Brake pad mold heat insulation device

Abstract

The utility model discloses a brake pad mold heat insulation device which comprises a storage bin, a rectangular cold guide sleeve plate is placed in the middle of the interior of the storage bin, a semiconductor chilling plate extending to the exterior of the storage bin is installed at the bottom of the rectangular cold guide sleeve plate, and an isolation groove is formed in the middle of the top of the storage bin. And a heat conduction groove plate is mounted in the isolation groove. Through the material of the heat conduction groove plate, excessive heat in the female die can be conveniently adsorbed, through the surrounding structure design of the heat conduction groove plate, the heating uniformity of the interior of the female die in the later period can be ensured, meanwhile, through the isolation groove and the storage bin designed outside the heat conduction groove plate, the heat in the female die can be blocked, and the heat dissipation efficiency is improved. Heat is effectively prevented from being conducted to the hot press body during hot pressing, the high-temperature phenomenon of the hot press body caused by heat conduction is relieved, and then the influence of the high-temperature phenomenon on the service life of the hot press body can be reduced.

Description

Technical Field

[0001] This utility model relates to the field of mold heat insulation technology, specifically a brake pad mold heat insulation device. Background Technology

[0002] With economic development and the improvement of people's living standards, more and more people own private cars. Cars have become a daily means of transportation. A car is a non-rail-borne vehicle with four or more wheels driven by power. It is a tool manufactured by people to transport people and goods. A car consists of many systems, including engine system, transmission system, running system, steering system, suspension system and braking system. An important component of the braking system is the brake pad. Currently, the hot pressing process of brake pads mostly uses a four-column one-time forming hot press. The hot pressing mold is directly fixed to the hot press by bolts. Therefore, it is necessary to design a heat insulation device for the brake pad mold.

[0003] The existing mold cavity is directly connected to the equipment without a heat insulation device. During the hot pressing process, the mold needs to be heated to 140-170℃, which causes some heat to be directly conducted to the equipment body through the mold. This not only causes heat loss, but also leads to excessively high internal temperature of the hot press body, which will accelerate the aging efficiency of the internal circuits of the hot press body, affect its service life, and increase the maintenance cost of the hot press body. Utility Model Content

[0004] The purpose of this utility model is to provide a heat insulation device for brake pad molds, which facilitates the heat insulation and protection of brake pad molds. By reducing heat conduction during hot pressing, the high temperature phenomenon inside the hot press body is reduced, thereby extending the service life of the hydraulic press body.

[0005] To achieve the above objectives, a brake pad mold heat insulation device is provided, comprising a storage chamber, a rectangular cooling plate placed at the center of the storage chamber, a semiconductor cooling chip extending to the outside of the storage chamber installed at the bottom of the rectangular cooling plate, an isolation groove installed at the center of the top of the storage chamber, a heat-conducting groove plate installed inside the isolation groove, a concave mold installed inside the heat-conducting groove plate, a convex mold mating with the inner top of the concave mold, and a liquid flow component provided on one side of the storage chamber.

[0006] According to the aforementioned brake pad mold heat insulation device, the liquid flow assembly includes a second connecting pipe, a water pump, a first connecting pipe, and a drain pipe. The drain pipe is installed at the top of one side of the isolation groove, and the bottom of the isolation groove is connected to the top of one side of the storage chamber. The water pump is installed on the side of the storage chamber away from the drain pipe. The input end of the water pump is provided with a second connecting pipe, and the second connecting pipe is connected to one side of the bottom of the storage chamber. The output end of the water pump is provided with a first connecting pipe, and the first connecting pipe is connected to the top of the other side of the isolation groove.

[0007] According to the aforementioned brake pad mold heat insulation device, the inner side of the isolation groove is provided with a cavity, and the cavity is connected to the interior of the connecting pipe and the drain pipe.

[0008] According to the aforementioned brake pad mold heat insulation device, a base plate is provided at the middle position of the bottom of the storage compartment, and a through groove that cooperates with the semiconductor cooling chip is opened at the middle position inside the base plate. Internal threaded fixing plates are installed on both sides of the base plate, and bolts are threadedly connected to the two ends of the two sets of internal threaded fixing plates on opposite sides.

[0009] According to the aforementioned brake pad mold heat insulation device, a liquid inlet is provided on one side of the top of one end of the front of the storage compartment, and a sealing cap that matches the liquid inlet is closed inside the liquid inlet.

[0010] According to the aforementioned brake pad mold heat insulation device, the semiconductor cooling chip is formed by connecting N-type semiconductors and P-type semiconductors in series, and both the N-type semiconductors and P-type semiconductors are connected to the power supply via external connecting lines.

[0011] According to the aforementioned brake pad mold heat insulation device, both the rectangular cooling sleeve plate and the heat-conducting groove plate are made of titanium alloy, and the heat-conducting groove plate is in contact with the outside of the mold cavity.

[0012] According to the aforementioned brake pad mold heat insulation device, the bottom of the storage compartment has openings on both sides, and the openings are sealed to the semiconductor cooling chip.

[0013] Compared with the prior art, the beneficial effects of this utility model are: the material of the heat-conducting groove plate can easily absorb excess heat inside the concave mold, and the surrounding structure design of the heat-conducting groove plate can ensure the uniformity of heating inside the concave mold in the later stage. At the same time, the isolation groove and storage chamber designed on the outside of the heat-conducting groove plate can block the heat inside, effectively preventing heat from being conducted to the hot press body during hot pressing, alleviating the high temperature phenomenon caused by heat conduction in the hot press body, and thus reducing the impact of high temperature phenomenon on the service life of the hot press body.

[0014] Meanwhile, the structural design of the semiconductor cooling chip and rectangular heat-conducting sleeve can easily achieve the cooling function of the liquid inside the storage chamber. Furthermore, through the structural design of the water pump, connecting pipe 2 and connecting pipe 1, the cooling liquid inside the storage chamber can be drawn into the interior of the isolation groove. By absorbing heat through the cooling liquid, the heat barrier function can be achieved again. At the same time, it can also cool down the brake pads after hot pressing, improving the efficiency of subsequent cooling and molding. Finally, the cooling liquid inside the drain pipe can carry the heat through the drain pipe and be discharged into the interior of the storage chamber, thus allowing for repeated use.

[0015] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0016] The present invention will be further described below with reference to the accompanying drawings and embodiments;

[0017] Figure 1 This is a three-dimensional structural diagram of a brake pad mold heat insulation device according to the present invention;

[0018] Figure 2 This is a three-dimensional structural diagram of a rectangular cooling guide sleeve plate of a brake pad mold heat insulation device according to this utility model;

[0019] Figure 3 This is a three-dimensional structural diagram of the isolation groove of the brake pad mold heat insulation device according to the present invention;

[0020] Figure 4 This is a front sectional view of a brake pad mold heat insulation device according to the present invention.

[0021] In the diagram: 1. Storage compartment; 2. Drain pipe; 3. Isolation groove; 4. Heat-conducting groove plate; 5. Punch mold; 6. Concave mold; 7. Rectangular heat-conducting sleeve plate; 8. Connecting pipe one; 9. Water pump; 10. Connecting pipe two; 11. Semiconductor cooling chip. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0023] Please see Figure 1-4This utility model provides a technical solution: a brake pad mold heat insulation device, including a storage chamber 1, a rectangular cooling plate 7 placed in the middle of the storage chamber 1, a semiconductor cooling chip 11 extending to the outside of the storage chamber 1 installed at the bottom of the rectangular cooling plate 7, an isolation groove 3 installed in the middle of the top of the storage chamber 1, a heat-conducting groove plate 4 installed inside the isolation groove 3, a concave mold 6 installed inside the heat-conducting groove plate 4, a convex mold 5 that cooperates with the concave mold 6 on the inner top of the concave mold 6, and a liquid flow component provided on one side of the storage chamber 1 to facilitate the heat insulation protection function of the brake pad mold. By insulating the heat, the heat conduction during hot pressing is reduced, the high temperature phenomenon inside the hot press body is reduced, so as to extend the service life of the hydraulic press body in the later stage.

[0024] The liquid flow assembly includes a second connecting pipe 10, a water pump 9, a first connecting pipe 8, and a drain pipe 2. The drain pipe 2 is installed on the top of one side of the isolation groove 3, and the bottom of the isolation groove 3 is connected to the top of one side of the storage chamber 1. The water pump 9 is installed on the side of the storage chamber 1 away from the drain pipe 2. The input end of the water pump 9 is provided with a second connecting pipe 10, and the second connecting pipe 10 is connected to one side of the bottom of the storage chamber 1. The output end of the water pump 9 is provided with a first connecting pipe 8, and the first connecting pipe 8 is connected to the top of the other side of the isolation groove 3. Through the operation of the water pump 9, the liquid inside the storage chamber 1 can be drawn into the interior of the isolation groove 3 through the second connecting pipe 10 and the first connecting pipe 8, and finally discharged into the interior of the storage chamber 1 through the drain pipe 2, thus repeating the cycle.

[0025] A cavity is provided inside the isolation groove 3, and the cavity is connected to the interior of the connecting pipe 8 and the drain pipe 2. The cavity facilitates the entry and flow of liquid to achieve the cooling and heat insulation function. A base plate is provided at the middle of the bottom of the storage chamber 1, and a through groove is provided in the middle of the bottom of the base plate to cooperate with the semiconductor cooling chip 11. Internal threaded fixing plates are installed on both sides of the base plate, and bolts are threaded to the ends of the two sets of internal threaded fixing plates on opposite sides. The base plate design provides support for the placement of the storage chamber 1 and the above components, and the through groove facilitates the heat dissipation function of the semiconductor cooling chip 11. Finally, the internal threaded fixing plates and bolts can be threaded to fix the storage chamber 1 and the above components to the worktable on the surface of the external hot press. A liquid inlet is provided on one side of the top of the front end of the storage chamber 1, and a sealing cap is provided inside the liquid inlet to cooperate with it. The liquid inlet provides a convenient way to... This allows for the addition of liquid to the storage chamber 1. The thermoelectric cooler 11 is formed by connecting N-type and P-type semiconductors in series. Both N-type and P-type semiconductors are connected to the power supply via external connecting wires. Through thermocouple pairs composed of N-type and P-type semiconductor materials, when current passes through these thermocouple pairs, heat is transferred between the different materials. Heat is transferred from the end that absorbs heat at the cold end to the end that releases heat at the hot end, thereby achieving the purpose of cooling. The cold end of the thermoelectric cooler 11 is connected to the rectangular heat-conducting sleeve 7, and the hot end extends to the outside of the storage chamber 1. The rectangular heat-conducting sleeve 7 and the heat-conducting groove plate 4 are both made of titanium alloy. The heat-conducting groove plate 4 is fitted to the outside of the concave mold 6. The titanium alloy material can effectively improve the heat conduction rate of the heat source and cold source. Openings are provided on both sides of the bottom of the storage chamber 1, and the openings are fitted and sealed with the thermoelectric cooler 11. The openings facilitate the installation and removal of the thermoelectric cooler 11.

[0026] Working principle: When in use, the storage compartment 1 and above components can be directly threaded onto the worktable on the surface of the external hot press body. The punch 5 is connected to the drive component on the top of the hot press body. Then, through the design and cooperation of the concave die 6 and the punch 5, the hot pressing of the brake pads can be achieved.

[0027] During hot pressing, excess heat inside the concave mold 6 can be absorbed by the rectangular cooling sleeve 7. The surrounding design of the rectangular cooling sleeve 7 can achieve uniform heating inside the concave mold 6, ensuring the quality of the brake pad hot pressing later. The surrounding design of the isolation groove 3 can block the heat inside the rectangular cooling sleeve 7. Finally, the storage chamber 1 can lift the isolation groove 3 to prevent heat from being conducted to the hot press body during hot pressing, ensuring the service life of the hot press body and reducing maintenance costs.

[0028] Simultaneously, after hot pressing, the liquid inside the storage chamber 1 can be pumped into the interior of the connecting pipe 8 through the connecting pipe 10 via the water pump 9, and then discharged into the interior of the isolation groove 3. The liquid can absorb the heat inside the rectangular heat-conducting sleeve 7 to improve the heat isolation quality in the later stage. At the same time, it can also improve the cooling efficiency of the mold inside the concave mold 6 in the later stage. Finally, the liquid inside the drain pipe 2 can carry the heat and be discharged into the interior of the storage chamber 1 through the drain pipe 2. This cycle is repeated. Through the structural design of the semiconductor cooling chip 11 and the rectangular heat-conducting sleeve 7, the liquid inside the storage chamber 1 can be cooled, achieving the cooling effect in the later stage. Furthermore, through the structure and material of the rectangular heat-conducting sleeve 7, the contact area with the liquid can be increased, improving the cooling efficiency of the liquid inside the storage chamber 1 in the later stage.

[0029] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. A heat insulation device for brake pad molds, comprising a storage compartment (1), characterized in that, A rectangular cooling sleeve plate (7) is placed in the middle of the storage compartment (1). A semiconductor cooling chip (11) extending to the outside of the storage compartment (1) is installed at the bottom of the rectangular cooling sleeve plate (7). An isolation groove (3) is installed in the middle of the top of the storage compartment (1). A heat-conducting groove plate (4) is installed inside the isolation groove (3). A concave mold (6) is installed inside the heat-conducting groove plate (4). A convex mold (5) is provided on the inner top of the concave mold (6) to cooperate with it. A liquid flow component is provided on one side of the storage compartment (1).

2. The brake pad mold heat insulation device as described in claim 1, characterized in that: The liquid flow assembly includes a second connecting pipe (10), a water pump (9), a first connecting pipe (8), and a drain pipe (2). The drain pipe (2) is installed on the top of one side of the isolation groove (3), and the bottom of the isolation groove (3) is connected to the top of one side of the storage chamber (1). The water pump (9) is installed on the side of the storage chamber (1) away from the drain pipe (2). The input end of the water pump (9) is provided with a second connecting pipe (10), and the second connecting pipe (10) is connected to one side of the bottom of the storage chamber (1). The output end of the water pump (9) is provided with a first connecting pipe (8), and the first connecting pipe (8) is connected to the top of the other side of the isolation groove (3).

3. The brake pad mold heat insulation device as described in claim 1, characterized in that: The inner side of the isolation groove (3) is provided with a cavity, and the cavity is connected to the interior of the connecting pipe (8) and the drain pipe (2).

4. The brake pad mold heat insulation device as described in claim 1, characterized in that: The storage compartment (1) has a base plate at the middle position of the bottom, and a through groove that cooperates with the semiconductor cooling chip (11) is opened in the middle position of the base plate. Both sides of the base plate are equipped with internal thread fixing plates, and the two ends of the two sets of internal thread fixing plates that are far apart are threaded with bolts.

5. The brake pad mold heat insulation device as described in claim 1, characterized in that: The storage compartment (1) has a liquid inlet on one side of the top of one end of the front, and the inside of the liquid inlet is covered with a sealing cap that matches it.

6. The brake pad mold heat insulation device as described in claim 1, characterized in that: The semiconductor cooling chip (11) is formed by connecting N-type semiconductors and P-type semiconductors in series, and both N-type semiconductors and P-type semiconductors are connected to the power supply through external connection lines.

7. The brake pad mold heat insulation device as described in claim 1, characterized in that: The rectangular cooling sleeve plate (7) and the heat-conducting groove plate (4) are both made of titanium alloy, and the heat-conducting groove plate (4) is in contact with the outside of the die (6).

8. The brake pad mold heat insulation device as described in claim 1, characterized in that: Both sides of the bottom of the storage compartment (1) are provided with openings, and the openings are sealed to the semiconductor cooling chip (11).

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