White light Mini LED and backlight module thereof

Abstract

The utility model discloses a white-light Mini LED and a backlight module thereof. The white-light Mini LED comprises a substrate, a chip and a packaging layer. The packaging layer is provided with a first protrusion and a plurality of micro-cavities, and the micro-cavities are located in the portion, close to the light-emitting face, of the first protrusion. A first curve point is arranged at the joint of the first curve section and the substrate; a second curve point is arranged at the joint of the first curve section and the second curve section; a third curve point is arranged at the joint of the second curve section and the third curve section; a fourth curve point is arranged at the joint of the third curve section and the fourth curve section; the center point of the fourth curve section is set as a fifth curve point; a first included angle formed by a connecting line of the first curve point and the second curve point and the substrate is 35-70 degrees; a second included angle formed between the second curve point and the connecting line of the second curve point and the substrate is 80-110 degrees; and a third included angle formed by a connecting line of the third curve point and the fourth curve point and the substrate is-5 degrees to 5 degrees. The LED lamp has the advantages of being uniform in light-emitting angle and light color.

Description

Technical Field

[0001] This utility model relates to the field of LED display technology, and in particular to a white Mini LED and its backlight module. Background Technology

[0002] Mini LED backlight technology with dynamic dimming offers advantages such as high contrast and excellent display quality, and its market share is gradually increasing. Color gamut is a crucial indicator of display performance, including standards like NTSC and DCI-P3. Mini LED displays often achieve ultra-high color gamut by using blue LED chips and quantum dot films. However, the high cost of Mini LED displays, especially with a large number of color zones, significantly impacts their market penetration. One way to reduce costs is to replace the expensive quantum dot films with high color gamut white Mini LEDs.

[0003] However, white Mini LEDs have a narrow emission angle. Reducing the size of the quantum dot film compromises the uniformity of the backlight module. While a secondary lens can increase the emission angle of white Mini LEDs, this requires a secondary lens and its mounting, increasing costs. Currently, popular Mini LEDs on the market have over a thousand zones, requiring larger angles for the LEDs than conventional ones, with the ratio of LED spacing to mixing distance within 1.5. Under these requirements, how to achieve the desired uniformity of a thousand-zone backlight using a primary lens while maintaining the LED spacing-to-mixing distance ratio within 1.5 has become a key challenge.

[0004] Therefore, a white Mini LED and its backlight module are provided to address the shortcomings of existing technologies. Utility Model Content

[0005] In order to overcome the shortcomings of the existing technology, this utility model provides a white light Mini LED and its backlight module, which aims to solve the problem that the white light Mini LED has a small light emission angle, and the uniformity of the backlight module cannot meet the requirements while reducing the quantum dot film.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A white Mini LED includes: a substrate, a chip, and a packaging layer;

[0008] The chip is connected to the substrate, and the encapsulation layer covers the chip;

[0009] The encapsulation layer is provided with a first protrusion and a plurality of micro cavities, wherein the plurality of micro cavities are located inside the first protrusion near the light-emitting surface;

[0010] The first protrusion includes a first curved segment, a second curved segment, a third curved segment, and a fourth curved segment that are connected end to end in sequence;

[0011] The connection point between the first curve segment and the substrate is designated as the first curve point;

[0012] The point where the first curve segment connects to the second curve segment is designated as the second curve point;

[0013] The point where the second curve segment connects to the third curve segment is designated as the third curve point;

[0014] The connection point between the third curve segment and the fourth curve segment is designated as the fourth curve point;

[0015] The center point of the fourth curve segment is set as the fifth curve point;

[0016] The first angle formed between the line connecting the first curve point and the second curve point and the substrate is 35°-70°.

[0017] The second angle formed between the second curve point and the line connecting the second curve point and the substrate is 80°-110°;

[0018] The third angle formed by the line connecting the third curve point and the fourth curve point with the substrate is -5° to -5°.

[0019] As a further improvement to the technical solution of this utility model, it also includes a fluorescence conversion layer, which covers the chip, and the encapsulation layer covers the fluorescence conversion layer.

[0020] As a further improvement to the technical solution of this utility model, the first protrusion also includes a second protrusion formed by the fourth curve segment, the highest point of the second protrusion being the fifth curve point, and the second protrusion being located above the chip.

[0021] As a further improvement to the technical solution of this utility model, it also includes a reflective layer, which covers the light-emitting surface of the encapsulation layer.

[0022] As a further improvement to the technical solution of this utility model, the ratio of the side height to the widest point of the encapsulation layer is 0.2-0.4.

[0023] As a further improvement to the technical solution of this utility model, the microcavity is a gas and / or contains gas particles, and the diameter of the microcavity is 20um-200um.

[0024] As a further improvement to the technical solution of this utility model, the material composition of the particles is Si, B, Na, or Ca.

[0025] As a further improvement to the technical solution of this utility model, the material of the first protrusion is one or more of silicone rubber, silicone resin, and epoxy resin, and the refractive index of the first protrusion is 4.6-5.2.

[0026] As a further improvement to the technical solution of this utility model, the chip includes a standard chip, a flip chip, and a vertical chip.

[0027] A backlight module, suitable for the aforementioned white Mini LED, further includes a driver IC, components, plug-in, and a reflective layer, wherein the driver IC, the components, and the plug-in are all connected to the substrate, and the reflective layer covers the driver IC, the components, the plug-in, and the substrate;

[0028] The ratio of the spacing between the white Mini LEDs to the light mixing distance is within 1.5.

[0029] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0030] In this white Mini LED, the encapsulation layer has a first protrusion and several microcavities, with the microcavities located inside the first protrusion near the light-emitting surface. The structure of the first protrusion and the microcavities increases the emission angle of the Mini LED. This white Mini LED features an increased emission angle achieved through a primary lens structure.

[0031] In this backlight module, a uniform light color is achieved by using white Mini LEDs, resulting in an LED spacing to light mixing distance ratio of less than 1.5. This reduces the amount of Mini LEDs used, avoids the use of secondary optical lenses and quantum dot films, and lowers the cost of hundreds to thousands of light-difference zones. This backlight module features a single-lens structure that achieves uniform light color. Attached Figure Description

[0032] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments:

[0033] Figure 1 This is a schematic diagram of the structure of the white Mini LED of this utility model;

[0034] Figure 2 This is a schematic diagram of the structure of Embodiment 4 of the white Mini LED of this utility model;

[0035] Figure 3 This is a schematic diagram of the backlight module of this utility model.

[0036] In the picture:

[0037] 1. Substrate;

[0038] 2. Chip;

[0039] 3. Encapsulation layer; 31. First protrusion; 32. Microcavity; 33. First curved segment; 34. Second curved segment; 35. Third curved segment; 36. Fourth curved segment; 37. Second protrusion;

[0040] 4. Phosphor conversion layer; 5. Driver IC; 6. Components; 7. Components; 8. Reflective layer; 9. Reflective layer. Detailed Implementation

[0041] The following will provide a clear and complete description of the concept, specific structure, and technical effects of this utility model in conjunction with the embodiments and accompanying drawings, so as to fully understand the purpose, solution, and effects of this utility model. It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The same reference numerals used throughout the drawings indicate the same or similar parts.

[0042] It should be noted that, unless otherwise specified, when a feature is referred to as "fixed" or "connected" to another feature, it can be directly fixed or connected to the other feature, or it can be indirectly fixed or connected to the other feature. Furthermore, the descriptions of "upper," "lower," "left," and "right" used in this utility model are only relative to the relative positional relationships of the various components of this utility model in the accompanying drawings.

[0043] Reference Figures 1 to 3 A white Mini LED includes: a substrate 1, a chip 2, and an encapsulation layer 3;

[0044] In embodiment 1, chip 2 is connected to substrate 1, and encapsulation layer 3 covers chip 2;

[0045] The encapsulation layer 3 is provided with a first protrusion 31 and a plurality of microcavities 32, the plurality of microcavities 32 being located inside the first protrusion 31 near the light-emitting surface; the first protrusion 31 includes a first curved segment 33, a second curved segment 34, a third curved segment 35, and a fourth curved segment 36 connected end to end in sequence; the connection point between the first curved segment 33 and the substrate 1 is designated as the first curved point; the connection point between the first curved segment 33 and the second curved segment 34 is designated as the second curved point; the connection point between the second curved segment 34 and the third curved segment 35 is designated as the third curved point; the connection point between the third curved segment 35 and the fourth curved segment 36 is designated as the fourth curved point; the center point of the fourth curved segment 36 is designated as the fifth curved point; the first angle formed by the line connecting the first curved point and the second curved point and the substrate 1 is 35°; the second angle formed by the line connecting the second curved point and the second curved point and the substrate 1 is 80°; the third angle formed by the line connecting the third curved point and the fourth curved point and the substrate 1 is -5°.

[0046] The encapsulation layer 3 includes a first protrusion 31 and several microcavities 32, with the microcavities 32 located inside the first protrusion 31 near the light-emitting surface. The structure of the first protrusion 31 and the microcavities 32 increases the emission angle of the Mini LED. This white Mini LED features an increased emission angle achieved through a primary lens structure.

[0047] In one embodiment, the white Mini LED further includes a phosphor conversion layer 4 covering the chip 2, and an encapsulation layer 3 covering the phosphor conversion layer 4. Preferably, the chip 2 includes a flip chip 2.

[0048] In one embodiment, chip 2 emits blue light with a wavelength of 450 nm. The fluorescence conversion layer comprises a red fluorescence conversion material, a green fluorescence conversion material, and silicone. Chip 2 excites the red and green fluorescence conversion materials to emit red and green light, which, together with the blue light emitted by chip 2, constitute white light. The red fluorescence conversion material comprises K2SiF6:Mn, and the green fluorescence conversion material comprises SiAlON:Eu.

[0049] In one embodiment, the first protrusion 31 further includes a second protrusion 37 formed by a fourth curve segment 36, the highest point of the second protrusion 37 being a fifth curve point, and the second protrusion 37 being located above the chip 2.

[0050] In one embodiment, the side height / widest point ratio of the encapsulation layer 3 is 0.3.

[0051] In one embodiment, the microcavity 32 is a gas-containing particle with a particle size of 60 μm. The particle is made of Si, B, Na, or Ca.

[0052] In one embodiment, the first protrusion 31 is made of silicone resin and has a refractive index of 4.9.

[0053] A backlight module, suitable for the aforementioned white Mini LED, further includes a driver IC5, an element 6, a plug-in 7, and a reflective layer 8. The driver IC5, the element 6, and the plug-in 7 are all connected to the substrate 1. The reflective layer 8 covers the driver IC5, the element 6, the plug-in 7, and the substrate 1. The ratio of the spacing between the white Mini LEDs to the light mixing distance is within 1.5.

[0054] In Example 2

[0055] The difference from Example 1 is that chip 2 is a standard chip 2, with a first included angle of 70°, a second included angle of 110°, and a third included angle of 5°. The side height / widest point ratio of the encapsulation layer 3 is 0.4, and the microcavity 32 contains gas particles with a particle size of 20µm. The fluorescence conversion layer contains yellow fluorescence conversion material YAG. The first protrusion 31 is made of silicone rubber, and the refractive index of the first protrusion 31 is 4.6.

[0056] In Example 3

[0057] The difference from Example 1 is that chip 2 is a vertical chip 2, with a first included angle of 50°, a second included angle of 100°, and a third included angle of 0°. The side height / widest point ratio of the encapsulation layer 3 is 0.2, and the microcavity 32 contains gas particles with a particle size of 200µm. The light conversion layer contains the red fluorescent conversion material K2SiF6:Mn, and the green fluorescent conversion material contains a silicate system. The first protrusion 31 is made of epoxy resin, and the refractive index of the first protrusion 31 is 5.2.

[0058] In Example 4

[0059] Reference Figure 2 As shown, the difference from Embodiment 1 is that chip 2 is a vertical chip 2, the height / width ratio of the side surface of the encapsulation layer 3 is 0.27, the microcavity 32 is filled with gas, and the gas size is 100µm. The light conversion layer contains red fluorescent conversion material K2SiF6:Mn, and green fluorescent conversion material contains a silicate system. The material of the first protrusion 31 is epoxy resin, and the refractive index of the first protrusion 31 is 5.0. The white Mini LED also includes a reflective layer 9, which covers the light-emitting surface of the encapsulation layer 3, and the reflective layer 9 contains TiO2 and ZrO2.

[0060] Other aspects of the white Mini LED of this invention are described in the prior art and will not be repeated here.

[0061] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model in any way. Therefore, any modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of the present utility model without departing from the technical solution of the present utility model shall still fall within the scope of the technical solution of the present utility model.

[0062] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0063] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

Claims

1. A white Mini LED, characterized in that, include: Substrate, chip, and packaging layer; The chip is connected to the substrate, and the encapsulation layer covers the chip; The encapsulation layer is provided with a first protrusion and a plurality of micro cavities, wherein the plurality of micro cavities are located inside the first protrusion near the light-emitting surface; The first protrusion includes a first curved segment, a second curved segment, a third curved segment, and a fourth curved segment that are connected end to end in sequence; The connection point between the first curve segment and the substrate is designated as the first curve point; The point where the first curve segment connects to the second curve segment is designated as the second curve point; The point where the second curve segment connects to the third curve segment is designated as the third curve point; The connection point between the third curve segment and the fourth curve segment is designated as the fourth curve point; The center point of the fourth curve segment is set as the fifth curve point; The first angle formed between the line connecting the first curve point and the second curve point and the substrate is 35°-70°. The second angle formed between the second curve point and the line connecting the second curve point and the substrate is 80°-110°; The third angle formed by the line connecting the third curve point and the fourth curve point with the substrate is -5° to -5°.

2. A white Mini LED according to claim 1, characterized in that, It also includes a fluorescence conversion layer that covers the chip, and the encapsulation layer that covers the fluorescence conversion layer.

3. A white Mini LED according to claim 2, characterized in that, The first protrusion also includes a second protrusion formed by the fourth curve segment, the highest point of the second protrusion being the fifth curve point, and the second protrusion being located above the chip.

4. A white Mini LED according to claim 1, characterized in that, It also includes a reflective layer that covers the light-emitting surface of the encapsulation layer.

5. A white Mini LED according to claim 1, characterized in that, The ratio of the side height to the widest point of the encapsulation layer is 0.2-0.

4.

6. A white Mini LED according to claim 1, characterized in that, The diameter of the microcavity is 20um-200um.

7. A white Mini LED according to claim 1, characterized in that, The material of the first protrusion is one of silicone rubber, silicone resin, and epoxy resin, and the refractive index of the first protrusion is 4.6-5.

2.

8. A white Mini LED according to claim 2, characterized in that, The chips include upright chips, flip chips, and vertical chips.

9. A backlight module, suitable for white Mini LED as described in any one of claims 1-8, characterized in that, It also includes a driver IC, components, plug-in modules, and a reflective layer, wherein the driver IC, the components, and the plug-in modules are all connected to the substrate, and the reflective layer covers the driver IC, the components, the plug-in modules, and the substrate; The ratio of the spacing between the white Mini LEDs to the light mixing distance is within 1.5.

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