Assembly with electronic component

Abstract

The utility model provides an assembly with an electronic component. The assembly comprises a coiled material belt, a plurality of reinforcing plates arranged at intervals are arranged on the material belt in the belt-shaped extension direction of the assembly, a circuit structure is fixed to each reinforcing plate, and electronic components are welded to the circuit structures. The assembly is in a strip shape with a plurality of circuit structures and can be conveniently and directly input into an injection molding machine for injection molding, bases can be respectively formed below the circuit structures and the reinforcing plates only through one-time injection molding, the injection molding frequency is low, and the production efficiency can be effectively improved. And then the injection-molded component is divided to form independent electronic components, and the reinforcing plate is arranged in the plastic base of each electronic component, so that the structural strength is high. The base in the electronic component can be used as the base of the voice coil motor, and the electronic component can be a Hall element and the like and is used for realizing the closed loop function of the voice coil motor in the camera module.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of electronic components, in particular to a kind of assembly with electronic components. BACKGROUND

[0002] The base of the closed-loop voice coil motor in the camera module of mobile terminal equipment usually needs to be provided with Hall element, capacitor, coil and driving chip and other electronic components to realize the corresponding closed-loop function. And due to the continuous miniaturization of mobile terminal equipment, the size of the base of the corresponding voice coil motor is also small, and the current production process is more complex for the production process of the base with various electronic components, and the production process efficiency is low.

[0003] The existing related technology such as Chinese patent CN 109287074 A discloses a production process of a base with electronic components, which forms a metal circuit by molding, and completes the integral molding of the whole base by twice injection molding and once SMT process, avoiding the assembly process between the electronic components and the plastic parts. However, the process needs to adopt multiple injection molding.

[0004] And the batch industrialized production and manufacturing of the above-mentioned camera module base usually need the cooperation of different manufacturers such as circuit manufacturers and injection molding manufacturers, and how to improve the coordination efficiency between different manufacturers is also crucial to improve the production efficiency of products. UTILITY MODEL CONTENT

[0005] The utility model aims at providing a kind of assembly with electronic components, with the advantage of improving production efficiency.

[0006] In order to achieve the above purpose, the solution of the utility model is:

[0007] A kind of assembly with electronic components, the assembly is belt structure, and can be rolled up;

[0008] The assembly includes a rolled material belt, and the material belt has a plurality of reinforcing plates arranged at intervals along the belt extension direction of the assembly, each reinforcing plate is fixed with a circuit structure, and the circuit structure is welded with electronic components;

[0009] The circuit structure is a circuit structure made of liquid metal, a circuit structure made of conductive silver paste or an FPC circuit structure.

[0010] Further, the material belt further includes two connecting belts, and each reinforcing plate is connected and arranged between the two connecting belts through a plurality of connecting pieces on both sides of the reinforcing plate.

[0011] Further, the material belt is a metal material belt, and the structure of connecting belt and connecting piece can be formed by stamping forming or etching process.

[0012] Further, the reinforcing plate is provided with at least one protruding structure, and the circuit structure is provided with a concave hole structure fixed to the protruding structure through positioning clamping.

[0013] Further, the circuit structure is fixed to the reinforcing plate in a bonding manner or a riveting manner.

[0014] Further, the circuit structure comprises a substrate and a circuit line arranged on the substrate.

[0015] Further, the substrate is a hard plate or a flexible plate.

[0016] After the above technical scheme is adopted, the assembly is in a strip shape with a plurality of circuit structures, and can be directly input into an injection molding machine for injection molding, so that the plurality of circuit structures and the reinforcing plate below can form bases respectively through one-time injection molding, the number of injection molding times is small, and the production efficiency can be effectively improved. Then, the assembly after injection molding is segmented to form independent electronic assemblies, and the plastic bases of the electronic assemblies are provided with reinforcing plates, and the structural strength is high. The bases in the electronic assemblies can be bases of voice coil motors, and the electronic components can be Hall elements, and are used for realizing the closed loop function of the voice coil motor in the camera module.

[0017] Moreover, the assembly can be wound to reduce the volume, facilitate logistics turnover, and facilitate transportation to a downstream injection molding manufacturer for injection molding production after production and manufacturing by an upstream circuit manufacturer, so that the cooperation efficiency of the upstream and downstream manufacturers can be greatly improved, the production efficiency can be improved, the production cost can be reduced, and the product quality can be improved through the corresponding process steps by a professional manufacturer. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 FIG. 1 is a schematic view of an embodiment assembly of the present application;

[0019] Figure 2 FIG. 2 is a sectional view of the reinforcing plate and the circuit structure of the embodiment assembly of the present application;

[0020] Figure 3 FIG. 3 is a schematic view of the processing technology of the embodiment of the present application;

[0021] Figure 4 FIG. 4 is a schematic view of the reinforcing plate and the connecting piece provided with a connecting circuit in the embodiment of the present application.

[0022] Label explanation: assembly 10, material strip 1, reinforcing plate 11, protruding structure 111, connecting strip 12, connecting piece 13, circuit structure 2, concave hole structure 21, electronic component 3, substrate 4, circuit structure 5, silk screen plate 6, insulating layer 7, connecting circuit 8. DETAILED DESCRIPTION

[0023] To make the purposes, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some but not all of the embodiments of the present application. The components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0024] As shown in Figure 1 and Figure 2 The component 10 with electronic components in the embodiment is in a strip structure and can be wound to facilitate product transfer and storage.

[0025] The component 10 includes a wound material strip 1, and the material strip 1 has a plurality of reinforcing plates 11 arranged at intervals along the strip extension direction of the component 10. Each reinforcing plate 11 is fixed with a circuit structure 2, and the circuit structure 2 is welded with an electronic component 3, which can be a Hall element, a capacitor, a coil or a driving chip, etc.

[0026] The circuit structure 2 can be a circuit structure made of liquid metal, a circuit structure made of conductive silver paste or an FPC circuit structure, etc.

[0027] Therefore, the component 10 can be directly input into an injection molding machine (not shown) for injection molding, and a base (not shown) can be formed under each circuit structure 2 and reinforcing plate 11 by one-time injection molding, so that the number of injection molding times is reduced. Then, the component 10 after injection molding is segmented to form independent electronic components, and each electronic component has a reinforcing plate 11 in the plastic base, so that the structural strength is high.

[0028] In the embodiment, the base can serve as a base of a voice coil motor, and the electronic component 3 can be a Hall element, etc., which is used to realize the closed-loop function of the voice coil motor in a camera module.

[0029] In the embodiment, the material strip 1 further includes two connecting strips 12, and each reinforcing plate 11 is connected to be arranged between the two connecting strips 12 through a plurality of connecting pieces 13 on both sides of the reinforcing plate 11. Therefore, when the component 10 after injection molding is segmented, the connecting pieces 13 can be conveniently broken to separate each base with the reinforcing plate 11 and the circuit structure 2 from the two connecting strips 12 on both sides. Or, part of the connecting pieces 13 can be reserved, and the connecting pieces 13 are in conductive communication with the circuit structure 2 to form a pin extending out of the base, which facilitates connection with an external circuit.

[0030] Therefore, the material strip 1 can be a metal material strip 1, and the connecting strip 12, the reinforcing plate 11 and the connecting piece 13 structure are formed by stamping to facilitate the use of the connecting piece 13 as a pin.

[0031] In this embodiment, the circuit structure 2 can be fixed on the reinforcing plate 11 by bonding or riveting. It can also be clamped to further facilitate the production of the product and improve the production efficiency.

[0032] Specifically, the reinforcing plate 11 can be provided with at least one protruding structure 111, and the circuit structure 2 is provided with a hole structure 21 clamped and fixed to the protruding structure 111. The hole structure 21 can be a through hole, and the through hole is tightly fitted with the protruding structure 111 to firmly fix the circuit structure 2 on the reinforcing plate 11.

[0033] Referring to Figure 3 The assembly 10 with electronic components 3 described above can use the following production process, which can include the following steps:

[0034] Step 1: Print a plurality of circuit lines spaced apart from each other in an array on the substrate 4. The substrate 4 can be a flexible plate made of PI (polyimide) or other materials, or a hard plate. The circuit line can be a liquid metal circuit, a conductive silver paste circuit or an FPC circuit. In this way, a circuit structure piece 5 with a plurality of circuit structures 2 can be formed.

[0035] Through batch printing, the forming efficiency of the circuit structure 2 can be greatly improved, and the use of liquid metal circuit, conductive silver paste circuit or FPC circuit can reduce the product size and weight.

[0036] Step 2: The circuit structure piece 5 can be produced by SMT process or other process to weld and fix electronic components 3 on each circuit structure 2, and finally obtain a circuit structure piece 5 with electronic components 3;

[0037] Specifically, a silk screen plate 6 is pre-covered on the circuit structure piece 5. The silk screen plate 6 is provided with an opening for positioning the circuit structure 2. The opening is provided for the patch-type electronic component 3. Then the silk screen plate 6 and the circuit structure piece 5 are sent to the silk screen printer for printing tin paste. After removing the silk screen plate 6, it is sent to the patch machine for patch production and fixed by reflow soldering. Finally, a circuit structure piece 5 with electronic components 3 is obtained.

[0038] Thus, by using SMT process for batch patch production, the welding efficiency of electronic components is greatly improved.

[0039] Step 3: The circuit structure piece 5 with electronic components 3 is divided into independent circuit structures 2 with electronic components 3.

[0040] Step 4: providing a strip-shaped material strip 1 with a plurality of reinforcing plates 11 arranged at intervals by punching or etching, and fixing each independent circuit structure 2 with electronic components 3 to the reinforcing plates 11 of the material strip 1 to form an assembly 10 with electronic components 3;

[0041] Step 5: winding the assembly 10 and storing it.

[0042] In this way, the circuit structures 2 are fixed to the material strip 1 to form an integrated whole, which can be conveniently input into an injection molding machine for subsequent base injection molding production.

[0043] Moreover, the material strip 1 is formed by punching or etching a metal strip, which can directly form the structure of the connecting strip 12, the reinforcing plate 11, and the connecting piece 13, facilitating the subsequent disassembly of each electronic assembly during base injection molding.

[0044] Meanwhile, in step 4, the circuit structure 2 can be fixed on the reinforcing plate 11 by adhesive or riveting, or can be clamped; if clamping is used, at least one recess structure 21 can be formed on each circuit structure 2 by punching before the circuit structure 5 is segmented in step 3; and in step 4, a protruding structure 111 for clamping the recess structure 21 of the circuit structure 2 can be punched on each reinforcing plate 11, and then the recess structure 21 of the circuit structure 2 is clamped on the protruding structure 111 of the reinforcing plate 11, and then pressed and clamped.

[0045] Further, in step 4, the reinforcing plate 11 can be further processed, as shown in Figure 4 An insulating layer 7 can be covered on the reinforcing plate 11 and the connecting piece 13, and then a connecting circuit 8 can be printed on the insulating layer 7, which has a connecting pin 81 on the connecting piece 13; finally, when the circuit structure 2 is fixed on the reinforcing plate 11, it is also electrically connected to the connecting pin 81 on the connecting piece 13; thus, the connecting piece 13 can be used as a support for the extended pins of the circuit structure 2, facilitating the assembly of the molded base, and the connecting piece 13 can be bent or the like, facilitating the plug-in assembly of the base.

[0046] The circuit structure 2 and the connecting circuit 8 can be connected by existing technology.

[0047] The production process can also be directly combined with the production of a camera module, for example, in step 5, the assembly 10 does not need to be wound, and can be directly input into an injection molding machine for base injection molding.

[0048] The above merely describes preferred embodiments of the present application, and the protection scope of the present application is not limited to the above-mentioned embodiments. Any technical solution falling within the concept of the present application shall fall within the protection scope of the present application. It should be noted that equivalent changes and modifications made by those skilled in the art without departing from the principles of the present application shall still fall within the protection scope of the present application.

[0049] In the description of the embodiments of the present application, it should be understood that the indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, or is the orientation or positional relationship commonly used when the product of the application is placed, or is the orientation or positional relationship commonly understood by those skilled in the art, and is merely for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

Claims

1. An assembly with electronic components, characterized in that: the assembly is in a strip structure and can be wound; the assembly comprises a material strip wound into a roll, the material strip having a plurality of reinforcing plates arranged at intervals along the strip extension direction of the assembly, each reinforcing plate having a circuit structure fixed thereon, and the circuit structure having electronic components welded thereon; the circuit structure is a liquid metal circuit structure, a conductive silver paste circuit structure or an FPC circuit structure; the material strip further comprises two connecting strips, and each reinforcing plate is connected to the two connecting strips through a plurality of connecting pieces; the material strip is a metal material strip; the reinforcing plate is provided with at least one protruding structure, and the circuit structure is provided with a concave structure matched with the protruding structure to be fixed to the protruding structure; the circuit structure is fixed to the reinforcing plate by means of adhesion or riveting; the circuit structure comprises a substrate and a circuit line arranged on the substrate; the substrate is a rigid substrate or a flexible substrate. ​ ​ ​ 2. An assembly with electronic components according to claim 1, characterized in that: ​ 3. An assembly with electronic components according to claim 1 or 2, characterized in that: ​ 4. An assembly with electronic components according to claim 1, characterized in that: ​ 5. An assembly with an electronic component according to claim 1, characterized in that: ​ 6. An assembly with an electronic component according to claim 1, characterized in that: ​ 7. An assembly with an electronic component according to claim 6, characterized in that: ​

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