Display device

Abstract

The utility model relates to a display device. The display device comprises a display panel, a first back plate, a second back plate, a first bonding layer and a second bonding layer, the display panel comprises a display part, a bending part and a binding part, and the binding part is bent to the back side of the display panel through the bending part; the first back plate is arranged on the back side of the display panel; the second backboard is arranged on the side, away from the display panel, of the first backboard and located between the binding part and the first backboard. The first bonding layer is arranged between the first back plate and the display part; the second bonding layer is arranged between the second back plate and the binding part; wherein the cohesive strength of the second bonding layer is greater than that of the first bonding layer. According to the display device, the second bonding layer located in the binding area is made of the bonding material with higher cohesive strength, so that the problem that bubbles are generated in the second bonding layer under the high-temperature and high-pressure conditions of the binding process is solved.

Description

Technical Field

[0001] This application relates to the field of display technology, and more particularly to a display device. Background Technology

[0002] The continuous development and innovation of flexible display technology have led to a gradual increase in the proportion of foldable screens in mobile phones. To achieve foldability, the extensibility and tensile properties of the module materials used in foldable screens have been strengthened. The selection of backplane (BP) materials also requires strong extensibility and tensile properties. The selection of pressure-sensitive adhesive (PSA) in the backplane material is usually based on considerations of low modulus and creep strength. Therefore, in the flexible printed circuit board on panel (FOP) bonding process of the display module, the PSA on the backplane located in the bonding area is greatly affected by high temperature and high pressure, which can easily lead to PSA cohesive failure, causing air bubbles to form inside the PSA, thus affecting bonding AOI inspection and increasing RA reliability risks. Utility Model Content

[0003] This application provides a display device in which the second adhesive layer located in the bonding area is made of an adhesive material with greater cohesive strength, so as to avoid the problem of air bubbles being generated inside the second adhesive layer under the high temperature and high pressure conditions of the bonding process.

[0004] To achieve the above objectives, this application provides a display device, comprising:

[0005] The display panel includes a display part, a bending part, and a binding part, wherein the binding part is bent to the back side of the display panel via the bending part;

[0006] The first back plate is disposed on the back side of the display panel;

[0007] The second back plate is disposed on the side of the first back plate away from the display panel and is located between the binding part and the first back plate;

[0008] A first adhesive layer is disposed between the first back plate and the display unit; and

[0009] A second adhesive layer is disposed between the second back plate and the bonding portion;

[0010] The cohesive strength of the second adhesive layer is greater than that of the first adhesive layer.

[0011] In some embodiments, the cohesive strength of the second adhesive layer is 2 to 5 times that of the cohesive strength of the first adhesive layer.

[0012] In some embodiments, the display panel is a flexible display panel, and the elastic modulus of the first adhesive layer at room temperature ranges from 5 kPa to 35 kPa, and the creep recovery rate ranges from 200% to 500%.

[0013] In some embodiments, the elastic modulus of the second adhesive layer is greater than that of the first adhesive layer, and the creep recovery rate of the second adhesive layer is less than that of the first adhesive layer.

[0014] In some embodiments, the first adhesive layer and the second adhesive layer are disposed separately.

[0015] In some embodiments, the thickness of the second adhesive layer is equal to the thickness of the first adhesive layer, and the thicknesses of the first adhesive layer and the second adhesive layer range from 5 μm to 30 μm.

[0016] In some embodiments, the thickness of the second adhesive layer is less than the thickness of the first adhesive layer, and the difference between the thickness of the second adhesive layer and the thickness of the first adhesive layer ranges from 5 μm to 20 μm.

[0017] In some embodiments, the thickness of the first adhesive layer ranges from 15 μm to 30 μm, and the thickness of the second adhesive layer ranges from 10 μm to 25 μm.

[0018] In some embodiments, the first adhesive layer includes a first pressure-sensitive adhesive, the second adhesive layer includes a second pressure-sensitive adhesive, and the cohesive strength of the second pressure-sensitive adhesive is greater than the cohesive strength of the first pressure-sensitive adhesive.

[0019] In some embodiments, the display device further includes a flexible circuit board bonded to the bonding portion.

[0020] This application provides a display device. A first adhesive layer is disposed between a first back plate and a display part, and a second adhesive layer is disposed between a second back plate and a bonding part. The cohesive strength of the second adhesive layer is greater than that of the first adhesive layer. This application avoids the problem of internal bubble formation caused by the cohesive failure of the second adhesive layer under the high temperature and high pressure conditions of the bonding process by using an adhesive material with greater cohesive strength in the second adhesive layer located in the bonding area. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0023] Figure 1 This is a schematic diagram of the structure of a display device provided in an embodiment of this application;

[0024] Figure 2 This is a schematic diagram of the unfolded state structure of a display device provided in an embodiment of this application;

[0025] Figure 3 This is a schematic diagram of the unfolded state structure of another display device provided in an embodiment of this application;

[0026] Figure 4 This is a schematic diagram of the cohesive strength test provided in an embodiment of this application.

[0027] Explanation of reference numerals in the attached figures:

[0028] 1. First steel plate; 2. Second steel plate; 3. Back plate; 4. Adhesive material; 5. Weight; 100. Display device; 110. Display panel; 101. Display part; 102. Bending part; 103. Binding part; 111. First back plate; 112. Second back plate; 121. First adhesive layer; 122. Second adhesive layer; 130. Polarizing film; 131. Optical adhesive; 140. Cover plate; 151. Third adhesive layer; 152. Support layer; 153. Fourth adhesive layer; 160. Fifth adhesive layer; 170. Protective layer; 180. Flexible circuit board; 190. Chip. Detailed Implementation

[0029] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0030] Please see Figure 1 , Figure 1This is a schematic diagram of the structure of a display device 100 provided in an embodiment of this application. This application provides a display device 100, which includes a display panel 110, a first back plate 111, a second back plate 112, a first adhesive layer 121, and a second adhesive layer 122. The display panel 110 includes a display portion 101 located in the display area AA, a bending portion 102 located in the bending area BA, and a bonding portion 103 located in the bonding area CA. The bonding portion 103 is bent to the back side of the display panel 110 through the bending portion 102. A first back plate 111 is disposed on the back side of the display panel 110, that is, on the side of the display portion 101 close to the bonding portion 103. A second back plate 112 is disposed on the side of the first back plate 111 away from the display panel 110, and is located between the bonding portion 103 and the first back plate 111. A first adhesive layer 121 is disposed between the first back plate 111 and the display portion 101. A second adhesive layer 122 is disposed between the second back plate 112 and the bonding portion 103. The cohesive strength of the second adhesive layer 122 is greater than the cohesive strength of the first adhesive layer 121.

[0031] The cohesive strength, also known as cohesive force, refers to the ability of molecules within an adhesive material to attract each other. This ability determines the strength and toughness of the adhesive material. Adhesive materials with good cohesive properties are less prone to breakage or delamination during use and can provide a stable bonding effect.

[0032] During the manufacturing of the display device 100, the process of bending the bonding portion 103 to the back side of the display panel 110 is usually carried out under high temperature and high pressure conditions. However, the second adhesive layer 122 located in the bonding area CA is easily affected by high temperature and high pressure during the bonding process. This application makes the cohesive strength of the second adhesive layer 122 greater than that of the first adhesive layer 121, that is, using an adhesive material with greater cohesive strength as the second adhesive layer 122. By increasing the interaction force between molecules within the material of the second adhesive layer 122, the strength of the second adhesive layer 122 is improved, thereby enhancing the cohesive performance of the second adhesive layer 122 under high temperature and high pressure conditions, thereby avoiding the problem of air bubbles being generated inside the second adhesive layer 122 during the bonding process.

[0033] In some embodiments, the display panel 110 may be a flexible display panel 110, such as an organic light-emitting diode (OLED). Correspondingly, the display device 100 may be a flexible display device 100, such as a foldable display device 100. To ensure the bending performance of the first adhesive layer 121 of the display area AA, the first adhesive layer 121 may be made of a low-modulus, low-creep-strength adhesive material to ensure its expansion and contraction performance. In this application, the elastic modulus of the first adhesive layer 121 may be in the range of 5 kPa to 35 kPa, and the creep recovery rate of the first adhesive layer 121 may be in the range of 200% to 500%. When the elastic modulus and creep recovery rate of the first adhesive layer 121 are within the above ranges, the first adhesive layer 121 has good bending performance to meet the bending performance requirements of the foldable display device 100. The above-mentioned elastic modulus range and creep recovery rate range refer to the parameter range of the first adhesive layer 121 under normal temperature conditions.

[0034] In some embodiments, the elastic modulus of the second adhesive layer 122 is greater than that of the first adhesive layer 121, and the creep recovery rate of the second adhesive layer 122 is less than that of the first adhesive layer 121. Because the cohesive strength of the second adhesive layer 122 is increased, its material composition and proportions change, thus changing the elastic modulus and creep recovery rate of the second adhesive layer 122. Due to the increased cohesive strength of the second adhesive layer 122, its bending performance is enhanced, and correspondingly, the elastic modulus of the second adhesive layer 122 is greater than that of the first adhesive layer 121. Due to the increased cohesive strength of the second adhesive layer 122, its creep performance is reduced, and correspondingly, the creep recovery rate of the second adhesive layer 122 is less than that of the first adhesive layer 121.

[0035] In some embodiments, the cohesive strength of the second adhesive layer 122 is 2 to 5 times the cohesive strength of the first adhesive layer 121. Preferably, the cohesive strength of the second adhesive layer 122 is 2 to 3 times the cohesive strength of the first adhesive layer 121. When the cohesive strength of the second adhesive layer 122 is within the above range, it can prevent the formation of air bubbles inside the second adhesive layer 122, and at the same time, it will not affect the bonding performance of the second adhesive layer 122 due to excessive cohesive strength.

[0036] In this application, the magnitude of the cohesive strength can be determined by the static shear strength, that is, the time required for a standard area of ​​tape to detach from the experimental board under a constant load (shear force).

[0037] The cohesive strength of the second adhesive layer 122 is 2 to 5 times that of the first adhesive layer 121. This means that, under the same conditions, the time required for the second adhesive layer 122 to detach from the experimental board under a constant load is 2 to 5 times that required for the first adhesive layer 121 to detach from the experimental board under a constant load. The longer the second adhesive layer 122 is bonded to the experimental board, the greater its cohesive strength.

[0038] Specifically, for example, under a temperature of 150°C, the time required for the first adhesive layer 121 of standard area to detach from the experimental board under a load of 500g is 2 days, and the time required for the second adhesive layer 122 of standard area to detach from the experimental board under a load of 500g is 6 days. Therefore, the cohesive strength of the second adhesive layer 122 is greater than the cohesive strength of the first adhesive layer 121, and it is considered that the cohesive strength of the second adhesive layer 122 is 3 times that of the cohesive strength of the first adhesive layer 121.

[0039] In some embodiments, during the bonding process of the display device 100, the bonding temperature is approximately 190°C, and the temperature of the second adhesive layer 122 is approximately 150°C. In this embodiment, the requirement for the cohesive strength of the second adhesive layer 122 is that, at a temperature of 150°C, the time required for a standard area of ​​the second adhesive layer 122 to detach from the test board under a constant load (500g weight) is greater than or equal to 6 days. Under this condition, the cohesive performance of the second adhesive layer 122 is superior, and no bubbles are generated inside the second adhesive layer 122 under the high temperature and high pressure conditions of the bonding process.

[0040] In some embodiments, both the first adhesive layer 121 and the second adhesive layer 122 can be pressure-sensitive adhesives. However, due to the different cohesive strengths of the first adhesive layer 121 and the second adhesive layer 122, the composition or ratio of the materials of the first adhesive layer 121 and the second adhesive layer 122 will be different. In this embodiment, the first adhesive layer 121 includes a first pressure-sensitive adhesive, and the second adhesive layer 122 includes a second pressure-sensitive adhesive. The cohesive strength of the second pressure-sensitive adhesive is greater than that of the first pressure-sensitive adhesive. The composition or ratio of the first pressure-sensitive adhesive and the second pressure-sensitive adhesive will be different to achieve the difference in cohesive strength between the first and second pressure-sensitive adhesives. It should be noted that the first and second pressure-sensitive adhesives can be obtained directly by purchasing commercially available pressure-sensitive adhesive products. For example, a pressure-sensitive adhesive that meets the bonding performance requirements can be selected as the first pressure-sensitive adhesive, and a pressure-sensitive adhesive that meets the bonding performance requirements and has a cohesive strength greater than that of the first pressure-sensitive adhesive can be selected as the second pressure-sensitive adhesive.

[0041] Specifically, the elastic modulus of the first pressure-sensitive adhesive can range from 5 kPa to 35 kPa, the creep recovery rate of the first pressure-sensitive adhesive can range from 200% to 500%, and the cohesive strength of the second pressure-sensitive adhesive is greater than that of the first pressure-sensitive adhesive. When the elastic modulus and creep recovery rate of the first pressure-sensitive adhesive are within the above ranges, the first adhesive layer 121 can be guaranteed to have good bending performance. At the same time, the cohesive strength of the second pressure-sensitive adhesive is greater than that of the first pressure-sensitive adhesive, which can ensure that the second pressure-sensitive adhesive will not experience cohesive failure and generate air bubbles during the bonding process.

[0042] In some embodiments, the first adhesive layer 121 and the second adhesive layer 122 are disposed separately. See also... Figure 2 , Figure 2 This is a schematic diagram of the unfolded state of a display device 100 provided in an embodiment of this application. Before bonding, the first back plate 111 and the second back plate 112 are spaced apart in a first direction X, and the first adhesive layer 121 and the second adhesive layer 122 are also spaced apart in the first direction X, which is parallel to the display panel 110. In this application, separating the first adhesive layer 121 and the second adhesive layer 122 facilitates the bending of the bending portion 102 and reduces stress during bending. Furthermore, since the materials of the first adhesive layer 121 and the second adhesive layer 122 are different, their cohesive strength and bonding performance differ. Disconnecting the first adhesive layer 121 and the second adhesive layer 122 avoids contact between the materials, preventing mutual interference in performance.

[0043] In some embodiments, please refer to Figure 2 The thickness of the second adhesive layer 122 is equal to the thickness of the first adhesive layer 121. The thickness of the first adhesive layer 121 and the thickness of the second adhesive layer 122 range from 5 μm to 30 μm. When the thickness of the first adhesive layer 121 and the thickness of the second adhesive layer 122 are within the above range, on the one hand, the bonding performance of the first adhesive layer 121 and the second adhesive layer 122 can be guaranteed, and on the other hand, excessive thickness can be avoided, which would affect the bending performance of the display device 100, as well as increase the overall thickness of the display device 100 and increase costs.

[0044] In some embodiments, please refer to Figure 3The thickness d2 of the second adhesive layer 122 can be less than the thickness d1 of the first adhesive layer 121. Under the high temperature and high pressure conditions of the bonding process, when the thickness of the second adhesive layer 122 decreases, the deformation of the second adhesive layer 122 is relatively small, the interfacial stress between the film layers is also relatively reduced, and the probability of air bubbles forming inside the second adhesive layer 122 will also decrease accordingly. This is because as the thickness of the adhesive layer increases, the internal defects (such as air bubbles, defects, and early fractures) in the adhesive layer increase rapidly in an exponential relationship, leading to a rapid decrease in cohesive strength; moreover, when the adhesive layer thickness is small, the flow and creep are smaller, the interfacial stress is smaller, and the probability of air bubbles and defects is reduced. Therefore, reducing the thickness of the second adhesive layer 122 accordingly can further improve the problem of air bubbles forming inside the second adhesive layer 122.

[0045] Specifically, the difference between the thickness of the second adhesive layer 122 and the thickness of the first adhesive layer 121 ranges from 5 μm to 20 μm, meaning the thickness of the second adhesive layer 122 is 5 μm to 20 μm less than the thickness of the first adhesive layer 121. Further, the thickness of the first adhesive layer 121 ranges from 15 μm to 30 μm, and the thickness of the second adhesive layer 122 ranges from 10 μm to 25 μm. When the thicknesses of the first adhesive layer 121 and the second adhesive layer 122 are within the above ranges, the bonding performance of the first adhesive layer 121 and the second adhesive layer 122 can be guaranteed, while preventing air bubbles from forming inside the second adhesive layer 122. Simultaneously, reducing the thickness of the second adhesive layer 122 further reduces the overall thickness of the display device 100 and lowers the cost.

[0046] In some embodiments, please continue reading Figure 1 The display device 100 also includes a polarizer 130, a cover plate 140, a composite support layer, a protective layer 170, a flexible circuit board 180, and a chip 190.

[0047] The polarizer 130 is located on the side of the display panel 110 away from the first back plate 111, and is used to improve the display effect of the display panel 110. The polarizer 130 and the cover plate 140 can be bonded together with optical adhesive 131 (OCA).

[0048] The cover plate 140 is located on the side of the polarizer 130 away from the display panel 110, and is used to protect the display panel 110. The cover plate 140 is made of a flexible material, such as ultra-thin glass (UTG), but is not limited to this.

[0049] The composite support layer is located on the side of the first back panel 111 near the second back panel 112. The composite support layer includes a third adhesive layer 151, a support layer 152, and a fourth adhesive layer 153, which are sequentially stacked from the second back panel 112 to the first back panel 111. The support layer 152 can be made of stainless steel (SUS) and serves as the main support for the display panel 110. The third adhesive layer 151 and the fourth adhesive layer 153 can be made of black adhesive or black polyimide (PI) and serve as light-shielding and adhesive materials.

[0050] Furthermore, a fifth adhesive layer 160 is also included between the composite support layer and the second back plate 112. The fifth adhesive layer 160 is used to fix the binding part 103. The material of the fifth adhesive layer 160 may be filler tape (Stiffener, STF), but is not limited to this.

[0051] The protective layer 170 is located on the side of the bent portion 102 away from the first back plate 111 and the second back plate 112. The protective layer 170 covers the surface of the bent portion 102 to protect it. The material of the protective layer 170 may be UV adhesive, but is not limited thereto.

[0052] The flexible circuit board 180 is bonded to the side of the bonding portion 103 away from the second back plate 112. The flexible circuit board 180 can be bonded to the bonding portion 103 of the display panel 110 by a flexible printed circuit on panel (FOP) bonding process, for example, by using conditions such as high temperature and high pressure to bond the flexible circuit board 180 to the bonding portion 103.

[0053] The chip 190 is bonded to the bonding portion 103 on the side away from the second backplate 112, and is located on the flexible circuit board 180 on the side near the bending portion 102.

[0054] The cohesive properties of the first adhesive layer 121 and the second adhesive layer 122 of the display device 100 described in this application will be further explained through specific experiments below.

[0055] Cohesive strength test method:

[0056] Example 1

[0057] S1, such as Figure 4As shown, a back plate 3 is attached to the first steel plate 1, wherein one side of the back plate 3 is bonded to the first steel plate 1 with a first adhesive layer 121 (first pressure-sensitive adhesive), and then the other side of the back plate 3 is attached to the second steel plate 2 with other adhesive material 4, and weights 5 required for the experiment (the size and quantity can be adjusted according to the weight) are applied to the second steel plate 2.

[0058] S2. Place the sample that was attached in step S1 into a high-temperature and high-humidity chamber, set the appropriate temperature and humidity, and observe at intervals to see if the first adhesive layer 121 has fallen off, and record the time of falloff. The test results are shown in Table 1.

[0059] Example 2

[0060] S1, such as Figure 4 As shown, a back plate 3 is attached to the first steel plate 1, wherein one side of the back plate 3 is bonded to the first steel plate 1 with a second adhesive layer 122 (second pressure-sensitive adhesive), and then the other side of the back plate 3 is attached to the second steel plate 2 with other adhesive material 4, and weights 5 required for the experiment (the size and quantity can be adjusted according to the weight) are applied to the second steel plate 2.

[0061] S2. Place the sample that was attached in S1 into a high-temperature and high-humidity chamber, set the appropriate temperature and humidity, and observe at intervals to see if the second adhesive layer at point 122 has fallen off, and record the time of falloff. The test results are shown in Table 1.

[0062] The experimental conditions for Examples 1 and 2 are the same. The only difference is the material of the adhesive layer between the steel plate 1 and the back plate. In Example 1, a first pressure-sensitive adhesive was used between the steel plate 1 and the back plate, while in Example 2, a second pressure-sensitive adhesive was used between the steel plate 1 and the back plate.

[0063] Table 1

[0064]

[0065] As shown in Table 1, the time required for the second pressure-sensitive adhesive to detach from the steel plate 1 is greater than the time required for the first pressure-sensitive adhesive to detach from the steel plate 1. This indicates that the cohesive strength of the second pressure-sensitive adhesive is greater than that of the first. With increased cohesive strength, no bubbles are generated inside the second pressure-sensitive adhesive under high-temperature conditions. This demonstrates that the display device 100 of this application ensures that the cohesive strength of the second adhesive layer 122 is greater than that of the first adhesive layer 121, thus preventing cohesive failure and bubble formation in the second adhesive layer 122 under the high-temperature and high-pressure conditions of the bonding process.

[0066] This application provides a display device. A first adhesive layer is disposed between a first back plate and a display part, and a second adhesive layer is disposed between a second back plate and a bonding part. The cohesive strength of the second adhesive layer is greater than that of the first adhesive layer. This application avoids the problem of internal bubble formation caused by the cohesive failure of the second adhesive layer under the high temperature and high pressure conditions of the bonding process by using an adhesive material with greater cohesive strength in the second adhesive layer located in the bonding area.

[0067] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0068] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0069] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0070] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. A display device, characterized in that, include: The display panel includes a display part, a bending part, and a binding part, wherein the binding part is bent to the back side of the display panel via the bending part; The first back plate is disposed on the back side of the display panel; The second back plate is disposed on the side of the first back plate away from the display panel and is located between the binding part and the first back plate; A first adhesive layer is disposed between the first back plate and the display unit; as well as A second adhesive layer is disposed between the second back plate and the bonding portion; The cohesive strength of the second adhesive layer is greater than that of the first adhesive layer.

2. The display device according to claim 1, characterized in that, The cohesive strength of the second adhesive layer is 2 to 5 times that of the cohesive strength of the first adhesive layer.

3. The display device according to claim 1, characterized in that, The display panel is a flexible display panel, and the elastic modulus of the first adhesive layer at room temperature ranges from 5 kPa to 35 kPa, and the creep recovery rate ranges from 200% to 500%.

4. The display device according to claim 1, characterized in that, The elastic modulus of the second adhesive layer is greater than that of the first adhesive layer, and the creep recovery rate of the second adhesive layer is less than that of the first adhesive layer.

5. The display device according to claim 1, characterized in that, The first adhesive layer and the second adhesive layer are disposed separately.

6. The display device according to claim 5, characterized in that, The thickness of the second adhesive layer is equal to the thickness of the first adhesive layer, and the thicknesses of the first adhesive layer and the second adhesive layer range from 5 μm to 30 μm.

7. The display device according to claim 5, characterized in that, The thickness of the second adhesive layer is less than the thickness of the first adhesive layer, and the difference between the thickness of the second adhesive layer and the thickness of the first adhesive layer ranges from 5 μm to 20 μm.

8. The display device according to claim 7, characterized in that, The thickness of the first adhesive layer ranges from 15 μm to 30 μm, and the thickness of the second adhesive layer ranges from 10 μm to 25 μm.

9. The display device according to any one of claims 1 to 8, characterized in that, The first adhesive layer includes a first pressure-sensitive adhesive, and the second adhesive layer includes a second pressure-sensitive adhesive, wherein the cohesive strength of the second pressure-sensitive adhesive is greater than the cohesive strength of the first pressure-sensitive adhesive.

10. The display device according to any one of claims 1 to 8, characterized in that, The display device further includes a flexible circuit board, which is bonded to the bonding portion.

Images