Wafer feeding mechanism and wafer defect detection equipment

Abstract

The utility model discloses a wafer feeding mechanism and wafer defect detection equipment, the wafer feeding mechanism comprises a temporary storage bin group, a first manipulator and a second manipulator, and the temporary storage bin group comprises a first operation unit and a second operation unit; the first manipulator is used for conveying to-be-detected wafers to the temporary storage bin group or transferring detected wafers in the temporary storage bin group; the second manipulator is used for conveying wafers between the detection mechanism and the temporary storage bin group, and the first operation unit and the second operation unit are connected to the second manipulator side by side; wherein the first operation unit comprises at least one temporary storage bin, and the second operation unit comprises at least one temporary storage bin. According to the embodiment of the invention, the two operation units can prepare materials or complement each other, continuous feeding of the wafer feeding mechanism is realized, and the feeding process of the to-be-detected wafer to the detection mechanism is optimized, so that the operation efficiency of the wafer defect detection process is improved.

Description

Technical Field

[0001] This application belongs to the field of semiconductor processing technology, and in particular relates to a wafer feeding mechanism and a wafer defect detection device. Background Technology

[0002] In semiconductor processing, the working environment requirements differ between different wafer fabrication steps. For example, defect detection steps may require a vacuum environment.

[0003] In related technologies, wafer defect inspection equipment is equipped with a buffer chamber that can repeatedly switch between atmospheric and vacuum environments to facilitate the transfer of the wafer from an atmospheric environment to a vacuum environment for subsequent defect inspection steps. However, the processing efficiency of wafer defect inspection equipment needs to be improved due to limitations in the pressure regulation speed of the buffer chamber. Utility Model Content

[0004] This application provides a wafer feeding mechanism and a wafer defect detection device. The wafer feeding mechanism can optimize the wafer feeding process of the wafer defect detection device, thereby improving the operating efficiency and economy of the wafer defect detection device.

[0005] In a first aspect, embodiments of this application provide a wafer delivery mechanism, including a temporary storage bin group, a first robotic arm, and a second robotic arm. The temporary storage bin group includes a first operating unit and a second operating unit. The first robotic arm is used to deliver wafers to be tested to the temporary storage bin group or to transfer wafers that have been tested in the temporary storage bin group. The second robotic arm is used to deliver wafers between the testing mechanism and the temporary storage bin group. The first operating unit and the second operating unit are connected side by side to the second robotic arm. The first operating unit includes at least one temporary storage bin, and the second operating unit includes at least one temporary storage bin. The wafers to be tested enter the testing mechanism sequentially through the first robotic arm, the temporary storage bin group, and the second robotic arm. The tested wafers are delivered out of the wafer delivery mechanism sequentially through the second robotic arm, the temporary storage bin group, and the first robotic arm.

[0006] In some embodiments, at least two second robotic arms are provided, and the at least two second robotic arms can simultaneously put the wafer to be tested into the testing mechanism and send out the tested wafer. One part is set in correspondence with the first working unit, and the other part is set in correspondence with the second working unit.

[0007] In some embodiments, a first robotic arm is provided, and the first robotic arm is located between the first working unit and the second working unit; or,

[0008] There are at least two first robotic arms, and a portion of each of the at least two first robotic arms is set to correspond to a first working unit, while the other portion is set to correspond to a second working unit.

[0009] In some of these embodiments, when a first robotic arm is provided, the distance between the first robotic arm and the first working unit is equal to the distance between the first robotic arm and the second working unit;

[0010] When there are at least two first robotic arms, each first robotic arm is set up in a one-to-one correspondence with a temporary storage bin, and the distance between each first robotic arm and its corresponding temporary storage bin is equal.

[0011] In some embodiments, the wafer feeding mechanism further includes a storage component, which is located on the side of the first robot arm away from the temporary storage bin group, and includes a first material box and a second material box arranged side by side.

[0012] In some embodiments, the shortest distance between the first robotic arm and the first material box is equal to the shortest distance between the first robotic arm and the second material box.

[0013] In some embodiments, the wafer feeding mechanism further includes an isolation component for switching the connection state between the temporary storage bin group and the testing mechanism. The isolation component includes at least two first valves, which are respectively configured to correspond to the first working unit and the second working unit.

[0014] In some embodiments, the second robotic arm is connected to the detection mechanism, and the first valve is located between the second robotic arm and the temporary storage bin; or,

[0015] The second robotic arm is located in the temporary storage compartment, and the first valve is located between the second robotic arm and the detection mechanism.

[0016] In some embodiments, the isolation assembly further includes at least two third valves, each corresponding to one of the at least two temporary storage chambers, with the third valves located at the end of the temporary storage chamber furthest from the second robotic arm.

[0017] Secondly, embodiments of this application provide a wafer defect detection device, including a wafer feeding mechanism provided in any of the foregoing embodiments and a detection mechanism for detecting wafers, wherein the detection mechanism is connected to a second robotic arm of the wafer feeding mechanism.

[0018] The wafer feeding mechanism of this application embodiment includes a first robotic arm, a temporary storage bin group, and a second robotic arm. The temporary storage bin group is provided with a first working unit and a second working unit. The first working unit and the second working unit are connected side by side to the second robotic arm. When one working unit is transferring the wafer to be tested to the inspection mechanism through the second robotic arm, the other working unit can transfer the inspected wafer out of the wafer feeding mechanism or put in a new wafer to be tested through the first robotic arm. Thus, the two working units can prepare materials for each other or supplement each other, realize the continuous operation of the wafer feeding mechanism, optimize the feeding process of the wafer to be tested to the inspection mechanism, and thereby improve the operating efficiency of the wafer defect inspection process. Attached Figure Description

[0019] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiments below. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0020] Figure 1 This is a connection diagram of the wafer feeding mechanism in some embodiments of this application;

[0021] Figure 2 This is a connection diagram of a wafer feeding mechanism for some other embodiments of this application.

[0022] The reference numerals in the detailed embodiments are as follows:

[0023] 110. First robotic arm; 120. Second robotic arm;

[0024] 200. Temporary storage warehouse;

[0025] 310. First material box; 320. Second material box;

[0026] 410, First valve; 420, Second valve; 430, Third valve;

[0027] 500. Precise;

[0028] 600. Testing institutions. Detailed Implementation

[0029] The embodiments of the technical solution of this application will now be described in detail with reference to the accompanying drawings. These embodiments are only used to more clearly illustrate the technical solution of this application and are therefore merely examples, and should not be used to limit the scope of protection of this application.

[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having”, and any variations thereof, in the specification, claims, and foregoing description of the drawings are intended to cover non-exclusive inclusion.

[0031] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.

[0032] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0033] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0034] In the description of the embodiments of this application, the term "multiple" refers to two or more (including two), similarly, "multiple sets" refers to two or more (including two sets), and "multiple pieces" refers to two or more (including two pieces).

[0035] In the description of the embodiments of this application, the technical terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0036] In the description of the embodiments of this application, unless otherwise expressly specified and limited, technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0037] In semiconductor manufacturing, many processes need to be performed in a vacuum environment to ensure processing precision. Taking wafer defect detection as an example, wafer defect detection typically involves exposing the wafer to be tested to a vacuum environment, using an electron beam or other optical equipment to scan and image the wafer surface, and then identifying whether defects exist on the wafer surface through the image.

[0038] However, in actual production environments, due to cost control or other considerations, wafer transport mechanisms typically operate in an atmospheric environment. Therefore, a buffer chamber needs to be set up between the wafer defect detection chamber and other processes. The buffer chamber can switch between a vacuum environment and an atmospheric environment to meet the operational needs of transporting wafers to the vacuum detection chamber or between other processes.

[0039] In related technologies, vacuum testing chambers typically have only one testing station, and a corresponding buffer chamber is also set up. During the process of transferring the wafer from the buffer chamber after testing, the buffer chamber needs to switch from a vacuum environment to an atmospheric environment to connect with other process equipment. After completing the process of transporting the tested wafer to other process equipment and receiving wafers to be tested from other process equipment in the atmospheric environment, it switches back to a vacuum environment to transport the wafer to be tested to the testing chamber. During this process, the vacuum testing chamber is idle and not fully utilized, which is detrimental to improving the operational efficiency and economy of wafer defect detection equipment.

[0040] To address the problems in the prior art, this application provides a wafer feeding mechanism and a wafer defect detection device. The wafer feeding mechanism provided in this application is described below.

[0041] Please see Figures 1 to 2 In a first aspect, embodiments of this application provide a wafer delivery mechanism, including a temporary storage bin group, a first robotic arm 110, and a second robotic arm 120. The first robotic arm 110 is used to deliver wafers to be tested to the temporary storage bin group or to transfer wafers that have been tested in the temporary storage bin group. The second robotic arm 120 is used to deliver wafers between the testing mechanism 600 and the temporary storage bin group. The wafers to be tested sequentially pass through the first robotic arm 110, the temporary storage bin group, and the second robotic arm 120 into the testing mechanism 600. The tested wafers sequentially pass through the second robotic arm 120, the temporary storage bin group, and the first robotic arm 110 out of the wafer delivery mechanism. The temporary storage bin group includes a first working unit and a second working unit, which are connected side-by-side to the second robotic arm 120. The first working unit includes at least one temporary storage bin 200, and the second working unit includes at least one temporary storage bin 200.

[0042] In some embodiments, both the first working unit and the second working unit contain wafers to be tested. The second robot 120 first transfers the wafers to be tested from the first working unit to the testing mechanism 600. After the testing mechanism 600 completes its work, the second robot 120 sends the tested wafers back to the first working unit and directly transfers the wafers to be tested from the second working unit to the testing mechanism 600, without waiting for the first working unit to vacuum and load the wafers.

[0043] In other embodiments, a first working unit is used to store the wafer to be tested, and a second working unit is used to store the wafers that have been tested. A second robotic arm 120 transfers the wafer to be tested from the first working unit to the testing mechanism 600. After the testing mechanism 600 completes its work, the second robotic arm 120 transfers the tested wafers to the second working unit. The first working unit can simultaneously perform vacuuming and loading during the operation of the testing mechanism 600 and the transfer of the tested wafers to the second working unit. The second working unit can simultaneously perform vacuuming and unloading during the transfer of the wafer to be tested to the testing mechanism 600 and the operation of the testing mechanism 600.

[0044] Therefore, the temporary storage unit can prepare or supplement each other's materials through the first and second working units, so as to realize the continuous operation of the wafer delivery mechanism. In one operation in a vacuum environment, the second robot arm 120 completes the loading of the wafer to be tested to the inspection mechanism 600 and the unloading of the inspected wafer by the inspection mechanism 600. This reduces the frequency of vacuuming and unloading of the wafer delivery mechanism and shortens the operation time of the temporary storage unit to adjust the atmospheric or vacuum environment, thereby improving the efficiency of the wafer delivery mechanism and the wafer defect inspection process.

[0045] According to certain embodiments of this application, at least two second robotic arms 120 are provided, one part of which is provided corresponding to the first working unit and the other part is provided corresponding to the second working unit.

[0046] Understandably, this correspondence can be flexibly adjusted according to actual needs. For example, the first working unit includes two input storage bins 200, and the second working unit includes one output storage bin 200. Two second robotic arms 120 are provided, one for transporting the wafer to be tested between the input storage bin 200 and the inspection mechanism 600, and the other for transporting the inspected wafer between the inspection mechanism 600 and the output storage bin 200.

[0047] Optionally, at least two second robotic arms 120 are configured in a one-to-one correspondence with at least two temporary storage bins 200, so that the second robotic arms 120 can respond promptly to environmental changes in the temporary storage bins 200 and place or remove wafers from the temporary storage bins 200. For example, a first work unit includes one temporary storage bin 200, a second work unit includes one temporary storage bin 200, and two second robotic arms 120 are configured, each corresponding to one of the two temporary storage bins 200. When one second robotic arm 120 transfers a wafer to be tested from one temporary storage bin 200 to the inspection mechanism 600, the other second robotic arm 120 can simultaneously transfer a wafer that has been inspected in the inspection mechanism 600 to the other temporary storage bin 200.

[0048] For example, the second manipulator 120 is configured as a robotic arm or an industrial robot. For instance, the second manipulator 120 is configured as a vacuum manipulator to improve the operational accuracy of the second manipulator 120 in a vacuum environment.

[0049] Therefore, the two processes of the second robotic arm 120 feeding the wafer to be tested into the inspection mechanism 600 and the inspection mechanism 600 unloading the inspected wafer can be carried out simultaneously, further shortening the wafer transfer time between the wafer feeding mechanism and the inspection mechanism 600, which helps to improve the operating efficiency of the wafer defect inspection equipment.

[0050] In other embodiments, a second robotic arm 120 is provided, and the distance between the second robotic arm 120 and the first working unit is equal to the distance between the second robotic arm 120 and the second working unit, so that the second robotic arm 120 can be directly transferred to another temporary storage bin 200 to pick up the wafer to be tested after the wafer has been placed after testing, thereby reducing the attitude adjustment time of the second robotic arm 120.

[0051] The first robotic arm 110 is used to transfer wafers to be tested into the wafer feeding mechanism or to transfer wafers that have been tested out of the wafer feeding mechanism.

[0052] Please see Figure 1 Optionally, the first robotic arm 110 is provided in a direction from the first working unit to the second working unit, and the first robotic arm 110 is located between the first working unit and the second working unit, so that the first robotic arm 110 can simultaneously meet the needs of transporting wafers to both working units.

[0053] Please see Figure 2 Optionally, at least two first robotic arms 110 are provided, one of which is configured to correspond to the first working unit and the other of which is configured to correspond to the second working unit. Thus, the wafer feeding mechanism can simultaneously perform the operations of conveying wafers to be tested to the temporary storage group and transferring tested wafers from the temporary storage group through at least two first robotic arms 110, thereby improving the working efficiency of the wafer feeding mechanism.

[0054] Optionally, the first robotic arm 110 is an industrial robot, robotic arm, or other mechanical equipment capable of wafer transport.

[0055] In some embodiments, the first robot arm 110 is provided with a distance between the first robot arm 110 and the first working unit equal to the distance between the first robot arm 110 and the second working unit, so that the first robot arm 110 can directly transfer the wafer that has been tested in the other working unit out of the wafer feeding mechanism after completing the feeding of the wafer to be tested into one of the working units, thereby reducing the attitude adjustment time of the first robot arm 110.

[0056] In other embodiments, at least two first robotic arms 110 are provided and are arranged in a one-to-one correspondence with the temporary storage bins 200. The interval between each first robotic arm 110 and its corresponding temporary storage bin 200 is the same, so that the working time of each first robotic arm 110 is the same, and the feeding efficiency and output efficiency of the wafer feeding mechanism are consistent, so as to achieve continuous high-efficiency operation.

[0057] According to certain embodiments of this application, the wafer feeding mechanism further includes a storage component, which is located on the side of the first robot arm 110 away from the temporary storage bin group. The storage component includes a first material box 310, which is used to store the wafer to be tested so that the first robot arm 110 can promptly acquire the wafer to be tested and transfer it to the temporary storage bin group.

[0058] Optionally, the storage assembly also includes a second material box 320, which is used to store the inspected wafers. The second material box 320 and the first material box 310 are located on the same side of the first robot arm 110.

[0059] Alternatively, the first material box 310 and the second material box 320 are arranged side by side to receive the wafers gripped or placed by the first robotic arm 110.

[0060] Therefore, the wafer feeding mechanism can accept wafers processed by any process and send them for inspection through the material storage component, thus expanding the application scenarios of the wafer feeding mechanism.

[0061] Alternatively, the shortest distance between the first robotic arm 110 and the first material box 310 is equal to the shortest distance between the first robotic arm 110 and the second material box 320.

[0062] For example, a first robotic arm 110 is provided, and the distance between the first robotic arm 110 and the first material box 310 is equal to the distance between the first robotic arm 110 and the second material box 320.

[0063] For example, there are two first robotic arms 110, and the distance between one robotic arm and the first material box 310 is equal to the distance between the other robotic arm and the second material box 320.

[0064] This ensures that the time taken for the first robotic arm 110 to pick up the wafer to be tested from the first material box 310 and the time taken for the first robotic arm 110 to drop the tested wafer into the second material box 320 are kept consistent, thus achieving continuous and efficient operation of the wafer feeding mechanism and facilitating the wafer feeding mechanism to connect with other processing mechanisms through the material storage component.

[0065] According to some embodiments of this application, the wafer feeding mechanism further includes an isolation component for switching the connection state between the temporary storage bin group and the detection mechanism 600. The isolation component includes at least two first valves 410, which are respectively configured to correspond to the first working unit and the second working unit.

[0066] Optionally, the first valve 410 is one of a solenoid valve, an electric valve, or a pneumatic valve, so as to achieve convenient and precise control of the opening and closing of the first valve 410.

[0067] Thus, the wafer delivery mechanism can separate the atmospheric environment between the temporary storage bin group and the testing mechanism 600 through the first valve 410. That is, the testing mechanism 600 can maintain a vacuum environment for continuous operation, and the temporary storage bin group can independently switch between atmospheric and vacuum environments without affecting the internal operation of the testing mechanism 600.

[0068] Please see Figure 2 In some embodiments, the second robotic arm 120 is connected to the temporary storage bin 200, and the first valve 410 is disposed between the second robotic arm 120 and the detection mechanism 600. Exemplarily, two second robotic arms 120 are provided, each connected to a first working unit and a second working unit respectively. Two first valves 410 are correspondingly provided for each second robotic arm 120, and a second valve 420 is also provided between the two second robotic arms 120 to separate the first working unit and the second working unit.

[0069] Please see Figure 1 In some other embodiments, the second robotic arm 120 is connected to the detection mechanism 600, the second robotic arm 120 is maintained in a vacuum environment, and the first valve 410 is disposed between the temporary storage chamber 200 and the second robotic arm 120. It can be understood that in this case, the first valve 410 corresponds one-to-one with the temporary storage chamber 200, and the first valve 410 is disposed at the end of the temporary storage chamber 200 near the second robotic arm 120.

[0070] According to certain embodiments of this application, the isolation assembly further includes at least two third valves 430, which are respectively disposed corresponding to the first working unit and the second working unit.

[0071] Optionally, two third valves 430 are provided, with the two third valves 430 respectively located at the end of the first working unit away from the second robot arm 120 and the end of the second working unit away from the second robot arm 120.

[0072] Optionally, the third valve 430 is one of a solenoid valve, an electric valve, or a pneumatic valve, so as to achieve convenient and precise control of the opening and closing of the third valve 430.

[0073] Optionally, there are three or more temporary storage bins 200, and the number of third valves 430 is the same as the number of temporary storage bins 200 and is set in a one-to-one correspondence, so that each temporary storage bin 200 can independently switch between atmospheric environment and vacuum environment. That is, wafer transport between different temporary storage bins 200 can be carried out simultaneously, thereby improving the operating efficiency of the wafer delivery mechanism.

[0074] Thus, the temporary storage chamber group forms an independent chamber through the first valve 410 and the third valve 430 to achieve a buffer between the vacuum environment of the testing mechanism 600 and the atmospheric environment of other processes.

[0075] According to certain embodiments of this application, the wafer delivery structure further includes a pre-calibration component connected to a temporary storage bin group. The pre-calibration component is used to adjust the orientation of the wafer to be tested or the wafer that has been tested.

[0076] It is understood that the pre-registration component is connected to the staging warehouse group, including the pre-registration component being directly connected to the staging warehouse group or indirectly connected to the staging warehouse group.

[0077] Optionally, the pre-registration component includes at least two pre-registrants 500, with each of the at least two pre-registrants 500 corresponding to at least two temporary storage bins 200.

[0078] For example, the pre-alignment component includes two pre-aligners 500, which are disposed between the second robot arm 120 and the detection mechanism 600. The two pre-aligners 500 are used to adjust the orientation of the wafer to be tested and the wafer after inspection, respectively.

[0079] Therefore, the pre-alignment component can adjust the wafer orientation before the wafer enters the inspection mechanism 600 or after the wafer has completed inspection, thereby reducing the positioning time of the wafer in the inspection mechanism 600 or the positioning time after the wafer is transferred to other processes, thus improving the operating efficiency of the wafer defect inspection equipment.

[0080] Secondly, please refer to Figure 1 or Figure 2 This application provides a wafer defect detection device, which includes a detection mechanism 600 and a wafer feeding mechanism provided in any of the foregoing embodiments. The detection mechanism is used to detect wafers, and the wafer feeding mechanism is connected to the detection mechanism 600 via a second robotic arm 120. It is understood that the wafer defect detection device has all the beneficial effects of the aforementioned wafer feeding mechanism.

[0081] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application, and they should all be covered within the scope of the claims and specification of this application. In particular, as long as there is no structural conflict, the various technical features mentioned in the embodiments can be combined in any way. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A wafer feeding mechanism, characterized in that, include: The temporary storage unit group includes the first operating unit and the second operating unit; The first robotic arm is used to transport the wafers to be tested to the temporary storage bin group or to transfer the wafers that have been tested in the temporary storage bin group. The second robotic arm is used to transport wafers between the inspection mechanism and the temporary storage bin group, and the first working unit and the second working unit are connected side by side to the second robotic arm; The first working unit includes at least one temporary storage bin, and the second working unit includes at least one temporary storage bin. The wafer to be tested enters the testing mechanism sequentially through the first robotic arm, the temporary storage bin group, and the second robotic arm. The tested wafer is then sequentially sent out of the wafer feeding mechanism through the second robotic arm, the temporary storage bin group, and the first robotic arm.

2. The wafer feeding mechanism according to claim 1, characterized in that, The second robotic arm is provided in at least two parts, and the at least two second robotic arms can simultaneously put the wafer to be tested into the testing mechanism and send out the tested wafer. One part is set in accordance with the first working unit, and the other part is set in accordance with the second working unit.

3. The wafer feeding mechanism according to claim 1, characterized in that, One first robotic arm is provided, and the first robotic arm is located between the first working unit and the second working unit; or... The first robotic arm is provided in at least two parts, one part of which is set to correspond to the first working unit and the other part is set to correspond to the second working unit.

4. The wafer feeding mechanism according to claim 3, characterized in that, When the first robotic arm is provided, the distance between the first robotic arm and the first working unit is equal to the distance between the first robotic arm and the second working unit; When there are at least two first robotic arms, each first robotic arm is configured in a one-to-one correspondence with a temporary storage bin, and the interval between each first robotic arm and its corresponding temporary storage bin is equal.

5. The wafer feeding mechanism according to claim 1, characterized in that, The wafer feeding mechanism further includes a storage component, which is located on the side of the first robotic arm away from the temporary storage bin group. The storage component includes a first material box and a second material box arranged side by side.

6. The wafer feeding mechanism according to claim 5, characterized in that, The shortest distance between the first robotic arm and the first material box is equal to the shortest distance between the first robotic arm and the second material box.

7. The wafer feeding mechanism according to claim 1, characterized in that, The wafer feeding mechanism further includes an isolation component, which is used to switch the connection state between the temporary storage bin group and the testing mechanism. The isolation component includes at least two first valves, which are respectively configured to correspond to the first working unit and the second working unit.

8. The wafer feeding mechanism according to claim 7, characterized in that, The second robotic arm is connected to the detection mechanism, and the first valve is located between the second robotic arm and the temporary storage bin; or, The second robotic arm is located inside the temporary storage chamber, and the first valve is located between the second robotic arm and the detection mechanism.

9. The wafer feeding mechanism according to claim 7, characterized in that, The isolation assembly also includes at least two third valves, each of which is configured in a one-to-one correspondence with at least two temporary storage chambers. The third valves are located at the end of the temporary storage chamber furthest from the second robotic arm.

10. A wafer defect detection device, characterized in that, include: Testing facilities, used for inspecting wafers; The wafer feeding mechanism as described in any one of claims 1 to 9, wherein the second robotic arm is connected to the detection mechanism.

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