Battery silicon wafer weight testing device

Abstract

The utility model discloses a battery silicon wafer weight testing device, and relates to the technical field of weight measurement, the battery silicon wafer weight testing device comprises an electronic balance and a scale pan with a bulge, an openable box body is arranged above the electronic balance, and the box body is used for preventing air from flowing above the scale pan. The bottom area of the box body is larger than the upper surface area of the scale pan. An auxiliary piece is placed on the scale, and a battery silicon wafer is horizontally placed on the auxiliary piece. According to the invention, the auxiliary member in the box body can ensure that the battery silicon wafer is not in direct contact with the scale pan during weighing, the battery silicon wafer is prevented from being polluted, and meanwhile, the suspension design is not needed, so that the risk that the silicon wafer is broken due to non-uniform stress is reduced.

Description

Technical Field

[0001] This application relates to the field of weight measurement technology, and in particular to a battery silicon wafer weight testing device. Background Technology

[0002] In the manufacturing process of solar cell silicon wafers / cells, weighing is required at many stages. For example, in the texturing and alkaline polishing processes, the silicon wafers need to be weighed before and after the texturing or alkaline polishing process to calculate the weight loss; in the screen printing process, the cells need to be weighed before and after screen printing to calculate the wet weight.

[0003] In related technologies, one weighing method involves placing the silicon wafer directly on the surface of an electronic balance. However, this method can easily cause the silicon wafer to come into contact with the weighing pan during the weighing process, contaminating the solar cells and leading to rework. To solve this problem, related technologies, such as patent document 202122071053.0, typically design a weighing bracket to suspend the silicon wafer, thereby minimizing the contact area between the weighing pan and the silicon wafer. However, with advancements in manufacturing processes, silicon wafers are becoming thinner and larger. This suspended placement method may cause the silicon wafer to break due to uneven force or additional pressure. Utility Model Content

[0004] The main purpose of this application is to provide a battery silicon wafer weight testing device, which aims to solve the technical problem that battery silicon wafers are prone to breakage when weighing in related technologies.

[0005] To achieve the above objectives, this application provides a battery silicon wafer weight testing device, including an electronic balance with a raised weighing pan and an openable housing above the electronic balance, the housing being used to prevent air from flowing from above the weighing pan.

[0006] The bottom area of ​​the box is larger than the upper surface area of ​​the weighing pan;

[0007] An auxiliary component is placed on the weighing pan, and a battery silicon wafer is placed flat on the auxiliary component.

[0008] In one embodiment, the auxiliary component is sulfur-free paper.

[0009] In one embodiment, the housing includes a base plate fixed to the upper surface of the electronic balance, a perimeter baffle disposed above the base plate, and an openable cover connected to the perimeter baffle.

[0010] In one embodiment, it further includes a first weighing component, which includes a weighing plate, the area of ​​which is larger than the surface area of ​​the weighing pan of the electronic balance.

[0011] The weighing plate engages with the weighing pan of the electronic balance via a snap-fit ​​groove on its lower surface; the outer contour of the snap-fit ​​groove matches the outer contour of the weighing pan of the electronic balance.

[0012] Sulfur-free paper is placed in the sulfur-free paper placement area on the upper surface of the weighing plate, and the weighing plate is used for the horizontal placement of silicon wafers.

[0013] In one embodiment, a first mounting groove is further provided on the upper surface of the weighing plate, the first mounting groove being used to install the second weighing component;

[0014] The second weighing component contains sulfur-free paper.

[0015] In one embodiment, the second weighing component includes a mounting bracket and a weighing basket connected to the mounting bracket by a rope; wherein,

[0016] The weighing basket is equipped with a flexible weighing net, and sulfur-free paper is placed above the flexible weighing net.

[0017] The second weighing component is mounted on the first mounting slot via a mounting bracket.

[0018] In one embodiment, the mounting bracket is further provided with a second mounting slot for mounting other second weighing components.

[0019] In one embodiment, the base plate includes a display opening for the electronic balance level ball.

[0020] In one embodiment, the opening angle of the cover is no greater than 90°.

[0021] In one embodiment, a fastening male component is provided on at least one non-connecting side of the opening and closing cover, a handle is provided on the top of the opening and closing cover, and fastening female components are provided on the surrounding baffles corresponding to the fastening male component.

[0022] The base plate is provided with a base plate slot, and the surrounding baffles are snapped onto the base plate through the base plate slot.

[0023] This application avoids interference from external airflow during weighing through the design of the box. At the same time, by increasing the contact area, it ensures that the silicon wafer can be placed horizontally for weighing to reduce local stress concentration and prevent the chip from breaking during the weighing process. The sulfur-free paper in the box effectively avoids silicon wafer contamination caused by direct contact between the silicon wafer and the weighing pan. In addition, the design of the flexible weighing component makes the silicon wafer easier to pick up and put down. Attached Figure Description

[0024] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0025] To more clearly illustrate the technical solutions in the embodiments of this application or related technologies, the accompanying drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, those skilled in the art can obtain other drawings based on these drawings without creative effort.

[0026] Figure 1 This is a first structural schematic diagram of the first embodiment of the silicon wafer weight testing device of this application.

[0027] Figure 2 This is a second structural schematic diagram of the first embodiment of the silicon wafer weight testing device of this application.

[0028] The purpose, features, and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings.

[0029] Reference numerals: 100 Electronic balance, 110 Weighing pan, 201 Snap-fit ​​slot, 202 Weighing plate, 203 Mounting bracket, 204 Second mounting slot, 205 Weighing basket, 210 Base plate, 211 Base plate slot, 220 Surround baffle, 230 Opening cover, 231 Handle, 232 Fastening male part, 233 Fastening female part. Detailed Implementation

[0030] It should be understood that the specific embodiments described herein are merely illustrative of the technical solutions of this application and are not intended to limit this application.

[0031] To better understand the technical solution of this application, a detailed description will be provided below in conjunction with the accompanying drawings and specific implementation methods.

[0032] In related technologies, one method of weighing solar cell silicon wafers is to place them directly on the surface of an electronic balance. However, this method can easily cause the silicon wafer to come into contact with the weighing pan during the weighing process, contaminating the wafer and leading to rework. To solve this problem, related technologies, such as patent document 202122071053.0, typically design a weighing bracket to suspend the silicon wafer, thereby minimizing the contact area between the weighing pan and the wafer. However, as silicon wafers become thinner and larger, this suspended placement method may cause the wafer to break due to uneven force or additional pressure. Furthermore, this patent adds a support plate to the weighing pan. Since electronic balances for weighing solar cells / silicon wafers have high precision, prolonged pressure from objects on the weighing pan surface can cause deformation of the internal sensing spring beneath the pan, affecting weighing accuracy.

[0033] Based on this, Embodiment 1 of this application provides a battery silicon wafer weight testing device, referring to... Figure 1 Figure 1 This is a schematic diagram of the silicon wafer weight testing device of this application.

[0034] In this embodiment, the battery silicon wafer weight testing device includes an electronic balance with a raised weighing pan and an openable housing above the electronic balance to prevent air from flowing from above the weighing pan.

[0035] The bottom area of ​​the box is larger than the top surface area of ​​the weighing pan.

[0036] An auxiliary component is placed on the weighing pan, and a battery silicon wafer is placed flat on the auxiliary component. The auxiliary component is sulfur-free paper.

[0037] The enclosure includes a base plate fixed to the upper surface of the electronic balance, four surrounding baffles located above the base plate, and an openable cover connected to the surrounding baffles.

[0038] Understandably, the upper surface of the electronic balance includes the weighing pan 110 and the base. In this embodiment, a housing can be added to the base of the electronic balance. In a specific example, holes can be made at the screw holes of the electronic balance, and the housing can be fixed to the base of the electronic balance using screws.

[0039] The housing includes a base plate 210 fixed to the electronic balance base, four surrounding baffles 220 disposed above the base plate, and an opening / closing cover 230, wherein the area of ​​the base plate 210 is larger than the area of ​​the electronic balance base. An auxiliary component, which can be sulfur-free paper, is placed on the weighing pan 110 of the electronic balance.

[0040] Understandably, as silicon wafers become larger, a larger weighing space is needed to accommodate their weight. This embodiment uses a larger base plate area to allow the silicon wafer to lie flat on the weighing pan 110 of the electronic balance, preventing it from being bumped and broken. The enclosure, with its surrounding baffles 220 and hinged cover 230, forms a closed space, preventing external airflow from affecting the weighing of the silicon wafer.

[0041] Silicon wafers are extremely sensitive to contamination, and the surface of the electronic balance pan 110 may contain grease, dirt, or other residues. Silicon wafers typically have a high degree of smoothness and brittleness, and direct contact with the electronic balance pan can cause surface scratches or abrasion. Sulfur-free paper is placed on the electronic balance pan. This soft, smooth, and non-corrosive paper provides a buffer layer for the silicon wafer, effectively preventing surface damage from direct contact. Simultaneously, sulfur-free paper generally has low electrostatic accumulation characteristics, reducing the adhesion of micro-dust caused by electrostatic adsorption, protecting the silicon wafer surface from micro-dust contamination, and further ensuring the stability of the weighing results.

[0042] In one specific implementation, refer to Figure 2 The silicon wafer weight testing device also includes a first weighing component, which includes a weighing plate 202, the area of ​​which is larger than the surface area of ​​the weighing pan 110 of the electronic balance.

[0043] The weighing plate 202 is engaged with the weighing pan 110 of the electronic balance through a snap-fit ​​groove 201 provided on the lower surface of the weighing plate 202; the outer contour shape of the snap-fit ​​groove 201 is consistent with the outer contour shape of the weighing pan 110 of the electronic balance.

[0044] Sulfur-free paper is placed in the sulfur-free paper placement area on the upper surface of the weighing plate 202, and the weighing plate 202 is used for the horizontal placement of silicon wafers.

[0045] In this embodiment, a first weighing component is placed on the weighing pan of the electronic balance. This first weighing component provides a larger weighing surface for the electronic balance, offering more space for the silicon wafers and meeting the weighing requirements of large-size silicon wafers, thus avoiding edge suspension due to an insufficient weighing surface. Simultaneously, a snap-fit ​​groove 201 is used to snap the first weighing component onto the weighing pan, allowing for flexible placement and removal of the groove. This prevents the internal sensing spring from being deformed due to prolonged pressure from external objects on the weighing pan 110, which would affect its lifespan. The sulfur-free paper placement area on the upper surface of the weighing plate is used to prevent the sulfur-free paper from deviating or sliding. It is understood that the outer contour shape of the snap-fit ​​groove 201 is consistent with the outer contour shape of the weighing pan 110 of the electronic balance. In this embodiment, the weighing pan 110 of the electronic balance is circular; therefore, the snap-fit ​​groove 201 can also be circular to achieve a snap-fit ​​with the circular weighing pan.

[0046] In another specific embodiment, a first mounting groove is also provided on the upper surface of the weighing plate. The first mounting groove is used to install a second weighing component, and sulfur-free paper is placed inside the second weighing component.

[0047] The second weighing component includes a mounting bracket 203 and a weighing basket 205 connected to the mounting bracket by a rope. The weighing basket 205 is provided with a flexible weighing net, and sulfur-free paper is provided above the flexible weighing net. The second weighing component is mounted on the first mounting groove through the mounting bracket 203.

[0048] The mounting bracket 203 is also provided with a second mounting slot 204, which is used to install other second weighing components.

[0049] Because silicon wafers are very thin, they are difficult to remove after being placed on the weighing pan 110 for weighing. In this embodiment, the second weighing component consists of a mounting bracket 203 and a weighing basket 205. The weighing basket 205 is equipped with a flexible weighing net, on which sulfur-free paper is laid to hold the silicon wafer. In this embodiment, the weighing basket and the mounting bracket are connected by a rope, allowing the silicon wafer to be easily placed and removed by lifting or moving the weighing basket. In actual operation, simply holding the bottom of the flexible weighing net by hand will create an angle between the silicon wafer and the net surface, making it easier to remove the silicon wafer from the weighing basket and reducing the difficulty of operation and the risk of silicon wafer breakage due to misoperation.

[0050] The second weighing component can be flexibly placed and removed from the first mounting slot via the mounting bracket 203. At the same time, the second mounting slot 204 on the second weighing component 203 can accommodate the placement of multiple second weighing components to accommodate the simultaneous testing of multiple silicon wafers. In a specific example, each second weighing component is responsible for weighing one silicon wafer to avoid mutual adsorption or additional wear caused by stacking multiple silicon wafers.

[0051] Furthermore, in this embodiment, the base plate includes a display opening for the electronic balance level ball.

[0052] The opening angle of the 230mm cover is no more than 90°.

[0053] At least one non-connecting side of the opening and closing cover 203 is provided with a fastening male part 232, a handle 231 is provided on the top of the opening and closing cover 203, and fastening female parts 233 are provided on the surrounding baffles 220 corresponding to the fastening male part. A bottom plate slot 211 is provided on the bottom plate 210, and the surrounding baffles 220 are engaged with the bottom plate 210 through the bottom plate slot 211.

[0054] In this embodiment, the opening and closing cover 230 is disposed above the surrounding baffles 220 and can be hinged to the surrounding baffles 220. The opening and closing cover 230 is provided with a handle 231 for easy opening. The opening and closing angle of the cover is no greater than 90°, so that the testing device occupies as little space on the table as possible to facilitate experimental operation.

[0055] The bottom plate 210 of the enclosure has an opening at the level bead position of the electronic balance 100, exposing the level bead for easy leveling. Simultaneously, a male fastener 232 is provided on at least one non-connecting side of the opening / closing cover 230, a handle 231 is provided on the top of the opening / closing cover 230, and female fasteners 233 are provided on the surrounding baffles 220 corresponding to the male fastener 232. It can be understood that the male fastener 232 and the female fastener 233 can be used to integrate the opening / closing cover 230 with the surrounding baffles 220. In actual operation, the opening / closing cover 230 and the surrounding baffles 220 can be lifted from the bottom plate slot 211 using the handle for easy cleaning of the enclosure and installation of components.

[0056] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

[0057] The above are only some embodiments of this application and do not limit the patent scope of this application. All equivalent structural transformations made under the technical concept of this application and using the contents of the specification and drawings of this application, or direct / indirect applications in other related technical fields, are included in the patent protection scope of this application.

Claims

1. A battery silicon wafer weight testing device, comprising an electronic balance with a raised weighing pan, characterized in that, The electronic balance is equipped with an openable box above it, which is used to prevent air from flowing from above the weighing pan. The bottom area of ​​the box is larger than the upper surface area of ​​the weighing pan; An auxiliary component is placed on the weighing pan, and a battery silicon wafer is placed flat on the auxiliary component.

2. The silicon wafer weight testing device as described in claim 1, characterized in that, The auxiliary component is sulfur-free paper.

3. The silicon wafer weight testing device as described in claim 1, characterized in that, The enclosure includes a base plate fixed to the upper surface of the electronic balance, four surrounding baffles disposed above the base plate, and an openable cover connected to the four surrounding baffles.

4. The silicon wafer weight testing device as described in claim 3, characterized in that, It also includes a first weighing component, which includes a weighing plate, the area of ​​which is larger than the surface area of ​​the weighing pan of the electronic balance. The weighing plate is engaged with the weighing pan of the electronic balance via a snap-fit ​​groove provided on the lower surface of the weighing plate; the outer contour shape of the snap-fit ​​groove is consistent with the outer contour shape of the weighing pan of the electronic balance. Sulfur-free paper is placed in the sulfur-free paper placement area on the upper surface of the weighing plate, and the weighing plate is used for horizontal placement of silicon wafers.

5. The silicon wafer weight testing device as described in claim 4, characterized in that, The upper surface of the weighing plate is also provided with a first mounting groove, which is used to install the second weighing component. The second weighing component contains sulfur-free paper.

6. The silicon wafer weight testing device as described in claim 5, characterized in that, The second weighing assembly includes a mounting bracket and a weighing basket connected to the mounting bracket by a rope; wherein, The weighing basket is equipped with a flexible weighing net, and sulfur-free paper is placed above the flexible weighing net. The second weighing component is mounted on the first mounting slot via the mounting bracket.

7. The silicon wafer weight testing device as described in claim 6, characterized in that, The mounting bracket is also provided with a second mounting slot, which is used to install a second weighing component.

8. The silicon wafer weight testing device as described in claim 3, characterized in that, The base plate includes a display opening for the electronic balance's level ball.

9. The silicon wafer weight testing device as described in claim 3, characterized in that, The opening angle of the cover is no greater than 90°.

10. The silicon wafer weight testing device as described in claim 3, characterized in that, A male fastener is provided on at least one non-connecting side of the opening and closing cover, a handle is provided on the top of the opening and closing cover, and female fasteners are provided on the surrounding baffles corresponding to the male fastener. The base plate is provided with a base plate slot, and the surrounding baffles are snapped onto the base plate through the base plate slot.

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