Multilayer reinforced circuit board
By setting up structures such as slots, brackets, and reinforcing ribs on multilayer circuit boards, and using hot melt adhesive to soften and bond them during pressing, the alignment and reinforcement problems of multilayer circuit boards during pressing are solved, achieving efficient processing and enhanced strength.
Patent Information
- Application Number
- CN202520278995.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-20
- Publication Date
- 2025-12-16
- Estimated Expiration
- 2035-02-20
AI Technical Summary
Existing multilayer circuit boards require individual alignment during lamination, which reduces working speed. Furthermore, the circuit boards are made of brittle materials and require reinforcing ribs for protection, resulting in low processing efficiency and complex structure.
A multi-layer reinforced circuit board is designed. By setting structures such as slots, slots, reinforcing ribs and rotating shafts on single-layer boards, and using hot melt adhesive to soften and bond them during pressing, multiple single-layer boards can be easily aligned and reinforced.
It enables convenient processing and efficient lamination of multilayer circuit boards, enhances the overall strength of the circuit boards, simplifies the processing flow, and improves production efficiency.
Smart Images

Figure CN223681271U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to the technical field of circuit board, concretely relates to a multilayer reinforced circuit board. BACKGROUND
[0002] Circuit board decides process difficulty and processing price according to the number of wiring surface. Double-sided board is the medium in the middle, both sides are wiring layer, multilayer board is multilayer wiring layer, the innermost two layers are composed of traditional double-sided board, and the outer layer is different, which is composed of independent single-sided board. Before rolling, the inner substrate will be drilled, through-hole electroplated, pattern transferred, developed and etched, and then each layer is rolled together to form a multilayer substrate. Different boards need to be processed one by one, and the existing multilayer circuit board needs to be aligned one by one during pressing, which reduces the working speed, and since the circuit board itself is a brittle material, it also needs to be installed with reinforcing ribs for protection. UTILITY MODEL CONTENTS
[0003] The utility model discloses a multilayer reinforced circuit board, simple structure connects multiple single-layer circuit boards into a row, which is convenient for processing, and the single-layer circuit boards can be aligned and pressed after electroplating, and the reinforcing mechanism is attached, which is practical and suitable for promotion.
[0004] The utility model provides the following technical scheme: a kind of multilayer reinforced circuit board, including single-layer board, clamping seat, the single-layer board is equipped with multiple according to the specific demand of reinforcing circuit board, the two sides of single-layer board long side near single side are equipped with clamping groove, the clamping groove is located in the upper and lower sides of single-layer board and mutually symmetrical;
[0005] The clamping seat is fixed with the two symmetrical cards towards the clamping groove, the card is tightly connected with the clamping groove, the two clamping seats of one side of single-layer board long side are equipped with opposite fixed slots, the two clamping seats are equipped with reinforcing rib, and the two ends of the reinforcing rib are inserted into the fixed slot and fixedly connected therewith;
[0006] The two single-layer boards are equipped with rotating interval, the clamping seat is fixed with external sheet towards rotating interval side, the clamping seat on the other side of reinforcing rib is fixed with internal sheet staggered with external sheet position, and the internal sheet is connected with external sheet through rotating shaft.
[0007] Preferably, the clamping seat, the card, the external sheet, the internal sheet and the rotating shaft are all composed of solid hot melt adhesive, the hot melt adhesive is softened in the pressing environment at the melting point,
[0008] Preferably, when the card is combined with the clamping groove, the clamping seat is attached to the side of single-layer board, and the card protrudes from the upper and lower surfaces of single-layer board.
[0009] Preferably, the outer connecting piece is provided with a through groove, when the clamping seat is attached to the single-layer board, the inner connecting piece is clamped between the single-layer board and the outer connecting piece and is tightly connected, the through groove is attached to the side wall of the rotating shaft, the front end of the rotating shaft is provided with a protruding head, and the protruding head is provided with a chamfer.
[0010] The utility model discloses beneficial effect: simple structure connects multiple single-layer circuit boards into a row, convenient for processing, and convenient for aligning and pressing single-layer circuit boards after electroplating, and attaching reinforcing mechanism, practicality is strong, and the specific is as follows:
[0011] (1), the utility model discloses a plurality of single-layer boards, and the plurality of single-layer boards are arranged in a row through the clamping seat, when drilling, through-hole electroplating, etching and other operations are carried out, a row of single-layer boards can be placed on the workbench, since the rotating interval between each single-layer board is fixed, the position of processing is convenient to determine, and working command can be inputted at a time, and after processing is completed, the single-layer boards can be bent through the rotating shaft, so that the single-layer boards are stacked one by one, the position of the clamping seat is fixed, and the single-layer boards are in the overlapping state after being stacked, so that calibration is not needed.
[0012] (2), the utility model discloses a clamping seat, when multiple single-layer boards are pressed, since the single-layer boards are pressed in a hot environment, the clamping seat made of hot melt adhesive material is softened, the clamping seat and the card are softened and adhered to the single-layer board, and the reinforcing rib is adhered to the side wall of the single-layer board by the hot melt adhesive, so that the long side of each single-layer board has the reinforcing rib structure during pressing, so that the strength of the multilayer circuit board is increased. DRAWINGS
[0013] The drawings are used to provide further understanding of the utility model and constitute a part of the specification, are used to explain the utility model together with the embodiments of the utility model, and do not constitute the limitation to the utility model.In the drawings:
[0014] Fig. 1 It is the overall schematic view of the utility model;
[0015] Fig. 2 It is the enlarged view of A of the utility model;
[0016] Fig. 3 It is the sectional view of A of the utility model;
[0017] Marked as in the drawing: 1, single-layer board;2, rotating interval;3, reinforcing rib;4, clamping seat;5, clamping groove;6, card;7, outer connecting piece;8, inner connecting piece;9, protruding head;10, fixed groove;11, rotating shaft;12, through groove. PREFERRED EMBODIMENT
[0018] The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the drawings in the embodiments of the present utility model; obviously, the described embodiments are only part of the embodiments of the present utility model, rather than all the embodiments, and all other embodiments obtained by those skilled in the art without creative labor on the basis of the embodiments in the present utility model belong to the scope of protection of the present utility model.
[0019] In the description of the present utility model, it should be explained that the terms "upper", "lower", "inner", "outer", "top / bottom end" and the like indicate the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present utility model and simplifying the description, and does not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present utility model.
[0020] In the description of the present utility model, it should be explained that, unless otherwise explicitly specified and limited, the terms "mounting", "provided with", "sleeved / connected", "connected" and the like should be understood broadly, for example, "connected" can be fixed connection, can also be detachable connection, or integral connection; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present utility model can be understood according to the specific circumstances.
[0021] The structural characteristics of the present utility model will be described in detail in combination with the drawings of the description.
[0022] Referring to Figs. 1-3 A multi-layer reinforced circuit board comprises single-layer boards 1 and card holders 4, multiple single-layer boards 1 are provided according to the specific requirements of the reinforced circuit board, the long side of each single-layer board 1 is provided with clamping grooves 5 on both sides close to the single side, the clamping grooves 5 are located on the upper and lower sides of the single-layer board 1 and are symmetrical to each other, the card holders 4 are fixedly provided with two symmetrical clamping cards 6 on the upper and lower sides facing the clamping grooves 5, the card holders 4 are installed by pressing the clamping cards 6 into the clamping grooves 5, the clamping cards 6 are tightly connected with the clamping grooves 5 so as not to be easily separated and slide, opposite fixed grooves 10 are arranged between the two card holders 4 on one side of the long side of the single-layer board 1, a reinforcing rib 3 is arranged between the two card holders 4, the two ends of the reinforcing rib 3 are inserted into the fixed grooves 10 and fixedly connected therewith, and the reinforcing rib 3 supports the side of the single-layer board 1.
[0023] Referring to Figs. 2-3The utility model discloses a multi -layer reinforced circuit board, simple structure is connected into a row with multiple single -layer circuit board, convenient for its processing, and after electroplating, convenient for the single -layer circuit board alignment compression, and attach the reinforcing mechanism, and the practicality is strong, is fit for promoting.
[0024] The multi -layer reinforced circuit board of the utility model, simple structure is connected into a row with multiple single -layer circuit board, convenient for its processing, and after electroplating, convenient for the single -layer circuit board alignment compression, and attach the reinforcing mechanism, and the practicality is strong, is fit for promoting.
[0025] Specifically, refer to Figs. 1-3 Multiple single -layer boards 1 are arranged in a row through the clamping seat 4, and when drilling, through-hole electroplating and etching are carried out, the single -layer boards 1 can be placed on a workbench, the rotating interval 2 between each single -layer board 1 is fixed, the position of processing can be determined, work commands can be input at one time, and after processing is completed, the rotating shaft 11 can be used to bend the single -layer boards 1, the single -layer boards 1 are stacked one by one, the position of the clamping seat 4 is fixed, the single -layer boards 1 are in an overlapping state suitable for compression after being stacked, and when the single -layer boards 1 are compressed, the clamping seat 4 is softened in a hot environment, the clamping seat 4 and the card 6 are softened and adhered to the single -layer board 1, and the reinforcing rib 3 is adhered to the side wall of the single -layer board 1 by the hot melt adhesive, so that the long side of each single -layer board 1 has the reinforcing rib 3 structure in the compression process, and the strength of the multi -layer circuit board is improved.
[0026] The above only is the preferred embodiment of the utility model, and does not use for limiting the utility model, although the utility model has been explained in detail with reference to the foregoing embodiment, for the person skilled in the art, still can modify the technical scheme recorded in the foregoing each embodiment, or equivalent replacement to part technical feature. Any modification, equivalent replacement, improvement etc. that is made within the spirit and principle of the utility model, should be included in the protection scope of the utility model.
Claims
1. A multi-layer reinforced circuit board comprising single-layer boards (1) provided in a plurality according to the specific requirements of the reinforced circuit board, a socket (4), characterized in that, The single-layer plate (1) has a clamping groove (5) on both sides of the long side near the single side. The clamping groove (5) is located on the upper and lower sides of the single-layer plate (1) and is symmetrical to each other. The card holder (4) is fixedly provided with two symmetrical cards (6) facing the clamping groove (5). The cards (6) are tightly connected to the clamping groove (5). A corresponding fixing groove (10) is provided between the two card holders (4) on one side of the long side of the single-layer plate (1). A reinforcing rib (3) is provided between the two card holders (4). The two ends of the reinforcing rib (3) are inserted into the fixing groove (10) and fixedly connected to it. A rotational gap (2) is provided between the two single-layer plates (1). An outer connecting piece (7) is fixedly provided on the side of the card holder (4) facing the rotational gap (2). An inner connecting piece (8) is fixedly provided on the card holder (4) on the other side of the reinforcing rib (3), which is staggered with the position of the outer connecting piece (7). The inner connecting piece (8) and the outer connecting piece (7) are connected by a rotational shaft (11).
2. The multi-layer reinforced circuit board of claim 1, wherein, The card holder (4), card (6), outer tab (7), inner tab (8), and rotating shaft (11) are all made of solid hot melt adhesive, which has a melting point that allows it to soften in the pressing environment.
3. The multi-layered reinforced circuit board of claim 1, wherein, When the card (6) is combined with the slot (5), the card holder (4) is attached to the side of the single-layer plate (1), and the card (6) protrudes from the upper and lower surfaces of the single-layer plate (1).
4. The multi-layered reinforced circuit board of claim 1, wherein, The outer piece (7) is provided with a through groove (12). When the card holder (4) is attached to the single-layer plate (1), the inner piece (8) is sandwiched between the single-layer plate (1) and the outer piece (7) and is tightly connected. The through groove (12) is attached to the side wall of the rotating shaft (11). The front end of the rotating shaft (11) is provided with a protrusion (9), and the protrusion (9) has a chamfer.