Monolithic integrated laser with reference light path

Abstract

The utility model provides a monolithic integrated laser with a reference light path, which comprises a single packaging shell, the packaging shell comprises a single packaging base and a packaging cap matched with the packaging base, and a laser chip, a first lens, a reference gas chamber and a photoelectric detector are arranged in the packaging shell. The laser chip is mounted on the packaging base; the first lens outputs laser of the laser chip as an output light beam through shaping, part of reflected light naturally generated by the first lens serves as a reference light beam, and the reference light beam passes through the reference gas chamber and then is detected by the photoelectric detector. The monolithic integrated laser with the reference light path has the advantages that compared with an existing complex packaging structure, the packaging structure has the advantages of being lower in cost, smaller in size and capable of achieving standardized general packaging, and the monolithic integrated laser can be packaged into single TO packaging or butterfly packaging.

Description

TECHNICAL FIELD

[0001] The utility model relates to a kind of laser device structures, specifically, a kind of single-chip integrated laser with reference light path is involved. BACKGROUND

[0002] Common gas leakage detection methods include electrochemical method, catalytic combustion method, solid electrolyte method, laser spectroscopic absorption method and the like. Among them, laser gas detection technology is a technology based on infrared spectroscopic absorption principle, which uses the characteristic spectrum of specific gas molecules to detect trace amounts of gas, and has the advantages of avoiding interference from other gases, high resolution, rapid detection and the like.

[0003] At present, in order to solve the problem of detection error caused by wavelength drift of the laser gas detection system, a method of integrating a reference photoelectric detector and a reference gas chamber is generally used to realize real-time tracking and calibration of the center wavelength of the laser; however, in the prior art, the laser with a reference photoelectric detector and a reference gas chamber (i.e., with a reference light path) has not been standardized and universally packaged from the device end; standardized and universal packaging refers to a series of standardized packaging forms used in semiconductor and optoelectronic device manufacturing, such as TO packaging or butterfly packaging of lasers, to ensure interchangeability, reliability and consistency of the devices.

[0004] In the prior art, for example, a coaxial laser with wavelength calibration and its light source kernel disclosed in Chinese invention patent CN201910356084.5 uses two TO can seats to assemble the coaxial laser light source kernel and the photoelectric detector with the reference gas chamber, and the two TO cans are perpendicular to each other, which has high manufacturing cost and large volume, and cannot be used as standardized and universal packaging. For example, a wavelength self-stabilized laser disclosed in Chinese utility model patent CN202221964594.4 and a gas sensing semiconductor laser with precise wavelength locking disclosed in Chinese utility model patent CN202120973730.5 use the characteristics of the front and rear light emission of the semiconductor DFB laser chip and the consistency of the front and rear light emission wavelengths to use the front light for measuring gas and the rear light for reference gas, which results in lengthening of the BOX / TO packaging and complexity of the packaging structure, and has high manufacturing cost and large volume, and also cannot be used as standardized and universal packaging.

[0005] Therefore, with the development trend of miniaturization and low cost of the laser gas detection system, it is necessary to propose a packaging structure of a laser with a reference light path from the device end, which is lower in cost and smaller in size and realizes standardized and universal packaging.

[0006] In order to solve the above problems, people have been seeking an ideal technical solution. UTILITY MODEL CONTENT

[0007] The utility model discloses a single integrated laser with reference light path which is low in cost, small in size and capable of realizing standardized general packaging.

[0008] In order to realize the above-mentioned purpose, the utility model adopts the technical scheme of:

[0009] A single integrated laser with reference light path, comprising a single packaging shell, the packaging shell comprises a single packaging base and a packaging cap matched with the packaging base, a laser chip, a first lens, a reference gas chamber and a photoelectric detector are arranged in the packaging shell, and the laser chip is mounted on the packaging base.

[0010] Based on the above, the packaging shell adopts T0 packaging, the laser chip adopts a surface-emitting laser chip or an edge-emitting laser chip, and an optical path turning structure is further arranged between the edge-emitting laser chip and the first lens.

[0011] Based on the above, the packaging shell adopts butterfly packaging, and the laser chip adopts an edge-emitting laser chip.

[0012] Based on the above, a second lens is further arranged between the first lens and the reference gas chamber, and the second lens is used for shaping the reference light beam.

[0013] Based on the above, a light path isolator is further arranged, and the output light beam passes through the light path isolator and is outputted outward.

[0014] A single integrated laser with reference light path, comprising a single packaging shell, the packaging shell comprises a single packaging base and a packaging cap matched with the packaging base, a laser chip, a first lens, a reference gas chamber and a photoelectric detector are arranged in the packaging shell, and the laser chip is mounted on the packaging base.

[0015] Based on the above, a thermistor, a TEC cooler and a heat sink are further arranged in the packaging shell, and the heat sink is arranged between the TEC cooler and the laser chip.

[0016] Based on the above, the second lens is further arranged between the beamsplitter and the reference gas chamber, and the second lens is used for shaping the reference light beam.

[0017] Based on the above, the light path isolator is further arranged, and the output light beam is outputted outward through the light path isolator after being shaped by the third lens.

[0018] Based on the above, the thermistor, the TEC cooler and the heat sink are further arranged in the packaging shell, and the heat sink is arranged between the TEC cooler and the laser chip.

[0019] Based on the above, the thermistor, the heater and the heat sink are further arranged in the packaging shell, and the heat sink is arranged between the heater and the laser chip.

[0020] Compared with the prior art, the single-chip integrated laser with a reference light path has the advantages that: the packaging structure of the single-chip integrated laser with the reference gas chamber and the reference photoelectric detector has the advantages of lower cost, smaller size and standardized general packaging compared with the existing complex packaging structure using two TO tube seats or utilizing front and rear light, and the single-chip integrated laser with a reference light path can be packaged into a single packaging shell, so that the single-chip integrated laser with a reference light path has good interchangeability, reliability and consistency at the device end, and the single-chip integrated laser with a reference light path is miniaturized and low-cost. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 is the overall structure schematic view of embodiment 1 of the utility model;

[0022] Figure 2 is the overall structure schematic view of embodiment 2 of the utility model;

[0023] Figure 3 is the overall structure schematic view of embodiment 3 of the utility model;

[0024] Figure 4 is the overall structure schematic view of embodiment 4 of the utility model;

[0025] In the drawing, the reference signs are:

[0026] Packaging shell 1, packaging base 11, packaging cap 12, pin 13; Laser chip 2, light path turning structure 21, thermistor 22, TEC cooler 23, heat sink 24; First lens 3; Reference gas chamber 4; Photoelectric detector 5; Second lens 6; Light path isolator 7; Beamsplitter 8; Third lens 9; Initial light beam a, output light beam b, reference light beam c. DETAILED DESCRIPTION

[0027] The technical solution of this utility model will be further described in detail below through specific embodiments.

[0028] Example 1:

[0029] like Figure 1 As shown, the monolithic integrated laser with reference optical path in this embodiment is a monolithic integrated surface-emitting TO packaged laser with reference optical path, which includes a package housing 1, a laser chip 2, a first lens 3, a reference gas chamber 4 and a photodetector 5. The laser chip 2, the first lens 3, the reference gas chamber 4 and the photodetector 5 are all disposed inside the package housing 1.

[0030] In this embodiment, the initial laser beam of the laser chip 2 is the initial beam a. The first lens 3 shapes the laser beam of the initial beam a into an output beam b. At the same time, the part of the reflected light naturally generated by the first lens 3 is used as a reference beam c and is detected by the photodetector 5 after passing through the reference gas chamber 4.

[0031] It is worth mentioning that, in reality, reflection by a lens is unavoidable. However, the degree of reflection may vary depending on factors such as the lens's material, shape, and surface treatment. In this embodiment, the reference beam c is the unavoidable portion of the reflected light that is naturally reflected when the first lens 3 shapes the initial beam a.

[0032] In this embodiment, the reference gas chamber 4 is filled with a target gas of a fixed concentration. The reference gas chamber 4 and the photodetector 5 together provide laser wavelength calibration and tracking for the laser gas detection system. The reference gas chamber 4 and the photodetector 5 can be configured as photodetectors with their own reference gas chambers. The photodetectors with their own reference gas chambers can be installed on the encapsulation base 11 described below. The reference gas chamber, the photodetector, and the photodetector with its own reference gas chamber are all prior art, and will not be described in detail here.

[0033] In this embodiment, the package housing 1 is a TO package. The package housing 1 includes a single package base 11 and a package cap 12 that matches the package base 11. The package base 11 is also provided with pins 13. A surface-emitting laser chip (VCSEL) is mounted on the package base 11. The laser chip 2 is mounted on the package base 11, and the initial beam a of the laser chip 2 is directed toward the top surface of the package cap 12.

[0034] Based on the above, the temperature control assembly is also mounted on the packaging base 11 to realize the temperature control of the laser chip 1, and the temperature control assembly includes a thermistor 22, a TEC cooler 23 and a heat sink 24, and the heat sink 24 is arranged between the TEC cooler 23 and the laser chip 2; specifically, the hot surface of the TEC cooler 23 is in contact with the packaging base 11, the heat sink 24 is in contact with the cold surface of the TEC cooler 23, and the laser chip 1 is mounted on the heat sink 24, and the heat sink 24 mainly realizes the transmission of the thermal response of the laser chip end and the TEC end.

[0035] It is worth mentioning that in addition to the TEC type temperature control, the temperature control assembly of the laser chip 1 can also use a heating type temperature control based on the working environment of the laser and other factors, for example, the TEC cooler 23 is replaced by a heater (resistance wire, ceramic heater, etc.), to adapt to the special laser use environment and save costs.

[0036] Based on the above, a second lens 6 is further arranged between the first lens 3 and the reference gas chamber 4, and the second lens 6 is used for shaping the reference light beam c.

[0037] Based on the above, an optical path isolator 7 is further included, and the output light beam b passes through the optical path isolator 7 and is output outward; in the embodiment, the optical path isolator 7 can be arranged outside the packaging cap 12, or the optical path isolator 7 can be arranged inside the packaging cap 12. Figure 2

[0038] In the embodiment, the reference light beam c is parallel or close to parallel to the initial light beam a after passing through the second lens 6, and the laser chip 2 and the photodetector 5 are both arranged on the packaging base 11, and the radius and height of the TO packaging shell 1 can still maintain a relatively compact size.

[0039] Embodiment 2:

[0040] As shown in Figure 2 , the single-chip integrated laser with a reference light path in the embodiment is a single-chip integrated edge-emitting TO packaging laser with a reference light path.

[0041] The difference between the embodiment and the embodiment 1 is that in the embodiment, an edge-emitting laser chip (EEL) is mounted on the packaging base 11, the chip of the laser chip 2 is mounted on the packaging base 11, and the initial light beam a of the laser chip 2 needs to pass through the optical path turning structure 21 to be directed to the packaging top surface of the packaging cap 12.

[0042] The other parts of the embodiment are consistent with the embodiment 1, and the radius and height of the TO packaging shell 1 can still maintain a relatively compact size.

[0043] Embodiment 3:

[0044] As shown in Figure 3 ​As shown, the monolithic integrated laser with reference optical path in this embodiment is a monolithic integrated edge-emitting butterfly-shaped packaged laser (reflective type) with reference optical path.

[0045] The difference between this embodiment and embodiment 1 is that in this embodiment, the package housing 1 is a butterfly package, and an edge-emitting laser chip (EEL) is installed in the package base 11. The initial beam a of the laser chip 2 is directed toward the package side of the package housing 1 that does not have pins 13.

[0046] Based on the above, the optical isolator 7 in this embodiment can be configured to be located outside the encapsulation housing 1 or inside the encapsulation housing 1.

[0047] In this embodiment, the reference beam c is parallel or nearly parallel to the initial beam a after passing through the second lens 6. The laser chip 2 and the photodetector 5 are both disposed on the packaging base 11. The overall width, length and height of the butterfly-shaped packaging shell 1 can still maintain a relatively compact size.

[0048] Example 4:

[0049] like Figure 4 As shown, the monolithic integrated laser with reference optical path in this embodiment is a monolithic integrated edge-emitting butterfly-shaped packaged laser (beam splitter) with reference optical path. It includes a package housing 1, a laser chip 2, a beam splitter 8, a third lens 9, a reference gas chamber 4, and a photodetector 5. The laser chip 2, beam splitter 8, third lens 9, reference gas chamber 4, and photodetector 5 are all disposed inside the package housing 1.

[0050] In this embodiment, the initial laser beam of the laser chip 2 is the initial beam a. The beam splitter 8 splits the laser beam of the initial beam a into an output beam b and a reference beam c. The output beam b is shaped by the third lens 9, and the reference beam c is detected by the photodetector 5 after passing through the reference gas chamber 4.

[0051] In this embodiment, the reference gas chamber 4 is filled with a target gas of a fixed concentration. The reference gas chamber 4 and the photodetector 5 together provide laser wavelength calibration and tracking for the laser gas detection system. The reference gas chamber 4 and the photodetector 5 can be configured as photodetectors with their own reference gas chambers. The photodetectors with their own reference gas chambers can be installed on the encapsulation base 11 described below. The reference gas chamber, the photodetector, and the photodetector with its own reference gas chamber are all prior art, and will not be described in detail here.

[0052] In the embodiment, the package shell 1 is a butterfly package, the package shell 1 comprises a single package base 11 and a package cap 12 matched with the package base 11, and the package base 11 is further provided with a pin 13. An edge emitting laser chip (EEL) is mounted in the package base 11, the laser chip 2 is mounted on the package base 11, and the initial light beam a of the laser chip 2 is directed to the package side of the package shell 1 which is not provided with the pin 13.

[0053] Based on the above, a temperature control assembly is further mounted on the package base 11 to realize temperature control of the laser chip 1, the temperature control assembly comprises a thermistor 22, a TEC cooler 23 and a heat sink 24, the heat sink 24 is arranged between the TEC cooler 23 and the laser chip 2; specifically, the hot surface of the TEC cooler 23 is in contact with the package base 11, the heat sink 24 is in contact with the cold surface of the TEC cooler 23, and the laser chip 1 is mounted on the heat sink 24, and the heat sink 24 mainly realizes the transmission of the thermal response of the laser chip end and the TEC end; of course, the temperature control assembly in the embodiment can also use a heating type temperature control according to needs.

[0054] Based on the above, a second lens 6 is further arranged between the beamsplitter 8 and the reference gas chamber 4, and the second lens 6 is used for shaping the reference light beam c.

[0055] Based on the above, a light path isolator 7 is further included, and the output light beam b is shaped by the third lens 9 and then outputted outward through the light path isolator 7; the light path isolator 7 in the embodiment can be selectively arranged outside the package shell 1 or inside the package shell 1.

[0056] In the embodiment, the reference light beam c is perpendicular or close to perpendicular to the initial light beam a after passing through the second lens 6, and the laser chip 2 and the photodetector 5 are both arranged on the package base 11, and the overall width, length and height of the laser chip 2 and the photodetector 5 are still relatively compact.

[0057] Compared with the existing complex packaging structure using two TO can or utilizing front and rear light, the packaging structure of the single chip integrated laser with a reference light path of the single chip integrated laser with a reference gas chamber and a reference photodetector has the advantages of lower cost, smaller size and standardization and universal packaging, can be packaged into a single TO package or a butterfly package, and makes the laser with a reference light path have good interchangeability, reliability and consistency at the device end, so that the laser with a reference light path is miniaturized and low-cost.

[0058] It should be noted that the above examples are used to illustrate the technical solutions of the present application, but not to limit them; although the present application has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the specific embodiments of the present application can be modified or some technical features can be replaced by equivalent ones; without departing from the spirit of the technical solutions of the present application, they should be covered in the technical solution range of the present application claimed.

Claims

1. A monolithic integrated laser with a reference light path, characterized by: The application relates to a laser chip package, which comprises a single package shell (1) comprising a single package base (11) and a package cap (12) matched with the package base (11), a laser chip (2), a first lens (3), a reference gas chamber (4) and a photoelectric detector (5) arranged in the package shell (1), wherein the laser chip (2) is mounted on the package base (11); the first lens (3) shapes the laser of the laser chip (2) into an output light beam, and part of the reflected light of the first lens (3) naturally generates reference light beams which are detected by the photoelectric detector (5) after passing through the reference gas chamber (4).

2. The monolithically integrated laser with reference light path of claim 1, wherein: The package shell (1) adopts T0 packaging, the laser chip (2) adopts a surface-emitting laser chip or an edge-emitting laser chip, and an optical path turning structure (21) is further arranged between the edge-emitting laser chip and the first lens (3).

3. The monolithically integrated laser with reference light path of claim 1, wherein: The package shell (1) adopts butterfly packaging, and the laser chip (2) adopts an edge-emitting laser chip.

4. The monolithically integrated laser with reference optical path according to claim 1 or 2 or 3, characterized in that: A second lens (6) is further arranged between the first lens (3) and the reference gas chamber (4), and the second lens (6) is used for shaping the reference light beams.

5. The monolithically integrated laser with reference optical path according to claim 1 or 2 or 3, characterized in that: An optical path isolator (7) is further arranged, and the output light beam passes through the optical path isolator (7) and is outputted outward.

6. A monolithic integrated laser with a reference light path, characterized by: The application relates to a laser chip package, which comprises a single package shell (1) comprising a single package base (11) and a package cap (12) matched with the package base (11), a laser chip (2), a beam splitter (8), a third lens (9), a reference gas chamber (4) and a photoelectric detector (5) arranged in the package shell (1), wherein the laser chip (2) is mounted on the package base (11); the beam splitter (8) splits the laser of the laser chip (2) into an output light beam and a reference light beam, the output light beam is shaped by the third lens (9), the reference light beam is detected by the photoelectric detector (5) after passing through the reference gas chamber (4); the package shell (1) adopts butterfly packaging, and the laser chip (2) adopts an edge-emitting laser chip.

7. The monolithically integrated laser with reference light path of claim 6, wherein: A second lens (6) is further arranged between the beam splitter (8) and the reference gas chamber (4), and the second lens (6) is used for shaping the reference light beams.

8. The monolithically integrated laser with reference light path of claim 6, wherein: An optical path isolator (7) is further arranged, and the output light beam passes through the optical path isolator (7) and is outputted outward.

9. The monolithically integrated laser with reference optical path according to claim 1 or 2 or 3 or 6, characterized in that: A thermistor (22), a TEC cooler (23) and a heat sink (24) are further arranged in the package shell (1), and the heat sink (24) is arranged between the TEC cooler (23) and the laser chip (2).

10. The monolithically integrated laser with reference optical path according to claim 1 or 2 or 3 or 6, characterized in that: A thermistor (22), a heater and a heat sink (24) are further arranged in the package shell (1), and the heat sink (24) is arranged between the heater and the laser chip (2).

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