Sound production device module for wearable electronic device and wearable electronic device
By setting up shock-absorbing components and opening sound holes between the module housing and the sound-generating unit, the problem of speaker vibration interference was solved, low-frequency performance was improved and interference with inertial sensors was reduced, thus improving the user experience of VR products.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- GEER TECH CO LTD
- Filing Date
- 2022-11-22
- Publication Date
- 2026-04-17
AI Technical Summary
While increasing the power and size of speakers can improve audio performance, it can also increase vibration intensity, interfering with other components in electronic products, especially inertial sensors, leading to detection errors or damage.
A vibration damping component, including an elastic connector and a vibrating plate, is installed between the module housing and the sound-generating unit to form an active vibration isolation structure. Front and rear sound holes are opened on the module housing to reduce vibration propagation and improve low-frequency performance.
It effectively reduces vibration interference from the sound-generating device to other components of electronic products, improves low-frequency performance, and enhances the user experience.
Smart Images

Figure CN115802237B_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of acoustic technology, and in particular relates to a sound-generating device module for wearable electronic devices and wearable electronic devices. Background Technology
[0002] With the rapid development of the virtual reality market, more and more consumers are willing to try the unprecedented visual experience it brings, thus the purchasing power for VR products is also growing rapidly. High-quality audio effects can greatly enhance the immersive experience of VR products, and high-power and large-size speakers are beneficial for improving audio performance. However, while increasing the power and size of speakers can effectively improve audio performance, it can also increase the vibration intensity, which may interfere with other components in the electronic product. For example, VR devices often include inertial sensors and gyroscopes to determine the spatial position of the device. If the vibration intensity of the speaker is too high, it may be detected by these sensors, causing sensor errors and interfering with the normal use of the product. In more serious cases, the speaker may even damage other components of the product.
[0003] Therefore, it is necessary to improve the sound-generating devices in electronic products to reduce their vibration interference to the outside world. Summary of the Invention
[0004] One objective of this application is to provide a sound-generating device module for wearable electronic devices and a new technical solution for wearable electronic devices.
[0005] According to a first aspect of the embodiments of this application, a sound-generating device module for wearable electronic devices is provided, comprising:
[0006] The module housing and the sound-generating unit, wherein a diaphragm is provided on the end face of the sound-generating unit, and the sound-generating unit is fixedly disposed in the module housing;
[0007] A vibration damping assembly includes an elastic connector and a vibrating plate. The vibrating plate is suspended inside the module housing via the elastic connector. The vibration damping assembly is connected to the end face of the sound-generating unit. The edge of the elastic connector is connected to the inner surface of the module housing. The vibration damping assembly divides the inner cavity of the module housing into a front acoustic cavity and a rear acoustic cavity. The vibrating plate is configured to passively vibrate when the diaphragm vibrates.
[0008] The module housing has a front acoustic hole, which is connected to the diaphragm through the front acoustic cavity. The module housing also has a rear acoustic hole, which is connected to the vibrating plate through the rear acoustic cavity.
[0009] Optionally, the vibrating plate has a ring-shaped structure and surrounds the diaphragm.
[0010] Optionally, the elastic connector includes a first connector and a second connector, wherein the first connector is connected between the sound-generating unit and the vibrating plate, and the second connector is connected between the vibrating plate and the inner surface of the module housing.
[0011] Optionally, the vibrating plate is flush with the end face of the sound-generating unit.
[0012] Optionally, a positioning groove is provided inside the module housing, the sound-emitting unit is disposed in the positioning groove, the end face of the sound-emitting unit protrudes from the positioning groove, and the positioning groove separates the main structure of the sound-emitting unit from the rear acoustic cavity.
[0013] Optionally, a bearing flange is formed on the inner surface of the module housing, and the edge of the elastic connector is connected to the bearing flange.
[0014] Optionally, a partition plate is formed inside the module housing, and an assembly hole is formed on the partition plate. The shock-absorbing component is disposed in the assembly hole, and the edge of the elastic connector is connected to the edge of the assembly hole.
[0015] The partition plate and the shock absorption assembly separate the inner cavity of the module housing to form a front acoustic cavity and a rear acoustic cavity.
[0016] Optionally, the elastic connector is connected to the inner surface of the sound-generating unit, the vibrating plate, and the module housing by means of bonding or hot melting.
[0017] Optionally, the opening direction of the front acoustic hole is relatively perpendicular to the vibration direction of the diaphragm;
[0018] The opening direction of the rear acoustic cavity is relatively perpendicular to the vibration direction of the vibrating plate.
[0019] According to a second aspect of the embodiments of this application, a wearable electronic device is provided, wherein the aforementioned sound-emitting device module is applied to the wearable electronic device, comprising:
[0020] A main body and a wearing device, wherein the wearing device is connected to the main body and the wearing device is configured to wear the main body on a predetermined target;
[0021] The sound-generating device module is mounted on the wearing device or the main body.
[0022] The technical advantages of the embodiments of this application are as follows:
[0023] 1. By setting a vibration damping component between the module housing and the sound-generating unit, the sound-generating unit and the vibration damping component are coupled to form an active vibration isolation structure, thereby weakening the vibration propagated to the module housing when the sound-generating unit emits sound, thereby reducing the interference and impact of the sound-generating device module on other components in electronic products.
[0024] 2. By opening front and rear acoustic holes on the module housing, the sound waves can be superimposed, which is beneficial to improving low-frequency performance.
[0025] Other features and advantages of this application will become clear from the following detailed description of exemplary embodiments with reference to the accompanying drawings. Attached Figure Description
[0026] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments of the present application and, together with their description, serve to explain the principles of the present application.
[0027] Figure 1 This is a simplified diagram illustrating the active vibration isolation principle of an embodiment of this application;
[0028] Figure 2 This is a graph showing the change in damping factor according to an embodiment of this application.
[0029] Figure 3 This is a schematic diagram of sound wave superposition according to an embodiment of this application;
[0030] Figure 4 This is a cross-sectional schematic diagram of the sound-generating device module according to an embodiment of this application;
[0031] Figure 5 This is an exploded view of the sound-generating device module according to an embodiment of this application;
[0032] Figure 6 This is a schematic diagram illustrating the application of the sound-generating device module according to an embodiment of this application;
[0033] Figure 7 This is a schematic diagram illustrating the application of the sound-generating device module according to an embodiment of this application;
[0034] Figure 8 This is a comparison chart of frequency response simulation data of the sound-generating device module in the embodiments of this application;
[0035] Figure 9 This is a test data diagram of the sound-generating device module according to an embodiment of this application;
[0036] Figure 10 This is a schematic diagram of the structure of the partition plate in an embodiment of this application.
[0037] Explanation of reference numerals in the attached drawings: Sound generating device module 100; module housing 1; front sound hole 11; rear sound hole 12; front sound cavity 13; rear sound cavity 14; bearing flange 15; positioning groove 16; shock absorption assembly 2; elastic connector 21; first connector 22; second connector 23; vibrating plate 24; sound generating unit 3; diaphragm 31; partition plate 4; assembly hole 41; human ear 5. Detailed Implementation
[0038] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values of the components and steps set forth in these embodiments do not limit the scope of the present application.
[0039] The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the scope of this application and its application or use.
[0040] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and equipment should be considered part of the specification.
[0041] In all the examples shown and discussed herein, any specific values should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values.
[0042] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.
[0043] According to a first aspect of the embodiments of this application, a sound-emitting device module 100 for wearable electronic devices is provided, comprising:
[0044] The module housing 1 and the sound-generating unit 3 are provided with a diaphragm 31 on the end face of the sound-generating unit 3, and the sound-generating unit 3 is fixedly disposed in the module housing 1;
[0045] The vibration damping assembly 2 includes an elastic connector 21 and a vibrating plate 24. The vibrating plate 24 is suspended inside the module housing 1 through the elastic connector 21. The vibration damping assembly 2 is connected to the end face of the sound-generating unit 3. The edge of the elastic connector 21 is connected to the inner surface of the module housing 1. The vibration damping assembly 2 divides the inner cavity of the module housing 1 into a front acoustic cavity 13 and a rear acoustic cavity 14. The vibrating plate 24 is configured to passively vibrate when the diaphragm 31 vibrates.
[0046] The module housing 1 has a front acoustic hole 11, which is connected to the diaphragm 31 through the front acoustic cavity 13. The module housing 1 also has a rear acoustic hole 12, which is connected to the vibrating plate 24 through the rear acoustic cavity 14.
[0047] like Figure 4 As shown, a diaphragm 31 is provided on the end face of the sound-generating unit 3. The diaphragm 31 is located at the end face of the sound-generating unit 3, and the diaphragm 31 can be seen from the surface of the sound-generating unit 3, which facilitates the sound generated by the diaphragm 31 when it vibrates to propagate outward.
[0048] like Figure 4 and Figure 5 As shown, a vibration damping component 2 is provided between the module housing 1 and the sound-emitting unit 3. The sound-emitting unit 3 and the vibration damping component 2 are coupled to form an active vibration isolation structure, thereby weakening the vibration propagated to the module housing 1 when the sound-emitting unit 3 emits sound, thereby reducing the interference and influence of the sound-emitting device module 100 on other components in the electronic product.
[0049] Further explanation: The vibration damping component 2 includes an elastic connector 21 and a vibrating plate 24. The vibrating plate 24 is suspended inside the module housing 1 by the elastic connector 21. In one embodiment, the elastic connector 21 connects the sound-generating unit 3 to the vibrating plate 24, and the elastic connector 21 also connects the vibrating plate 24 to the module housing 1. The sound-generating unit 3, the elastic connector 21, and the vibrating plate 24 are coupled together to form an active vibration isolation structure. When the sound-generating unit 3 receives an electrical signal and causes the diaphragm 31 to vibrate, on the one hand, the sound it generates can propagate outward normally; on the other hand, the sound-generating unit 3 itself is inevitably vibrated by the diaphragm 31. The vibration of the sound-generating unit 3 itself is transmitted to the vibrating plate 24. The vibrating plate 24 and the elastic connector 21 connected to the vibrating plate 24 will buffer and absorb the vibration, thereby reducing the interference and impact of the sound-generating device module 100 on other components in the electronic product.
[0050] like Figure 6As shown, the vibration damping component 2 is disposed inside the module housing 1. The vibration damping component 2 and the sound-generating unit 3 divide the inner cavity of the module housing 1 into a front sound cavity 13 and a rear sound cavity 14. A front sound hole 11 is provided on the side end of the module housing 1. The diaphragm 31 is disposed on the side of the sound-generating unit 3 facing the front sound cavity 13. The front sound hole 11 is connected to the diaphragm 31 through the front sound cavity 13. When the diaphragm 31 vibrates, it generates sound, and the sound waves are transmitted to the ear 5 through the front sound cavity 13 and the front sound hole 11. A rear sound hole 12 is also provided on the side end of the module housing 1. The rear sound hole 12 is connected to the vibrating plate 24 through the rear sound cavity 14. The airflow generated by the vibration of the diaphragm 31 causes the vibrating plate 24 to vibrate up and down. The sound wave signal generated by the up and down movement of the vibrating plate 24 is transmitted to the ear 5 through the rear sound cavity 14 and the rear sound hole 12. Since the up-and-down vibration of the diaphragm 24 is caused by the movement of the diaphragm 31, the vibration frequency and amplitude of the diaphragm 24 are the same as those of the diaphragm 31. According to the principle of sound wave superposition, the combination of two sound sources with the same frequency and amplitude forms a superimposed sound pressure with doubled amplitude, which is beneficial to improving low-frequency performance and enhancing the user's listening experience.
[0051] Preferably, the elastic connector 21 can be made of materials such as metal, plastic, or plant fiber, which can provide internal resistance and elasticity. This type of elastic connector 21 can better provide cushioning and vibration damping for the sound-generating unit 3.
[0052] Optionally, the vibrating plate 24 has a ring-shaped structure and surrounds the diaphragm 31.
[0053] like Figure 4 and Figure 5 As shown, the vibrating plate 24 can be in the form of a ring. In the embodiment where the elastic connector 21 connects the sound-generating unit 3 to the vibrating plate 24, and the elastic connector 21 connects the vibrating plate 24 to the module housing 1, the structure of the vibrating plate 24 is adapted to the structure of the sound-generating unit 3. The vibrating plate 24 surrounds the diaphragm 31, which is more conducive to it receiving vibrations from the diaphragm 31.
[0054] Optionally, the elastic connector 21 includes a first connector 22 and a second connector 23, wherein the first connector 22 is connected between the sound-generating unit 3 and the vibrating plate 24, and the second connector 23 is connected between the vibrating plate 24 and the inner surface of the module housing 1.
[0055] like Figure 4As shown, the elastic connector 21 includes a first connector 22 and a second connector 23. The first connector 22 is configured to connect the sound-generating unit 3 and the vibrating plate 24, and the second connector 23 is configured to connect the vibrating plate 24 and the module housing 1. The sound-generating unit 3 inevitably vibrates along with the diaphragm 31. The vibration of the sound-generating unit 3 is transmitted to the vibrating plate 24, and the vibrating plate 24 vibrates between the first connector 22 and the second connector 23. The first connector 22 and the second connector 23 provide internal resistance for the vibration of the vibrating plate 24, which buffers and absorbs the vibration, thereby reducing the interference and influence of the sound-generating device module 100 on other components in the electronic product.
[0056] Further alternatively, on the one hand, in order to enable the elastic connector 21 to better provide vibration buffering for the sound-generating unit 3 and exert a spring-like buffering performance; on the other hand, in order to make the structure of the elastic connector 21 more adaptable to the overall structural shape of the sound-generating unit 3, the elastic connector 21 can be made into a structure similar to the diaphragm 31, for example, the elastic connector 21 has a folded ring portion. The bending extension structure of the folded ring portion can better form elastic deformation along a predetermined direction, and its structural form is similar to the structure of the diaphragm 31, which is the main vibrating body, making it easier to combine with the vibrating plate 24 to cancel and buffer its vibration. In embodiments where the elastic connector 21 connects the sound-generating unit 3 to the vibrating plate 24, and the elastic connector 21 connects the vibrating plate 24 to the module housing 1, the first connector 22 can be arranged around the sound-generating unit 3, so that the folded ring portion can form a buffer with the vibration of the diaphragm 31.
[0057] In a preferred embodiment, the first connector 22 and the second connector 23 can be made of materials that can provide internal resistance and elasticity, such as metal, plastic or plant fiber. Different materials can be used for the first connector 22 and the second connector 23 at the same time to provide different damping to balance the problem of uneven mass of the speaker unit at different positions. For example, the front connector is made of metal and the rear connector is made of plastic.
[0058] Optionally, the vibrating plate 24 is flush with the end face of the sound-generating unit 3.
[0059] like Figure 4 As shown, the end face of the vibrating plate 24 is flush with the upper end face of the sound-generating unit 3. When the sound-generating unit 3 vibrates, the vibrating plate 24 can buffer and absorb the vibration transmitted from the sound-generating unit 3.
[0060] Optionally, a positioning groove 16 is provided inside the module housing 1, the sound-emitting unit 3 is disposed in the positioning groove 16, the end face of the sound-emitting unit 3 is exposed from the positioning groove 16, and the positioning groove 16 separates the main structure of the sound-emitting unit 3 from the rear acoustic cavity 14.
[0061] like Figure 4 and Figure 5 As shown, the module housing 1 has a positioning groove 16 inside that matches the shape of the sound-generating unit 3, fixing the sound-generating unit 3 in the positioning groove 16. In this way, when the diaphragm 31 vibrates, the vibration generated by the sound-generating unit 3 itself can be more definite and have a relatively fixed vibration direction, avoiding phenomena such as skewness when the sound-generating unit 3 vibrates. This design has a good effect on the sound-generating unit 3, and can prevent the sound-generating unit 3 from colliding with the module housing 1 or from being significantly skewed, thus avoiding damage to the elastic connector 21.
[0062] Furthermore, if the sound-emitting unit 3 itself vibrates unstablely, it may cause slight changes in the position and direction of sound transmission, or cause reverse interference to the vibration of the diaphragm 31, thereby affecting the user's auditory experience.
[0063] Furthermore, the positioning groove 16 separates the main structure of the sound-generating unit 3 from the rear acoustic cavity 14, preventing the vibration generated by the sound-generating unit 3 from being transmitted through the rear acoustic cavity 14, and further preventing the sound wave signal generated by the up-and-down vibration of the vibrating plate 24 from being transmitted through the rear acoustic cavity 14 and the rear acoustic hole 12 from containing impurities.
[0064] Optionally, a bearing flange 15 is formed on the inner surface of the module housing 1, and the edge of the elastic connector 21 is connected to the bearing flange 15.
[0065] like Figure 4 As shown, in one embodiment, the interior of the module housing 1 is formed with a bearing flange 15. One end of the second connector 23 is connected to the bearing flange 15, and the other end of the second connector 23 is connected to the vibrating plate 24. The two ends of the first connector 22 are respectively connected to the sound-generating unit 3 and the vibrating plate 24. The bearing flange 15 and the sound-generating unit 3 facilitate the formation of a supporting effect for the vibration damping assembly 2 inside the module housing 1, improve the connection reliability of the vibration damping assembly 2, and simplify the assembly process.
[0066] Optionally, a partition plate 4 is formed inside the module housing 1, and an assembly hole 41 is formed on the partition plate 4. The shock-absorbing component 2 is disposed in the assembly hole 41, and the edge of the elastic connector 21 is connected to the edge of the assembly hole 41.
[0067] The partition plate 4 and the shock absorption component 2 separate the inner cavity of the module housing 1 to form a front acoustic cavity 13 and a rear acoustic cavity 14.
[0068] In another embodiment, such as Figure 10As shown, a partition plate 4 is provided inside the module housing 1. The partition plate 4 has multiple mounting holes 41. The sound-generating unit 3 is disposed inside one of the mounting holes 41. The position of the mounting hole 41 corresponds to the position of the positioning groove 16. The end face of the sound-generating unit 3 protrudes from the positioning groove 16 and extends out of the partition plate 4, flush with the end face of the front sound cavity 13. The sound-generating unit 3 and the partition plate 4 are fixed together by the positioning groove 16 and the mounting hole 41. When the diaphragm 31 vibrates, the sound-generating unit 3 vibrates accordingly, avoiding phenomena such as skewness during the vibration of the sound-generating unit 3. This design has a good effect on the sound-generating unit 3, and can prevent the sound-generating unit 3 from colliding with the module housing 1 or from being significantly skewed, thus avoiding damage to the elastic connector 21.
[0069] In the above embodiment, the vibration damping component 2 is disposed inside another mounting hole 41. One end of the elastic connector 21 is connected to the edge of the mounting hole 41, and the edge of the vibrating plate 24 is connected to the other end of the elastic connector 21. The elastic connector 21 and the vibrating plate 24 are coupled together to form an active vibration isolation structure. When the sound-generating unit 3 receives an electrical signal and causes the diaphragm 31 to vibrate, on the one hand, the sound it generates can propagate outward normally; on the other hand, the airflow generated by the diaphragm 31 causes the vibrating plate 24 to vibrate. The vibrating plate 24 and the elastic connector 21 connected to the vibrating plate 24 will buffer and absorb the vibration, thereby reducing the interference and influence of the sound-generating device module 100 on other components in the electronic product.
[0070] Optionally, the elastic connector 21 is connected to the sound-generating unit 3, the vibrating plate 24, and the inner surface of the module housing 1 by means of bonding or hot melting.
[0071] In this embodiment, the first connector 22 and the sound-generating unit 3, the first connector 22 and the vibrating plate 24, the second connector 23 and the vibrating plate 24, the second connector 23 and the module housing 1, the elastic connector 21 and the partition plate 4, and the elastic connector 21 and the vibrating plate 24 are all connected by adhesive or heat fusion.
[0072] Optionally, the opening direction of the front acoustic hole 11 is relatively perpendicular to the vibration direction of the diaphragm 31;
[0073] The opening direction of the rear acoustic cavity 14 is relatively perpendicular to the vibration direction of the vibrating plate 24.
[0074] like Figure 6As shown, a front acoustic hole 11 is provided on the side of the module housing 1. The front acoustic hole 11 is connected to the diaphragm 31 through the front acoustic cavity 13, and the direction of the front acoustic hole 11 is perpendicular to the direction of vibration of the diaphragm 31, which can change the direction of sound propagation and make the sound heard by the human ear 5 clearer. A rear acoustic hole 12 is provided on the side of the module housing 1. The rear acoustic hole 12 is connected to the vibrating plate 24 through the rear acoustic cavity 14, and the direction of the rear acoustic hole 12 is perpendicular to the direction of vibration of the vibrating plate 24, which can change the direction of sound propagation and make the sound heard by the human ear 5 clearer.
[0075] The application principle of the sound-generating device module 100 is as follows: Figure 1 As shown, mass Mm represents the device that needs to be protected from external interference. There is a solid in contact with the outside world, and a spring with an elastic coefficient Km and a resistance Rm is inserted between the device and the solid. When a simple harmonic force F0 acts on mass Mm, the force F transmitted to the solid through the spring will be greatly reduced compared to F0. This kind of vibration isolation is called active vibration isolation. The vibrating plate 24 corresponds to mass Mm in the schematic diagram, the elastic connector 21 corresponds to the spring in the schematic diagram, and the product corresponds to the solid in the schematic diagram.
[0076] like Figure 2 The Q variation curve shown has D on the vertical axis. F The horizontal axis is z, and the curve is Q, where D F Let z be the transfer ratio, z be the frequency ratio, and Q be the damping factor. The graph shows the curves for different damping factors, where Q takes values of 0.5, 0.7, 1.0, 1.7, 2.5, 5, and ∞. The curves in the graph show that when z = z... c When the value is √2, there is a dividing line. When the value is greater than this, the transmission ratio is always less than 1 and decreases as Q increases. When the value is less than this, the transmission ratio is always greater than 1 and there is a peak value. Therefore, the spring can only play a vibration isolation role when the frequency f > √2f0. Moreover, the further away from the system's natural frequency, the better the vibration isolation. In this case, the force F that F0 acts on Mm and is transmitted to the foundation through Rm will be greatly suppressed.
[0077] like Figure 3 The diagram shown illustrates the superposition of sound waves. It assumes two sound sources separated by a distance *l*, with identical frequencies, amplitudes, and phases. The radiated sound pressure of each source is known to be... Therefore, by superimposing the radiated sound pressures of the two sound sources, the sound pressure of the synthesized sound field can be obtained as follows:
[0078]
[0079] As can be seen from the figure, the following approximate relationship exists:
[0080]
[0081] in The equation is half the path difference between the two sound sources and the observation point. Substituting r1 and r2 into the above equation, we get...
[0082]
[0083] When two sound sources are very close together The synthesized sound pressure is
[0084]
[0085] At this point, the combined sound sources are equivalent to a superimposed sound field radiation with doubled amplitude.
[0086] like Figure 8 As shown, according to the principle of sound wave superposition, two sound sources with the same frequency and amplitude combine to form a superimposed sound pressure with doubled amplitude, which is beneficial for improving low-frequency performance. Figure 8 The simulation data further demonstrates that this design has the advantage of improving low-frequency performance.
[0087] like Figure 9 As shown, the Y-axis represents the product's vibration displacement, and the X-axis represents the product's operating frequency. The data shows that the vibration displacement of the sound-generating module 100 in each frequency band is significantly smaller than that of a regular loudspeaker. This indicates that the vibration damping component 2 and the sound-generating unit 3 form an active vibration isolation structure. That is, when the sound-generating unit 3 vibrates, the vibration damping component 2 can isolate the vibration, thereby reducing the vibration generated by the sound-generating unit 3 during operation from being transmitted to the main body of the product through the solid structure of the product. This prevents the vibration of the sound-generating unit 3 from affecting the use of the product.
[0088] According to a second aspect of the embodiments of this application, a wearable electronic device is provided, wherein the aforementioned sound-emitting device module 100 is applied to the wearable electronic device, comprising:
[0089] A main body and a wearing device, wherein the wearing device is connected to the main body and the wearing device is configured to wear the main body on a predetermined target;
[0090] The sound-generating device module 100 is disposed on the wearable device or the main body. VR / AR products typically include inertial sensors. When the vibration of the sound-generating unit 3 is transmitted to the product, it affects the performance of the inertial sensor, thus impacting the user experience. Furthermore, when the vibration of the sound-generating unit 3 is transmitted to the product, the product vibrates accordingly. Since it is a wearable product, the user will feel the vibration, which also affects the user experience. Therefore, by incorporating the aforementioned sound-generating device module 100 into the VR / AR product, these problems can be avoided.
[0091] While specific embodiments of this application have been described in detail by way of examples, those skilled in the art should understand that the above examples are for illustrative purposes only and are not intended to limit the scope of this application. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of this application. The scope of this application is defined by the appended claims.
Claims
1. A sound production device module for a wearable electronic device, the sound production device module comprising: include: The module housing and the sound-generating unit, wherein a diaphragm is provided on the end face of the sound-generating unit, and the sound-generating unit is fixedly disposed in the module housing; A vibration damping assembly includes an elastic connector and a vibrating plate. The vibrating plate is suspended inside the module housing via the elastic connector. The vibration damping assembly is connected to the end face of the sound-generating unit. The edge of the elastic connector is connected to the inner surface of the module housing. The vibration damping assembly divides the inner cavity of the module housing into a front acoustic cavity and a rear acoustic cavity. The vibrating plate is configured to passively vibrate when the diaphragm vibrates. The elastic connector connects the sound-generating unit to the vibrating plate; The module housing has a front acoustic hole, which is connected to the diaphragm through the front acoustic cavity. The module housing also has a rear acoustic hole, which is connected to the vibrating plate through the rear acoustic cavity. The vibrating plate has a ring-shaped structure and surrounds the diaphragm; The elastic connector includes a first connector and a second connector. The first connector is connected between the sound-generating unit and the vibrating plate, and the second connector is connected between the vibrating plate and the inner surface of the module housing. The vibrating plate is flush with the end face of the sound-generating unit.
2. The sound production device module of claim 1, wherein, The module housing is provided with a positioning groove, the sound-emitting unit is disposed in the positioning groove, the end face of the sound-emitting unit protrudes from the positioning groove, and the positioning groove separates the main structure of the sound-emitting unit from the rear acoustic cavity.
3. The sound production device module of claim 1, wherein, A bearing flange is formed on the inner surface of the module housing, and the edge of the elastic connector is connected to the bearing flange.
4. The sound production device module of claim 1, wherein, A partition plate is formed inside the module housing, and an assembly hole is formed on the partition plate. The shock-absorbing component is disposed in the assembly hole, and the edge of the elastic connector is connected to the edge of the assembly hole. The partition plate and the shock absorption assembly separate the inner cavity of the module housing to form a front acoustic cavity and a rear acoustic cavity.
5. The sound production device module of claim 1, wherein, The elastic connector is connected to the inner surface of the sound-generating unit, the vibrating plate, and the module housing by means of bonding or hot melting.
6. The sound-generating device module according to claim 1, characterized in that, The opening direction of the front acoustic hole is relatively perpendicular to the vibration direction of the diaphragm; The opening direction of the rear acoustic cavity is relatively perpendicular to the vibration direction of the vibrating plate.
7. A wearable electronic device, comprising: A main body and a wearing device, wherein the wearing device is connected to the main body and the wearing device is configured to wear the main body on a predetermined target; The sound-generating device module according to any one of claims 1-6, wherein the sound-generating device module is disposed on the wearing device or the main body.
Citation Information
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