The heat spreader 100 provided by the present invention has a simple structure, can avoid solder penetration, avoid contamination of the internal structure of the heat spreader 100, and improve the heat conduction efficiency of the heat spreader 100. The heat spreader 100 will be described in detail below with reference to the main drawings.
[0037] Please see Figure 1 , Figure 2 and Figure 4 The heat equalization device includes a plate body 1, which includes a first plate body and a second plate body 12 arranged opposite to each other. The first plate body 11 and the second plate body 12 form an inner cavity 13. The first plate body 11 and / or the second plate body 12 are provided with grooves 21, which surround the inner cavity 13. The grooves 21 are provided with solder for welding the first plate body 11 and the second plate body 12.
[0038] In this utility model, a groove 21 is provided on the first body and / or the second plate 12, and solder is provided in the groove 21. When welding the first plate 11 and the second plate 12, the solder melts and fills the groove 21, which can prevent the solder from overflowing and flowing into the inner cavity 13 and contaminating other structures in the inner cavity 13. At the same time, placing the solder in the groove 21 can not only improve the connection strength of the first plate 11 and the second plate 12, but also prevent the solder from overflowing in the groove 21 during the welding process, ensuring that the thickness of the heat spreader 100 is basically consistent, and avoiding the local increase in thickness of the heat spreader 100 due to solder overflow, which would affect the heat conduction effect of the heat spreader 100.
[0039] It should be noted that the specific location of the groove 21 is not limited and can be selected according to the actual situation. In some embodiments, the groove 21 is formed on the first plate 11. In other embodiments, the groove 21 is formed on the second plate 12. In still other embodiments, the first plate 11 and the second plate 12 are both provided with grooves 21.
[0040] In some embodiments, please refer to Figure 1 The first plate 11 is a lower shell plate, and the second plate 12 is an upper shell plate. The upper and lower shell plates respectively form a first receiving groove 111 and a second receiving groove 121. The upper and lower shell plates are welded together so that the first receiving groove 111 and the second receiving groove 121 communicate to form an inner cavity 13. It should be noted that the heat spreader 100 is also provided with a first reinforcing structure. The specific location of the first reinforcing structure is not limited, as long as it is located in the inner cavity 13. In the above embodiment, the first reinforcing structure is located on the first plate 11. Of course, the first reinforcing structure can also be located on the second plate 12, depending on the actual situation. Since the first plate 11 is the lower shell plate, placing the first reinforcing structure on the first plate 11 facilitates the welding connection between the first plate 11 and the second plate 12.
[0041] In some embodiments, the inner cavity 13 is provided with a working fluid for heat exchange. It should be noted that the type of working fluid in the above embodiments is not limited and can be selected according to the actual application. For example, the working fluid can be lubricating oil, water, cold air, alcohol compounds, etc.
[0042] Please see Figure 2 , Figure 3 and 4A first receiving groove 111 is formed on the first plate 11, and the edge of the first receiving groove 111 is folded outward to form a first connecting wall 112. A second receiving groove 121 is formed on the second plate 12, and the edge of the second receiving groove 121 is folded outward to form a second connecting wall 122. The first connecting wall 112 and the second connecting wall 122 correspond to each other. In the actual welding process, the first plate 11 and the second plate 12 are welded together by welding the first connecting wall 112 and the second connecting wall 122. More specifically, the first connecting wall 112 has a groove 21 on the side facing the second plate 12, and the second plate 12 covers the groove 21. In this embodiment, the groove 21 is used to accommodate solder, and the second connecting wall 122 acts as a "cover plate" to cover the groove 21, thereby forming a receiving cavity 23 between the two. During welding, the solder melts and fills the receiving cavity 23. Since the second connecting wall 122 covers the groove 21, it can prevent the solder from overflowing from the groove 21, thereby preventing the solder from overflowing and leaving in the inner cavity 13 and contaminating the inner cavity 13.
[0043] Please see Figure 6 , Figure 7 and Figure 8 The groove 21 has a first side 211 near the inner cavity 13 and a second side 212 away from the inner cavity 13. The vertical distance between the first side 211 and the second side 212 is L1, and the width of the first connecting wall 112 is L4, where 0.05 ≤ L1 / L4 ≤ 0.25. It should be noted that the width of the groove 21 should not be too wide or too small. When L1 / L4 is less than 0.05, the width of the groove 21 is too narrow, and the volume of the groove 21 decreases. When the volume of solder remains constant, during welding, because the groove 21 is too small, the solder will still overflow from the groove 21 and flow into the inner cavity 13, contaminating the inner cavity 13. When the solder decreases accordingly, the connection strength between the first plate 11 and the second plate 12 will decrease, making it prone to splitting during use. When L1 / L4 is greater than 0.25, the width of the groove 21 is too large, resulting in a decrease in the strength of the first connecting wall 112, making it prone to breakage during welding.
[0044] It should be noted that the specific location of the groove 21 is not limited and can be set according to the actual situation. In this embodiment, the vertical distance from the first side 211 to the edge of the inner cavity 13 is L2, and the vertical distance from the second side 212 to the side of the first connecting wall 112 away from the inner cavity 13 is L3, where 0.9 ≤ L2 / L3 ≤ 1.1. Specifically, when L2 / L3 is less than 0.9, the groove 21 is too close to the inner cavity 13, and during the welding process, the solder can easily penetrate into the inner cavity 13, contaminating it. When L2 / L3 is greater than 1.1, the groove 21 is too far from the inner cavity 13, which can effectively prevent solder penetration and contamination. However, when the groove 21 is too close to the edge of the first connecting wall 112, the edge of the first connecting wall 112 is prone to cracking due to heat during the welding process. Specifically, the groove 21 is located in the middle of the first connecting wall 112, i.e., L2 = L3. This setting can also ensure the uniformity of the force on the first connecting wall 112 during the welding process.
[0045] In some embodiments, please refer to Figure 4 and Figure 5 The edge of the second plate 12 forms a second connecting wall 122, which corresponds to the first connecting wall 112. A protrusion 22 is provided on the side of the second connecting wall 122 facing the first connecting wall 112, and the protrusion 22 covers the groove 21. During actual installation, the solder is first placed in the groove 21, and then the second plate 12 is placed on top of the first plate 11, so that the protrusion 22 corresponds to the groove 21. During the covering process, the protrusion 22 can be engaged in the groove 21. On one hand, the cooperation between the protrusion 22 and the groove 21 can pre-fix the first plate 11 and the second plate 12, facilitating the welding operation; on the other hand, the cooperation between the protrusion 22 and the groove 21 can fix the solder within the groove 21, preventing solder penetration and thus protecting the inner cavity 13 from contamination.
[0046] Please see Figure 6 and Figure 7 Along the thickness direction of the first plate 11, the height of the protrusion 22 is H1, and the depth of the groove 21 is H2, where H1 is less than H2. In this embodiment, the height of the protrusion 22 is less than the depth of the groove 21. This is to prevent the solder from being squeezed out when the protrusion 22 and the groove 21 are engaged, which would cause the solder to penetrate and contaminate the inner cavity 13. At the same time, since the height of the protrusion 22 is less than the depth of the groove 21, a receiving cavity 23 is formed between the groove 21 and the protrusion 22. The solder is placed in the receiving cavity 23, which is used to contain the solder, thereby preventing the solder from overflowing and contaminating the inner cavity 13.
[0047] In some embodiments, H2 = H1 + b1, where b1 is a first coefficient, 0.05mm ≤ b1 ≤ 0.15mm. It should be noted that b1 represents the depth of the receiving cavity 23. When b1 is less than 0.05mm, the height of the protrusion 22 is too high, resulting in a shallow receiving cavity 23. When the volume of solder remains constant, solder will still overflow from the groove 21 during soldering and flow into the inner cavity 13, contaminating it. When the amount of solder decreases accordingly, the connection strength between the first plate 11 and the second plate 12 will decrease, making them prone to splitting during use. When b1 is greater than 0.15mm, the height of the protrusion 22 is too small, resulting in an increased volume of the receiving cavity 23, reducing its sealing effect, and making solder prone to overflow. Specifically, in this embodiment, b1 can be 0.05mm, 0.06mm, 0.07mm, 0.08mm, 0.09mm, 0.1mm, 0.11mm, 0.12mm, 0.13mm, 0.14mm, 0.15mm, or other unlisted data.
[0048] Please see Figure 6 , Figure 7 and Figure 8 The thickness of the first connecting wall 112 is H3, where 0.06 ≤ H2 / H3 ≤ 0.7. It should be noted that when H2 / H3 is less than 0.06, the depth of the groove 21 is too small, and the volume of the groove 21 decreases. Even with a constant solder volume, solder will still overflow from the groove 21 during welding, flowing into the inner cavity 13 and contaminating it. When the solder volume decreases accordingly, the connection strength between the first plate 11 and the second plate 12 decreases, making them prone to splitting during use. When H2 / H3 is greater than 0.7, the depth of the groove 21 increases, reducing the structural strength of the first connecting wall 112 and making it more susceptible to damage.
[0049] In some embodiments, the thickness of the second connecting wall 122 is H4, where 0.05 ≤ H1 / H4 ≤ 0.6. When H1 / H4 is less than 0.05, the height of the protrusion 22 is too small, resulting in an increase in the volume of the receiving cavity 23, reducing the sealing effect of the receiving cavity 23, and making it easy for solder to overflow. When H1 / H4 is greater than 0.6, the height of the protrusion 22 is too high, resulting in an insufficient depth of the receiving cavity 23. When the volume of solder remains constant, solder will still overflow from the groove 21 during welding and flow into the inner cavity 13, contaminating the inner cavity 13. When the amount of solder decreases accordingly, the connection strength between the first plate 11 and the second plate 12 will decrease, making it prone to splitting during use.
[0050] In some embodiments, the volume of the receiving cavity 23 is V1, and the volume of the solder is V2, where 0.65 ≤ V2 / V1 ≤ 1. It should be noted that when V2 / V1 is less than 0.65, the solder volume is too small, reducing the welding strength of the first plate 11 and the second plate 12, and making defects such as incomplete soldering more likely. When V2 / V1 is greater than 1, the solder volume is too large, making it prone to seepage during the welding process, flowing into the inner cavity 13 and contaminating it.
[0051] Please see Figure 6 and Figure 7 The groove width of the recess 21 is B1, and the width of the protrusion 22 is B2, where B1 = B2 + b2, and b2 is a second coefficient, 0.03mm ≤ b2 ≤ 0.05mm. It should be noted that this arrangement facilitates the fitting of the first plate 11 and the second plate 12. The protrusion 22 and the groove 21 have a clearance fit, which is convenient for the operator. Specifically, b2 can be 0.03mm, 0.04mm, 0.05mm, or other unlisted values.
[0052] In some embodiments, the heat spreader 100 further includes a plurality of liquid absorbent cores 3 and a wire mesh 4. The plurality of liquid absorbent cores 3 are located in the inner cavity 13. The plurality of liquid absorbent cores 3 are disposed on the first plate body 11 and extend along the length direction of the plate body 1. The plurality of liquid absorbent cores 3 are spaced apart in the inner cavity 13 along the width direction of the plate body 1. The wire mesh 4 is disposed between the plurality of liquid absorbent cores 3 and the second plate body 12.
[0053] It should be noted that the specific materials of the absorbent core 3 and the wire mesh 4 are not limited, and can be selected according to the actual situation. In this embodiment, the absorbent core 3 is a stainless steel absorbent core 3; the wire mesh 4 is a stainless steel wire mesh 4. Stainless steel has strong corrosion resistance and its structural strength is high, making it resistant to damage. In other embodiments, the absorbent core 3 is a copper absorbent core 3, and the wire mesh 4 is a copper wire mesh 4.
[0054] In some embodiments, please refer to Figure 1 The heat exchange plate 100 also has a liquid inlet 5, which is connected to the inner cavity 13. The liquid inlet 5 is equipped with a liquid injection pipe, which is connected to the outside and is used to input the working fluid into the inner cavity 13.
[0055] The plate body 1 includes a first part, a second part, and a third part, with the second part connecting the first and third parts. (See also...) Figure 9 In some embodiments, the first and third parts are located on the same plane, and the heat spreader 100 has an "I"-type structure. Please refer to [link / reference]. Figure 10 In some other embodiments, the first and third parts are located on different planes, and the heat spreader 100 has an "L"-shaped structure. For more specific details, please refer to... Figure 11Combining two "L"-shaped heat spreaders 100 can form a "T"-shaped heat spreader 100. The specific choice depends on the actual situation.
[0056] This utility model also proposes a battery, which includes a heat spreader 100. The specific structure of the heat spreader 100 is as described in the above embodiments. Since this battery adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, and will not be described in detail here.
[0057] Specifically, in one embodiment, the battery further includes a battery casing, which is composed of heat spreaders 100. That is, each of the six sides of the battery casing can be composed of a heat spreader 100. This arrangement saves space and improves space utilization. It should be noted that the six heat spreaders 100 can be interconnected or not, depending on the actual situation.
[0058] In some embodiments, the battery casing has six surfaces, and the heat spreader 100 can be applied to any one of the surfaces of the battery casing, or it can be applied to multiple surfaces simultaneously. For example, the heat spreader 100 can be applied to two adjacent surfaces of the battery casing. Specifically, the first part of the heat spreader 100 corresponds to one surface, and the second part of the heat spreader 100 corresponds to another surface, so that the heat spreader 100 can serve as two surfaces of the battery casing. The specific choice depends on the size of the battery module.
[0059] In some other embodiments, the heat spreader 100 can also be used inside the battery. The battery includes a battery casing and a core pack assembly. The core pack assembly is installed in the battery casing and includes at least one core pack. Specifically, the first part of the heat spreader 100 corresponds to one side of the core pack, and the second part of the heat spreader 100 corresponds to the other side of the core pack. Furthermore, in order to achieve temperature uniformity between adjacent core packs, a heat spreader 100 can also be provided between two adjacent core packs to achieve temperature uniformity on multiple sides, thereby transferring the temperature of the high-temperature part to the low-temperature part that is directly cooled by the cooling plate, improving cooling efficiency, and avoiding thermal runaway.
[0060] In some other embodiments, the heat spreader 100 can also be used in a battery module, which includes multiple batteries. The first part of the heat spreader 100 corresponds to one side of the battery casing, and the second part corresponds to the other side of the battery casing. Furthermore, in order to achieve uniform temperature between adjacent batteries, a heat spreader 100 can also be set between two adjacent batteries to achieve temperature equalization on multiple sides, thereby transferring the temperature of the high-temperature part to the low-temperature part directly cooled by the cooling plate. The technical solution of this utility model is further described in detail below with reference to specific embodiments and data. It should be understood that the following embodiments are only used to explain this utility model and are not intended to limit this utility model.
[0061] Example 1
[0062] A groove is formed on the first plate, and a protrusion is formed on the second plate. The height of the protrusion is 0.1 mm, the depth of the groove is 0.15 mm, the solder is brazing, and the welding method is laser penetration.
[0063] verify:
[0064] The heat spreader was tested for air tightness, and the air tightness of the heat spreader was qualified.
[0065] The heat spreader was cut, and the internal structure of the heat spreader was observed after cutting. It was found that there was no solder on the liquid absorption core and the wire mesh.
[0066] Example 2
[0067] The first plate has a groove, and the second plate has a protrusion. The height of the protrusion is 0.1 mm, the depth of the groove is 0.2 mm, the solder is brazing, and the welding method is laser penetration.
[0068] verify:
[0069] The heat spreader was tested for air tightness, and the air tightness of the heat spreader was qualified.
[0070] The heat spreader was cut, and the internal structure of the heat spreader was observed after cutting. It was found that there was no solder on the liquid absorption core and the wire mesh.
[0071] Example 3
[0072] The first plate has a groove, and the second plate has a protrusion. The height of the protrusion is 0.1 mm, the depth of the groove is 0.25 mm, the solder is brazing, and the welding method is laser penetration.
[0073] verify:
[0074] The heat spreader was tested for air tightness, and the air tightness of the heat spreader was qualified.
[0075] The heat spreader was cut, and the internal structure of the heat spreader was observed after cutting. It was found that there was no solder on the liquid absorption core and the wire mesh.
[0076] Comparative Example 1
[0077] The first plate has a groove, and the second plate has a protrusion. The height of the protrusion is 0.15 mm, the depth of the groove is 0.1 mm, the solder is brazing, and the welding method is laser penetration.
[0078] verify:
[0079] An airtightness test was performed on the heat spreader, and the airtightness result was NG.
[0080] The heat spreader was cut open, and the internal structure of the heat spreader was observed. Solder was found on the liquid absorber, indicating that the liquid absorber was contaminated.
[0081] Comparative Example 2
[0082] The first plate has a groove, and the second plate has a protrusion. The height of the protrusion is 0.05 mm, the depth of the groove is 0.2 mm, the solder is brazing, and the welding method is laser penetration.
[0083] verify:
[0084] An airtightness test was performed on the heat spreader, and the airtightness result was NG.
[0085] The heat spreader was cut, and the internal structure of the heat spreader was observed. It was found that the liquid wick and the wire mesh had no solder.
[0086] The embodiments of this utility model have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this utility model. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this utility model. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this utility model. Therefore, the content of this specification should not be construed as a limitation of this utility model.
Claims
1. A heat spreader, characterized in that, include: First plate (11); The second plate (12) is disposed opposite to the first plate (11). The first plate (11) and the second plate (12) form an inner cavity (13). The first plate (11) and / or the second plate (12) are provided with grooves (21). The grooves (21) surround the inner cavity (13). The grooves (21) are provided with solder for welding the first plate (11) and the second plate (12).
2. The heat spreader according to claim 1, characterized in that, The first plate (11) has a first connecting wall (112) formed on its edge, and the first connecting wall (112) is adjacent to the inner cavity (13). The first connecting wall (112) has the groove (21) on the side facing the second plate (12), and the second plate (12) covers the groove (21).
3. The heat spreader according to claim 2, characterized in that, The groove (21) has a first side (211) close to the inner cavity (13) and a second side (212) away from the inner cavity (13), the vertical distance between the first side (211) and the second side (212) is L1, and the width of the first connecting wall (112) is L4, wherein 0.05≤L1 / L4≤0.
25.
4. The heat spreader according to claim 3, characterized in that, The vertical distance from the first side (211) to the edge of the inner cavity (13) is L2, and the vertical distance from the second side (212) to the side of the first connecting wall (112) away from the inner cavity (13) is L3, 0.9≤L2 / L3≤1.
1.
5. The heat spreader according to claim 2, characterized in that, The edge of the second plate (12) is formed with a second connecting wall (122), and the second connecting wall (122) is adjacent to the inner cavity (13). The second connecting wall (122) corresponds to the first connecting wall (112). The second connecting wall (122) has a protrusion (22) on the side facing the first connecting wall (112), and the protrusion (22) is embedded in the groove (21).
6. The heat spreader according to claim 5, characterized in that, Along the thickness direction of the first plate (11), the height of the protrusion (22) is H1, and the depth of the groove (21) is H2, wherein H1 is less than H2, so that a receiving cavity (23) is formed between the groove (21) and the protrusion (22), and the solder is disposed in the receiving cavity (23).
7. The heat spreader according to claim 6, characterized in that, H2 = H1 + b1, where b1 is the first coefficient, and 0.05mm ≤ b1 ≤ 0.15mm.
8. The heat spreader according to claim 6, characterized in that, The thickness of the first connecting wall (112) is H3, 0.06 ≤ H2 / H3 ≤ 0.7; and / or, The thickness of the second connecting wall (122) is H4, 0.05≤H1 / H4≤0.
6.
9. The heat spreader according to claim 6, characterized in that, The volume of the cavity (23) is V1, the volume of the solder is V2, and 0.65≤V2 / V1≤1.
10. The heat spreader according to any one of claims 5-9, characterized in that, The groove (21) has a groove width of B1 and the protrusion (22) has a width of B2, B1 = B2 + b2, b2 is a second coefficient, 0.03mm ≤ b2 ≤ 0.05mm.
11. A battery, characterized in that, Includes the heat spreader (100) as described in any one of claims 1-10.