Earphone

Abstract

The utility model discloses an earphone, which comprises a shell, a sound production unit and a sound guide structure, and is characterized in that the shell is provided with a mounting cavity and a sound outlet hole communicated with the mounting cavity; the sound production unit is arranged in the mounting cavity, and the sound production unit and the mounting cavity jointly define a rear cavity; the sound guide structure is arranged in the shell and is communicated with the rear cavity and the sound outlet hole; wherein the shell comprises a shell body and a cover body, the shell body is provided with a first pipe groove part, the cover body is provided with a second pipe groove part, and the cover body covers the shell body, so that the first pipe groove part and the second pipe groove part are encircled to form the sound guide structure. The earphone can improve the low-frequency performance of the earphone, and is applied to the technical field of audio equipment.

Description

Technical Field

[0001] This utility model relates to the field of audio equipment technology, and in particular to headphones. Background Technology

[0002] Compared to closed-back headphones, open-back headphones do not penetrate deeply into the ear canal. This greater distance results in significant low-frequency leakage, leading to a greater bass loss compared to closed-back headphones, thus resulting in poor bass performance. Furthermore, as users increasingly demand portability and aesthetics, the size of open-back headphones needs to be further reduced. This shrinkage reduces the volume of the speaker enclosure, which plays a crucial role in low-frequency response, further diminishing the bass performance of open-back headphones. Utility Model Content

[0003] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes a headphone capable of improving its low-frequency performance.

[0004] The earphones according to an embodiment of the present invention include:

[0005] The housing has a mounting cavity and a sound outlet communicating with the mounting cavity;

[0006] The sound-generating unit is located within the mounting cavity, and the mounting cavity is separated into a rear cavity;

[0007] A sound guiding structure is disposed within the housing and connects the rear cavity with the sound outlet.

[0008] The housing includes a shell body and a cover. The shell body has a first groove portion, and the cover has a second groove portion. The cover is placed on the shell body so that the first groove portion and the second groove portion together form the sound guiding structure.

[0009] The earphones according to the embodiments of the present invention have at least the following beneficial effects:

[0010] 1. The sound guide structure provides a larger space for the diffusion and radiation of low-frequency sounds emitted from the rear cavity, thereby reducing the probability of acoustic short circuits. At the same time, the space within the sound guide structure makes it easier for low-frequency sounds to resonate. The reflected sound waves and the original sound waves are more likely to superimpose and interfere with each other. The low-frequency sound is affected by resonance and its intensity increases, making the low-frequency sound emitted from the sound hole fuller, rounder and deeper, thereby improving the low-frequency performance of the headphones.

[0011] 2. The sound-guiding structure is formed by utilizing the space between the shell and the cover, which makes the internal space of the sound-guiding structure larger. This allows for a larger reflection space of sound waves within the sound-guiding structure, enabling sound waves to resonate at lower frequencies and improving the low-frequency performance of the headphones.

[0012] According to some embodiments of the present invention, the first tube groove portion has a first abutting surface, the second tube groove portion has a second abutting surface, and the second abutting surface seals against the first abutting surface.

[0013] According to some embodiments of the present invention, the first abutting surface includes an outwardly convex arc surface, and the second abutting surface includes an inwardly concave arc surface, wherein the outwardly convex arc surface seals against the inwardly concave arc surface.

[0014] According to some embodiments of the present invention, the housing further includes a sealing recess and a sealing protrusion that are both distributed along the sound output direction of the sound guiding structure. The sealing recess is disposed on one of the first abutting surface and the second abutting surface, and the sealing protrusion is disposed on the other. The sealing recess and the sealing protrusion are sealed together.

[0015] According to some embodiments of the present invention, the housing further includes a sealing layer disposed between the first abutting surface and the second abutting surface.

[0016] According to some embodiments of this utility model, the sound guiding structure is distributed in a serpentine pattern.

[0017] According to some embodiments of this utility model, the length of the sound guiding structure along the sound output direction of the sound guiding structure is L, the maximum width of the sound guiding structure is D, and the earphone satisfies: 8mm≤L≤20mm, 1.5mm≤D≤3mm.

[0018] According to some embodiments of the present invention, the housing includes at least two of the sound outlet holes.

[0019] According to some embodiments of the present invention, at least two of the sound outlet holes are arranged in the same axial direction, and the sound guiding structure is connected to one of the sound outlet holes.

[0020] According to some embodiments of the present invention, the earphone further includes a separator that divides the mounting cavity into a first cavity and a second cavity. The first cavity is equipped with the sound-generating unit and is connected to all the sound outlet holes. The second cavity is used to install electronic components.

[0021] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0022] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0023] Figure 1 This is a cross-sectional schematic diagram of an earphone according to an embodiment of the present invention;

[0024] Figure 2 This is an exploded cross-sectional view of an earphone according to an embodiment of the present invention;

[0025] Figure 3 This is a cross-sectional schematic diagram of the shell body portion of an earphone according to an embodiment of the present invention;

[0026] Figure 4 This is a schematic diagram of the structure of an earphone in an embodiment of the present invention when the first abutting surface and the second abutting surface are about to abut. In this diagram, a) is a schematic diagram when the first abutting surface is an outwardly convex arc surface and the second abutting surface is an inwardly concave arc surface; b) is a schematic diagram when the first abutting surface has a sealing protrusion and the second abutting surface has a sealing concave portion; c) is a schematic diagram when there is a sealing layer between the first abutting surface and the second abutting surface.

[0027] Figure 5 This is a graph showing the simulation data of different sizes of the sound guide structure in an earphone according to an embodiment of the present invention. In the graph, d) is the data curve of the length of the sound guide structure along the sound output direction while the maximum width of the sound guide structure remains unchanged, and e) is the data curve of the maximum width of the sound guide structure while the length of the sound guide structure along the sound output direction remains unchanged.

[0028] Figure 6 This is a graph showing the frequency response data of an earphone according to an embodiment of the present invention.

[0029] Icon labels:

[0030] Housing 100; mounting cavity 101; sound outlet 102; rear cavity 103; first sub-cavity 104; second sub-cavity 105;

[0031] Shell body 110; first tube groove portion 111; first abutment surface 1111;

[0032] Cover 120; Second tube groove 121; Second abutment surface 1211;

[0033] Sealing concave portion 130; sealing convex portion 140; sealing layer 150;

[0034] 200 sound-producing units;

[0035] Sound guiding structure 300;

[0036] Separator 400. Detailed Implementation

[0037] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0038] In the description of this utility model, it should be understood that the orientation descriptions, such as up, down, etc., are based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0039] In the description of this utility model, "several" refers to one or more, and "multiple" refers to two or more. The use of "first" and "second" is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, the number of indicated technical features, or the sequential relationship between indicated technical features.

[0040] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0041] In related technologies, open-back headphones are placed outside the ear and do not penetrate the ear canal as deeply as closed-back headphones. The distance between open-back headphones and the ear canal is greater than that of closed-back headphones. This causes low-frequency sounds from open-back headphones to leak outside the ear canal, making it difficult for them to penetrate deeply. The direct impression given to users of open-back headphones is poor low-frequency sound quality. Furthermore, due to the need for portability and aesthetics, the size of open-back headphones has been further reduced, resulting in less space within the rear cavity reserved for low-frequency performance, further decreasing their low-frequency capabilities.

[0042] Reference Figures 1 to 4 As shown in the figure, this utility model embodiment proposes an earphone, which can be an open-back wireless earphone, an open-back wired earphone, an open-back neckband earphone, or other open-back earphones that do not go into the ear. The earphone can be equipped with call noise reduction function and / or artificial intelligence noise reduction function; at the same time, it can also be equipped with stereo surround sound and other functions.

[0043] The headphones include: a housing 100, a sound-generating unit 200, and a sound-conducting structure 300.

[0044] The housing 100 has a mounting cavity 101 and a sound outlet 102 communicating with the mounting cavity 101.

[0045] Specifically, the housing 100 is a hollow structure with a mounting cavity 101. The housing 100 includes a housing body 110 and a cover 120. One end of the housing body 110 has an opening, and the cover 120 covers the opening. The housing body 110 and the cover 120 cooperate to form the mounting cavity 101. One side of the housing body 110 has a sound outlet 102, which connects the mounting cavity 101 to the outside, allowing sound waves in the mounting cavity 101 to be discharged from the sound outlet 102. The sound outlet 102 also has the function of maintaining air pressure balance, so that the sound outlet 102 can maintain stable air pressure in the mounting cavity 101. As another embodiment, the housing body 110 may have a first half-hole, and the cover 120 may have a second half-hole. When the cover 120 covers the housing body 110, the first half-hole and the second half-hole together form the sound outlet 102, or the cover 120 may have a sound outlet 102 on one side.

[0046] The sound-generating unit 200 is located inside the mounting cavity 101, and the mounting cavity 101 is separated into a rear cavity 103.

[0047] Specifically, the sound-generating unit 200 includes a fixed cavity and a diaphragm. The diaphragm can vibrate and produce sound. A sound-producing cavity is formed between the diaphragm and the fixed cavity. The gap between the fixed cavity and the mounting cavity 101 defines a rear cavity 103. The rear cavity 103 provides a larger diffusion and radiation space for the low-frequency sound emitted from the rear of the sound-generating unit 200, thereby enhancing the low-frequency performance of the headphones. A mounting groove is formed on the inner wall of the other end of the housing 100. The side of the sound-generating unit 200 where the diaphragm is located is mounted in the mounting groove, and the edge of the sound-generating unit 200 is positioned through the mounting groove. The diaphragm of the sound-generating unit 200 is opposite to and spaced apart from the bottom of the mounting groove, forming a front cavity. The front cavity can provide a certain range of diffusion and radiation space for the high-frequency sound emitted from the front of the diaphragm. The housing 100 also forms a main sound hole within the mounting groove. The main sound hole connects the front cavity to the outside to ensure the sound transparency of the sound-generating unit 200.

[0048] It should be noted that low-frequency sounds are characterized by longer wavelengths, longer propagation distances, and stronger penetrating power. The design of the rear cavity 103 provides a larger space for the diffusion and radiation of low-frequency sounds, which can reduce the risk of sound returning directly or canceling each other out, thereby reducing the risk of acoustic short circuits. It can also make low-frequency sounds fuller, rounder, and deeper, improving the sound quality.

[0049] The sound guiding structure 300 is located inside the housing 100 and connects the rear cavity 103 with the sound outlet 102.

[0050] It is understandable that the sound guide structure 300 can provide a larger diffusion and radiation space for the low-frequency sound emitted from the rear cavity 103, thereby reducing the probability of acoustic short circuit. At the same time, the space within the sound guide structure 300 can make low-frequency sound more likely to resonate. The reflected sound waves and the original sound waves are more likely to superimpose and interfere with each other. The low-frequency sound is affected by the resonance and its intensity increases, making the low-frequency sound emitted from the sound outlet 102 fuller, rounder and deeper, thereby improving the low-frequency performance of the headphones.

[0051] It should be noted that, as shown in the attached document... Figure 5 As shown, when low-frequency sounds resonate, the simulated data graph of the sound waves will display obvious peaks. The horizontal axis of the peak is the resonance frequency of the low-frequency sound, and the vertical axis of the peak is the intensity of the low-frequency sound. Therefore, the closer the horizontal axis of the peak is to the origin, the lower the resonance frequency of the headphones; the further the vertical axis of the peak is from the origin, the greater the intensity of the low-frequency sound.

[0052] The shell 100 includes a shell body 110 and a cover 120. The shell body 110 has a first tube groove 111, and the cover 120 has a second tube groove 121. The cover 120 covers the shell body 110, and the first tube groove 111 and the second tube groove 121 together form a sound guiding structure 300.

[0053] Specifically, in related technologies, the sound guiding structure 300 is separately disposed within the shell body 110. When the overall size of the shell 100 is reduced, the size of the shell body 110 is also further reduced, resulting in a smaller space to accommodate the sound guiding structure 300. The sound guiding structure 300 has limited enhancement of low-frequency sound. In this embodiment, the sound guiding structure 300 is formed by the first tube groove portion 111 of the shell body 110 and the second tube groove portion 121 of the cover 120. This allows the sound guiding structure 300 to utilize most of the space between the cover 120 and the shell body 110, thereby increasing the size space of the sound guiding structure 300 and further improving the enhancement of low-frequency sound by the sound guiding structure 300, resulting in better low-frequency performance of the headphones.

[0054] It is understandable that when the sound waves emitted by the sound unit 200 enter the sound guide structure 300 from the rear cavity 103, the sound waves will collide and reflect within the sound guide structure 300 and superimpose and interfere with the original sound waves. At a certain low frequency, the intensity of the sound waves is increased, thereby forming resonance and improving the low-frequency performance of the headphones. The sound guide structure 300 is formed by utilizing the space between the shell body 110 and the cover 120, making the internal space of the sound guide structure 300 larger. This results in a larger reflection space for the sound waves within the sound guide structure 300, allowing the sound waves to resonate at lower frequencies and improving the low-frequency performance of the headphones.

[0055] Reference Figure 4As shown, in some specific embodiments of this utility model, the first tube groove portion 111 has a first abutting surface 1111, and the second tube groove portion 121 has a second abutting surface 1211. The second abutting surface 1211 seals against the first abutting surface 1111, and the first tube groove portion 111 and the second tube groove portion 121 together form a sealed sound guiding structure 300, which can prevent sound leakage from the sound guiding structure 300 and further improve the resonance ability of low-frequency sound within the sound guiding structure 300, so that the headphones have better low-frequency performance.

[0056] Furthermore, referring to Figure 4 As shown in a), the first abutting surface 1111 includes an outwardly convex arc surface, and the second abutting surface 1211 includes an inwardly concave arc surface, with the outwardly convex arc surface sealingly abutting against the inwardly concave arc surface.

[0057] Specifically, an abutment gap is formed between the first abutment surface 1111 and the second abutment surface 1211. The first tube groove 111 also includes a groove wall with two opposing groove sides. When both the first abutment surface 1111 and the second abutment surface 1211 are planes perpendicular to the groove sides, the shape of the abutment gap along its width direction is a straight line. When the first abutment surface 1111 is an outwardly convex arc surface and the second abutment surface 1211 is an inwardly concave arc surface, the shape of the abutment gap along its width direction is a curve. The length of the curve will be greater than the length of the straight line, which makes the sealing performance between the first abutment surface 1111 and the second abutment surface 1211 better, and low-frequency sounds are difficult to pass through the abutment gap and leak.

[0058] As another implementation, the first abutting surface 1111 and the second abutting surface 1211 can also be inclined surfaces that are angled to the side of the groove. The inclined surface can be a curved surface or a plane. When the inclined surface is a plane, the shape of the abutting gap along its width direction is an oblique straight line. Compared with the straight line formed when the first abutting surface 1111 and the second abutting surface 1211 are both planes perpendicular to the side of the groove, the oblique straight line has an increased length, which makes the sealing performance between the first abutting surface 1111 and the second abutting surface 1211 better.

[0059] Furthermore, referring to Figure 4 As shown in b), the housing 100 also includes a sealing recess 130 and a sealing protrusion 140, both distributed along the sound output direction of the sound guiding structure 300. The sealing recess 130 is disposed on one of the first abutment surface 1111 and the second abutment surface 1211, and the sealing protrusion 140 is disposed on the other. The sealing recess 130 and the sealing protrusion 140 are sealed together.

[0060] Specifically, the sealing protrusion 140 and the sealing recess 130 are distributed along the sound output direction of the sound guiding structure 300. When the cover 120 is closed on the shell body 110, the sealing protrusion 140 and the sealing recess 130 abut against each other and seal together to increase the contact area between the first contact surface 1111 and the second contact surface 1211. This increases the distance that low-frequency sound travels through the side wall of the sound guiding structure 300 between the first contact surface 1111 and the second contact surface 1211 in the direction of penetrating the side wall of the sound guiding structure 300. Low-frequency sound needs to travel a longer distance to pass through the gap forming the sound guiding structure 300, and low-frequency sound is less likely to leak from the position between the first contact surface 1111 and the second contact surface 1211.

[0061] In this embodiment, the sealing protrusion 140 is a semi-cylindrical protrusion, and the sealing recess 130 is a semi-cylindrical groove. The protrusion and groove are adapted to each other and seal against each other between the first abutment surface 1111 and the second abutment surface 1211, thereby further increasing the length of the abutment gap to improve the sealing performance between the first abutment surface 1111 and the second abutment surface 1211. As another embodiment, the sealing protrusion 140 can also be a protruding corner, and the sealing recess 130 can be a recessed corner groove, with the corner and corner groove being adapted to each other. Multiple sealing protrusions 140 are distributed along the width direction of the sidewall of the sound guiding structure 300, and the sealing recesses 130 correspond one-to-one with the sealing protrusions 140.

[0062] Furthermore, referring to Figure 4 As shown in c), the housing 100 also includes a sealing layer 150, which is disposed between the first abutment surface 1111 and the second abutment surface 1211.

[0063] Specifically, when the first contact surface 1111 and the second contact surface 1211 abut against each other through the sealing layer 150, the sealing layer 150 is subjected to pressure and seals the gap between the first contact surface 1111 and the second contact surface 1211, making the sound guiding structure 300 more sealing and preventing sound leakage, thereby increasing the low-frequency performance of the headphones.

[0064] In this embodiment, the sealing layer 150 is made of sealing EVA (EVA specifications: hardness 30-50 degrees, thickness 0.5-1.0mm), or sealing foam (specifications: hardness 30-50 degrees, thickness 0.5-1.0mm), or sealing silicone (specifications: hardness 30-50 degrees, thickness 0.5-1.0mm), etc.

[0065] In this embodiment, the sealing layer 150 may be pre-fixed to the first abutment surface 1111 or the second abutment surface 1211. Alternatively, the sealing layer 150 may include a first layer and a second layer, with the first layer fixed to the first abutment surface 1111 and the second layer fixed to the second abutment surface 1211. The specific fixing method may be a connection method such as adhesive bonding. Alternatively, the sealing layer 150 may be a separate part. Before the shell body 110 and the cover body 120 are assembled, the sealing layer 150 is placed on the first abutment surface 1111 or the second abutment surface 1211. After the shell body 110 and the cover body 120 are assembled, the sealing layer 150 is fixed by the clamping force of the first abutment surface 1111 and the second abutment surface 1211.

[0066] Reference Figure 3 As shown, in some specific embodiments of this utility model, the sound guiding structure 300 is distributed in a serpentine pattern.

[0067] It is worth noting that the serpentine sound guide structure 300 has a longer length to provide a larger space for the diffusion and radiation of low-frequency sounds, allowing low-frequency sounds to resonate at lower frequencies and further improving the low-frequency performance of the headphones.

[0068] Reference Figure 5 As shown, in some specific embodiments of this utility model, the length of the sound guiding structure 300 along the sound output direction is L, and the maximum width of the sound guiding structure 300 is D. The earphone satisfies: 8mm≤L≤20mm, 1.5mm≤D≤3mm. Specifically, when the cross-section of the sound guiding structure 300 perpendicular to the sound output direction is circular, the width direction of the sound guiding structure 300 is its radial direction, and the maximum width is its maximum diameter. When the cross-section of the sound guiding structure 300 perpendicular to the sound output direction is rectangular or other polygonal, the maximum width of the sound guiding structure 300 is the maximum value along the width direction.

[0069] Specifically, the headphones were simulated and tested using different size parameters, and the measured data are as follows: Figure 5 As shown in d) and c), the summary is as follows:

[0070] L = 8mm, D = 2mm, the simulated resonance frequency is 108Hz, and the sound intensity is 85dB;

[0071] L = 10mm, D = 2mm, the simulated resonance frequency is 98Hz, and the sound intensity is 87dB;

[0072] L = 5mm, D = 2mm, the simulated resonance frequency is 136Hz, and the sound intensity is 90dB;

[0073] L = 8mm, D = 2.5mm, the simulated resonance frequency is 139Hz, and the sound intensity is 89dB;

[0074] L = 8mm, D = 1.5mm, the simulated resonance frequency is 80Hz, and the sound intensity is 81dB.

[0075] Therefore, it can be seen that, with the maximum width of the sound-conducting structure 300 remaining unchanged, an increase in the length of the sound-conducting structure 300 along the sound output direction results in a decrease in the resonance frequency. Figure 5 In d), this is manifested as follows: the wave crest moves along the horizontal axis to the origin, and simultaneously, the sound intensity decreases accordingly. Figure 5 In d), this is reflected as: the wave crest moves along the vertical axis toward the origin.

[0076] With the length of the sound-conducting structure 300 along the sound output direction remaining constant, the maximum width of the sound-conducting structure 300 increases, and the resonant frequency decreases. Figure 5 In (e), this is manifested as: the wave crest shifts along the horizontal axis towards the origin, while the sound intensity decreases accordingly. Figure 5 In (e), this is reflected as: the wave crest moves along the vertical axis towards the origin.

[0077] Therefore, a lower resonance frequency results in a wider low-frequency response range for the headphones, which improves the sound quality. However, the sound intensity also decreases accordingly. Technicians can choose between low-frequency performance and sound intensity based on specific design needs and select appropriate size parameters.

[0078] Reference Figure 1 and Figure 2 As shown, in some specific embodiments of this utility model, the housing 100 includes at least two sound outlets 102, and the multiple sound outlets 102 can improve the bass elasticity and power of the headphones.

[0079] It should be noted that when miniaturizing open-back headphones, the volume of the rear cavity 103 decreases, and the exhaust position is closer to the sound-generating unit 200, resulting in low-frequency sound attenuation, affecting the elasticity and power of the bass, and reducing the bass effect of the headphones. In this embodiment, through the design of the sound guide structure 300 and the sound outlet 102, low-frequency sound can be slowed down by the sound guide structure 300, and the low-frequency sound intensity can be further increased through resonance, while the low-frequency frequency during resonance is reduced, thereby improving the elasticity and power of the bass.

[0080] Reference Figure 1 and Figure 2 As shown, in some specific embodiments of this utility model, at least two sound outlet holes 102 are arranged in the same axial direction, and the sound guiding structure 300 is connected to one of the sound outlet holes 102.

[0081] It is understandable that when the sound outlets 102 are oriented in the same direction, interference will occur when the sound emitted from the sound-generating unit 200 propagates through different paths due to the different directions of the sound outlets 102. Orienting multiple different sound outlets 102 along the same axis allows the sound to propagate in the same direction, thus providing a certain degree of amplification. In this embodiment, referring to... Figure 1 As shown, when the two sound holes 102 are oriented in the same direction, the sound intensity at a frequency of around 200Hz on the horizontal axis can be enhanced, thereby improving the spatial and stereoscopic feel of the sound.

[0082] Reference Figure 1 and Figure 2 As shown, in some specific embodiments of this utility model, the earphone also includes a separator 400, which divides the mounting cavity 101 into a first cavity 104 and a second cavity 105. The first cavity 104 is equipped with a sound-generating unit 200 and is connected to all sound outlet holes 102. The second cavity 105 is used to install electronic components.

[0083] It is understandable that the separator 400 separates the sound-emitting unit 200 from other electronic components, including batteries, motherboards and other parts. Within the first cavity 104, the separator 400 and the sound-emitting unit 200 form a rear cavity 103. Through the separation of the separator 400, the space of the first cavity 104 and the rear cavity 103 formed within it is relatively pure, and the movement of sound waves within this space is more in line with the design expectations, thereby making the low-frequency sound purer.

[0084] Specifically, the shell body 110 has a first slot, and a separator 400 covers the opening of the first slot, defining a first cavity 104. A sound-emitting unit 200 is disposed within the first cavity 104, spaced apart from the separator 400. This space forms a rear cavity 103, resulting in purer sound from the sound-emitting unit 200 and purer transmission of low-frequency sounds within the rear cavity 103, thereby improving the headphone's sound quality. In this embodiment, the inner peripheral wall of the first slot near the opening has a mounting protrusion. The separator 400 is mounted on the mounting protrusion, covering the opening of the first slot and spaced apart from the sound-emitting unit 200.

[0085] For ease of understanding, some specific embodiments and experimental parameters are provided below as examples.

[0086] Comparative Example 1

[0087] The headphones have a rear cavity 103 and a single sound outlet 102, with the rear cavity 103 directly connected to the sound outlet 102.

[0088] Example 1

[0089] The earphone has a rear cavity 103 and two sound outlets 102. The rear cavity 103 is directly connected to one of the sound outlets 102, and the rear cavity 103 is connected to the other sound outlet 102 through a sound guide structure 300. The sound guide structure 300 is configured with L = 13mm and D = 2mm.

[0090] After testing, the frequency response curve of the headphones should be as follows: Figure 6 As shown, Figure 6 The red curve in the figure represents Comparative Example 1. Figure 6 The blue curve in the image represents Example 1. (From...) Figure 6 As can be seen from the headphone frequency response curve, compared with Comparative Example 1, Example 1 has an increased low-frequency bandwidth. The music played by the headphones in Example 1 is characterized by: more elastic low-frequency sound, significantly enhanced low-frequency sound intensity, and correspondingly enhanced sense of space.

[0091] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. An earphone, characterized in that, include: The housing has a mounting cavity and a sound outlet communicating with the mounting cavity; The sound-generating unit is located within the mounting cavity, and the mounting cavity is separated into a rear cavity; A sound guiding structure is disposed within the housing and connects the rear cavity with the sound outlet. The housing includes a shell body and a cover. The shell body has a first groove portion, and the cover has a second groove portion. The cover is placed on the shell body so that the first groove portion and the second groove portion together form the sound guiding structure.

2. The earphone according to claim 1, characterized in that: The first tube groove has a first abutting surface, and the second tube groove has a second abutting surface, the second abutting surface sealingly abutting against the first abutting surface.

3. The earphone according to claim 2, characterized in that: The first abutting surface includes an outwardly convex arc surface, and the second abutting surface includes an inwardly concave arc surface, wherein the outwardly convex arc surface seals against the inwardly concave arc surface.

4. The earphone according to claim 2, characterized in that: The housing also includes a sealing recess and a sealing protrusion, both distributed along the sound output direction of the sound guiding structure. The sealing recess is located on one of the first abutment surface and the second abutment surface, and the sealing protrusion is located on the other. The sealing recess and the sealing protrusion are sealed together.

5. The earphone according to claim 2, characterized in that: The housing also includes a sealing layer disposed between the first abutment surface and the second abutment surface.

6. The earphone according to claim 1, characterized in that: The sound guiding structure is distributed in a serpentine pattern.

7. The earphone according to claim 1, characterized in that: The length of the sound guiding structure along the sound output direction is L, the maximum width of the sound guiding structure is D, and the earphone satisfies: 8mm≤L≤20mm, 1.5mm≤D≤3mm.

8. The earphone according to claim 1, characterized in that: The housing includes at least two of the sound outlets.

9. The earphone according to claim 8, characterized in that: At least two of the sound outlet holes are arranged in the same axial direction, and the sound guiding structure is connected to one of the sound outlet holes.

10. The earphone according to claim 1, characterized in that, The headphones also include a separator that divides the mounting cavity into a first compartment and a second compartment. The first compartment houses the sound-generating unit and is connected to all the sound outlets. The second compartment is used to house electronic components.

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