Hot riveting device for preventing rebounding of tire pressure sensor PCBA after hot melting

Abstract

The utility model discloses a hot riveting device for preventing rebounding of a PCBA (printed circuit board assembly) of a tire pressure sensor after hot melting, which comprises a conveying mechanism used for positioning a shell to be subjected to hot riveting, and a circuit board is placed in the shell; the pre-pressing mechanism comprises a first mounting seat, a first driving air cylinder and a pre-pressing plate, the first driving air cylinder is fixedly mounted on the first mounting seat, and the pre-pressing plate is fixedly mounted on a piston rod of the first driving air cylinder; the shell positioning mechanism comprises a second driving air cylinder and a shell positioning rod, and the shell positioning rod is fixedly installed at the output end of the second driving air cylinder; and the pressing hot melting mechanism is used for hot riveting the fixing columns on the shell through the hot melting columns. Compared with the prior art, the tire pressure sensor circuit board hot riveting device solves the problems that an existing tire pressure sensor circuit board rebounds after hot riveting, and the hot riveting quality is poor.

Description

TECHNICAL FIELD

[0001] The utility model relates to the manufacturing technical field of tire pressure sensor, especially to a hot riveting device for avoiding rebound of PCBA of tire pressure sensor after hot melting. BACKGROUND

[0002] In the processing of the tire pressure sensor, in order to realize the fixation of the circuit board (PCBA), after the circuit board is placed in the product shell, the hot riveting device presses the fixing column in the product shell through the hot melting column, and the fixing column is hot melted and deformed by the heating of the copper column, so as to realize the hot riveting fixation of the circuit board.

[0003] In the hot riveting fixation process of the existing circuit board of the tire pressure sensor, after hot melting, the circuit board (PCBA) has a rebound force, which can damage the formation of the hot riveting point and affect the hot riveting fixation effect.

[0004] In addition, in the hot riveting fixation device of the existing circuit board of the tire pressure sensor, the hot melting column position continuously generates heat, which can damage the peripheral motion mechanism cylinder for a long time and reduce the service life. UTILITY MODEL CONTENTS

[0005] The utility model aims at providing a hot riveting device for avoiding rebound of PCBA of tire pressure sensor after hot melting, so as to solve the problems of rebound and poor hot riveting quality of the existing circuit board of the tire pressure sensor after hot riveting.

[0006] In order to realize the above-mentioned purpose, the utility model adopts the following technical scheme: a hot riveting device for avoiding rebound of PCBA of tire pressure sensor after hot melting, comprising:

[0007] A conveying mechanism is used for positioning the shell to be hot riveted, and the circuit board is placed in the shell.

[0008] A pre-pressing mechanism comprises a first mounting seat, a first driving cylinder and a pre-pressing plate, the first driving cylinder is fixedly installed on the first mounting seat, and the pre-pressing plate is fixedly installed on the piston rod of the first driving cylinder.

[0009] A shell positioning mechanism comprises a second driving cylinder and a shell positioning rod, and the shell positioning rod is fixedly installed on the output end of the second driving cylinder.

[0010] A hot melting and pressing mechanism is used for hot riveting the fixing column on the shell through the hot melting column.

[0011] The conveying mechanism comprises a sliding rail, a sliding seat and a positioning seat, the sliding seat is slidably connected to the sliding rail, the positioning seat is fixedly installed on the sliding seat, the shell is placed in the positioning seat, the pre-pressing plate is arranged above the shell, and the pre-pressing plate is provided with an avoiding hole for avoiding the hot melting column.

[0012] As a further description of the above-mentioned technical scheme:

[0013] The pre-pressing plate is arranged below the pressing block.

[0014] As a further description of the above technical solution:

[0015] The down-pressing hot melting mechanism further comprises a heating plate, a lifting plate and a third driving cylinder, the lifting plate is fixedly installed on the output end of the third driving cylinder, the heating plate is fixedly installed on the lifting plate, and the hot melting column is fixedly installed on the heating plate.

[0016] As a further description of the above technical solution:

[0017] The heating plate and the lifting plate are provided with a heat insulation piece.

[0018] As a further description of the above technical solution:

[0019] The heat insulation piece comprises two layers of heat insulation plates stacked up and down.

[0020] As a further description of the above technical solution:

[0021] The heat insulation plate is an FR-4 epoxy resin plate.

[0022] In summary, due to the adoption of the above technical solution, the beneficial effects of the present application are:

[0023] 1、In the present application, the hot riveting front and rear of the fixed column on the shell is kept extruded on the shell and the circuit board by the pre-pressing plate of the pre-pressing mechanism, after the hot melting column is separated from the hot riveting point, until the fixed column deformed by hot melting is solidified, the pre-pressing plate is raised again to release the positioning, effectively avoiding the rebound force of the circuit on the hot riveting point, and avoiding the damage to the formation of the hot riveting point.

[0024] 2、In the present application, the heat insulation piece is arranged between the heating plate and the lifting plate, and specifically adopts the FR-4 epoxy resin plate heat insulation stacked up and down, effectively blocks the heat transfer to the lifting plate, protects the third driving cylinder, and prolongs the service life of the down-pressing hot melting mechanism. BRIEF DESCRIPTION OF DRAWINGS

[0025] In order to more clearly illustrate the technical scheme of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments, it should be understood that the following drawings only show some embodiments of the present application, therefore should not be regarded as a limitation to the scope, for those skilled in the art, without creative labor, other related drawings can also be obtained according to these drawings.

[0026] Figure 1 It is a structure schematic view of a hot riveting device for avoiding rebound of tire pressure sensor PCBA after hot melting.

[0027] Figure 2It is a kind of structure schematic view of conveying mechanism in hot riveting device for avoiding rebound of tire pressure sensor PCBA after hot melting.

[0028] Figure 3 It is a kind of structure schematic view of pre-pressing mechanism in hot riveting device for avoiding rebound of tire pressure sensor PCBA after hot melting.

[0029] Figure 4 It is a kind of structure schematic view of lower hot melting mechanism in hot riveting device for avoiding rebound of tire pressure sensor PCBA after hot melting.

[0030] Legend:

[0031] 1, conveying mechanism;11, slide rail;12, sliding seat;13, positioning seat;2, pre-pressing mechanism;21, first mounting seat;22, first drive cylinder;23, pre-pressing plate;231, avoiding hole;3, shell positioning mechanism;31, second drive cylinder;32, shell positioning rod;4, lower hot melting mechanism;41, hot melting column;42, heating plate;43, lifting plate;44, third drive cylinder;45, heat insulation plate;9, shell;91, circuit board. DETAILED DESCRIPTION

[0032] The technical scheme in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0033] Embodiment 1

[0034] Please refer to Figures 1-4 The present application provides a technical scheme: a hot riveting device for avoiding rebound of tire pressure sensor PCBA after hot melting, comprising:

[0035] The conveying mechanism 1 is used for positioning the shell 9 to be hot riveted, and the circuit board 91 is placed in the shell 9.

[0036] The pre-pressing mechanism 2 comprises a first mounting seat 21, a first drive cylinder 22 and a pre-pressing plate 23. The first drive cylinder 22 is fixedly installed on the first mounting seat 21, and the pre-pressing plate 23 is fixedly installed on the piston rod of the first drive cylinder 22.

[0037] The shell positioning mechanism 3 comprises a second drive cylinder 31 and a shell positioning rod 32. The shell positioning rod 32 is fixedly installed on the output end of the second drive cylinder 31.

[0038] The lower hot melting mechanism 4 is used for hot riveting the fixed column on the shell 9 through the hot melting column 41.

[0039] The conveying mechanism 1 comprises a sliding rail 11, a sliding seat 12 and a positioning seat 13, the sliding seat 12 is slidably connected to the sliding rail 11, the positioning seat 13 is fixedly installed on the sliding seat 12, the shell 9 is placed in the positioning seat 13, and the pre-pressing plate 23 is arranged above the shell 9, and the pre-pressing plate 23 is provided with a relief hole 231 which avoids the hot melting column 41.

[0040] The downward hot melting mechanism 4 further comprises a heating plate 42, a lifting plate 43 and a third driving cylinder 44, the lifting plate 43 is fixedly installed on the output end of the third driving cylinder 44, the heating plate 42 is fixedly installed on the lifting plate 43, and the hot melting column 41 is fixedly installed on the heating plate 42.

[0041] The third driving cylinder 44 drives the lifting plate 43 to lift, controls the heating plate 42 and the hot melting column 41 to descend, and realizes hot riveting. The heating plate 42 controls the temperature through a built-in heating rod, and the heat of the heating plate 42 is conducted to the fixed column on the shell 9 through the hot melting column 41, so that hot riveting is realized.

[0042] Working principle: the circuit board 91 is placed in the shell 9 positioned by the positioning seat 13 on the sliding seat 12 of the conveying mechanism 1, the fixed column on the shell 9 is arranged in the circuit board 91, then the pre-pressing plate 23 of the pre-pressing mechanism 2 is lowered, the first driving cylinder 22 drives the pre-pressing plate 23 to descend and press the shell 9 and the circuit board 91, at the same time, the shell positioning rod 32 in the shell positioning mechanism 3 is driven by the second driving cylinder 31 to extend, the shell positioning rod 32 abuts against the shell 9, further positions the shell 9, avoids deformation of the shell 9, and guarantees the hot riveting quality. Finally, the hot melting column 41 in the downward hot melting mechanism 4 descends, the fixed column on the shell 9 is hot melted and deformed, and hot riveting is completed.

[0043] Before and after hot riveting of the fixed column on the shell 9, the pre-pressing plate 23 of the pre-pressing mechanism 2 keeps extruding the shell 9 and the circuit board 91, after the hot melting column 41 is separated from the hot riveting point, until the fixed column which is hot melted and deformed is solidified, the pre-pressing plate 23 is raised again and the positioning is released, so that the rebound force of the circuit board 91 (PCBA) on the hot riveting point is effectively avoided, and the formation of the hot riveting point is avoided from being damaged.

[0044] Embodiment 2

[0045] In the embodiment, the pre-pressing plate 23 is provided with a pressing block 232 below.

[0046] The pressing block is made of FR-4 epoxy resin material, so that damage of the shell 9 and the circuit board 91 is avoided in the downward pressing process.

[0047] Embodiment 3

[0048] The embodiment further makes the following improved technical scheme on the basis of the above embodiment: a heat insulation piece is arranged between the heating plate 42 and the lifting plate 43, and the heat insulation piece comprises two layers of heat insulation plates 45 stacked up and down. In addition, the heat insulation plate 45 is an FR-4 epoxy resin plate.

[0049] The heat insulation piece is arranged between the heating plate 42 and the lifting plate 43, and specifically, the FR-4 epoxy resin plate is used to insulate up and down, effectively blocks the heat transfer to the lifting plate 43, protects the third driving cylinder 44, and prolongs the service life of the hot melting mechanism 4.

[0050] The above is only a preferred specific embodiment of the present application, but the protection scope of the present application is not limited to this. Any person skilled in the art can make equivalent replacement or change according to the technical scheme and the inventive concept of the present application within the technical range disclosed by the present application, which should be covered within the protection scope of the present application.

Claims

1. A hot riveting device for preventing the tire pressure sensor PCBA from rebounding after hot melting, characterized in that, include: A conveying mechanism for positioning the housing to be hot-riveted, with the circuit board placed inside the housing; A pre-compression mechanism includes a first mounting base, a first drive cylinder, and a pre-compression plate. The first drive cylinder is fixedly mounted on the first mounting base, and the pre-compression plate is fixedly mounted on the piston rod of the first drive cylinder. A housing positioning mechanism includes a second drive cylinder and a housing positioning rod, wherein the housing positioning rod is fixedly installed at the output end of the second drive cylinder; A downward-pressing hot-melt mechanism is used to hot-rivet the fixing posts on the outer shell via hot-melt pins; The conveying mechanism includes a slide rail, a sliding seat, and a positioning seat. The sliding seat is slidably connected to the slide rail, and the positioning seat is fixedly installed on the sliding seat. The outer shell is placed inside the positioning seat, and the pre-pressure plate is disposed above the outer shell. The pre-pressure plate is provided with a clearance hole to avoid the hot melt column.

2. The hot riveting device for preventing the tire pressure sensor PCBA from rebounding after hot melting according to claim 1, characterized in that, A pressure block is provided below the pre-pressure plate.

3. The hot riveting device for preventing the tire pressure sensor PCBA from rebounding after hot melting according to claim 1, characterized in that, The downward pressing hot melt mechanism also includes a heating plate, a lifting plate, and a third driving cylinder. The lifting plate is fixedly installed at the output end of the third driving cylinder, the heating plate is fixedly installed on the lifting plate, and the hot melt column is fixedly installed on the heating plate.

4. The hot riveting device for preventing the tire pressure sensor PCBA from rebounding after hot melting according to claim 3, characterized in that, A heat insulation component is provided between the heating plate and the lifting plate.

5. A hot riveting device for preventing the tire pressure sensor PCBA from rebounding after hot melting, as described in claim 4, is characterized in that... The insulation component comprises two layers of stacked insulation panels.

6. A hot riveting device for preventing the tire pressure sensor PCBA from rebounding after hot melting, as described in claim 5, is characterized in that... The insulation board is an FR-4 epoxy resin board.

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