Electronic chip packaging structure

Abstract

The utility model discloses an electronic chip packaging structure which comprises a mounting groove plate, a packaging plate is arranged at the top of the mounting groove plate, two sides of the surface of the packaging plate are communicated with air inlet pipes for ventilation, a chip main body is arranged in an inner cavity of the mounting groove plate, and heat pipes which are uniformly distributed are arranged at the bottom of the chip main body. Cooling fins are fixedly mounted at the bottoms of the heat pipes, and a cleaning mechanism is arranged in an inner cavity of the mounting groove plate. The cleaning mechanism is arranged to clean the surface of the heat pipe, dust or other impurities can be prevented from being accumulated on the surface of the heat pipe in the using process, the heat conduction performance of the heat pipe is prevented from being influenced by the impurities, the purpose of improving the heat dissipation effect of the chip body is achieved, the use performance of the chip body is prevented from being influenced by untimely heat dissipation, and the service life of the chip body is prolonged. Meanwhile, the problems that dust and impurities are attached to the surface of the heat pipe after the heat pipe is used for a long time, the heat conduction performance of the heat pipe is affected, heat dissipation of the chip is not smooth, the temperature of the chip is too high, and the use performance of the chip is affected are solved.

Description

Technical Field

[0001] This utility model relates to the field of chip packaging technology, specifically to an electronic chip packaging structure. Background Technology

[0002] Electronic chip packaging is the technology of encapsulating, protecting, and connecting a chip to external circuits. It's like putting a "coat" on the chip, physically protecting it from damage caused by the external environment (such as moisture, dust, and physical impact). The packaging process involves fixing the chip onto a specific packaging substrate and establishing electrical connections between the chip's internal circuitry and external pins using metal leads or solder balls, ensuring the chip can interact normally with circuit boards and other electronic components. Furthermore, good packaging design considers performance requirements such as heat dissipation, thereby improving the chip's stability, reliability, and applicability in various electronic devices.

[0003] Regarding the above-mentioned and existing related technologies, the inventors believe that the following defects often exist: some high-performance electronic chips require heat pipes to quickly dissipate the heat they generate during use. However, after prolonged use, dust and impurities will adhere to the surface of the heat pipes, which will affect their thermal conductivity, resulting in poor heat dissipation of the chip and causing the chip temperature to be too high, thus affecting the chip's performance. Therefore, an electronic chip packaging structure is proposed to address the above problems. Utility Model Content

[0004] The purpose of this invention is to provide an electronic chip packaging structure that has the advantages of cleaning the heat pipe surface and improving the heat dissipation effect of the chip. It solves the problem that after long-term use, dust and impurities will adhere to the surface of the heat pipe, which will affect its thermal conductivity, resulting in poor heat dissipation of the chip, and thus causing the chip temperature to be too high, affecting the chip's performance.

[0005] To achieve the above objectives, this utility model provides the following technical solution: an electronic chip packaging structure, including a mounting slot plate, a packaging plate disposed on the top of the mounting slot plate, air inlet pipes for ventilation connected to both sides of the surface of the packaging plate, a chip body disposed in the inner cavity of the mounting slot plate, heat pipes uniformly distributed at the bottom of the chip body, heat sinks fixedly mounted at the bottom of the heat pipes, a cleaning mechanism disposed in the inner cavity of the mounting slot plate, a heat dissipation port opened at the bottom of the mounting slot plate, a heat dissipation cylinder communicating with the heat dissipation port fixedly mounted at the bottom of the mounting slot plate, and a heat dissipation motor disposed in the inner cavity of the heat dissipation cylinder.

[0006] The effect achieved by the above components is as follows: by setting up a cleaning mechanism to clean the surface of the heat pipe, it is possible to avoid the accumulation of dust or other impurities on the surface of the heat pipe during use, prevent impurities from affecting its thermal conductivity, thereby improving the heat dissipation effect on the chip body and avoiding the impact on the performance of the chip body due to untimely heat dissipation.

[0007] Preferably, the cleaning mechanism includes a collar fitted onto the surface of the heat pipe, the inner surface of the collar being provided with bristles for cleaning, a reinforcing rod fixedly installed between the collars, a side rod fixedly installed on the outer side of the collar, a transmission plate fixedly installed at the bottom of the side rod, a protruding rod fixedly installed at the bottom of the fan blade at the output end of the cooling motor, two connecting rods fixedly installed on the surface of the protruding rod, and a transmission block for pressing the transmission plate fixedly installed at the end of the connecting rod.

[0008] The aforementioned components achieve the following effects: During chip use, a certain amount of heat is generated. The heat pipe conducts the heat generated by the chip and then dissipates it into the air inside the mounting slot through the heat sink. The cooling motor exhausts the air and heat from the mounting slot through the heat dissipation vent and heat sink. External air enters the packaging board and the mounting slot through the air intake pipe. When the cooling motor rotates, the fan blades at the output end of the cooling motor drive the cam to rotate. The cam drives the connecting rod and the transmission block to rotate together. The rotating transmission block presses against the inclined surface at the bottom of the transmission plate and pushes the transmission plate upward. The transmission plate drives the side rod, collar, and reinforcing rod to move upward together. When the surface of the transmission block separates from the bottom of the transmission plate, the spring force causes the transmission plate to spring downward. The transmission plate then drives the side rod, collar, and reinforcing rod to move downward, thereby causing the collar to move up and down on the surface of the heat pipe. The bristles on the inside of the collar clean the surface of the heat pipe, preventing the accumulation of dust or other impurities on the surface of the heat pipe during use, which would affect its thermal conductivity.

[0009] Preferably, a side plate is fixedly installed on the outer side of the transmission plate, and a spring is fixedly installed on the top of the side plate, with the end face of the spring being fixedly connected to the bottom of the mounting groove plate.

[0010] The effect achieved by the above components is that by setting the side plate and the spring to work together to spring open the transmission plate, the springing force is applied to the collar, which facilitates the reset of the collar.

[0011] Preferably, the bottom of the transmission plate is inclined, and the surface of the transmission block is arc-shaped.

[0012] Preferably, the packaging plate is fixedly mounted on the top of the mounting slot plate by mounting bolts, and a support plate for supporting the chip body is fixedly mounted in the inner cavity of the mounting slot plate.

[0013] The effect achieved by the above components is to improve the stability of the chip body after it is packaged in the inner cavity of the mounting slot by setting a support plate for mounting and supporting the chip body.

[0014] Preferably, the bottom of the mounting groove plate is fixedly equipped with four support legs.

[0015] The effect achieved by the above components is to improve the support stability of the mounting plate by setting four support legs to provide all-round support for the bottom of the mounting plate.

[0016] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0017] This invention cleans the surface of the heat pipe by setting a cleaning mechanism, which can prevent dust or other impurities from accumulating on the surface of the heat pipe during use, and prevent impurities from affecting its thermal conductivity. This improves the heat dissipation effect on the chip body and avoids affecting the performance of the chip body due to untimely heat dissipation. At the same time, it solves the problem that dust and impurities will adhere to the surface of the heat pipe after long-term use, which will affect its thermal conductivity, resulting in poor heat dissipation of the chip, and thus causing the chip temperature to be too high, affecting the performance of the chip. Attached Figure Description

[0018] Figure 1 This is a three-dimensional view of the structure of this utility model;

[0019] Figure 2 This is a schematic diagram of the main structure of the chip of this utility model;

[0020] Figure 3 This is a schematic diagram of the internal structure of the mounting slot plate of this utility model;

[0021] Figure 4 This is a schematic diagram of the cleaning mechanism of this utility model.

[0022] In the diagram: 1. Mounting slot plate; 2. Cleaning mechanism; 201. Collar; 202. Reinforcing rod; 203. Side rod; 204. Transmission plate; 205. Side plate; 206. Spring; 207. Protruding rod; 208. Connecting rod; 209. Transmission block; 3. Support leg; 4. Encapsulation plate; 5. Air inlet pipe; 6. Chip body; 7. Support plate; 8. Heat pipe; 9. Heat sink; 10. Heat dissipation port; 11. Heat dissipation cylinder; 12. Heat dissipation motor. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] Please see Figure 1-4An electronic chip packaging structure includes a mounting slot 1, a packaging plate 4 on the top of the mounting slot 1, air inlet pipes 5 for ventilation on both sides of the surface of the packaging plate 4, a chip body 6 in the inner cavity of the mounting slot 1, heat pipes 8 evenly distributed at the bottom of the chip body 6, heat sinks 9 fixedly installed at the bottom of the heat pipes 8, a cleaning mechanism 2 in the inner cavity of the mounting slot 1, a heat dissipation port 10 at the bottom of the mounting slot 1, a heat dissipation cylinder 11 communicating with the heat dissipation port 10 fixedly installed at the bottom of the mounting slot 1, and a heat dissipation motor 12 in the inner cavity of the heat dissipation cylinder 11.

[0025] Specifically, the cleaning mechanism 2 includes a collar 201 fitted onto the surface of the heat pipe 8. The inner surface of the collar 201 is provided with bristles for cleaning. A reinforcing rod 202 is fixedly installed between the collars 201. A side rod 203 is fixedly installed on the outer side of the collar 201. A transmission plate 204 is fixedly installed at the bottom of the side rod 203. A protruding rod 207 is fixedly installed at the bottom of the fan blade at the output end of the cooling motor 12. Two connecting rods 208 are fixedly installed on the surface of the protruding rod 207. A transmission block 209 for pressing the transmission plate 204 is fixedly installed at the end of the connecting rod 208.

[0026] During use, the chip body 6 generates heat. The heat is dissipated by the heat pipe 8 and then by the heat sink 9 into the air inside the mounting slot 1. The cooling motor 12 exhausts the air and heat from the mounting slot 1 through the heat dissipation port 10 and the heat sink 11. External air enters the packaging board 4 and the mounting slot 1 through the air inlet pipe 5. When the cooling motor 12 rotates, the fan blades at the output end of the cooling motor 12 drive the convex rod 207 to rotate. The convex rod 207 drives the connecting rod 208 and the transmission block 209 to rotate together. The rotating transmission block 209 rotates at the bottom of the transmission plate 204. The inclined plane squeezes and pushes the transmission plate 204 upward. The transmission plate 204 drives the side rod 203, collar 201 and reinforcing rod 202 to move upward together. When the surface of the transmission block 209 separates from the bottom of the transmission plate 204, the transmission plate 204 is pushed downward by the elastic force of the spring 206. The transmission plate 204 then drives the side rod 203, collar 201 and reinforcing rod 202 to move downward, so that the collar 201 moves up and down on the surface of the heat pipe 8. The bristles on the inside of the collar 201 clean the surface of the heat pipe 8 to prevent dust or other impurities from accumulating on the surface of the heat pipe 8 during use, which would affect its thermal conductivity.

[0027] Specifically, a side plate 205 is fixedly installed on the outer side of the transmission plate 204, and a spring 206 is fixedly installed on the top of the side plate 205. The end face of the spring 206 is fixedly connected to the bottom of the mounting slot plate 1.

[0028] The side plate 205 and the spring 206 work together to spring open the transmission plate 204, thereby applying a springing force to the collar 201, which facilitates the reset of the collar 201.

[0029] Specifically, the bottom of the transmission plate 204 is inclined, and the surface of the transmission block 209 is arc-shaped.

[0030] Specifically, the packaging board 4 is fixedly installed on the top of the mounting slot 1 by mounting bolts, and the inner cavity of the mounting slot 1 is fixedly installed with a support plate 7 for supporting the chip body 6.

[0031] The support plate 7 is used to install and support the chip body 6, thereby improving the stability of the chip body 6 after it is packaged in the inner cavity of the mounting slot plate 1.

[0032] Specifically, four support legs 3 are fixedly installed at the bottom of the mounting plate 1.

[0033] Four support legs 3 are used to provide all-round support for the bottom of the mounting slot plate 1, thereby improving the support stability of the mounting slot plate 1.

[0034] During use, the chip body 6 generates heat. The heat is dissipated by the heat pipe 8 and then by the heat sink 9 into the air inside the mounting slot 1. The cooling motor 12 exhausts the air and heat from the mounting slot 1 through the heat dissipation port 10 and the heat sink 11. External air enters the packaging board 4 and the mounting slot 1 through the air inlet pipe 5. When the cooling motor 12 rotates, the fan blades at the output end of the cooling motor 12 drive the convex rod 207 to rotate. The convex rod 207 drives the connecting rod 208 and the transmission block 209 to rotate together. The moving transmission block 209 presses against the inclined surface at the bottom of the transmission plate 204 and pushes the transmission plate 204 upward. The transmission plate 204 drives the side rod 203, the collar 201 and the reinforcing rod 202 to move upward together. When the surface of the transmission block 209 separates from the bottom of the transmission plate 204, the transmission plate 204 is pushed downward by the elastic force of the spring 206. The transmission plate 204 then drives the side rod 203, the collar 201 and the reinforcing rod 202 to move downward, thereby causing the collar 201 to move up and down on the surface of the heat pipe 8. The bristles on the inside of the collar 201 clean the surface of the heat pipe 8.

[0035] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An electronic chip packaging structure, comprising a mounting slot (1), characterized in that: The top of the mounting slot (1) is provided with an encapsulation plate (4), and both sides of the surface of the encapsulation plate (4) are connected to air inlet pipes (5) for ventilation. The inner cavity of the mounting slot (1) is provided with a chip body (6), and the bottom of the chip body (6) is provided with uniformly distributed heat pipes (8). The bottom of the heat pipes (8) is fixedly installed with heat sinks (9). The inner cavity of the mounting slot (1) is provided with a cleaning mechanism (2). The bottom of the mounting slot (1) is provided with a heat dissipation port (10), and the bottom of the mounting slot (1) is fixedly installed with a heat dissipation cylinder (11) communicating with the heat dissipation port (10). The inner cavity of the heat dissipation cylinder (11) is provided with a heat dissipation motor (12).

2. The electronic chip packaging structure according to claim 1, characterized in that: The cleaning mechanism (2) includes a collar (201) sleeved on the surface of the heat pipe (8). The inner surface of the collar (201) is provided with bristles for cleaning. A reinforcing rod (202) is fixedly installed between the collars (201). A side rod (203) is fixedly installed on the outer side of the collar (201). A transmission plate (204) is fixedly installed at the bottom of the side rod (203). A protruding rod (207) is fixedly installed at the bottom of the fan blade at the output end of the heat dissipation motor (12). Two connecting rods (208) are fixedly installed on the surface of the protruding rod (207). A transmission block (209) for pressing the transmission plate (204) is fixedly installed at the end of the connecting rod (208).

3. The electronic chip packaging structure according to claim 2, characterized in that: A side plate (205) is fixedly installed on the outer side of the transmission plate (204), and a spring (206) is fixedly installed on the top of the side plate (205). The end face of the spring (206) is fixedly connected to the bottom of the mounting slot plate (1).

4. The electronic chip packaging structure according to claim 2, characterized in that: The bottom of the transmission plate (204) is inclined, and the surface of the transmission block (209) is arc-shaped.

5. The electronic chip packaging structure according to claim 1, characterized in that: The encapsulation plate (4) is fixedly installed on the top of the mounting slot plate (1) by mounting bolts, and a support plate (7) for supporting the chip body (6) is fixedly installed in the inner cavity of the mounting slot plate (1).

6. The electronic chip packaging structure according to claim 1, characterized in that: The bottom of the mounting slot plate (1) is fixedly equipped with four support legs (3).

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