Jig structure for PCBA wireless module

Abstract

The utility model discloses a jig structure for a PCBA (Printed Circuit Board Assembly) wireless module. The jig structure for the PCBA wireless module comprises a lower jig, an upper jig, a lower needle die and a single-chip buffer pressing mechanism, the lower jig comprises a jig bottom plate, a lower supporting plate is fixedly arranged in the middle area of the jig bottom plate, and a lower needle die used for containing the PCBA wireless module is arranged on the lower supporting plate. Limiting supporting columns are arranged at the four corners of the jig bottom plate correspondingly. The upper jig comprises a top plate, positioning buffer sleeves are arranged at the positions, corresponding to the limiting supporting columns, of the top plate, and the positioning buffer sleeves are connected to the limiting supporting columns in an inserted mode. According to the utility model, a test switching function is provided for the PCBA wireless module through the lower needle die, and the upper jig and the lower jig are matched to realize vertical displacement, so that the single-chip buffer pressing mechanism can independently press each module unit of the PCBA wireless module, the structural stability is greatly improved, and the accuracy of a test result is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to mechanical equipment technical field especially relates to a tool structure for PCBA wireless module. BACKGROUND

[0002] PCBA (printed circuit board) wireless module is the important component element in various electric appliances, and the PCBA wireless module needs to be tested in the production process, is burnt or is detected in quality.

[0003] The PCBA wireless module is positioned on the tool usually when being tested, and the position of the PCBA wireless module needs to be ensured not to deviate in order to keep the stability of electrical connection in the testing process, and the existing tool does not have this function, resulting in the low accuracy of the test result. UTILITY MODEL CONTENTS

[0004] In view of the above problem, the utility model is provided to overcome the above problem or at least partially solve the above problem.

[0005] The utility model provides a tool structure for PCBA wireless module, the tool structure for PCBA wireless module includes: lower tool, upper tool, lower needle mould and single piece buffer pressure combination mechanism, the lower tool includes tool base plate, the middle area of tool base plate is fixedly provided with lower support plate, is provided with lower needle mould for accommodating PCBA wireless module on lower support plate, the four corners of tool base plate are provided with limiting support column respectively, the upper tool includes top plate, the position of limiting support column is provided with positioning buffer sleeve in top plate, positioning buffer sleeve is inserted on limiting support column, the position of lower support plate is provided with upper pressure plate in top plate, the position of lower needle mould is provided with single piece buffer pressure combination mechanism on upper pressure plate, the both sides of lower support plate are provided with positioning guide cylinder respectively, the position of positioning guide cylinder is provided with positioning guide column in upper pressure plate respectively, and positioning guide column is inserted in positioning guide cylinder.

[0006] Optionally, the bottom of the lower support plate is provided with a test line adapter plate corresponding to the position of the lower needle mold, and the test line adapter plate is electrically connected with the lower needle mold.

[0007] Optionally, the two sides of the tool base plate are respectively provided with a first side connecting groove.

[0008] Optionally, a support mounting seat is arranged on the tool base plate, and a support strip is hingedly connected to the support mounting seat.

[0009] Optionally, a plurality of first through holes are arranged on the tool base plate.

[0010] Optionally, the lower needle mold comprises a PCBA carrier plate, a needle mold assembly, a double-head probe assembly, a probe plate cover plate, a test adapter plate and a baffle; the upper end of the needle mold assembly is provided with the PCBA carrier plate, the needle mold assembly is connected with the double-head probe assembly, the lower end of the needle mold assembly is provided with the probe plate cover plate, the probe plate cover plate is arranged below the double-head probe assembly, the lower end of the probe plate cover plate is provided with the test adapter plate, the double-head probe assembly penetrates through the probe plate cover plate and is electrically connected with the test adapter plate; the two sides of the PCBA carrier plate are respectively provided with the baffle.

[0011] Optionally, the two sides of the top plate are respectively provided with a second side connecting groove.

[0012] Optionally, a plurality of second through holes are arranged on the top plate.

[0013] Optionally, the single-piece buffer compression mechanism comprises a plurality of independent compression assemblies, and the positions of the compression assemblies correspond to the module units of the PCBA wireless module one by one.

[0014] Optionally, the compression assembly comprises a profiling compression block, a compression rod shaft, an elastic compression rod sleeve, an open baffle, a side guide rod, a side sleeve, a first limiting protrusion and a second limiting protrusion; the compression rod shaft and the side guide rod are movably connected to the upper pressing plate, and the compression rod shaft and the side guide rod are connected to the profiling compression block at the lower end of the upper pressing plate; the elastic compression rod sleeve is arranged at the upper end of the compression rod shaft, the elastic compression rod sleeve is provided with a spring, the bottom of the elastic compression rod sleeve is provided with the first limiting protrusion, and the top end of the compression rod shaft is provided with the open baffle; the side sleeve is arranged at the upper end of the side guide rod, and the bottom of the side sleeve is provided with the second limiting protrusion.

[0015] The technical scheme provided in the embodiment of the utility model has at least the following technical effects or advantages:

[0016] The jig structure for the PCBA wireless module provided by the embodiment of the utility model provides test adapter function for the PCBA wireless module through the lower needle mold, and the upper jig and the lower jig cooperate to realize up-down displacement, so that the single-piece buffer compression mechanism can independently compress each module unit of the PCBA wireless module, the stability of the structure is greatly improved, and the accuracy of the test result is improved.

[0017] The above description is only a summary of the technical scheme of the utility model, in order to more clearly understand the technical means of the utility model, the specific embodiment of the utility model can be implemented according to the content of the specification, and in order to make the above and other purposes, characteristics and advantages of the utility model more obvious and easy to understand, the specific embodiment of the utility model is described below. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the fixture structure for PCBA wireless modules described in this utility model;

[0020] Figure 2 This is a schematic diagram of the lower fixture.

[0021] Figure 3 This is a schematic diagram of the lower needle mold structure;

[0022] Figure 4 This is a schematic diagram of the upper fixture.

[0023] Figure 5 This is a schematic diagram of a single-piece buffer pressing mechanism.

[0024] Explanation of reference numerals in the attached figures:

[0025] 1. Lower jig; 2. Upper jig; 3. Lower needle mold; 4. Single-piece buffer pressing mechanism; 10. Jig base plate; 11. Test line adapter plate; 12. Lower support plate; 13. Positioning guide cylinder; 14. Limiting support column; 15. First side connecting groove; 16. Support mounting base; 17. Support strip; 18. First through hole; 19. First handle; 21. Top plate; 22. Upper pressure plate; 23. Positioning buffer sleeve; 24. Positioning guide column; 25. Second side connecting groove; 26. Second through hole; 27. Second handle; 31. PCBA carrier board; 32. Needle mold assembly; 33. Dual-head probe assembly; 34. Probe board cover; 35. Test adapter board; 36. Baffle; 40. Contouring pressure block; 41. Pressure rod shaft; 42. Elastic pressure rod sleeve; 43. Open retaining ring; 44. Side guide rod; 45. Side sleeve; 46. First limiting protrusion; 47. Second limiting protrusion. Detailed Implementation

[0026] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings.

[0027] In order to make the person skilled in the art better understand the technical scheme of the present application, the technical scheme in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. The preferred embodiments of the present application are given in the drawings. The present application can be realized in many different forms, and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0028] Unless otherwise specified, the various raw materials, instruments and equipment used in the present application can be purchased from the market or prepared by existing methods.

[0029] Figure 1 is a structural schematic diagram of a jig structure for a PCBA wireless module provided by an embodiment of the present application, referring to Figure 1 As shown in the figure, the jig structure for the PCBA wireless module comprises a lower jig 1, an upper jig 2, a lower needle die 3 and a single-piece buffer compression mechanism 4. The lower jig 1 comprises a jig bottom plate 10 for providing physical support, a lower support plate 12 is fixedly arranged in the middle area of the jig bottom plate 10, and the lower needle die 3 for accommodating the PCBA wireless module is arranged on the lower support plate 12. Limiting support columns 14 are arranged at the four corners of the jig bottom plate 10, respectively. The upper jig 2 comprises a top plate 21 for providing physical support, a positioning buffer sleeve 23 is arranged on the top plate 21 corresponding to the position of the limiting support column 14, and the positioning buffer sleeve 23 is inserted on the limiting support column 14. An upper pressing plate 22 is arranged on the top plate 21 corresponding to the position of the lower support plate 12, and a single-piece buffer compression mechanism 4 for compression of the PCBA wireless module is arranged on the upper pressing plate 22 corresponding to the position of the lower needle die 3. Positioning guide cylinders 13 are arranged on both sides of the lower support plate 12, respectively, and positioning guide columns 24 are arranged on the upper pressing plate 22 corresponding to the positions of the positioning guide cylinders 13, respectively. The positioning guide columns 24 are inserted in the positioning guide cylinders 13, so that the top plate 21 can move up and down based on the guiding action of the positioning guide columns 24, realizing the compression of the PCBA wireless module by the single-piece buffer compression mechanism 4, and positioning the four-corner positions in cooperation with the positioning buffer sleeve 23 and the limiting support column 14.

[0030] Figure 2 is a structural schematic diagram of the lower jig 1, in conjunction with Figure 2 As shown in the figure, a test line adapter plate 11 is arranged on the bottom of the lower support plate 12 corresponding to the position of the lower needle die 3, and the test line adapter plate 11 is electrically connected with the lower needle die 3 for transmitting electrical signals in the test process.

[0031] The first side connecting groove 15 is used for connecting with the external support structure, so as to limit the installation position of the lower jig 1.

[0032] The support mounting seat 16 is arranged on the jig bottom plate 10, and the support strip 17 is hinged to the support mounting seat 16. The support strip 17 can be erected to limit the pressing distance between the upper jig 2 and the lower jig 1, and can be folded when not in use.

[0033] A plurality of first through holes 18 are arranged on the jig bottom plate 10, which are hollowed out, so as to reduce the structural load, reduce material loss and save cost.

[0034] The first handle 19 is further arranged on the jig bottom plate 10, which provides a force supporting point for technicians when disassembling during later maintenance.

[0035] Figure 3 It is a structural schematic view of the lower needle mold 3, which is combined with Figure 3 As shown in the figure, the lower needle mold 3 includes a PCBA carrier plate 31, a needle mold assembly 32, a double-head probe assembly 33, a probe plate cover plate 34, a test adapter plate 35 and a baffle plate 36; the upper end of the needle mold assembly 32 is provided with the PCBA carrier plate 31, the needle mold assembly 32 is inserted with the double-head probe assembly 33, the lower end of the needle mold assembly 32 is provided with the probe plate cover plate 34, the probe plate cover plate 34 is arranged below the double-head probe assembly 33, the lower end of the probe plate cover plate 34 is provided with the test adapter plate 35, the double-head probe assembly 33 penetrates the probe plate cover plate 34 and is electrically connected with the test adapter plate 35, and the test adapter plate 35 is electrically connected with the test line adapter plate 11; the two sides of the PCBA carrier plate 31 are respectively provided with the baffle plate 36, which is used to provide upper limit for the PCBA carrier plate 31, limit the limit distance when the single-piece buffer pressing mechanism 4 is pressed, and avoid damage to the PCBA wireless module in some scenes.

[0036] Figure 4 It is a structural schematic view of the upper jig 2, which is combined with Figure 4 As shown in the figure, the two sides of the top plate 21 are respectively provided with the second side connecting groove 25, which is used for connecting with the external lifting mechanism and moving up and down under the action of the external lifting structure.

[0037] A plurality of second through holes 26 are arranged on the top plate 21, which are hollowed out, so as to reduce the structural load, reduce material loss and save cost.

[0038] The second handle 27 is further arranged on the top plate 21, which provides a force supporting point for technicians when disassembling during later maintenance.

[0039] Figure 5 Figure 1 is a structural schematic diagram of a single-piece buffering press-fit mechanism 4 according to an embodiment of the present application, and Figure 2 is a structural schematic diagram of a jig structure for a PCBA wireless module according to an embodiment of the present application. Figure 5 As shown in the figures, the single-piece buffering press-fit mechanism 4 includes a plurality of independent press-fit assemblies, each of which is in one-to-one correspondence with a module unit of the PCBA wireless module, thereby realizing independent press fitting. Specifically, the press-fit assembly includes a profiled press block 40, a press rod shaft 41, an elastic press rod sleeve 42, an open blocking ring 43, a side guide rod 44, a side sleeve 45, a first limiting protrusion 46, and a second limiting protrusion 47. The press rod shaft 41 and the side guide rod 44 are movably inserted into the upper press plate 22, and the press rod shaft 41 and the side guide rod 44 are connected to the profiled press block 40 at the lower end of the upper press plate 22. The bottom surface of the profiled press block 40 is matched with the shape of the module unit of the PCBA wireless module. The press rod shaft 41 is sleeved with the elastic press rod sleeve 42 at the upper end of the upper press plate 22. The elastic press rod sleeve 42 is internally provided with a spring (not shown in the figure), and the bottom of the elastic press rod sleeve 42 is provided with the first limiting protrusion 46. The top end of the press rod shaft 41 is provided with the open blocking ring 43. The side guide rod 44 is sleeved with the side sleeve 45 at the upper end of the upper press plate 22, and the bottom of the side sleeve 45 is provided with the second limiting protrusion 47. When the upper press plate 22 is pressed, the profiled press block 40 is pressed onto the module unit of the PCBA wireless module. At this time, the side guide rod 44 plays a guiding role, the press rod shaft 41 is lifted up, the first limiting protrusion 46 and the second limiting protrusion 47 can limit the limit distance of press fitting, the open blocking ring 43 can prevent the press rod shaft 41 from being separated from the elastic press rod sleeve 42, and the spring internally provided in the elastic press rod sleeve 42 can provide a reset function.

[0040] The jig structure for the PCBA wireless module according to the embodiment of the present application provides a test switching function for the PCBA wireless module through the lower pin 3. The upper jig 2 and the lower jig 1 are cooperated to realize up-down displacement, so that the single-piece buffering press-fit mechanism 4 can independently press fit each module unit of the PCBA wireless module, greatly improving the stability of the structure and the accuracy of the test results.

[0041] In the specification provided herein, a large number of specific details are described. However, it can be understood that the embodiments of the present application can be practiced without these specific details. In some examples, well-known methods, structures, and techniques are not shown in detail in order not to obscure the understanding of the present specification.

[0042] Similarly, it is to be understood that the embodiments of the application which have been outlined above are intended to be illustrative of the various aspects of the application rather than limiting. Other embodiments of the application will readily occur to those skilled in the art upon reading the above description. Accordingly, it will be appropriate for the scope of the application to refer not only to the embodiments illustrated above, but to all alternative embodiments as can be made and come within the scope of the following claims. The claims are intended to cover all alternatives falling within the scope of the claims. The claims are intended to cover all alternatives falling within the scope of the claims.

[0043] It is to be understood that the above description is intended to be illustrative and not restrictive. Many other embodiments will be apparent to those of skill in the art upon reading the above description. The scope of the application should, therefore, be determined not with reference to the above description, but should instead be determined with reference to the appended claims, along with their full scope of equivalents.

Claims

1. A jig structure for a PCBA wireless module, characterized by, The jig structure for the PCBA wireless module comprises a lower jig, an upper jig, a lower needle mold and a single-piece buffer pressing mechanism; the lower jig comprises a jig bottom plate, a lower support plate is fixedly arranged at the middle area of the jig bottom plate, and a lower needle mold for accommodating the PCBA wireless module is arranged on the lower support plate; limit support columns are arranged at the four corners of the jig bottom plate, respectively; the upper jig comprises a top plate, a positioning buffer sleeve is arranged on the top plate at the positions corresponding to the limit support columns, and the positioning buffer sleeve is inserted on the limit support columns; an upper pressing plate is arranged on the top plate at the positions corresponding to the lower support plate, and a single-piece buffer pressing mechanism is arranged on the upper pressing plate at the positions corresponding to the lower needle mold; positioning guide cylinders are arranged on the two sides of the lower support plate, respectively, and positioning guide columns are arranged on the upper pressing plate at the positions corresponding to the positioning guide cylinders, respectively, and the positioning guide columns are inserted in the positioning guide cylinders.

2. The jig structure for PCBA wireless module according to claim 1, wherein: A test line adapter plate is arranged on the bottom of the lower support plate at the positions corresponding to the lower needle mold, and the test line adapter plate is electrically connected with the lower needle mold.

3. The jig structure for PCBA wireless module according to claim 1, wherein: First side connecting grooves are arranged on the two sides of the jig bottom plate, respectively.

4. The jig structure for PCBA wireless module according to claim 1, wherein: Supporting mounting seats are arranged on the jig bottom plate, and supporting strips are hingedly arranged on the supporting mounting seats.

5. The jig structure for PCBA wireless module according to claim 1, wherein: A plurality of first through holes are arranged on the jig bottom plate.

6. The jig structure for PCBA wireless module according to claim 1, wherein: The lower needle mold comprises a PCBA carrier plate, a needle mold assembly, a double-head probe assembly, a probe plate cover plate, a test adapter plate and a baffle; a PCBA carrier plate is arranged at the upper end of the needle mold assembly, a double-head probe assembly is inserted on the needle mold assembly, a probe plate cover plate is arranged at the lower end of the needle mold assembly, the probe plate cover plate is arranged below the double-head probe assembly, a test adapter plate is arranged at the lower end of the probe plate cover plate, the double-head probe assembly penetrates through the probe plate cover plate and is electrically connected with the test adapter plate; baffles are arranged on the two sides of the PCBA carrier plate, respectively.

7. The jig structure for PCBA wireless module according to claim 1, wherein: Second side connecting grooves are arranged on the two sides of the top plate, respectively.

8. The jig structure for PCBA wireless module according to claim 1, wherein: A plurality of second through holes are arranged on the top plate.

9. The jig structure for PCBA wireless module according to claim 1, wherein: The single-piece buffer pressing mechanism comprises a plurality of independent pressing assemblies, and the positions of the pressing assemblies correspond to the module units of the PCBA wireless module one by one, respectively.

10. The jig structure for PCBA wireless module according to claim 9, wherein: The pressing assembly comprises a profiling pressing block, a pressing rod shaft, an elastic pressing rod sleeve, an open baffle, a side guide rod, a side sleeve, a first limit protrusion and a second limit protrusion; the pressing rod shaft and the side guide rod are movably inserted on the upper pressing plate, and the pressing rod shaft and the side guide rod are connected with the profiling pressing block at the lower end of the upper pressing plate; the elastic pressing rod sleeve is sleeved on the upper end of the pressing rod shaft, a spring is arranged in the elastic pressing rod sleeve, a first limit protrusion is arranged on the bottom of the elastic pressing rod sleeve, and an open baffle is arranged on the top end of the pressing rod shaft; the side sleeve is sleeved on the upper end of the side guide rod, and a second limit protrusion is arranged on the bottom of the side sleeve.

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