Electronic component, circuit board assembly and vehicle

Abstract

The utility model discloses an electronic component, a circuit board assembly and a vehicle, relates to the technical field of vehicles, and aims to solve the problem of low signal transmission efficiency caused by low connection efficiency of a device body layer and a terminal layer in related technologies. The embodiment of the utility model provides an electronic component. The electronic component comprises a substrate, a device body layer and a terminal layer. The device body layer is installed on the substrate, the substrate is electrically connected with the device body layer, the terminal layer is arranged on the side, away from the substrate, of the device body layer in a stacked mode in the first direction, and the terminal layer is electrically connected with the device body layer.

Description

Technical Field

[0001] This utility model relates to the field of vehicle technology, and in particular to electronic components, circuit board assemblies, and vehicles. Background Technology

[0002] Electronic components play a variety of important roles in circuits, mainly including controlling current and voltage, storing and amplifying signals. Electronic components involve connecting the device body layer and the terminal layer to link the device body layer to external circuits.

[0003] However, in related technologies, the connection efficiency between the device body layer and the terminal layer is low, resulting in low signal transmission efficiency. Utility Model Content

[0004] The purpose of this disclosure is to provide an electronic component, a circuit board assembly, and a vehicle, which aims to solve the problem of low signal transmission efficiency caused by the low connection efficiency between the device body layer and the terminal layer in the related art.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] This application provides an electronic component, which includes a substrate, a device body layer, and a terminal layer. The device body layer is mounted on the substrate, and the substrate and the device body layer are electrically connected. The terminal layer is stacked along a first direction on the side of the device body layer facing away from the substrate, and the terminal layer is electrically connected to the device body layer.

[0007] This application provides an electronic component whose connection path between the device body layer and terminal layer is shortened compared to that in related technologies due to the arrangement of the device body layer and terminal layer. The reason is as follows: In related technologies, both the device body layer and terminal layer are laid flat on the circuit layer of the substrate. To achieve the connection path between the device body layer and terminal layer, the terminal layer needs to be connected to the device body layer through the circuit layer and bonding wires. In this application embodiment, the device body layer and terminal layer are arranged in a stacked configuration along a first direction, facilitating the connection between the device body layer and terminal layer. Furthermore, the connection can be achieved without using the circuit layer on the substrate, thus shortening the transmission path between the device body layer and terminal layer, improving signal transmission efficiency, and reducing parasitic inductance.

[0008] In some embodiments, the electronic component further includes a power connection layer, which is stacked between the terminal layer and the device body layer. The terminal layer includes power terminals, which are electrically connected to the device body layer through the power connection layer.

[0009] The electronic component provided by the embodiment of the present application improves the reliability of power transmission in the electronic component by further comprising the power connection layer.

[0010] In some embodiments, the power terminal comprises a DC end and an AC end, and the power connection layer comprises a DC power layer and an AC power layer. The DC end is electrically connected to the device body layer through the DC power layer, and the AC power layer is stacked with the DC power layer, and the AC end is electrically connected to the device body layer through the AC power layer.

[0011] The electronic component provided by the embodiment of the present application can ensure the stability in the process of power signal transmission by the setting that the power terminal comprises a DC end and an AC end, and the power connection layer comprises a DC power layer and an AC power layer.

[0012] In some embodiments, the DC end comprises a first end and a second end, the device body layer comprises an upper bridge device and a lower bridge device, the DC power layer comprises a first region and a second region, the first end is electrically connected to the upper bridge device through the first region, and the second end is electrically connected to the lower bridge device through the second region.

[0013] The electronic component provided by the embodiment of the present application can realize the connection of the DC end with the upper bridge device and the lower bridge device respectively and the transmission of signals to the upper bridge device and the lower bridge device respectively by the above setting.

[0014] In some embodiments, the first region and the second region are arranged in a second direction.

[0015] The electronic component provided by the embodiment of the present application can reduce the probability of mutual interference of signals of the first region and signals of the second region by the above setting.

[0016] In some embodiments, the first region comprises a first part and a second part. The second part is connected to the first part, the second part is located between the first part and the second region, and the second part is electrically connected to the first end and the upper bridge device.

[0017] The electronic component provided by the embodiment of the present application can set the path of the power signal by the setting that the first region comprises the first part and the second part, so that the power signal is transmitted from the first part to the second part and then to the upper bridge device, which is conducive to reducing the parasitic inductance.

[0018] In some embodiments, the first part comprises a plurality of first avoiding parts arranged in a first direction.

[0019] The electronic component provided by the embodiment of the present application is conducive to avoiding other components and facilitating the arrangement of other connection layers by the above setting.

[0020] In some embodiments, the second region comprises a third portion and a fourth portion, the third portion is electrically connected with the second end and the lower bridge device, and the third portion is located between the second portion and the fourth portion.

[0021] The electronic component provided in the embodiments of the present application is configured by the second region comprising the third portion and the fourth portion,

[0022] In some embodiments, the fourth portion comprises a plurality of second avoiding portions penetratingly arranged along the first direction.

[0023] The electronic component provided in the embodiments of the present application is configured by the above arrangement, which is conducive to avoiding other components and facilitates the arrangement of other connection layers.

[0024] In some embodiments, the AC power layer comprises a third region and a fourth region, the third region is connected with the device body layer on the side close to the device body layer, the fourth region is connected with the third region, and the fourth region is connected with the AC end.

[0025] The electronic component provided in the embodiments of the present application is configured by the above arrangement, which is conducive to reducing the parasitic inductance under the joint action of the AC power layer and the DC power layer.

[0026] In some embodiments, the third region and the fourth region are arranged along the second direction.

[0027] The electronic component provided in the embodiments of the present application is configured by the above arrangement, which makes the structure of the electronic component more neat and compact and is conducive to improving the utilization rate of space.

[0028] In some embodiments, the direction in which the third region points to the fourth region is consistent with the direction in which the first region points to the second region.

[0029] The electronic component provided in the embodiments of the present application is configured by the above arrangement, which can offset the parasitic inductance generated by the DC layer and the AC layer respectively, and is conducive to reducing the parasitic inductance.

[0030] In some embodiments, the third region is provided with a third avoiding portion penetratingly arranged along the first direction.

[0031] The electronic component provided in the embodiments of the present application is configured by the above arrangement, which is conducive to avoiding other components and facilitates the arrangement of other connection layers, and is also conducive to reducing the use of materials.

[0032] In some embodiments, along the second direction, the fourth region is protrudingly arranged from the DC power layer.

[0033] The electronic component provided in the embodiments of the present application is configured by the above arrangement, which can realize the connection between the fourth region and the AC end.

[0034] In some embodiments, the terminal layer comprises a gate terminal, a source terminal, the electronic component comprises a gate layer, a source layer. The gate terminal is electrically connected to the device body layer through the gate layer, the source layer is arranged in a stack with the gate layer, and the source terminal is electrically connected to the device body layer through the source layer.

[0035] The electronic component provided by the embodiments of the present application can realize more functions of the electronic component through the connection of the gate and the source, and can make the space of the electronic component more compact and improve the space utilization.

[0036] In some embodiments, the gate layer and the source layer are located on the side of the DC power supply layer and the AC power supply layer away from the device body layer.

[0037] The electronic component provided by the embodiments of the present application can make the layout of the electronic component more reasonable, and facilitate the connection between the gate layer and the gate terminal and the connection between the source terminal and the source layer.

[0038] In some embodiments, the gate terminal comprises a third terminal and a fourth terminal, the gate layer comprises a fifth region and a sixth region, the third terminal is electrically connected to the upper bridge device through the fifth region, and the fourth terminal is electrically connected to the lower bridge device through the sixth region.

[0039] The electronic component provided by the embodiments of the present application can reduce the interference rate of the gate signal transmission of the upper bridge device and the gate signal transmission of the lower bridge device, and improve the stability of the signal transmission.

[0040] In some embodiments, the fifth region comprises a fourth avoiding portion arranged through in the first direction.

[0041] The electronic component provided by the embodiments of the present application is conducive to avoiding other components, facilitates the arrangement of other connection layers, and is also conducive to reducing the use of materials.

[0042] In some embodiments, the source terminal comprises a fifth terminal and a sixth terminal, the source layer comprises a seventh region and an eighth region, the fifth terminal is electrically connected to the upper bridge device through the seventh region, and the sixth terminal is electrically connected to the lower bridge device through the eighth region.

[0043] The electronic component provided by the embodiments of the present application can reduce the interference rate of the source signal transmission of the upper bridge device and the source signal transmission of the lower bridge device, and improve the stability of the signal transmission.

[0044] In some embodiments, the seventh region comprises a fifth avoiding portion arranged through in the first direction.

[0045] The electronic component provided by the embodiment of the present application is beneficial to the avoidance of other components, facilitates the arrangement of other connection layers, and is beneficial to the reduction of the use of materials.

[0046] In some embodiments, the terminal layer comprises a resistance terminal, and the device body layer further comprises a thermistor, and the resistance terminal is electrically connected with the thermistor.

[0047] The electronic component provided by the embodiment of the present application can detect the temperature of the substrate, and is beneficial to the real-time detection of the temperature of the substrate.

[0048] In some embodiments, the substrate comprises an AMB substrate.

[0049] The electronic component provided by the embodiment of the present application is beneficial to the heat exchange of the electronic component due to the good heat conductivity of the AMB substrate.

[0050] In some embodiments, the substrate further comprises a heat conduction layer, and the heat conduction layer is stacked between the device body layer and the AMB substrate along the first direction, and the heat conduction layer is electrically connected with the device body layer and the AMB substrate.

[0051] The electronic component provided by the embodiment of the present application further improves the heat conduction efficiency of the electronic component by the arrangement of the heat conduction layer in the substrate, and can prolong the service life of the electronic component.

[0052] The circuit board assembly provided by the embodiment of the present application comprises the electronic component of any one of the above.

[0053] The circuit board assembly provided by the embodiment of the present application can reduce the signal transmission path inside the circuit board assembly and improve the signal transmission efficiency by the above arrangement.

[0054] The vehicle provided by the embodiment of the present application comprises the circuit board assembly of any one of the above.

[0055] The vehicle provided by the embodiment of the present application can reduce the signal transmission path inside the circuit board assembly and improve the signal transmission efficiency in the vehicle by the above arrangement. DETAILED DESCRIPTION

[0056] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0057] Figure 1 The structure of the electronic component in the embodiment of the present application is shown in the figure.

[0058] Figure 2 Fig. 1 is a schematic plan view of an electronic component according to an embodiment of the present application. Figure 1

[0059] Figure 3 Fig. 2 is a schematic plan view of a partial structure of the electronic component shown in Fig. 1. Figure 1

[0060] Figure 4 Fig. 3 is a schematic side view of a partial structure of the electronic component shown in Fig. 1. Figure 1

[0061] Figure 5 Fig. 4 is a schematic side view of a partial structure of the electronic component shown in Fig. 1. Figure 1

[0062] Figure 6 Fig. 5 is a schematic plan view of a partial structure of the electronic component shown in Fig. 1. Figure 1

[0063] Figure 7 Fig. 6 is a schematic side view of a partial structure of the electronic component shown in Fig. 1. Figure 1

[0064] Figure 8 Fig. 7 is a schematic plan view of a partial structure of the electronic component shown in Fig. 1. Figure 1

[0065] Figure 9 Fig. 8 is a schematic plan view of a vehicle according to an embodiment of the present application.

[0066] Reference Signs:

[0067] 1 vehicle; 11 vehicle body; 12 wheel;

[0068] 100 electronic component; X first direction; Y second direction;

[0069] 110 substrate; 111 AMB substrate; 112 thermally conductive layer;

[0070] 120 device body layer;

[0071] 121 upper bridge device;

[0072] 122 lower bridge device;

[0073] 123 thermistor;

[0074] 130 terminal layer;

[0075] 131 power terminal; 1311 DC terminal; M1 first end; M2 second end; 1312 AC terminal;

[0076] 132 gate terminal; M3 third end; M4 fourth end; ​​​​​​​

[0077] 133 source terminal; M5 fifth terminal; M6 sixth terminal;

[0078] 134 resistor terminal;

[0079] 140 power connector layer;

[0080] 141DC power layer; 1411 first region; B1 first part; B11 first clearance part; B2 second part; 1412 second region; B3 third part; B4 fourth part; B41 second clearance part;

[0081] 142AC power layer; 1421 third area; C1 third clearance area; 1422 fourth area;

[0082] 150 Gate layer; 151 Fifth region; C2 Fourth clearance section; 152 Sixth region;

[0083] 160 Source Layer; 161 Seventh Region; C3 Fifth Avoidance Section; 162 Eighth Region. Detailed Implementation

[0084] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0085] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0086] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "communication" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection. They can refer to a direct connection or an indirect connection through an intermediate medium, or a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0087] In the embodiments of the present application, the terms "comprising", "containing" or any other variant thereof are intended to cover a non-exclusive inclusion, so that a process, article or apparatus that comprises a list of elements not only includes those elements, but also includes other elements that are not expressly listed, or inherent to such process, article or apparatus. Without more limitations, the element defined by the phrase "comprising a" does not exclude the presence of additional identical elements in the process, article or apparatus comprising the element.

[0088] In the embodiments of the present application, the words "exemplary" or "for example" are used to mean serving as an example or illustration.

[0089] In the description of the present application, specific features, structures, materials or characteristics can be combined in any one or more embodiments or examples in a suitable manner.

[0090] Electronic components play a variety of important roles in circuits, mainly including controlling current and voltage, storing and amplifying signals, etc. The electronic component includes a device body layer and a terminal layer connected to realize connection of the device body layer in the electronic component through the terminal layer and external circuit.

[0091] However, in the related art, the device body layer and the terminal layer are connected inefficiently, resulting in low signal transmission efficiency.

[0092] Please refer to Figures 1 to 2 The electronic component 100 provided by the embodiments of the present application includes a substrate 110, a device body layer 120 and a terminal layer 130. The device body layer 120 is mounted on the substrate 110, the substrate 110 is electrically connected to the device body layer 120, and the terminal layer 130 is stacked on the side of the device body layer 120 away from the substrate 110 along a first direction X, and the terminal layer 130 is electrically connected to the device body layer 120.

[0093] The device body layer 120 includes but is not limited to an upper bridge device 121, a lower bridge device 122 and a resistor, wherein the upper bridge device 121 includes but is not limited to an upper bridge chip, and the lower bridge device 122 includes but is not limited to a lower bridge chip.

[0094] Optionally, the upper bridge chip includes 8, and the lower bridge chip includes 8.

[0095] Optionally, the first direction X is the thickness direction of the substrate 110.

[0096] The connection mode between the terminal layer 130 and the device body layer 120 includes but is not limited to a connection line connection, a conductive layer connection, a conductive column connection, and the like. Of course, it can also be a combination of a conductive layer and a conductive column connection.

[0097] Optionally, the connection between the terminal layer 130 and the device body layer 120 can be achieved by inserting a connection column arranged in the first direction X into the insulating plate.

[0098] The electronic component 100 provided by the embodiment of the present application shortens the connection path between the device body layer 120 and the terminal layer 130 compared with the connection path in the related art. The reason is as follows. In the related art, the device body layer 120 and the terminal layer 130 are both laid out on the circuit layer on the substrate 110. In order to achieve the connection path between the device body layer 120 and the terminal layer 130, the terminal layer 130 needs to be connected to the device body layer 120 through the circuit layer and the bonding wire. In the embodiment of the present application, the device body layer 120 and the terminal layer 130 are arranged in the first direction X. This facilitates the connection between the device body layer 120 and the terminal layer 130, and the connection between the two can be achieved without the circuit layer on the substrate 110. Therefore, the transmission path between the device body layer 120 and the terminal layer 130 can be shortened, the signal transmission efficiency between the two can be improved, and the parasitic inductance can be reduced.

[0099] In some embodiments, the electronic component 100 further includes a power supply connection layer 140, which is stacked between the terminal layer 130 and the device body layer 120. The terminal layer 130 includes a power supply terminal 131, which is electrically connected to the device body layer 120 through the power supply connection layer 140.

[0100] The electronic component 100 provided by the embodiment of the present application improves the reliability of power supply transmission in the electronic component 100 by further including the power supply connection layer 140.

[0101] In some embodiments, the power supply terminal 131 includes a DC terminal 1311 and an AC terminal 1312, and the power supply connection layer 140 includes a DC power supply layer 141 and an AC power supply layer 142. The DC terminal 1311 is electrically connected to the device body layer 120 through the DC power supply layer 141. The AC power supply layer 142 is stacked with the DC power supply layer 141, and the AC terminal 1312 is electrically connected to the device body layer 120 through the AC power supply layer 142.

[0102] Exemplarily, the number of the DC power supply layer 141 and the AC power supply layer 142 is not limited to one set, and can also include multiple sets of the DC power supply layer 141 and the AC power supply layer 142, and the multiple sets of the DC power supply layer 141 and the AC power supply layer 142 are stacked to enhance the overcurrent capacity of the electronic component 100.

[0103] The electronic component 100 provided by the embodiment of the present application can ensure the stability in the process of power signal transmission by including the DC terminal 1311 and the AC terminal 1312 through the power terminal 131 and including the DC power supply layer 141 and the AC power supply layer 142 through the power connection layer 140.

[0104] Please refer to Figures 3 to 8 In some embodiments, the DC terminal 1311 includes a first end M1 and a second end M2, the component body layer 120 includes an upper bridge component 121 and a lower bridge component 122, the DC power supply layer 141 includes a first region 1411 and a second region 1412, the first end M1 is electrically connected to the upper bridge component 121 through the first region 1411, and the second end M2 is electrically connected to the lower bridge component 122 through the second region 1412.

[0105] The electronic component 100 provided by the embodiment of the present application can realize the separate connection of the DC terminal 1311, the upper bridge component 121 and the lower bridge component 122 and the transmission of signals between the DC terminal 1311, the upper bridge component 121 and the lower bridge component 122 through the above-mentioned arrangement.

[0106] In some embodiments, the first region 1411 and the second region 1412 are arranged at intervals along the second direction Y.

[0107] The electronic component 100 provided by the embodiment of the present application can reduce the probability of mutual interference of signals of the first region 1411 and signals of the second region 1412 through the above-mentioned arrangement.

[0108] In some embodiments, the first region 1411 includes a first part B1 and a second part B2. The second part B2 is connected to the first part B1, the second part B2 is located between the first part B1 and the second region 1412, and the second part B2 is electrically connected to the first end M1 and the upper bridge component 121.

[0109] The electronic component 100 provided by the embodiment of the present application can set the path of the power signal so that the power signal is transmitted from the first part B1 to the second part B2 and then to the upper bridge component 121 through the arrangement that the first region 1411 includes the first part B1 and the second part B2, which is conducive to reducing the parasitic inductance.

[0110] In some embodiments, the first part B1 includes a plurality of first avoiding parts B11 arranged through the first direction X.

[0111] The electronic component 100 provided by the embodiment of the present application is beneficial to the avoidance of other components and facilitates the arrangement of other connection layers through the above arrangement.

[0112] In some embodiments, the second region 1412 includes a third part B3 and a fourth part B4. The third part B3 is electrically connected to the second end M2 and the lower bridge device 122, and the third part B3 is located between the second part B2 and the fourth part B4.

[0113] The electronic component 100 provided by the embodiment of the present application is beneficial to the avoidance of other components and facilitates the arrangement of other connection layers through the arrangement of the second region 1412 including the third part B3 and the fourth part B4.

[0114] In some embodiments, the fourth part B4 includes a plurality of second avoidance parts B41 arranged through in the first direction X.

[0115] The electronic component 100 provided by the embodiment of the present application is beneficial to the avoidance of other components and facilitates the arrangement of other connection layers through the above arrangement.

[0116] In some embodiments, the AC power layer 142 includes a third region 1421 and a fourth region 1422. The third region 1421 is connected to the device body layer 120 on one side of the device body layer 120, and the fourth region 1422 is connected to the third region 1421 and the AC end 1312.

[0117] The electronic component 100 provided by the embodiment of the present application is beneficial to the avoidance of other components and facilitates the arrangement of other connection layers through the above arrangement.

[0118] In some embodiments, the third region 1421 and the fourth region 1422 are arranged along the second direction Y.

[0119] The electronic component 100 provided by the embodiment of the present application is beneficial to the avoidance of other components and facilitates the arrangement of other connection layers through the above arrangement.

[0120] In some embodiments, the direction in which the third region 1421 points to the fourth region 1422 is consistent with the direction in which the first region 1411 points to the second region 1412.

[0121] The electronic component 100 provided by the embodiment of the present application is beneficial to the avoidance of other components and facilitates the arrangement of other connection layers through the above arrangement.

[0122] In some embodiments, the third region 1421 is provided with a third avoidance part C1 arranged through in the first direction X.

[0123] The electronic component 100 provided by the embodiment of the present application is beneficial to the avoidance of other components, facilitates the arrangement of other connection layers, and is beneficial to the reduction of the use of materials.

[0124] In some embodiments, the fourth area 1422 protrudes from the DC power supply layer 141 along the second direction Y.

[0125] The electronic component 100 provided by the embodiment of the present application can realize the connection between the fourth area 1422 and the AC terminal 1312 through the above arrangement.

[0126] In some embodiments, the terminal layer 130 includes a gate terminal 132 and a source terminal 133, and the electronic component 100 includes a gate layer 150 and a source layer 160. The gate terminal 132 is electrically connected to the device body layer 120 through the gate layer 150, the source layer 160 is arranged in a stack with the gate layer 150, and the source terminal 133 is electrically connected to the device body layer 120 through the source layer 160.

[0127] The electronic component 100 provided by the embodiment of the present application can realize more functions of the electronic component 100 through the connection of the gate and the source, can make the space of the electronic component 100 more compact, and improves the utilization rate of the space.

[0128] In some embodiments, the gate layer 150 and the source layer 160 are located on the side of the DC power supply layer 141 and the AC power supply layer 142 away from the device body layer 120.

[0129] The electronic component 100 provided by the embodiment of the present application is more reasonable in layout through the above arrangement, and facilitates the connection between the gate layer 150 and the gate terminal 132 and the connection between the source terminal 133 and the source layer 160.

[0130] In some embodiments, the gate terminal 132 includes a third terminal M3 and a fourth terminal M4, the gate layer 150 includes a fifth area 151 and a sixth area 152, the third terminal M3 is electrically connected to the upper bridge device 121 through the fifth area 151, and the fourth terminal M4 is electrically connected to the lower bridge device 122 through the sixth area 152.

[0131] The electronic component 100 provided by the embodiment of the present application can reduce the interference rate of the gate signal of the upper bridge device 121 and the gate signal of the lower bridge device 122, and improve the stability of signal transmission through the above arrangement.

[0132] In some embodiments, the fifth area 151 includes a fourth avoidance part C2 arranged through along the first direction X.

[0133] The electronic component 100 provided by the embodiment of the present application is beneficial to the avoidance of other components, facilitates the arrangement of other connection layers, and is beneficial to the reduction of the use of materials.

[0134] In some embodiments, the source level includes a fifth terminal M5 and a sixth terminal M6, the source level layer includes a seventh region 161 and an eighth region 162, the fifth terminal M5 is electrically connected to the upper bridge device 121 through the seventh region 161, and the sixth terminal M6 is electrically connected to the lower bridge device 122 through the eighth region 162.

[0135] The electronic component 100 provided by the embodiment of the present application can reduce the interference rate of the transmission of the source level signal of the upper bridge device 121 and the source level signal of the lower bridge device 122, and improve the stability of signal transmission.

[0136] In some embodiments, the seventh region 161 includes a fifth avoidance part C3 arranged through in the first direction X.

[0137] The electronic component 100 provided by the embodiment of the present application is beneficial to the avoidance of other components, facilitates the arrangement of other connection layers, and is beneficial to the reduction of the use of materials.

[0138] In some embodiments, the terminal layer 130 includes a resistance terminal 134, and the device body layer 120 further includes a thermistor 123, and the resistance terminal 134 is electrically connected to the thermistor 123.

[0139] The positions of the resistance terminal 134, the first terminal M1, the second terminal M2, the third terminal M3, the fourth terminal M4, the fifth terminal M5, and the sixth terminal M6 can be adaptively adjusted according to actual conditions.

[0140] The electronic component 100 provided by the embodiment of the present application can detect the temperature of the substrate 110, and facilitate the real-time detection of the temperature of the substrate 110.

[0141] In some embodiments, the substrate 110 includes an AMB (Active Metal Brazing, high-performance active metal brazing) substrate 111.

[0142] Optionally, the AMB substrate includes a circuit layer, an intermediate insulating layer, and a connection layer, the circuit layer includes a circuit pattern capable of realizing electrical connection, the intermediate insulating layer is made of a ceramic material, and optionally, is made of a silicon nitride material, and the connection layer can be made of a metal layer capable of realizing the connection between the external circuit.

[0143] The electronic component 100 provided by the embodiment of the present application can realize the heat exchange of the electronic component 100 due to the good heat conductivity of the AMB substrate 111.

[0144] In some embodiments, the substrate 110 further comprises a heat-conducting layer 112, which is arranged between the device body layer 120 and the AMB substrate 111 in the first direction X, and is electrically connected with the device body layer 120 and the AMB substrate 111.

[0145] The electronic component 100 provided by the embodiments of the present application further improves the heat-conducting efficiency of the electronic component 100 by arranging the heat-conducting layer 112 in the substrate 110, prolongs the service life of the electronic component 100, and provides a larger heat dissipation angle for the electronic component 100.

[0146] The embodiments of the present application provide a circuit board assembly comprising the electronic component 100 of any of the above.

[0147] The circuit board assembly provided by the embodiments of the present application can reduce the signal transmission path inside the circuit board assembly and improve the signal transmission efficiency by the above arrangement.

[0148] The embodiments of the present application provide a vehicle 1 comprising the circuit board assembly of any of the above.

[0149] Please refer to Figure 9 The vehicle 1 provided by the embodiments of the present application can reduce the signal transmission path inside the circuit board assembly and improve the signal transmission efficiency in the vehicle 1 by the above arrangement.

[0150] The vehicle 1 includes a vehicle 1, a robot, etc., and can be a pure electric vehicle 1, a hybrid electric vehicle 1, a plug-in hybrid electric vehicle 1, a range-extended electric vehicle 1, a fuel vehicle, etc. The vehicle 1 can also be a sedan, a van, a bus, a truck, a trailer, etc. The vehicle 1 comprises a vehicle body 11 and wheels 12 for bearing the vehicle body 11, and the circuit board assembly is installed in the vehicle 1.

[0151] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto, and any skilled person in the art can easily think of changes or replacements within the technical range disclosed by the present application, which should be covered by the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. An electronic component (100), characterized by The electronic component (100) comprises: a substrate (110); a device body layer (120) mounted on the substrate (110), the substrate (110) being electrically connected with the device body layer (120); and a terminal layer (130) stacked on a side of the device body layer (120) away from the substrate (110) along a first direction (X), the terminal layer (130) being electrically connected with the device body layer (120).

2. The electronic component (100) according to claim 1, characterized in that The electronic component (100) further comprises a power connection layer (140) stacked between the terminal layer (130) and the device body layer (120), the terminal layer (130) comprises a power terminal (131), the power terminal (131) being electrically connected with the device body layer (120) through the power connection layer (140).

3. The electronic component (100) according to claim 2, characterized in that The power terminal (131) comprises a DC terminal (1311) and an AC terminal (1312), the power connection layer (140) comprises: a DC power layer (141), the DC terminal (1311) being electrically connected with the device body layer (120) through the DC power layer (141); and an AC power layer (142) stacked with the DC power layer (141), the AC terminal (1312) being electrically connected with the device body layer (120) through the AC power layer (142).

4. The electronic component (100) according to claim 3, characterized in that The DC terminal (1311) comprises a first end (M1) and a second end (M2), the device body layer (120) comprises an upper bridge device (121) and a lower bridge device (122), the DC power layer (141) comprises a first region (1411) and a second region (1412), the first end (M1) being electrically connected with the upper bridge device (121) through the first region (1411), and the second end (M2) being electrically connected with the lower bridge device (122) through the second region (1412).

5. The electronic component (100) according to claim 4, characterized in that The first region (1411) and the second region (1412) are arranged at intervals along a second direction (Y).

6. The electronic component (100) according to claim 5, characterized in that The first region (1411) comprises: a first part (B1); and a second part (B2) connected with the first part (B1), the second part (B2) being located between the first part (B1) and the second region (1412), and the second part (B2) being electrically connected with the first end (M1) and the upper bridge device (121).

7. The electronic component (100) according to claim 6, characterized in that The first part (B1) comprises a plurality of first avoiding parts (B11) arranged through along the first direction (X).

8. The electronic component (100) according to claim 6, characterized in that The second region (1412) comprises: a third part (B3) electrically connected with the second end (M2) and the lower bridge device (122); and a fourth part (B4), the third part (B3) being located between the second part (B2) and the fourth part (B4).

9. The electronic component (100) according to claim 8, characterized in that The fourth part (B4) comprises a plurality of second avoiding parts (B41) arranged through along the first direction (X).

10. The electronic component (100) according to claim 4, characterized in that The AC power layer (142) comprises: The third region (1421) is connected with the device body layer (120) on one side close to the device body layer (120); and The fourth region (1422) is connected with the third region (1421), and the fourth region (1422) is connected with the AC terminal (1312).

11. The electronic component (100) according to claim 10, characterized in that The third region (1421) and the fourth region (1422) are arranged along a second direction (Y).

12. The electronic component (100) according to claim 10, characterized in that The direction in which the third region (1421) points to the fourth region (1422) is consistent with the direction in which the first region (1411) points to the second region (1412).

13. The electronic component (100) according to claim 12, characterized in that The third region (1421) is provided with a third avoiding part (C1) penetrating along a first direction (X).

14. The electronic component (100) according to claim 10, characterized in that The fourth region (1422) protrudes from the DC power supply layer (141) along the second direction (Y).

15. The electronic component (100) according to claim 4, characterized in that The terminal layer (130) comprises a gate terminal (132) and a source terminal (133), and the electronic component (100) further comprises: A gate layer (150), the gate terminal (132) is electrically connected with the device body layer (120) through the gate layer (150); and A source layer (160) is arranged in a stack with the gate layer (150), and the source terminal (133) is electrically connected with the device body layer (120) through the source layer (160).

16. The electronic component (100) according to claim 15, characterized in that The gate layer (150) and the source layer (160) are located on a side of the DC power supply layer (141) and the AC power supply layer (142) away from the device body layer (120).

17. The electronic component (100) according to claim 15, characterized in that The gate terminal (132) comprises a third terminal (M3) and a fourth terminal (M4), The gate layer (150) comprises a fifth region (151) and a sixth region (152), the third terminal (M3) is electrically connected with the upper bridge device (121) through the fifth region (151), and the fourth terminal (M4) is electrically connected with the lower bridge device (122) through the sixth region (152).

18. The electronic component (100) according to claim 17, characterized in that The fifth region (151) comprises a fourth avoiding part (C2) penetrating along the first direction (X).

19. The electronic component (100) according to claim 16, characterized in that The source terminal (133) comprises a fifth terminal (M5) and a sixth terminal (M6), The source layer (160) comprises a seventh region (161) and an eighth region (162), the fifth terminal (M5) is electrically connected with the upper bridge device (121) through the seventh region (161), and the sixth terminal (M6) is electrically connected with the lower bridge device (122) through the eighth region (162).

20. The electronic component (100) according to claim 19, characterized in that The seventh region (161) comprises a fifth avoiding part (C3) penetrating along the first direction (X).

21. The electronic component (100) according to claim 17, characterized in that The terminal layer (130) further comprises a resistance terminal (134), and the device body layer (120) further comprises a thermistor (123), and the resistance terminal (134) is electrically connected with the thermistor (123).

22. The electronic component (100) according to any one of claims 1 to 21, characterized in that The substrate (110) comprises an AMB substrate (111).

23. The electronic component (100) according to claim 22, characterized in that The substrate (110) further comprises a heat-conducting layer (112) arranged in a stack along the first direction (X) between the device body layer (120) and the AMB substrate (111), the heat-conducting layer (112) being electrically connected with the device body layer (120), the AMB substrate (111).

24. A circuit board assembly, characterized by An electronic component (100) according to any one of claims 1 to 23.

25. A vehicle (1) characterized by An electronic component (100) according to any one of claims 1 to 23, or a circuit board assembly according to claim 24.

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