Point power supply module

Abstract

The embodiment of the utility model discloses a point power supply module which comprises a substrate, an inductor and a plurality of copper columns, and an electronic component is arranged on the upper surface of the substrate. The inductor is welded on the lower surface of the substrate; and the plurality of copper columns are welded on the lower surface of the substrate and are used for establishing electrical connection with an external circuit. Different from the condition of the prior art, the embodiment of the utility model adopts a concentric circle layout structure in which the inductors are centered and the copper columns are surrounded. The inductor is arranged in the center of the lower surface of the substrate, and the multiple copper columns surround at equal intervals to form an annular array. The structure optimizes the heat conduction path, improves the heat dissipation efficiency, enhances the structural stability of the module, effectively reduces the warping risk of the substrate, and also reduces the overall height of the module.

Description

TECHNICAL FIELD

[0001] The embodiment of the utility model relates to point power supply technical field, especially point to a kind of point power supply module. BACKGROUND

[0002] With the development of third-generation semiconductor technology, the requirements for power modules are becoming higher and higher, and the demand for power modules with multiple output functions is also increasing. This requires further improving the power density and integration of power modules so that they can be widely used in communication fields such as interchanging devices, access devices, mobile communication, and aerospace fields.

[0003] In power modules, buck, boost or buck-boost are most widely used. In the structure of these power modules, the layout of devices has a great influence on the high integration of the module. Inductors are generally large-sized devices, so the placement of inductors is particularly important. For power modules with relatively high power density requirements, inductors are generally elevated in form, elevated by copper bars and PCB carriers.

[0004] This traditional inductor elevation form requires the heat of the inductor to be first conducted to the upper PCB carrier, and then conducted to the lower PCB substrate through the copper column for heat dissipation. Secondly, this elevation method also increases the overall height of the power module. SUMMARY

[0005] The technical problem solved by the embodiment of the utility model is to provide a point power supply module that can solve the problem of poor heat dissipation efficiency of existing point power supply modules.

[0006] To solve the above technical problems, one technical solution adopted by the utility model is to provide a point power supply module, which includes: a substrate, the upper surface of the substrate is provided with electronic components; an inductor, the inductor is welded to the lower surface of the substrate; and a plurality of copper columns, the plurality of copper columns are welded to the lower surface of the substrate, and the copper columns are used to establish electrical connection with external circuits.

[0007] In some embodiments, the plurality of copper columns surround the inductor and are welded to the lower surface of the substrate.

[0008] In some embodiments, one end of the copper column is provided with a solder ball, and the solder ball is used to establish electrical connection with a mother board.

[0009] In some embodiments, one end of the copper column is a pin structure.

[0010] In some embodiments, the heights of the plurality of copper columns are consistent, and the height of the inductor is less than the height of the copper columns.

[0011] In some embodiments, an upper plastic encapsulation is further included, which encapsulates the electronic components on the upper surface of the substrate.

[0012] In some embodiments, a heat conduction path is formed between the upper plastic encapsulation and the substrate, for conducting the heat generated by the electronic components.

[0013] In some embodiments, the inductor forms a bidirectional heat dissipation channel through the substrate and the plurality of copper pillars.

[0014] In some embodiments, the plurality of copper pillars are evenly distributed along the edge region of the substrate.

[0015] In some embodiments, the electronic components include a chip, a MOSFET, and a resistor-capacitor device.

[0016] The embodiment of the utility model has the advantages that: different from the prior art, the embodiment of the utility model adopts the concentric circle layout structure with the inductor in the center and the copper pillars surrounding the inductor. The inductor is arranged at the center of the lower surface of the substrate, and the plurality of copper pillars are arranged at equal intervals to form a ring array. This structure optimizes the heat conduction path, improves the heat dissipation efficiency, enhances the stability of the module structure, effectively reduces the warping risk of the substrate, and reduces the overall height of the module. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 is a structural schematic view of a point power module provided by the embodiment of the utility model;

[0018] Figure 2 is another structural schematic view of a point power module provided by the embodiment of the utility model;

[0019] Figure 3 is a structural schematic view of another point power module provided by the embodiment of the utility model. DETAILED DESCRIPTION

[0020] In order to facilitate the understanding of the utility model, the utility model will be described in more detail below in combination with the drawings and specific embodiments. It should be noted that when an element is described as "fixed to" another element, it can be directly on the other element or one or more intervening elements can be present therebetween. When an element is described as "connected to" another element, it can be directly connected to the other element or one or more intervening elements can be present therebetween. The terms "vertical", "horizontal", "left", "right" and similar expressions used in the specification are only for illustrative purposes.

[0021] Unless otherwise defined, all technical and scientific terms used in the present disclosure have the same meaning as commonly understood by one of ordinary skill in the art to which the present disclosure belongs. The terminology used in the description of the present disclosure herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the present disclosure. The use of the terms "and / or" includes a combination of one or more of the associated listed items.

[0022] Referring to Figure 1 and Figure 2 Embodiments of the present disclosure disclose a point power module, which is composed of the following parts:

[0023] The substrate 100, the inductor 200, the plurality of copper columns 300, the electronic components 400, and the solder balls 500. The whole module is encapsulated and protected by the upper plastic encapsulation 600.

[0024] The substrate 100 adopts a multi-layer PCB structure. The electronic components 400 are arranged on the upper surface of the substrate 100, and the inductor 200 and the plurality of copper columns 300 are arranged on the lower surface of the substrate 100. As an example but not limitation, the substrate 100 is made of FR-4 material, with a thickness of 1.6 mm and a surface copper thickness of 2 oz. The substrate 100 internally includes a power layer, a ground layer, and a signal layer, and the electrical interconnection between layers is realized through vias. The surface of the substrate 100 adopts an OSP surface treatment process to ensure good soldering performance.

[0025] The inductor 200 is located at the center position of the lower surface of the substrate 100. The inductor 200 is an integrally formed magnetic core structure made of ferrite material, and the outside is wound with enameled wire. The inductor 200 is soldered to the substrate 100 at a specific pad position through high-temperature solder paste, with a soldering area not less than 80% of the cross-sectional area of the inductor body to ensure sufficient heat dissipation. As an example but not limitation, the total height of the inductor 200 is 2.5 mm, which is less than the height of the copper column 300, ensuring the stability of the module installation.

[0026] The plurality of copper columns 300 form a ring array structure around the inductor 200. The copper column 300 is made of red copper material and is treated by a nickel-gold plating process on the surface. The height of each copper column 300 is 3.0 mm, and the diameter is 0.5 mm. The spacing between the copper columns 300 is kept at 1.27 mm to form a regular interval distribution. The total number of copper columns 300 is 64, which are evenly arranged along the edge of the lower surface of the substrate 100. The copper column 300 and the substrate 100 are soldered with lead-free solder, with a soldering strength not less than 2.5 kg / mm 2 .

[0027] As an example but not limited, electronic components 400 include master chip, MOSFET and capacitor components, etc. The above electronic components 400 are installed on the upper surface of the substrate 100 at designated positions by reflow soldering process. The layout of the electronic components 400 fully considers the electromagnetic compatibility requirements, and the key signal wiring adopts differential distribution line mode.

[0028] The solder ball 500 is fixed at the bottom end of the copper column 300 by reflow soldering process. The solder ball 500 has a self-alignment feature, which facilitates the accurate positioning and installation of the point power module on the motherboard.

[0029] The upper layer of the plastic package 600 adopts epoxy resin material, covering all the electronic components 400 on the upper surface of the substrate 100. The surface of the upper layer of the plastic package 600 is free of defects such as bubbles and cracks.

[0030] The substrate 100 bottom can also be added with a copper foil heat conduction layer covering the inductor 200 peripheral area. The heat conduction layer adopts thick copper design, and accommodates the inductor 200 and copper column 300 through local windowing. The heat conduction layer is connected with the internal copper layer of the substrate 100 through a heat conduction via array, forming a complete heat dissipation network. The edge of the heat conduction layer is reserved for welding area, which is used for interfacing with the external heat dissipation system.

[0031] The heat dissipation path design of the point power module:

[0032] The first level heat dissipation path starts from the inductor body, and conducts heat into the substrate through the welding interface. The internal copper layer of the substrate builds a horizontal heat diffusion network, evenly spreading heat to the surrounding area of the substrate. The welding interface adopts high thermal conductivity material to ensure rapid heat transfer. The internal copper foil of the substrate adopts thickening design to form an efficient horizontal heat conduction path.

[0033] The second level heat dissipation is realized through the vertical conduction network of the copper column. The copper column is distributed in a ring array around the inductor, forming multiple vertical heat dissipation channels around the substrate. The copper column is connected to the substrate with an enlarged pad to expand the heat conduction area. Multiple copper columns work together to establish a three-dimensional heat dissipation structure, ensuring rapid downward conduction of heat.

[0034] The third level heat dissipation is completed through the surface device to the plastic package path. The surface electronic components form a closed heat dissipation loop with the substrate through the plastic package. The bottom of the device is planned to have an independent heat dissipation area, and the internal via is enhanced to enhance heat exchange with the lower layer. The plastic package is filled with heat conductive material to improve the overall heat dissipation efficiency.

[0035] The electrical connection path of the point power module:

[0036] The main power connection is input through a special thickened copper column, which is connected to the power distribution layer inside. The power layer adopts thick copper foil to ensure the large current carrying capacity. The signal connection adopts independent copper column transmission, and the internal wiring considers the impedance matching requirements. The ground connection relies on multiple ground copper columns to form a distributed ground network.

[0037] The manufacturing process flow of the point power module is as follows:

[0038] The process is implemented from the substrate manufacturing, and the inner layer pattern manufacturing, lamination, drilling and other processes are completed in turn. The surface treatment includes chemical copper plating, pattern plating and other links to establish a reliable metallization layer. The component installation adopts a step-by-step implementation strategy, and the upper surface components are mounted first, and then the lower surface inductors are fixed.

[0039] The copper column installation process adopts a selective soldering method to ensure the soldering quality. The surface of the copper column is pretreated to improve the soldering reliability. Finally, the module encapsulation process is completed to complete the plastic encapsulation and curing. Quality control points are set for each process to ensure product quality.

[0040] The embodiment minimizes the module height and establishes an efficient heat dissipation channel through the central arrangement of the inductor 200 and the surrounding distribution structure of the copper column 300. The height difference design between the copper column 300 and the inductor 200 ensures the reliability of the module installation. The overall structural layout is reasonable and meets the mass production requirements.

[0041] Referring to Figure 3 , the embodiment discloses another implementation scheme of a point power module, which adopts a pin type connection structure to realize convenient installation and reliable connection of the module by optimizing the end shape of the copper column.

[0042] The point power module includes a substrate 100, an inductor 200, a plurality of copper columns 300, electronic components 400, and an upper plastic encapsulation body 600. The substrate 100 bears the overall module structure and adopts a multi-layer PCB design, which is divided into signal layers, power supply layers, ground layers and other functional layers. The electronic components 400 are arranged on the upper surface of the substrate 100, and the inductor 200 and the plurality of copper columns 300 are carried on the lower surface of the substrate 100. The surface of the substrate 100 is treated by lead-free process to ensure environmental protection requirements. The overall structure is encapsulated and protected by the upper plastic encapsulation body 600.

[0043] The end of the copper column 300 is shaped as a pin structure, which is different from the solder ball connection method. The pin is made of copper alloy material and plated with a nickel layer and a gold layer on the surface. The end of the pin is chamfered for easy insertion. The connection section of the copper column 300 and the substrate 100 remains cylindrical and is fixed by lead-free solder. The total height of the copper column 300 remains consistent to ensure the same level of the pin plane.

[0044] The end pin part of the copper column 300 adopts a stepped design and is divided into a guide section, a transition section and a matching section. The guide section is tapered with a chamfer angle of 45 degrees for easy insertion and guidance. The transition section is cylindrical with a diameter slightly smaller than that of the matching section, forming a step. The matching section has a standard diameter and forms an interference fit with the target PCB hole diameter. The surface of the pin is plated with a double-layer structure including a bottom nickel layer and a surface gold layer. The plating layer thickness is strictly controlled to ensure dimensional tolerance.

[0045] To resist the mechanical stress caused by the pin connection, the substrate 100 is designed with a reinforcing structure in the corresponding area. A ring-shaped reinforcing rib is arranged around the mounting position of the copper column 300 to improve the bending resistance of the substrate. The peripheral area of the inductor 200 is enhanced in mechanical connection strength with the substrate 100 through an array of fixing holes.

[0046] Considering the influence of the pin connection method on signal transmission, a ground shielding ring is provided around the key signal copper column 300. The signal copper column is designed in a differential pair, and the distance between the two pins is kept at a fixed value. The high-speed signal channel is designed with impedance matching throughout, and an impedance adjustment area is reserved in the pin segment.

[0047] The inductor 200 is located in the central area of the lower surface of the substrate 100, forming a symmetrical layout. The height of the inductor 200 is lower than that of the copper column 300, ensuring the normal implementation of the pin function. The inductor 200 adopts a flattening design to reduce the overall height. The inductor 200 is fixed by high-temperature solder, and the soldering area is optimized to balance the mechanical strength and heat dissipation requirements.

[0048] The copper column 300 forms a ring-shaped distribution around the inductor 200, forming a three-dimensional heat dissipation network. The copper column 300 serves dual functions, acting as both an electrical connection channel and a heat dissipation path. The substrate 100 is designed with multiple copper foils inside, forming a planar heat dissipation layer. The upper plastic encapsulation 600 seals the electronic components 400, creating a stable heat dissipation environment.

[0049] The power copper column is selected with a thickened specification to improve current carrying capacity. The signal copper column is arranged according to functional zoning, taking into account signal integrity requirements. The ground copper column is evenly distributed around the periphery, forming a reliable grounding network. The substrate 100 is designed with impedance control inside to optimize signal transmission quality.

[0050] A copper foil heat conduction layer can also be added to the bottom of the substrate 100, covering the peripheral area of the inductor 200. The heat conduction layer is designed with thick copper, which is partially windowed to accommodate the inductor 200 and the copper column 300. The heat conduction layer is connected to the internal copper layer of the substrate 100 through an array of heat conduction vias, forming a complete heat dissipation network. The edge of the heat conduction layer is reserved for soldering area, which is used to interface with the external heat dissipation system.

[0051] The manufacturing process of the point power module is as follows: the first stage completes the substrate 100 production, including internal layer pattern, lamination, drilling, etc. The second stage implements surface treatment to establish a metallization layer. The third stage performs component 400 mounting and inductor 200 fixation. The fourth stage performs copper column 300 implantation and shaping. Finally, the encapsulation is completed by plastic encapsulation 600 injection molding.

[0052] The pin forming adopts a precise stamping process, ensuring the size accuracy of each section. The surface treatment adds an anti-oxidation coating, improving long-term reliability. The pin and copper column 300 are connected by laser welding, ensuring coaxiality requirements. In mass production, an online detection process is set for pin coaxiality and perpendicularity.

[0053] The pin structure does not require reflow soldering and is directly inserted into the preset hole of the application circuit board. The installation process is simple and fast, and disassembly and maintenance are supported. The pin structure has self-alignment capability, improving assembly efficiency. Connection reliability is ensured through pin elastic design.

[0054] Unlike the prior art, the embodiments of the utility model adopt a concentric circular layout structure with inductance in the center and copper columns surrounding it. The inductance is arranged in the center of the lower surface of the substrate, and multiple copper columns are arranged at equal intervals to form a ring array. This structure optimizes the heat conduction path, improves the heat dissipation efficiency, enhances the stability of the module structure, effectively reduces the risk of substrate warping, and reduces the overall height of the module.

[0055] It should be noted that the specification and drawings of the utility model give a preferred embodiment of the utility model, but the utility model can be realized in many different forms and is not limited to the embodiments described in the specification. These embodiments are not additional limitations on the content of the utility model, and the purpose of providing these embodiments is to make the disclosure of the utility model more thorough and comprehensive. Furthermore, the above technical features continue to combine to form various embodiments not listed above, which are considered to be within the scope of the utility model specification; further, for those skilled in the art, the above description can be improved or changed, and all these improvements and changes should be within the scope of the claims of the utility model.

Claims

1. A point power module, characterized by, The application relates to a substrate, an inductor and a plurality of copper columns. The substrate has an upper surface provided with electronic components. The inductor is welded to the lower surface of the substrate. The plurality of copper columns are welded to the lower surface of the substrate and used to establish electrical connection with external circuits. The plurality of copper columns are welded to the lower surface of the substrate and surround the inductor.

2. The point power module of claim 1, wherein, One end of the copper column is provided with a soldering ball used to establish electrical connection with a mother board.

3. The point power module of claim 1, wherein, One end of the copper column is in the form of a pin structure.

4. The point power module of claim 1, wherein, The plurality of copper columns have the same height, and the height of the inductor is less than the height of the copper columns.

5. The point power module of claim 1, wherein, An upper plastic sealing body is further provided, which encapsulates the electronic components on the upper surface of the substrate.

6. The point power module of claim 1, wherein, A heat conduction path is formed between the upper plastic sealing body and the substrate, which is used to conduct the heat generated by the electronic components.

7. The point power module of claim 6, wherein, The inductor forms a bidirectional heat dissipation channel through the substrate and the plurality of copper columns.

8. The point power module of claim 1, wherein, The plurality of copper columns are uniformly distributed along the edge area of the substrate.

9. The point power module of claim 1, wherein, The electronic components include chips, MOSFETs and capacitive devices.

10. The point power module of claim 1, wherein, ​

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