Electronic product shell production injection molding machine

Abstract

The utility model discloses an electronic product shell production injection molding machine, and relates to the technical field of electronic product shell production, in particular to an electronic product shell production injection molding machine which comprises a lower mold and an upper mold, the top of the lower mold is fixedly connected with a positioning sliding column, and the lower mold and the upper mold are both provided with inner mold cavities capable of being closed. The upper die is vertically connected to the positioning sliding column in a sliding mode, an upper material pushing mechanism capable of moving upwards to push discharging is movably installed at the bottom of an inner die cavity of the lower die, a lower material pushing mechanism capable of moving downwards to push discharging is movably installed at the top of an inner die cavity of the upper die, and a linkage mechanism is connected between the upper die and the lower material pushing mechanism. And the lower material pushing mechanism and the upper material pushing mechanism push materials in sequence. Through movement of the upper mold, under the action of the upper pushing mechanism, the lower pushing mechanism and the linkage mechanism, the effect that the lower mold and the upper mold can be demolded is achieved, and then the effect of rapid discharging is achieved.

Description

TECHNICAL FIELD

[0001] The utility model relates to electronic product shell production technical field, concretely is a kind of electronic product shell production injection molding machine. BACKGROUND

[0002] Injection mold is a tool for producing plastic products, and is also a tool for giving plastic products complete structure and accurate size. Injection molding is a processing method used when mass-producing some parts with complex shapes. Specifically, after heated and melted plastic is injected into a mold cavity by an injection molding machine at high pressure, the molded product is obtained after cooling and solidification. Most injection molds include a fixed mold and a movable mold. The movable mold moves to combine with the fixed mold, and then hot and melted plastic material is injected into the space after the molds are combined. After the plastic material cools and solidifies, the finished product is obtained. After the finished product is molded, the movable mold moves away, and then the finished product is removed. To ensure that the finished product is not bumped when it is just removed, and thus the integrity of the finished product is not affected, the staff often removes the finished product from the fixed mold one by one during demolding. This seriously reduces the efficiency of injection molding products, and during the long labor process of the staff, the finished product may be dropped, which may damage the finished product. Therefore, we propose an electronic product shell production injection molding machine. SUMMARY

[0003] The utility model provides a kind of electronic product shell production injection molding machine, solve the problem raised in above background art.

[0004] To achieve the above purpose, the utility model realizes the following technical scheme: an electronic product shell production injection molding machine, including lower mould and upper mould, the top of the lower mould is fixedly connected with locating slide column, and the lower mould and the upper mould are both provided with inner mold cavity that can be combined, the upper mould is vertically slidably connected on the locating slide column, the bottom of the lower mould inner mold cavity is movably installed with the upper pushing mechanism that can be pushed out of material, the top of the upper mould inner mold cavity is movably installed with the lower pushing mechanism that can be pushed out of material, and the upper mould and the lower pushing mechanism are connected with linkage mechanism, with the upper movement of the upper mould, the lower pushing mechanism and the upper pushing mechanism successively push material, and the sidewall of the inner mold cavity of the lower mould and the upper mould is fixedly installed with semiconductor refrigeration assembly, and the semiconductor refrigeration assembly on the lower mould and the upper mould can be electrically connected.

[0005] Optionally, the semiconductor refrigeration assembly is arranged in the form of a ring at the sidewall of the inner mold cavity, and the bottom end of the semiconductor refrigeration assembly on the lower mould extends out of the bottom of the lower mould, and the top end of the semiconductor refrigeration assembly on the upper mould extends out of the top of the lower mould. When the lower mould and the upper mould are combined, the semiconductor refrigeration assemblies on the lower mould and the upper mould are electrically connected.

[0006] Optionally, the top end of the positioning slide column is fixedly connected with a top plate, the middle of the upper mold is fixedly connected with a material guide pipe, the top end of the material guide pipe extends out of the top plate, and the top of the upper mold is fixedly connected with an electric push rod, and the top end of the electric push rod is fixed with the bottom of the top plate.

[0007] Optionally, the upper pushing mechanism comprises an upper pushing column, a second spring and an upper pushing support, the upper pushing support is in the shape of a square box, the upper pushing column is fixedly connected at the bottom of the upper pushing support, the upper pushing column is movably connected with the upper mold and extends into the inner mold cavity of the upper mold, and the second spring is fixedly connected at the bottom of the upper pushing support, and the bottom end of the second spring is fixed with the top of the upper mold.

[0008] Optionally, the positioning slide column is fixedly connected with a square-shaped abutting plate, the abutting plate is directly above the upper pushing support, and the top of the upper pushing support can be in contact with the bottom of the abutting plate.

[0009] Optionally, the lower pushing mechanism comprises a lower pushing support and a lower pushing column, the lower pushing support is below the lower mold, the top of the lower pushing support is fixedly connected with the lower pushing column, and the lower pushing column is movably connected with the lower mold and extends into the inner mold cavity of the lower mold.

[0010] Optionally, the bottom of the lower mold is fixedly connected with a fixing column, the bottom end of the fixing column is fixedly connected with a bottom plate, and the lower pushing support is between the bottom plate and the lower mold.

[0011] Optionally, the linkage mechanism comprises a linkage block, a linkage sleeve rod, a linkage rod and a third spring, the linkage block is fixedly connected at the side of the upper mold, the bottom of the upper mold is fixedly connected with the linkage rod, the linkage sleeve rod is fixedly connected at the top of the lower pushing support, the bottom end of the linkage rod extends into the inside of the linkage sleeve rod and is movably connected therewith, the outside of one end of the linkage rod extending into the linkage sleeve rod is fixedly connected with the third spring, and one end of the third spring is fixed with the end of the linkage sleeve rod.

[0012] The utility model has the following beneficial effects:

[0013] 1. The electronic product shell production injection molding machine, through the movement of the upper mold, and under the action of the upper pushing mechanism, the lower pushing mechanism and the linkage mechanism, the lower mold and the upper mold can be demolded, and the rapid discharging effect is realized, so that the demolding is more convenient.

[0014] 2. The electronic product shell production injection molding machine, through the movement of the upper mold, the semiconductor refrigeration assembly can be electrically connected, the intelligent control of the inner mold cavity cooling effect is realized, and the first time connection can be realized after the mold is closed, the rapid cooling effect is realized, so that the injection molding is more convenient. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 is a structure schematic view of the utility model;

[0016] Figure 2 is a structure schematic view of the utility model;

[0017] Figure 3 is a structure schematic view of the utility model;

[0018] Figure 4 is a structure schematic view of the utility model;

[0019] Figure 5 is a structure schematic view of the utility model;

[0020] Figure 6 is a structure schematic view of the utility model;

[0021] Figure 7 is a structure schematic view of the utility model.

[0022] In the figure: 1, lower mould; 2, upper mould; 3, positioning slide column; 4, material guide pipe; 5, electric push rod; 6, top plate; 7, abutment plate; 8, linkage block; 9, first spring; 10, fixed column; 11, bottom plate; 12, lower pushing material support; 13, lower pushing material column; 14, linkage sleeve rod; 15, linkage rod; 16, upper pushing material column; 17, second spring; 18, upper pushing material support; 19, semiconductor refrigeration assembly; 20, third spring. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the utility model.

[0024] Please refer to Figures 1 to 6The utility model provides an electronic product shell production injection molding machine, including lower mould 1 and upper mould 2, the top fixedly connected with locating slide column 3 of lower mould 1, and the lower mould 1 and upper mould 2 are all set up the inner mould cavity that can carry out the mould, and upper mould 2 is vertically slidingly connected on locating slide column 3, and upper mould 2 can carry out the lifting of fixed track on locating slide column 3, realizes the effect of moulding and opening mould, its characterized in that: the bottom of lower mould 1 inner mould cavity movably installs the upper pushing material mechanism of upper moving and pushing discharge, and the effect of upper mould 2 demoulding can be realized through upper pushing material mechanism, and the top of upper mould 2 inner mould cavity movably installs the lower pushing material mechanism of lower moving and pushing discharge, and the effect of lower mould 1 demoulding can be realized through lower pushing material mechanism, and upper mould 2 and lower pushing material mechanism are connected with linkage mechanism, and through linkage mechanism, the effect that lower mould 1 and upper mould 2 can all carry out demoulding along with the opening of upper mould 2 can be realized, and along with the upper movement of upper mould 2, lower pushing material mechanism and upper pushing material mechanism push material in succession, and then make lower mould 1 and upper mould 2 can all carry out demoulding when the opening of upper mould 2, to make its use more convenient, and the sidewall of lower mould 1 and upper mould 2 inner mould cavity is fixedly installed with semiconductor refrigeration assembly 19, and the effect that the inner mould cavity is cooled down can be realized through semiconductor refrigeration assembly 19, and one end of semiconductor refrigeration assembly 19 is connected with external power supply assembly, and it is prior art, and here is not repeated, and semiconductor refrigeration assembly 19 on lower mould 1 and upper mould 2 can be electrically connected, and the electric connection is realized through the insertion of semiconductor refrigeration assembly 19, to drive semiconductor refrigeration assembly 19 to operate, and can be connected in time after moulding, reaches the effect of rapid cooling, to make its injection more convenient.

[0025] Please refer to Figures 1 to 6 Semiconductor refrigeration assembly 19 is arranged at the sidewall of the inner mould cavity in a surrounding shape, and the bottom end of semiconductor refrigeration assembly 19 on the lower mould 1 extends out of the bottom of the lower mould 1, and the top end of semiconductor refrigeration assembly 19 on the upper mould 2 extends out of the top of the lower mould 1, and semiconductor refrigeration assembly 19 on the lower mould 1 and the upper mould 2 is electrically connected just after the moulding of the lower mould 1 and the upper mould 2, so that it can be connected in time after moulding, reaches the effect of rapid cooling, to make its injection more convenient, and the heat-absorbing part is in the inner mould cavity, and the heat-emitting part is outside, and it is prior art, and here is not repeated.

[0026] Please refer to Figures 1 to 6The top of the positioning slide column 3 is fixedly connected to the top plate 6, and the middle of the upper mold 2 is fixedly connected to the guide tube 4. The guide tube 4 can inject injection material between the lower mold 1 and the upper mold 2. The top of the guide tube 4 extends out of the top plate 6, and an electric push rod 5 is fixedly connected to the top of the upper mold 2. The top of the electric push rod 5 is fixed to the bottom of the top plate 6. Under the push of the electric push rod 5, the upper mold 2 can achieve the effect of lifting and lowering. The top of the lower mold 1 and the outer ring of the bottom of the upper mold 2 are fixedly connected to the first spring 9. Under the action of the elastic force of the first spring 9, the upper mold 2 can be assisted in opening the mold.

[0027] Please see Figures 1 to 6 The upper pusher mechanism includes an upper pusher column 16, a second spring 17, and an upper pusher bracket 18. The upper pusher bracket 18 is square-shaped. The upper pusher column 16 is fixedly connected to the bottom of the upper pusher bracket 18. The upper pusher column 16 is movably connected to the upper mold 2 and extends into the inner mold cavity of the upper mold 2. The second spring 17 is fixedly connected to the bottom of the upper pusher bracket 18. The bottom end of the second spring 17 is fixed to the top of the upper mold 2. Under the push of the upper pusher bracket 18, the upper pusher column 16 can move down to push the material. Under the action of the elastic force of the second spring 17, the upper pusher column 16 can automatically return to its original position.

[0028] Please see Figures 1 to 6 A square-shaped abutment plate 7 is fixedly connected to the positioning slide column 3. The abutment plate 7 is located directly above the upper pusher bracket 18, and the top of the upper pusher bracket 18 can contact the bottom of the abutment plate 7. After the upper mold 2 moves upward and drives the upper pusher bracket 18 to contact the abutment plate 7, the upper pusher column 16 can move relative to the upper mold 2 and then push the material.

[0029] Please see Figures 1 to 5 The lower pusher mechanism includes a lower pusher bracket 12 and a lower pusher column 13. The lower pusher bracket 12 is located below the lower mold 1. The lower pusher column 13 is fixedly connected to the top of the lower pusher bracket 12. The lower pusher column 13 is movably connected to the lower mold 1 and extends into the inner mold cavity of the lower mold 1. Driven by the lower pusher bracket 12, the lower pusher column 13 can move upward and push the material.

[0030] Please see Figures 1 to 7 The bottom of the lower mold 1 is fixedly connected to a fixed column 10, and the bottom end of the fixed column 10 is fixedly connected to a base plate 11. The lower pusher bracket 12 is located between the base plate 11 and the lower mold 1.

[0031] Please see Figures 1 to 7The linkage mechanism includes a linkage block 8, a linkage sleeve 14, a linkage rod 15, and a third spring 20. The linkage block 8 is fixedly connected to the side of the upper mold 2, and under the drive of the upper mold 2, the linkage block 8 can move up and down accordingly. The linkage rod 15 is fixedly connected to the bottom of the upper mold 2, and under the drive of the linkage block 8, the linkage rod 15 can move up and down accordingly. The linkage sleeve 14 is fixedly connected to the top of the lower pusher bracket 12, and under the drive of the linkage sleeve 14, the lower pusher bracket 12 can move up and down accordingly. The bottom end of the linkage rod 15 extends into the linkage sleeve 14. The internal mechanism is connected to the linkage sleeve 14 and the linkage rod 15, allowing them to move relative to each other. A third spring 20 is fixedly connected to the outer side of one end of the linkage rod 15 that extends into the linkage sleeve 14. One end of the third spring 20 is fixed to the end of the linkage sleeve 14. When the upper mold 2 moves upward, the linkage sleeve 14 and the linkage rod 15 move relative to each other. After the third spring 20 returns to its original position, the linkage rod 15 can continue to pull the linkage sleeve 14 upward, and drive the lower pusher column 13 upward through the lower pusher bracket 12 to achieve the effect of pushing the material upward for discharge.

[0032] In summary, this injection molding machine for producing electronic product casings operates by using an electric push rod 5 to move the upper mold 2 downwards, allowing it to close with the lower mold 1. As the upper mold 2 moves downwards, the linkage block 8 drives the linkage rod 15 downwards. At this time, the linkage sleeve 14 and the linkage rod 15 move relative to each other, causing the third spring 20 to stretch. This stretches the lower pusher bracket 12, which in turn pulls the lower pusher column 13 to abut against the inner cavity of the lower mold 1. After the lower mold 1 and upper mold 2 close, Material can be injected through the guide tube 4. Then, when the upper mold 2 moves upward, its linkage sleeve 14 and linkage rod 15 move relative to each other. After the third spring 20 returns to its original state, the linkage rod 15 can continue to pull the linkage sleeve 14 to move upward. And through the lower pusher bracket 12, it drives the lower pusher column 13 to move upward to achieve the effect of pushing the material out upward. After the upper pusher bracket 18 contacts the abutment plate 7, the upper pusher column 16 can abut against the upper mold 2 to move and achieve the effect of pushing the material out downward.

[0033] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model; the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. In addition, unless otherwise explicitly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances. Moreover, the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0034] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An injection molding machine for producing electronic product casings, comprising a lower mold (1) and an upper mold (2), wherein a positioning slide post (3) is fixedly connected to the top of the lower mold (1), and both the lower mold (1) and the upper mold (2) are provided with inner mold cavities for mold closing, and the upper mold (2) is vertically slidably connected to the positioning slide post (3), characterized in that: The bottom of the inner cavity of the lower mold (1) is movably equipped with an upward pushing mechanism that can move upward to push out material, and the top of the inner cavity of the upper mold (2) is movably equipped with a downward pushing mechanism that can move downward to push out material. A linkage mechanism is connected between the upper mold (2) and the downward pushing mechanism. As the upper mold (2) moves upward, the downward pushing mechanism and the upward pushing mechanism push out material in sequence. A semiconductor cooling component (19) is fixedly installed in the side wall of the inner cavity of the lower mold (1) and the upper mold (2). The semiconductor cooling component (19) on the lower mold (1) and the upper mold (2) can be electrically plugged in.

2. The injection molding machine for producing electronic product casings according to claim 1, characterized in that: The semiconductor cooling component (19) is arranged in a ring shape on the side wall of the inner mold cavity, and the bottom end of the semiconductor cooling component (19) on the lower mold (1) extends out of the bottom of the lower mold (1), and the top end of the semiconductor cooling component (19) on the upper mold (2) extends out of the top of the lower mold (1). When the lower mold (1) and the upper mold (2) are closed, the semiconductor cooling components (19) on the lower mold (1) and the upper mold (2) are electrically connected.

3. The injection molding machine for producing electronic product casings according to claim 2, characterized in that: The top of the positioning slide column (3) is fixedly connected to a top plate (6), and the middle of the upper mold (2) is fixedly connected to a guide tube (4). The top of the guide tube (4) extends out of the top plate (6), and an electric push rod (5) is fixedly connected to the top of the upper mold (2). The top of the electric push rod (5) is fixed to the bottom of the top plate (6).

4. The injection molding machine for producing electronic product casings according to claim 3, characterized in that: The upper pusher mechanism includes an upper pusher column (16), a second spring (17), and an upper pusher bracket (18). The upper pusher bracket (18) is square-shaped. The upper pusher column (16) is fixedly connected to the bottom of the upper pusher bracket (18). The upper pusher column (16) is movably connected to the upper mold (2) and extends into the inner mold cavity of the upper mold (2). The second spring (17) is fixedly connected to the bottom of the upper pusher bracket (18). The bottom end of the second spring (17) is fixed to the top of the upper mold (2).

5. The injection molding machine for producing electronic product casings according to claim 4, characterized in that: A square-shaped abutment plate (7) is fixedly connected to the positioning slide column (3). The abutment plate (7) is located directly above the upper pusher bracket (18), and the top of the upper pusher bracket (18) can contact the bottom of the abutment plate (7).

6. The injection molding machine for producing electronic product casings according to claim 5, characterized in that: The lower pusher mechanism includes a lower pusher bracket (12) and a lower pusher column (13). The lower pusher bracket (12) is located below the lower mold (1). The lower pusher column (13) is fixedly connected to the top of the lower pusher bracket (12). The lower pusher column (13) is movably connected to the lower mold (1) and extends into the inner mold cavity of the lower mold (1).

7. The injection molding machine for producing electronic product casings according to claim 6, characterized in that: The bottom of the lower mold (1) is fixedly connected to a fixed column (10), and the bottom end of the fixed column (10) is fixedly connected to a base plate (11), with its lower pusher bracket (12) located between the base plate (11) and the lower mold (1).

8. The injection molding machine for producing electronic product casings according to claim 7, characterized in that: The linkage mechanism includes a linkage block (8), a linkage sleeve (14), a linkage rod (15), and a third spring (20). The linkage block (8) is fixedly connected to the side of the upper mold (2). The bottom of the upper mold (2) is fixedly connected to the linkage rod (15). The linkage sleeve (14) is fixedly connected to the top of the lower pusher bracket (12). The bottom end of the linkage rod (15) extends into the interior of the linkage sleeve (14) and is movably connected thereto. The outer side of the end of the linkage rod (15) extending into the linkage sleeve (14) is fixedly connected to the third spring (20). One end of the third spring (20) is fixed to the end of the linkage sleeve (14).

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