Manipulator, transmission device, transmission chamber and semiconductor process equipment

Abstract

The utility model discloses a manipulator, a transmission device, a transmission chamber and semiconductor process equipment, and the manipulator comprises a first arm which comprises a first end and a second end, and the second end can rotate around the first end; the second arm comprises a third end and a fourth end, the second arm is rotatably connected with the second end through the third end, the fourth end is provided with fingers, and the rotatable angle range of the second arm is larger than that of the first arm. According to the manipulator, the first arm can rotate around the first end to drive the second arm to the target position, the second arm rotates around the third end, and fingers can be controlled to take and place wafers. As the rotatable angle range of the second arm is larger than that of the first arm, wafer transmission can be realized without transverse movement cooperation of a guide rail, and the risk that particles easily exceed the standard in the transmission process of the guide rail is avoided. And raw materials of the transmission chamber can be reduced, so that the cost can be reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor manufacturing equipment, in particular to a mechanical hand, a transmission device, a transmission chamber and a semiconductor process equipment. BACKGROUND

[0002] Wafer manufacturing usually involves multiple etching processes, and etching efficiency directly affects the efficiency of the entire wafer production process, thereby affecting production costs. In order to improve production efficiency, the existing transmission device generally includes double mechanical arms, and when wafer transmission is performed with a process chamber, one mechanical arm is used to take out a wafer that has completed a process from the process chamber, and the other mechanical arm is used to put a wafer that has not undergone a process into the process chamber. The double mechanical arms need to be arranged on a guide rail (Track) to solve the problem of lateral movement of the double mechanical arms. Through lateral movement, rotation, extension and other actions, the wafer on the mechanical arm is transmitted to a designated station, but the guide rail increases the risk of exceeding the standard of particles in the transmission chamber during transmission. CONTENT OF THE UTILITY MODEL

[0003] In view of the above technical problems, the present application provides a mechanical hand, a transmission device, a transmission chamber and a semiconductor process equipment, which can improve the problem that the existing mechanical arm needs to be laterally moved with the aid of a guide rail when performing wafer transmission, which causes the particles in the transmission chamber to exceed the standard.

[0004] To solve the above technical problems, in a first aspect, the present application provides a mechanical hand, comprising:

[0005] A first arm comprising a first end and a second end, the second end being rotatable about the first end;

[0006] A second arm comprising a third end and a fourth end, the second arm being rotatably connected to the second end through the third end, and the fourth end being provided with a finger, and the rotatable angle range of the second arm being greater than that of the first arm.

[0007] Optionally, the second arm is provided with at least two and is arranged in a vertical direction, and each second arm is independently rotatable about the corresponding third end;

[0008] Each second arm is provided with at least one finger.

[0009] Optionally, the mechanical hand further comprises:

[0010] A third arm comprising a fifth end and a sixth end, the sixth end being rotatable about the fifth end,

[0011] The first arm is rotatably connected to the sixth end through the first end;

[0012] The third arm has a rotatable angle range smaller than that of the first arm.

[0013] Optionally, the third arm has a rotatable angle range of -135° to 135°; and / or,

[0014] The first arm has a rotatable angle range of -170° to 170°; and / or,

[0015] The second arm has a rotatable angle range of -350° to 350°.

[0016] Optionally, the third arm further performs lifting motion through the fifth end.

[0017] Optionally, the fifth end of the third arm is configured to be connected with a driving part to rotate the third arm around the fifth end and / or perform lifting motion.

[0018] The third end of each second arm is configured to be connected with the driving part to independently rotate each second arm around the respective third end.

[0019] The first end of the first arm is configured to be connected with the driving part to rotate the first arm around the first end.

[0020] Optionally, the driving part comprises a driving shaft connected with the third end of each second arm, and the driving shaft is connected with the third end of the corresponding second arm through a transmission structure of transmission belt-intermediate shaft-transmission belt.

[0021] Optionally, the finger comprises:

[0022] A connecting plate having one end connected with the fourth end;

[0023] At least two support plates connected with the other end of the connecting plate, the at least two support plates being stacked and arranged in parallel in a vertical direction with a preset gap.

[0024] Optionally, the connecting plate and the at least two support plates are integrated.

[0025] Optionally, the finger further comprises: a first clamping plate and a second clamping plate clamping the connecting plate in the middle, one end of the first clamping plate away from the support plate exceeding the connecting plate, and the part of the first clamping plate exceeding the connecting plate being provided with a fixing hole and a leveling hole.

[0026] The fixing hole is configured to connect a fastener to connect with the second arm.

[0027] The leveling hole is configured to connect a jackscrew to level the support plate.

[0028] In a second aspect, the embodiments of the present application further provide a transmission device, comprising a driving part and the mechanical hand as described in the above embodiments;

[0029] The driving part is configured to drive the first arm to rotate around the first end and drive the second arm to rotate around the third end.

[0030] In a third aspect, the embodiments of the present application further provide a transmission chamber, comprising a transmission cavity and the transmission device as described in the above embodiments, and a connecting hole is arranged on the transmission cavity;

[0031] The mechanical hand is located in the transmission cavity, and the driving part is located outside the transmission cavity, and the driving part is sealingly connected with the mechanical hand at the connecting hole.

[0032] Optionally, the driving part comprises:

[0033] a sealing cover, which covers the connecting hole;

[0034] a driving body, an output shaft of the driving body penetrating through the sealing cover and being connected with the mechanical hand.

[0035] In a fourth aspect, the embodiments of the present application further provide a semiconductor process equipment, comprising at least one process chamber, a load lock chamber and the transmission device as described in the above embodiments;

[0036] The process chamber, the load lock chamber and the transmission cavity are connected through a transmission port.

[0037] Optionally, the process chamber is arranged along the long side of the transmission cavity, and the mechanical hand is arranged at the center of the transmission cavity.

[0038] As described above, the mechanical hand of the present application, the first arm can rotate around the first end to drive the second arm to the target position, and the second arm rotates around the third end (i.e. the second end of the first arm) to control the fingers to pick and place the wafer. Since the rotatable angle range of the second arm is greater than that of the first arm, the wafer can be transmitted without the need of a guide rail for lateral movement, thereby avoiding the risk of excessive particles generated by the guide rail during transmission. In addition, the mechanical hand of the present application does not need to be arranged with a guide rail in the transmission chamber, thereby reducing the volume of the transmission chamber and indirectly reducing the raw materials of the transmission chamber, thereby reducing the cost. BRIEF DESCRIPTION OF DRAWINGS

[0039] The drawings incorporated into the specification and forming a part of the specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the application. In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the description of the embodiments will be briefly introduced. Obviously, for those of ordinary skill in the art, other drawings can also be obtained from these drawings without creative labor.

[0040] Figure 1 is a structural schematic diagram of a semiconductor process equipment of the related art;

[0041] Figure 2 is a structural schematic diagram of a transfer chamber of the related art;

[0042] Figure 3 is a structural schematic diagram of a semiconductor process equipment provided by the embodiments of the present application;

[0043] Figure 4 is a sectional structural schematic diagram of a transfer device provided by the embodiments of the present application;

[0044] Figure 5 is a sectional structural schematic diagram of a transfer device provided by the embodiments of the present application;

[0045] Figure 6 is a structural schematic diagram of a finger provided by the embodiments of the present application;

[0046] Figure 7 is a principle schematic diagram of a three-arm robot provided by the embodiments of the present application, wherein (a) is a structural schematic diagram of a three-arm robot, and (b) is a structural schematic diagram of a four-arm robot;

[0047] Figure 8 is a connection structural schematic diagram of a finger and a second arm provided by the embodiments of the present application, wherein (a) is an overall assembly drawing, (b) is an enlarged view of part A in (a), and (c) is a sectional view of a clamped connection plate 41;

[0048] Figure 9 is a structural schematic diagram of a transfer chamber provided by the embodiments of the present application;

[0049] Figure 10 is a structural schematic diagram of a single-chamber double-wafer process chamber provided by the embodiments of the present application.

[0050] The objectives, functional characteristics and advantages of the present application will be further explained with reference to the embodiments illustrated in the drawings. The embodiments explicitly illustrated in the drawings have been shown above, and will be described in more detail below. These drawings and the description related thereto are not intended to restrict the scope of the inventive concept in any way, but rather to illustrate the inventive concept by means of a specific embodiment for the person skilled in the art. DETAILED DESCRIPTION

[0051] The exemplary embodiments will be described in detail herein with reference to the accompanying drawings. In the following description, unless otherwise indicated, like numbers in the different drawings represent similar or analogous elements. The embodiments described in the following exemplary embodiments are not meant to represent all implementations consistent with the present application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of the present application as detailed in the appended claims.

[0052] It should be noted that, in this document, the terms "comprises", "comprising", or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can also include other elements not expressly listed or inherent to such process, method, article, or apparatus. An element proceeded by "comprises... a" does not, without more constraints, exclude the presence of additional identical elements in the process, method, article, or apparatus that includes the element. In the different embodiments of the present application, components, features, elements, or steps with identical names have the same or similar meanings, unless otherwise indicated.

[0053] It should further be understood that the terms "comprise", "comprising", "include", "including", "contain", "containing", "have", "having", and the like, mean that the elements, steps, operations, components, members, items, kinds, and / or groups are present, but do not preclude the presence or addition of one or more other elements, steps, operations, components, members, items, kinds, and / or groups. The term "or", "and / or", "including at least one of", and the like as used in this application can be construed in the inclusive sense, or in the sense of "one of, and / or any combination". For example, "including at least one of: A, B, and C" means "at least one of: A; B; C; A and B; A and C; B and C; and A, B, and C". As another example, "A, B, or C" or "A, B, and / or C" means "at least one of: A; B; C; A and B; A and C; B and C; and A, B, and C". This exception is made only when a combination of elements, functions, steps, or operations are in some way inherently mutually exclusive.

[0054] It should be understood that, although the terms first, second, third, etc. can be employed in this text to describe various information, these information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other. For example, without departing from the scope of this text, the first information can also be referred to as the second information, and similarly, the second information can also be referred to as the first information. Depending on the context, as used herein, the singular forms "a", "an" and "the" are intended to include plural forms as well, unless the context clearly indicates otherwise.

[0055] It should be understood that the terms "top", "bottom", "upper", "lower", "vertical", "horizontal" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0056] For the convenience of description, in the following embodiments, the orthogonal space determined by the horizontal plane and the vertical direction is taken as an example for description, and this precondition should not be understood as a limitation on the present application.

[0057] As described above, the existing transmission device generally includes a double mechanical arm, which needs to be arranged on a guide rail (Track) to solve the problem of transverse movement of the double mechanical arm. However, the guide rail will increase the risk of exceeding the standard of particles in the transmission chamber during the transmission process. Please refer to Figure 1 and Figure 2 , Figure 1 is a structural schematic diagram of a semiconductor process equipment of related art, which includes a transmission chamber (TC) 10a, six process chambers (PM1~PM6) 20a, and two wafer loading positions (LLA and LLB) 31a, 32a, for example, LLA is used to place wafers that have not been processed, and LLB is used to place wafers that have been processed. A transmission device 40a is arranged in the transmission chamber 10a, which includes a guide rail (Track) 41a and a mechanical hand 42a arranged on the guide rail (Track) 41a, the end of the mechanical hand 42a is connected with a finger 43a, through the rotation, extension (hand extension) and retraction (hand retraction) of the mechanical hand 42a, and the movement of the guide rail 41a, the wafer transmission between different process chambers 20a and wafer loading positions 31a, 32a is realized.

[0058] The transmission device 40a of the structure can realize a higher-efficiency wafer transmission action, but due to the small rotation angle of the manipulator 42a, only simple rotation and extension actions can be realized, and the wafer cannot be placed on the designated station through a large-range rotation of the manipulator 42a. The horizontal movement needs to be realized through the guide rail 41a, and the guide rail 41a increases the risk of exceeding the standard of particles in the transmission chamber 10a during transmission. In addition, in order to meet the wafer transmission range of all process chambers 20a, the guide rail 41a needs to cover the length of the entire transmission chamber 10a. Therefore, the length of the transmission chamber 10a needs to be larger, the installation of the guide rail 41a is needed, and the guide rail 41a occupies a certain longitudinal space in the transmission chamber 10a. Please refer to Figure 2 , Figure 2 is a structural schematic diagram of a semiconductor process equipment of the related art. The transmission chamber 10a is roughly T-shaped, which increases the volume of the transmission chamber 10a and consumes more material cost. Based on this, the present application provides a manipulator, a transmission device, a transmission chamber and a semiconductor process equipment.

[0059] Please refer to Figure 3 and Figure 4 , Figure 3 is a three-dimensional structural schematic diagram of a manipulator provided by an embodiment of the present application, Figure 4 is a sectional structural schematic diagram of a manipulator provided by an embodiment of the present application. The manipulator can include a first arm 10 and a second arm 20. The first arm 10 includes a first end E1 and a second end E2. The second end E2 is rotatable about the first end E1. The second arm 20 includes a third end E3 and a fourth end E4. The second arm 20 is rotatably connected to the second end E2 through the third end E3. The fourth end E4 is provided with a finger 40. The rotatable angle range of the second arm 20 is greater than the rotatable angle range of the first arm 10. For example, the rotatable angle range of the first arm 10 can be -170° to 170°, and the rotatable angle range of the second arm 20 can be -350° to 350°. It should be noted that the second arm 20 can be provided with one or more. The second arm 20 is the end arm, and each second arm 20 can be provided with one or more fingers 40. The present embodiment is not particularly limited.

[0060] Please refer to Figure 5 , Figure 5Fig. 1 is a structural schematic diagram of a semiconductor process equipment according to an embodiment of the present application. The robot of the present embodiment can be applied to the semiconductor process equipment. In operation, the first arm 10 can rotate around the first end E1 to drive the second arm 20 to a target position. The second arm 20 rotates around the third end E3 (i.e. the second end E2 of the first arm 10) to control the fingers 40 to pick and place wafers. Since the rotatable angle range of the second arm 20 is greater than that of the first arm 10, the wafer transfer can be realized without the need of a guide rail for lateral movement, thus avoiding the risk of particle exceeding standard during the transfer process. In addition, the robot of the present embodiment does not need to be provided with a guide rail in the transfer chamber, and does not need to be made into a T shape, thus reducing the volume of the transfer chamber and indirectly reducing the raw materials of the transfer chamber, thereby reducing the cost.

[0061] In one embodiment, the second arm 20 is provided with at least two, and is arranged in a vertical direction. Each second arm 20 can independently rotate around the corresponding third end E3. Each second arm 20 is provided with at least one finger 40. For example, please continue to refer to Figure 4 and Figure 5 , in the figure, the second arm 20 is provided with two, which are the lower second arm 20A and the upper second arm 20B. Each second arm 20 can be provided with two fingers 40. In application, for example, for a single-chamber double-wafer station process chamber, the second arm 20A takes out the wafer that has been made, and the second arm 20B puts in the wafer to be processed. When the second arm 20A takes out the wafer from the process chamber, each finger 40 takes out a wafer from one of the wafer stations. When the second arm 20B puts the wafer into the process chamber, each finger 40 puts a wafer into one of the wafer stations. That is, the number of fingers 40 on each second arm 20 is preferably equal to the number of wafer stations in a single chamber.

[0062] The conventional robot can only complete the taking out of one wafer and the putting in of one wafer at a time. The robot of the present embodiment, by providing at least two second arms 20 and at least one finger 40 on each second arm 20, can complete the taking out and putting in of multiple wafers (the same as the number of fingers 40) at a time after the first arm 10 drives the second arm 20 to the target position, which can greatly reduce the transfer time and improve the production efficiency.

[0063] In one embodiment, please continue to refer to Figures 3-5 , the robot can further include a third arm 30. The third arm 30 includes a fifth end E5 and a sixth end E6. The sixth end E6 is rotatable around the fifth end E5. The first arm 10 is rotatably connected to the sixth end E6 through the first end E1. The rotatable angle range of the third arm 30 is smaller than that of the first arm 10.

[0064] The embodiment can further increase the transmission range of the robot by adding the third arm 30 and the rotatable angle range of the third arm 30 is smaller than the rotatable angle range of the first arm 10. As an example, the rotatable angle range of the third arm 30 can be -135° to 135°, the rotatable angle range of the first arm 10 can be -170° to 170°, and the rotatable angle range of the second arm 20 can be -350° to 350°.

[0065] It should be noted that when the robot transports the wafer to the target station of the process chamber, the position and the angle are determined, the position determination means that the center of the wafer is coincided with the center of the station, and the angle determination means that the vertical direction of the notch of the wafer is transported to the cavity. Figure 3 As shown in FIG. 5, when the robot transports the wafer to the station, the position and the angle of the second arm 20 are determined. Figure 7 As shown in FIG. 6, the robot is simplified as a planar link. Figure 7 FIG. 1 is a schematic diagram of a three-arm robot provided by the embodiment of the application, wherein (a) is a schematic diagram of the structure of the three-arm robot of the application, and (b) is a schematic diagram of the structure of a four-arm robot. Based on the characteristics of the planar three-link robot, if the position and the angle of the end are unique, in the preferred embodiment of the application, there are at most three links. When the number of links is greater than 3, the robot does not have a determined posture, which causes unstable control of the robot. The embodiment increases the third arm 30, so that the robot includes three arms, and the position and the angle of the wafer transmission can be accurately controlled.

[0066] In one embodiment, the third arm 30 also makes lifting motion through the fifth end E5. It should be noted that Figure 1 In the process of wafer transmission of the robot of FIG. 8, three-pin pick-and-place is used when picking and placing the wafer, the movement of the robot needs to be controlled, and the lifting and retraction of the three pins in the process chamber also need to be controlled, so the control system is relatively complex. The third arm 30 of the embodiment also makes lifting motion through the fifth end E5. When picking the wafer, one of the fingers 40 of the second arm 20 is inserted into the bottom of the wafer, and then the third arm 30 is controlled to rise, the finger 40 lifts the wafer and then retracts the finger to complete the picking of the wafer. When placing the wafer, the finger 40 of the other second arm 20 carries the wafer to above the tray of the process chamber, and then the third arm 30 is controlled to descend, after the wafer is supported on the pins of the tray, the finger 40 is retracted to complete the placing of the wafer. The picking and placing process of the embodiment only needs to control the robot, so the control system is simpler, and the robot of the embodiment can be lifted, so it can match process chambers of different heights.

[0067] In one embodiment, the fifth end E5 of the third arm 30 is configured to be connected to the driving unit 50, so that the third arm 30 rotates around the fifth end E5 and the third arm 30 can also move up and down through the fifth end E5; the third end E3 of each second arm 20 is configured to be connected to the driving unit 50, so that each second arm 20 rotates independently around the respective third end E3; the first end E1 of the first arm 10 is configured to be connected to the driving unit 50, so that the first arm 10 rotates around the first end E1. It can be understood that the driving unit 50 can independently drive: (1) the third arm 30 to rotate relative to the driving unit 50 and / or the third arm 30 to move up and down relative to the driving unit 50; (2) the first arm 10 to rotate relative to the third arm 30; (3) each second arm 20 to independently rotate relative to the first arm 10.

[0068] In one embodiment, please refer to Figure 6 , Figure 6 is a structural diagram of a finger provided by an embodiment of the present application. The finger 40 can include a connecting plate 41 and at least two support plates 42. One end of the connecting plate 41 is connected to the fourth end E4 of the second arm 20, and the other end is connected to all the support plates 42. All the support plates 42 are arranged in a vertical direction according to a preset gap and are parallel. The preset gap can be the spacing between two adjacent wafers in a wafer box. By arranging multiple support plates 42, the transmission efficiency of the single-chamber multi-wafer process equipment can be improved.

[0069] As some examples, please refer to Figure 6 , all the support plates 42 can be bonded by an adhesive. The support plate 42 can be V-shaped to reduce the contact area with the wafer. A protrusion (such as a rubber boss) 421 for supporting the wafer can also be arranged on the support plate 42 to further reduce the contact area with the wafer. A wafer marking 422 can also be arranged on the support plate 42, which can intuitively determine whether the wafer is misaligned on the support plate 42. Preferably, the connecting plate 41 and all the support plates 42 are in an integrated structure, which can reduce assembly errors and improve the accuracy of wafer transmission.

[0070] In one embodiment, please refer to Figure 8 , Figure 8 is a connection structure diagram of a finger and a second arm provided by an embodiment of the present application. Wherein (a) is an overall assembly diagram, (b) is an enlarged view of part A in (a), and (c) is a cross-sectional view of the connecting plate 41 being clamped. The finger 40 can also include a first clamp plate 43 and a second clamp plate 44 clamping the connecting plate 41 in the middle. Please refer to (c) in Figure 8 , one end of the first clamp plate 43 away from the support plate 42 exceeds the connecting plate 41, and the part of the first clamp plate 43 exceeding the connecting plate 41 is provided with a fixing hole 431 and a leveling hole 432. Please refer to Figure 8(b) in the first arm 10. The fixing holes 431 are used to connect fasteners to connect with the second arms 20, and the fixing holes 431 can be provided with four. The leveling holes 432 are used to connect top wires to level the support plates 42, and the leveling holes 432 can be provided with three for three-point leveling.

[0071] The embodiments of the present application also provide a transmission device, please continue to refer to Figure 4 The transmission device can include a driving part 50 and the manipulator as described in each of the above embodiments; the driving part 50 is used to drive the first arm 10 to rotate around the first end E1 and drive the second arm 20 to rotate around the third end E3.

[0072] In other embodiments, the manipulator can also include the third arm 30 as described in each of the above embodiments, and the driving part 50 can drive the third arm 30 to rotate relative to the driving part 50.

[0073] Taking the example of providing two second arms 20 on the first arm 10 and providing two fingers 40 on each second arm 20, please continue to refer to Figure 5 The driving part 50 can include: a first driving shaft 511, a second driving shaft 512, a third driving shaft 513, a fourth driving shaft 514, a first intermediate shaft 521, a second intermediate shaft 522, a third intermediate shaft 523, a first terminal shaft 531, a second terminal shaft 532, and four driving sources (not shown in the figure) connected with the first driving shaft 511, the second driving shaft 512, the third driving shaft 513 and the fourth driving shaft 514 respectively.

[0074] The output end of the first driving shaft 511 is fixedly connected with the third arm 30, and is used to drive the third arm 30 to rotate. In other embodiments, the first driving shaft 511 can also drive the third arm 30 to make lifting movement.

[0075] The second driving shaft 512 is coaxially and rotatably arranged through the first driving shaft 511, one end of the first intermediate shaft 521 is rotatably connected with the third arm 30, and the other end is rotatably connected with the first arm 10; the output end of the second driving shaft 512 is connected with the first intermediate shaft 521 in the third arm 30 through the first transmission belt 541, and is used to drive the first intermediate shaft 521 to rotate. One end of the first terminal shaft 531 is rotatably connected with the first arm 10, and the other end is fixedly connected with the second arm 20A located below; the end of the first terminal shaft 531 connected with the first arm 10 is connected with the first intermediate shaft 521 in the first arm 10 through the second transmission belt 542, and the first intermediate shaft 521 drives the first terminal shaft 531 to rotate when rotating, so as to drive the second arm 20A located below to rotate.

[0076] The third driving shaft 513 is coaxially and rotatably arranged through the second driving shaft 512; the second intermediate shaft 522 is coaxially and rotatably arranged outside the first intermediate shaft 521, and the output end of the third driving shaft 513 is connected with the second intermediate shaft 522 in the third arm 30 through a third transmission belt 543, for driving the second intermediate shaft 522 to rotate. The second terminal shaft 532 is coaxially and rotatably arranged through the first terminal shaft 531, and one end is rotatably connected with the first arm 10 and the other end is fixedly connected with the second arm 20B located above. The one end of the second terminal shaft 532 connected with the first arm 10 is connected with the second intermediate shaft 522 in the first arm 10 through a fourth transmission belt 544, and the second intermediate shaft 522 drives the second terminal shaft 532 to rotate, so as to drive the second arm 20B located above to rotate.

[0077] The fourth driving shaft 514 is coaxially and rotatably arranged through the third driving shaft 513. The third intermediate shaft 523 is coaxially and rotatably arranged outside the second intermediate shaft 522, and one end is rotatably connected with the third arm 30 and the other end is fixedly connected with the first arm 10; the output end of the fourth driving shaft 514 is connected with the third intermediate shaft 523 in the third arm 30 through a fifth transmission belt 545, for driving the third intermediate shaft 523 to rotate, so as to drive the first arm 10 to rotate.

[0078] The four driving sources respectively drive the first driving shaft 511, the second driving shaft 512, the third driving shaft 513 and the fourth driving shaft 514 to rotate independently. Exemplarily, the above transmission belts can be steel belts.

[0079] It can be understood that the power transmission processes of the above driving structures are respectively as follows:

[0080] (1) the first driving shaft 511-the third arm 30;

[0081] (2) the second driving shaft 512-the first transmission belt 541-the first intermediate shaft 521-the second transmission belt 542-the first terminal shaft 531-the second arm 20A located below;

[0082] (3) the third driving shaft 513-the third transmission belt 543-the second intermediate shaft 522-the fourth transmission belt 544-the second terminal shaft 532-the second arm 20B located above;

[0083] (4) the fourth driving shaft 514-the fifth transmission belt 545-the third intermediate shaft 523-the first arm 10.

[0084] It can be understood that when more second arms 20 are provided, and more fingers 40 are provided on each second arm 20, the number of driving sources, the number of driving shafts, the number of intermediate shafts, the number of transmission belts, and the number of end shafts can be increased accordingly, and the structure principle shown in Figure 5 can be designed.

[0085] The embodiment of the present application also provides a transmission chamber, please refer to Figure 9 , the transmission chamber can include a transmission cavity 100, and the transmission device as described in each of the above embodiments, the transmission cavity 100 is provided with a connecting hole (not shown in the figure), the robot is located in the transmission cavity 100, the driving part 50 is located outside the transmission cavity 100, and the driving part 50 is sealingly connected with the robot at the connecting hole.

[0086] As an example, combined with Figure 4 and Figure 9 , the driving part 50 can include a sealing cover 51 and a driving body 52, the sealing cover 51 covers the connecting hole of the transmission cavity 100, and the output shaft of the driving body 52 passes through the sealing cover 51 and is connected with the robot.

[0087] The embodiment of the present application also provides a semiconductor process equipment, please refer to Figure 3 , including at least one process chamber 200, a load lock chamber 300, and a transmission device as described in each of the above embodiments, the process chamber 200, the load lock chamber 300 and the transmission cavity 100 are connected through a wafer port, the load lock chamber 300 is an atmospheric end chamber, which can be used to store wafers to be processed and wafers that have completed the process. The robot is used for wafer transmission between the transmission cavity 100 and the process chamber 200, and between the transmission cavity 100 and the load lock chamber 300.

[0088] As an example, please refer to Figure 3 , the process chamber 200 is arranged along the long side of the transmission cavity 100, and the robot is arranged at the center of the transmission cavity 100, so that the wafer transmission between the robot and each process chamber 200 can be realized without the lateral movement of the guide rail.

[0089] In one embodiment, the transmission cavity 100 is rectangular, a plurality of process chambers 200 are symmetrically distributed along two long sides of the transmission cavity 100, the process chamber 200 is rectangular, a plurality of wafer carriers 210 are arranged in the process chamber 200 along the long side of the process chamber 200, and the size of the wafer port is less than the sum of the distance between the centers of the two wafers located at the outermost side and the diameter of the wafer.

[0090] Taking a single-chamber double-wafer structure as an example, please refer to Figure 3 and Figure 10 , Figure 10is a structural schematic diagram of a single-chamber dual-wafer process chamber provided by an embodiment of the present application. Two wafer carrier plates 210 are arranged along the long side of the process chamber 200 in the process chamber 200, and the size M of the wafer transfer port is less than the sum N of the distance between the centers of the two wafers and the diameter of the wafer.

[0091] The semiconductor process equipment of the embodiment has a small size of the wafer transfer port of the process chamber 200, which can make the airflow field of the process chamber 200 more stable and is beneficial to improving the uniformity of the process. During wafer transfer, the robot can transfer the wafers along the middle C direction (i.e., at a certain angle with the vertical direction). Figure 10 The middle C direction (i.e., at a certain angle with the vertical direction).

[0092] For other working principles and processes of the transfer device, the transfer chamber and the semiconductor process equipment of the embodiment, refer to the foregoing description of the robot of the embodiment of the present application, which will not be described here.

[0093] The above has introduced in detail a robot, a transfer device, a transfer chamber and a semiconductor process equipment provided by the present application, and the principles and implementation manners of the present application have been described by applying specific examples. It should be noted that the description of each embodiment in the present application has its own emphasis, and the parts not described or recorded in a certain embodiment can be referred to the related description of other embodiments.

[0094] The above is only the preferred embodiment of the present application, and does not limit the patent scope of the present application. Each technical feature of the technical solution of the present application can be combined arbitrarily. In order to make the description simple, each technical feature in the above embodiments is not described in all possible combinations. Any equivalent structure or equivalent flow conversion obtained by using the content of the present application and the drawings, or directly or indirectly applied in other related technical fields, as long as the combination of these technical features does not exist contradiction, is also included in the patent protection scope of the present application.

Claims

1. A robotic arm, characterized in that, include: The first arm includes a first end and a second end, wherein the second end is rotatable about the first end; The second arm includes a third end and a fourth end. The second arm is rotatably connected to the second end via the third end. The fourth end is provided with fingers. The rotation angle range of the second arm is greater than that of the first arm. The fingers include: Connecting plate; The support plate is connected to the connecting plate; The connecting plate is held between a first clamping plate and a second clamping plate. The end of the first clamping plate away from the support plate extends beyond the connecting plate. The end of the first clamping plate away from the support plate is connected to the fourth end. The portion of the first clamping plate extending beyond the connecting plate is provided with a leveling hole. The leveling hole is used to connect the set screw to level the support plate.

2. The robotic arm according to claim 1, characterized in that, The second arm is provided in at least two parts and is arranged in a vertical direction. Each second arm can rotate independently around the corresponding third end. Each of the second arms is provided with at least one of the fingers.

3. The robotic arm according to claim 2, characterized in that, Also includes: The third arm includes a fifth end and a sixth end, wherein the sixth end is rotatable about the fifth end. The first arm is rotatably connected to the sixth end via the first end; The rotation angle range of the third arm is smaller than that of the first arm.

4. The robotic arm according to claim 3, characterized in that, The third arm has a rotational angle range of -135° to 135°; and / or, The first arm has a rotational angle range of -170° to 170°; and / or, The second arm has a rotation angle range of -350° to 350°.

5. The robotic arm according to claim 3, characterized in that, The third arm also moves up and down via the fifth end.

6. The robotic arm according to claim 5, characterized in that, The fifth end of the third arm is used to connect to the drive unit so that the third arm rotates around the fifth end and / or performs lifting and lowering movements; The third end of each second arm is used to connect to the drive unit so that each second arm can rotate independently about its respective third end; The first end of the first arm is used to connect to the drive unit so that the first arm rotates about the first end.

7. The robotic arm according to claim 6, characterized in that, The drive unit includes a drive shaft connected to the third end of each of the second arms, the drive shaft being connected to the third end of the corresponding second arm via a transmission structure of drive belt-intermediate shaft-drive belt.

8. The robotic arm according to any one of claims 1-7, characterized in that, The support plate is provided in at least two parts, and all the support plates are stacked and arranged in parallel in the vertical direction with a preset gap.

9. The robotic arm according to claim 8, characterized in that, The connecting plate and the at least two supporting plates are an integrated structure.

10. The robotic arm according to claim 9, characterized in that, The portion of the first clamping plate extending beyond the connecting plate is provided with fixing holes; The fixing hole is used to connect fasteners for connection to the second arm.

11. A transmission device, characterized in that, It includes a drive unit and a robotic arm as described in any one of claims 1-10; The drive unit is used to drive the first arm to rotate around the first end, and to drive the second arm to rotate around the third end.

12. A transmission chamber, characterized in that, It includes a transmission cavity and the transmission device according to claim 11, wherein the transmission cavity is provided with a connection hole; The robotic arm is located inside the transmission cavity, and the drive unit is located outside the transmission cavity. The drive unit and the robotic arm are sealed together at the connection hole.

13. The transmission chamber according to claim 12, characterized in that, The drive unit includes: A sealing cap is used to seal the connection hole. A drive body, the output shaft of which passes through the sealing cover and is connected to the robotic arm.

14. A semiconductor process apparatus, characterized in that, It includes at least one process chamber, a load locking chamber, and the transfer chamber as described in claim 12 or 13; The process chamber, the load locking chamber, and the transmission chamber are connected via a transfer port.

15. The semiconductor process equipment according to claim 14, characterized in that, The process chamber is arranged along the long side of the transmission cavity, and the robotic arm is located at the center of the transmission cavity.

Images