Electronic system for testing or data acquisition and host thereof

Abstract

The utility model relates to an electronic system for testing or data acquisition and a host thereof. The host comprises a host mother board, a host mainboard and a flexible circuit board, the flexible circuit board is provided with a plurality of differential communication lines; the host mother board is connected with the host mainboard through the flexible circuit board, and each differential communication line is electrically connected with the host mother board and the host mainboard so as to transmit a group of differential signals between the host mother board and the host mainboard. The host mainboard can communicate with a target object through the host mother board; the target object comprises at least one of a tested piece, auxiliary equipment for testing and electronic equipment to be subjected to data acquisition; wherein the transmission rate information of the at least two differential communication lines is different, and / or wherein the at least two differential communication lines are different types of differential communication lines.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of testing or data acquisition, and in particular to an electronic system for testing or data acquisition and a host thereof. BACKGROUND

[0002] In the application scenarios of data acquisition, testing, etc., a host is required to control the data acquisition and testing process, and the host can generally include a host motherboard, and the host motherboard can be provided with circuit modules such as a processor.

[0003] In the prior art, in the application scenarios of data acquisition, testing, etc., in some systems, the host motherboard and other devices can communicate through Ethernet, at which time only a standardized network cable is required to be used to connect externally, and in other systems, the host motherboard and other devices can be connected through the standardized plug-in connection of a PCIe plug-in connector and a slot, and only a PCIe bus is achieved. It can be seen that in the prior art, in the application scenarios of data acquisition, testing, etc., the host motherboard is connected and communicates with other devices through a standardized network cable or a standardized PCIe plug-in connection, and it can be seen that only a standardized medium can be used for connection. CONTENT OF THE UTILITY MODEL

[0004] Therefore, it is necessary to provide an electronic system for testing or data acquisition and a host thereof in view of the above technical problems.

[0005] In a first aspect, the present application provides a host of an electronic system for testing or data acquisition, comprising a host motherboard, a host motherboard, and a flexible circuit board; the flexible circuit board is provided with a plurality of differential communication lines; the host motherboard and the host motherboard are connected through the flexible circuit board, each differential communication line is electrically connected between the host motherboard and the host motherboard, to transmit a group of differential signals between the host motherboard and the host motherboard, and the host motherboard can communicate with a target object through the host motherboard; the target object includes at least one of the following: a measured object, an auxiliary device for testing, and an electronic device to be data-acquired;

[0006] The transmission rate information of at least two differential communication lines is different, and / or: at least two differential communication lines are differential communication lines of different types.

[0007] Optionally, the plurality of differential communication lines includes at least one of the following: a PCIe communication line, an Ethernet communication line, and a USB communication line.

[0008] Optionally, the host motherboard is connected to an external interface, and the plurality of differential communication lines includes a target differential communication line, and the target differential communication line is connected to the external interface through the host motherboard.

[0009] The external interface comprises a USB interface, and the target differential communication line comprises a USB communication line, and / or: the external interface comprises an Ethernet interface, and the target differential communication line comprises an Ethernet communication line.

[0010] Optionally, the flexible circuit board comprises a multi-layer board; the plurality of differential communication lines comprises one or more first differential communication lines and one or more second differential communication lines; the transmission rate information of the first differential communication lines is lower than that of the second differential communication lines; and the second differential communication lines are distributed on non-adjacent layers of the board.

[0011] Optionally, the multi-layer board comprises a first layer board, a second layer board, a third layer board and a fourth layer board stacked in sequence; the second differential communication lines are distributed on the first layer board and the third layer board, and the first differential communication lines are distributed on the first layer board, the second layer board, the third layer board and the fourth layer board.

[0012] Optionally, the host further comprises a heat dissipation module, which is located between the host motherboard and the host mainboard.

[0013] Optionally, one side of the host motherboard is provided with at least two mounting positions, each of which is used for mounting one host mainboard.

[0014] In a second aspect, the application provides an electronic system comprising the host of the first aspect and the optional solutions thereof, and the electronic system is a test system for testing a measured object or a data acquisition system for acquiring data of an electronic device loaded on a vehicle.

[0015] Optionally, the electronic system further comprises a backboard and a communication device.

[0016] The host and the communication device are both arranged on the backboard, and the host can communicate with the communication device through the backboard, and the communication device is used for communicating with the target object externally.

[0017] Optionally, the communication device comprises at least one of the following: a bus communication device; a signal acquisition device; and a signal generation device.

[0018] In the electronic system and its host for testing or data acquisition, the host motherboard and the host mainboard are connected through the flexible circuit board, so that the standard communication medium can be abandoned, the same flexible circuit board can be used to realize the communication of the differential communication lines of different transmission rate information, and the communication needs of different transmission rates can be met through various communication modes. In addition, the connection between the host motherboard and the host mainboard is realized without using connectors, which helps to save the space between the host motherboard and the host mainboard, and facilitates the accommodation of other devices (such as a heat dissipation module). BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related art, the drawings needed to be used in the description of the embodiments of the present application or the related art will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other related drawings can be obtained by those skilled in the art without creative labor.

[0020] Figure 1 is a schematic view of the structure of the host in an embodiment of the present application;

[0021] Figure 2 is a schematic view of the structure of the flexible circuit board in an embodiment of the present application;

[0022] Figure 3 is a schematic view of the structure of the electronic system in an embodiment of the present application Figure 1 .

[0023] Figure 4 is a schematic view of the structure of the electronic system in an embodiment of the present application Figure 2 .

[0024] BRIEF DESCRIPTION OF DRAWINGS

[0025] 1 - host mainboard;

[0026] 2 - host motherboard;

[0027] 3 - heat dissipation module;

[0028] 4 - flexible circuit board;

[0029] 401 - first layer board; 402 - second layer board; 403 - third layer board; 404 - fourth layer board; 405 - first differential communication line; 406 - second differential communication line; 407 - grid ground plane; 408 - solid ground plane; 409 - solid power plane; 410 - grid power plane; 411 - connector;

[0030] 5 - communication device;

[0031] 6 - a selective on device;

[0032] 7 - a substrate. DETAILED DESCRIPTION

[0033] For the purpose of promoting an understanding of the present application, the present application will now be described in greater detail with reference to the relevant drawings. The embodiments of the present application are shown in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of the present application is more thorough and complete.

[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs. The terminology used in the description of the present application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the present application.

[0035] It should be understood that the terms "first", "second", etc. used herein can be used to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish the first element from another element.

[0036] It should be noted that when an element is considered to be "connected" to another element, it can be directly connected to the other element or connected to the other element through a central element. In addition, "connected" in the following embodiments should be understood as "electrically connected", "communicatively connected" and the like if there is a transmission of electrical signals or data between the connected objects.

[0037] As used herein, the singular forms "a", "an" and "the" can include plural forms unless the context clearly indicates otherwise. It should also be understood that the terms "comprise / comprises" or "have / having" specify the presence of the stated features, integers, steps, operations, components, parts or combinations thereof, but do not exclude the presence or addition of one or more other features, integers, steps, operations, components, parts or combinations thereof.

[0038] In the application scenario of the embodiments of the present application, the host in the electronic system can be connected to the target object through the communication device. The embodiments of the present application can be used for testing the target object, and can also be used for data acquisition of the target object loaded in the vehicle.

[0039] The target object therein can be any object or combination of objects that needs to interact with the host during the testing or data acquisition process, wherein the object usually refers to a hardware object.

[0040] In an example, the target object can be a DUT, specifically a hardware under test, such as a controller in a development process and / or a verification stage, which can be a controller suitable for application to a vehicle after development, such as a domain controller on a vehicle, for example, a controller of a low-altitude aircraft, a drone. In a further example, the DUT can refer to a DUT of a hardware-in-the-loop (HIL) test, wherein the one or more hosts can be an industrial PC, i.e., a real-time PC (RTPC) in a hardware-in-the-loop test, which is usually configured with an embedded operating system, specifically a real-time embedded operating system, or can be understood as an embedded operating system with relatively high real-time performance.

[0041] In another example, the target object can be an actuator in a rapid control prototyping (RCP) test, in which case the one or more hosts can be an industrial PC used in the RCP test, i.e., an industrial PC for rapid control prototyping (RCP) test, which is usually configured with an embedded operating system, specifically a real-time embedded operating system, or can be understood as an embedded operating system with relatively high real-time performance. In this case, the software under test (e.g., an algorithm, a model, etc.) can be provided on the industrial PC, and the industrial PC needs to control the actuator to test the function of the software. It can be seen that the actuator can also be understood as an auxiliary device for testing (testing of the software under test).

[0042] In yet another example, the target object can also be an auxiliary device for testing that provides corresponding auxiliary functions for an industrial PC in a test process (e.g., HIL test, RCP test, etc.), such as a test bench, a simulation device, a simulation bench, etc. for simulating corresponding sensors, structural functions, etc.

[0043] In still another example, the target object can also be a data acquisition object, such as a target object for data acquisition (i.e., a data acquisition object), which is usually a device provided on a vehicle during operation, such as various on-vehicle devices (on-vehicle sensors, bus networks, etc.). In this case, the one or more hosts can be an industrial PC for data acquisition.

[0044] It can be seen that the target object can include at least one of the following: a DUT, an auxiliary device for assisting in testing (e.g., testing of the DUT), a data acquisition object.

[0045] The host can be any circuit, circuit board, device with a processor, such as a host that refers to a circuit board or a combination of multiple circuit boards with a processor, or a host that includes a circuit board with a processor and a mechanical structure such as a housing. The host can be an industrial PC or a host computer configured with a desktop operating system. The number of hosts is at least one. If the number of hosts is two or more, one of the hosts is usually an industrial PC, and the remaining hosts can be industrial PCs or host computers.

[0046] In an example, taking HIL test as an example, the industrial computer is RTPC, which is used to run the test, and the host computer is needed to realize the man-machine interaction with the user, so that the user can monitor and / or affect the test run by the industrial computer through the host computer. The affect can include the affect before the test, such as configuring the test environment and test case, and can also include the affect during the test.

[0047] In addition, the electronic system can be at least one of an HIL test system, an RCP test system, a simulation test system, a back-annotation test system, etc., and can also be a data acquisition system.

[0048] Please refer to Figure 1 The host computer of the electronic system for testing or data acquisition includes a host motherboard 2, a host mainboard 1, a flexible circuit board 4, and a heat dissipation module 3.

[0049] The heat dissipation module 3 can be any device or combination of devices that can dissipate heat from the host mainboard 1, such as at least one of heat dissipation fins, heat dissipation fans, water-cooled heat dissipation devices, and specific heat-conductive materials.

[0050] The flexible circuit board 4 is provided with a plurality of differential communication lines; the host motherboard 2 and the host mainboard 1 are connected through the flexible circuit board 4, and each differential communication line is electrically connected to the host motherboard 2 and the host mainboard 1 to transmit a set of differential signals between the host motherboard 2 and the host mainboard 1.

[0051] In some embodiments, the transmission rate information of at least two differential communication lines is different; the transmission rate information can be any information describing the transmission data capacity of the differential communication line per unit time, such as the upper limit of the transmission rate, or the transmission rate corresponding to the differential communication line being calibrated, advertised, or defined.

[0052] In other embodiments, at least two differential communication lines are different types of differential communication lines. Different types refer to communication based on different standard protocols, such as PCIe communication lines, Ethernet communication lines, and USB communication lines, but they can also be not limited to this.

[0053] In some other embodiments, the plurality of differential communication lines satisfy both: the transmission rate information of at least two differential communication lines is different; and at least two differential communication lines are differential communication lines of different types. The differential communication lines of different types and different transmission rate information can be the same or different.

[0054] In some examples, the plurality of differential communication lines includes at least one of: a PCIe communication line, an Ethernet communication line, and a USB communication line.

[0055] The Ethernet may, for example, include at least one of a general Ethernet, an in-vehicle Ethernet, an EtherCAT industrial Ethernet, etc. The Ethernet communication line may include only one transmission rate information or multiple transmission rate information, for example, may include one or more of a 1Gbps Ethernet communication line, a 10Gbps Ethernet communication line, a 40Gbps Ethernet communication line, or even a higher speed Ethernet communication line. The PCIe communication line may include only one transmission rate information or multiple transmission rate information, the USB communication line may include only one transmission rate information or multiple transmission rate information.

[0056] In comparison, the prior art test system and data acquisition system, especially the HIL test system, usually use Ethernet to connect the host motherboard and other devices. Even if it is thought to consider different communication methods, such as considering Ethernet and PCIe, it is still connected by using standardized Ethernet network cables and PCIe slots and connectors. For example, if two Ethernet communication lines of different transmission rates are considered, two Ethernet network cables are used for connection. However, the present application integrates multiple differential communication lines in the same communication medium by using a flexible circuit board, which has better integration and facilitates connection.

[0057] In some examples, the host motherboard is provided with at least two mounting positions, and each mounting position is used to mount a host motherboard. In some examples, the electronic system can use at least two host motherboards, and each mounting position is mounted with a host motherboard. In other examples, the electronic system can use only one host motherboard, and some mounting positions are vacant.

[0058] It can be seen that, in the present application, the host motherboard is provided with at least two mounting positions, which can facilitate the production of host motherboards with at least two mounting positions in batches, thereby meeting the needs of electronic systems with one or two host motherboards, without the need for customized production of different host motherboards for different numbers of host motherboards, which can help reduce production costs on this basis.

[0059] The host motherboard 1 can communicate with target objects through the host motherboard 2; the host motherboard 2 can be provided with a structure for communication with other devices, for example, a PCIe communication module, an etherCAT module, etc. for communication with a backplane through the backplane.

[0060] The host motherboard 2 is connected to an external interface, and the plurality of differential communication lines includes a target differential communication line, which is connected to the external interface through the host motherboard.

[0061] For example, the external interface can include an Ethernet interface connected to the host motherboard 2, and the corresponding target differential communication line can be a corresponding Ethernet communication line;

[0062] For another example, the external interface can include a USB interface connected to the host motherboard 2, and the corresponding target differential communication line can be a corresponding USB communication line.

[0063] Further, based on the host motherboard 2, the connection of the external interface and the communication bridge between the external interface and the host motherboard can be realized.

[0064] In some embodiments, referring to Figure 2 , the flexible circuit board includes a plurality of layers; the plurality of differential communication lines includes one or more first differential communication lines and one or more second differential communication lines; the transmission rate information of the first differential communication line is lower than that of the second differential communication line; the layers on which the second differential communication lines are distributed are non-adjacent layers, thereby avoiding interference between differential communication buses with higher rates.

[0065] Specifically, the plurality of differential communication lines can be divided into first differential communication lines below a certain transmission rate information threshold and second differential communication lines above the threshold according to the transmission rate information, the number of differential communication lines required to be transmitted by the flexible circuit board, etc. The threshold can be one of the following, for example: 200Mbps, 500Mbps, 1Gbps, 2Gbps, 3Gbps, 4Gbps, 5Gbps, 6Gbps, 7Gbps, 8Gbps, 9Gbps, 10Gbps, 12Gbps, 20Gbps.

[0066] In a further example, the multi-layered board comprises a first layer, a second layer, a third layer and a fourth layer stacked in sequence; in the case of four layers, the first layer is the top layer and the fourth layer is the bottom layer.

[0067] The second differential communication lines are distributed in the first layer and the third layer, and the first differential communication lines are distributed in the first layer, the second layer, the third layer and the fourth layer.

[0068] In the case of more first differential communication lines with low transmission rate information and second differential communication lines with high transmission rate information which are prone to interference, the distribution requirements of the first differential communication lines can be fully met, and the distribution requirements of the second differential communication lines with high transmission rate information can be met while avoiding or reducing interference.

[0069] In addition, with reference to Figure 2 Due to the space limitation of the FPC, if a conventional grid copper is used in each layer, the maximum current flow cannot be met, and therefore in the example shown in FIG. 1, the power plane of the first layer and the fourth layer is set as solid copper, and the power plane of the second layer and the third layer in the middle is set as grid copper, so as to ensure the current flow while taking into account the bending characteristics of the FPC. Figure 2

[0070] The electronic system can be a test system for testing a DUT or a data acquisition system for acquiring data from electronic devices loaded in a vehicle.

[0071] In some examples, with reference to Figure 3 The electronic system can further comprise a backplane 7 and a communication device 5.

[0072] The host and the communication device 5 are both arranged on the backplane 7, and the host can communicate with the communication device 5 through the backplane 7, and the communication device 5 is configured to communicate with the target object.

[0073] The backplane can be any circuit board for realizing communication between the host and the communication device and / or communication between different communication devices. Specifically, the backplane can be provided with a communication circuit, such as at least one of a PCIe circuit, an EtherCAT circuit, etc., and the devices connected to the backplane, such as the host, the communication device, and optionally the selective connection device, can communicate through the communication circuit.

[0074] In an example, the devices connected to the backplane can selectively use the PCIe circuit or the EtherCAT circuit for communication.​

[0075] In an example, the backboard can be provided with a connection slot for detachably connecting a communication device, two ends (which can be described as a first end and a second end) of the connection slot can be connected to an EtherCAT circuit, when a communication device is connected to the connection slot, the connection slot can connect the communication device between the first end and the second end, so that the communication device is connected to the EtherCAT circuit as a node of the EtherCAT circuit, when there is no communication device connected to the connection slot, the connection slot can short the first end and the second end, at this time, the position of the connection slot is not a node of the EtherCAT, but as a piece of connection line, because the EtherCAT circuit is a node cascade connection architecture, through the connection slot, the cascade connection architecture of the connection slot without device can be avoided, and the cascade connection of the EtherCAT architecture can still be effectively run whether the connection slot is connected to the device or not, which provides reliable protection for the detachable design of the communication device, thereby providing a hardware basis for freely selecting, assembling and disassembling the communication device according to the needs.

[0076] In an example, in order to meet the above-mentioned selective communication and / or the role of the connection slot, a switch module can be provided between the communication device and the PCIe circuit and / or the EtherCAT circuit, the switch module can be controlled electronically or mechanically, and the switch module can be used to control whether the communication device is connected to the PCIe circuit and / or whether the communication device is connected to the EtherCAT circuit.

[0077] In a specific example, the communication device includes at least one of the following: a bus communication device; a signal acquisition device; a signal generation device.

[0078] The bus communication device can be understood as a device that communicates with a target object based on a bus protocol, a single bus communication device can only implement one bus protocol, or can also implement the function of multiple bus protocols, and further, the bus communication device can be used to implement communication of at least one of the following bus protocols: CAN bus, LIN bus, Flexray bus, vehicle Ethernet bus, DSI bus, PSI bus, SENT bus, etc. The communication channel provided by the bus communication device can be part or all of the bus channel, such as CAN channel, LIN channel, Flexray channel, vehicle Ethernet channel, DSI channel, PSI channel, and SENT channel. In some examples, the bus communication device can also provide other communication channels that are not bus channels.

[0079] The signal collection device can be understood as a device for collecting signals fed back by the target object. The signals collected by the signal collection device can include at least one of a voltage digital quantity, a current digital quantity, a voltage analog quantity, and a current analog quantity. Furthermore, the communication channel provided by the signal collection device can be a signal collection channel. A single signal collection channel can be used to collect only one type of signal or can be used to collect multiple types of signals. For example, a single signal collection channel can have multiple states, and different states can be used to collect different types of signals. For example, a single signal collection channel can have a voltage digital quantity collection state, a current digital quantity collection state, a voltage analog quantity collection state, and a current analog quantity collection state.

[0080] The signal generation device can be understood as a device for generating and feeding back signals to the target object under the control of the host. The signals generated by the signal generation device can include at least one of a voltage digital quantity, a current digital quantity, a voltage analog quantity, and a current analog quantity. Furthermore, the communication channel provided by the signal generation device can be a signal generation channel. A single signal generation channel can be used to generate only one type of signal or can be used to generate multiple types of signals. For example, a single signal generation channel can have multiple states, and different states can be used to generate different types of signals. For example, a single signal generation channel can have a voltage digital quantity generation state, a current digital quantity generation state, a voltage analog quantity generation state, and a current analog quantity generation state.

[0081] It can be seen that the communication device can provide communication channels.

[0082] In some embodiments, the electronic system can include a selective connection device.

[0083] The multiple communication channels are connected to different first connection portions of the selective connection device. Multiple second connection portions of the selective connection device are used to connect different communication lines of the target object. The selective connection device can selectively connect the first connection portions to the second connection portions, so that the corresponding communication channels are connected to the communication lines. In a further example, each second connection portion can be connected to a universal connection portion, and the universal connection portion is used to connect a communication line.

[0084] Therefore, if the multiple communication channels include different types of communication channels, even if the same universal connection portion (or can be understood as a second connection portion) is used to connect different types of communication lines (such as signal output lines and signal input lines of the target object) in different test tasks / data collection tasks, the selective connection device can meet the signal transmission requirements of each test by selectively connecting the corresponding channels.

[0085] The different types of communication channels can include at least two of a signal generation channel, a signal collection channel, and a bus channel.

[0086] If the different types of communication channels include signal generation channels and signal collection channels, in the prior art, the external interface of the test system is usually divided into DI (digital input) connection, DO (digital output) connection, AI (analog input) connection, AO (analog output) connection, and the like. Different connections correspond to different channels in the test system, for example, the DI connection is connected to the digital signal collection channel in the signal collection channel, and is used to connect the digital signal output line of the target object externally. The DO connection is connected to the digital output channel in the signal generation channel, and is used to connect the digital signal input line of the target object externally. The AI connection is connected to the analog signal collection channel in the signal collection channel, and is used to connect the analog signal output line of the target object externally. The AO connection is connected to the analog output channel in the signal generation channel, and is used to connect the analog signal input line of the target object externally. If the digital and analog signals are further divided into voltage and current, the classification of the connection and channel is more complicated. When wiring, different connections need to be distinguished to connect the line of the target object, which is relatively complicated and prone to errors.

[0087] In the above scheme of the present application, a single universal connection can consider digital / analog signal input / output functions, and the connection resource is fully and effectively utilized. It also has the effects of facilitating wiring and high degree of freedom in wiring. Specifically, the line of the target object can be connected to any universal connection, and only the selective connection device needs to be configured to ensure that the universal connection can be connected to the corresponding channel (signal generation channel or signal collection channel).

[0088] If the different types of communication channels include one-way channels (such as signal generation channels and / or signal collection channels) and bus channels, in the prior art, in addition to the external interface of the test system or data collection system, which is usually divided into DI (digital input) connection, DO (digital output) connection, AI (analog input) connection, AO (analog output) connection, and the like, a bus interaction connection is also provided, such as CAN bus, LIN bus, Flexray bus, DSI bus, and the like. The bus interaction connection is used to connect the bus communication line of the corresponding bus of the target object externally. When wiring, different connections need to be distinguished to connect the line of the target object, which is relatively complicated and prone to errors.

[0089] In the above scheme of the application, the single universal connection part can consider the digital / analog signal output function and the bus interaction function, and fully and effectively utilize the connection part resources. It can also have the effects of facilitating wiring, high wiring freedom, etc. Specifically, the line of the target object can be arbitrarily connected to any universal connection part, and only the selective connection device needs to be configured to ensure that the universal connection part can be connected to the corresponding channel (signal generation channel or signal acquisition channel).

[0090] Since the bus is an interactive communication method, and signal generation and signal acquisition are a one-way communication method, generally speaking, the connection part cannot be shared. However, the above scheme of the application creatively thinks of the sharing of the interactive communication medium and the one-way communication medium, and guarantees that no matter how the wiring is connected, the signal transmission requirement can be met through the selective connection device, for example, a certain bus communication line can be connected to the matching bus channel.

[0091] The first connection part can be understood as a medium for connecting the corresponding channel (such as a signal generation channel, a signal acquisition channel, or a bus channel), and different first connection parts connect different channels. The second connection part can be understood as a medium for connecting the corresponding universal connection part, and different second connection parts connect different universal connection parts, or: the second connection part can also be the universal connection part.

[0092] The selective connection device has a selective connection freedom, which includes at least two cases. In one case, all first connection parts can be selectively connected to all second connection parts, that is, each first connection part can be selectively connected to any second connection part. In another case, selective connection can be achieved within a certain range, for example: the total number of first connection parts is M1, and the total number of second connection parts is M2. M1 can be equal to M2 or not equal to M2. Furthermore, for N1 first connection parts in M1, they can be selectively connected to N2 second connection parts in M2. N1 < M1, N2 < M2, that is, only N1 first connection parts and N2 second connection parts can be freely and selectively connected, and cannot be connected to other second connection parts outside the N2 second connection parts.

[0093] Further, the selective connection device, which can also be understood as any device whose circuit can freely connect the first connection part and the second connection part, for example, can be implemented by using a switch matrix, a relay matrix, etc., or by using an FPGA. The selective connection device can include one circuit board or a combination of multiple circuit boards. The selective connection device can be configured to control the connection relationship between the first connection part and the second connection part under the control of an industrial computer or an upper computer, or can automatically control or manually control the connection relationship through other devices (for example, an upper computer or a server externally connected to the test system). The control process can be implemented through the host computer, or can bypass the host computer and directly control the selective connection device through other interfaces of the test system.

[0094] The technical features of the above embodiments can be combined in any manner. To make the description concise, all possible combinations of the technical features in the above embodiments are not described, but as long as the combinations of the technical features do not contradict, they should be considered as falling within the scope of the present application.

[0095] The above embodiments only express several implementation manners of the present application, and the description is relatively specific and detailed, but it should not be considered as a limitation on the patent scope of the present application. It should be pointed out that, for those skilled in the art, some modifications and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the appended claims.

Claims

1. A host for an electronic system for testing or data acquisition, characterized in that, The host comprises a host motherboard, a host mainboard and a flexible circuit board; the flexible circuit board is provided with a plurality of differential communication lines; the host motherboard and the host mainboard are connected through the flexible circuit board; each differential communication line is electrically connected to the host motherboard and the host mainboard respectively, so as to transmit a group of differential signals between the host motherboard and the host mainboard; the host mainboard can communicate with a target object through the host motherboard; the target object comprises at least one of the following: a measured piece, auxiliary equipment for testing, electronic equipment to be data collected. The transmission rate information of at least two differential communication lines is different, and / or: at least two differential communication lines are differential communication lines of different types.

2. The host of claim 1, wherein, The plurality of differential communication lines comprises at least one of the following: a PCIe communication line, an Ethernet communication line and a USB communication line.

3. The host of claim 1, wherein, The host motherboard is connected to an external interface; the plurality of differential communication lines comprises a target differential communication line; the target differential communication line is connected to the external interface through the host motherboard. The external interface comprises a USB interface; the target differential communication line comprises a USB communication line, and / or: the external interface comprises an Ethernet interface; the target differential communication line comprises an Ethernet communication line.

4. The host of claim 1, wherein, The flexible circuit board comprises a plurality of layers of boards; the plurality of differential communication lines comprises one or more first differential communication lines and one or more second differential communication lines; the transmission rate information of the first differential communication line is lower than that of the second differential communication line. The second differential communication line is distributed on non-adjacent boards.

5. The host of claim 4, wherein, The plurality of layers of boards comprises a first board, a second board, a third board and a fourth board which are stacked in sequence; the second differential communication line is distributed on the first board and the third board; the first differential communication line is distributed on the first board, the second board, the third board and the fourth board.

6. The host of any one of claims 1 to 5, wherein, A heat dissipation module is further included, which is located between the host motherboard and the host mainboard.

7. The host of any one of claims 1 to 5, wherein, At least two mounting positions are provided on one side of the host motherboard; each mounting position is used for mounting one host mainboard.

8. An electronic system, characterized by The electronic system is a test system used for testing a measured piece or a data collection system used for collecting data of electronic equipment loaded on a vehicle.

9. The electronic system of claim 8, wherein, A backboard and a communication device are further included. The host and the communication device are both arranged on the backboard; the host can communicate with the communication device through the backboard; the communication device is used for communicating with the target object externally.

10. The electronic system of claim 9, wherein, The communication device comprises at least one of the following: a bus communication device, a signal collection device and a signal generation device.

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