Multilayer HDI circuit board with interconnected inner layers

Abstract

The utility model discloses a multilayer HDI circuit board with interconnected inner layers, which comprises a mounting frame, two opposite surfaces of the mounting frame are provided with movable grooves, the upper surface of the mounting frame is provided with a protective cover, two opposite surfaces of the inner wall of the protective cover are provided with limiting grooves, the movable grooves are internally connected with push plates in a sliding manner, one side surface of each push plate is provided with a limiting pin, and the limiting pins are connected with the push plates in a sliding manner. A first spring is arranged on the other side of the push plate, clamping grooves are symmetrically formed in the upper surface of the mounting frame, a second spring is arranged on one side face of the inner wall of each clamping groove, and a clamping plate is arranged at one end of each second spring. The protective cover covers the mounting frame, the protective cover is pressed downwards, under extrusion of the inner wall of the protective cover, a limiting pin is extruded to push a push plate to enter a movable groove, and when the protective cover is pressed downwards to a certain position, the push plate pushes the limiting pin to be clamped into a limiting groove under the elastic force action of a first spring, so that the limiting pin is connected with the protective cover in a clamped mode; the protective cover can effectively protect the circuit board body.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of circuit board, especially, relate to a multilayer HDI circuit board of inner layer interconnection. BACKGROUND

[0002] HDI circuit board is a kind of circuit board with higher line distribution density using micro blind hole technology.Under the premise of electronic product tends to multifunctional complex, the contact distance of integrated circuit component is reduced, and the signal transmission speed is relatively improved, and then the wiring quantity is improved, and the length of point-to-point wiring is shortened locally, which needs to apply high-density line configuration and micro-hole technology to achieve the goal.

[0003] At present, the existing circuit board still has the following problems in the process of using, due to the insufficient strength of the circuit board body, and no corresponding protection structure, when the circuit board is accidentally impacted by the outside world, the existing circuit board is difficult to carry out autonomous protection, cannot carry out certain safety protection measures to itself, is easy to cause damage to the circuit board, and further reduces the service life of the circuit board, the safety degree is lower, and there is a safety hazard, therefore, a multilayer HDI circuit board of inner layer interconnection is proposed. SUMMARY

[0004] The utility model discloses a multilayer HDI circuit board of inner layer interconnection, solves the existing problem.

[0005] To solve the above technical problem, the utility model is realized through the following technical schemes:

[0006] The utility model discloses a multilayer HDI circuit board of inner layer interconnection, including the installation frame, the movable slot is set up to the opposite surface of installation frame, the protection cover is set up on the upper surface of installation frame, the limit slot is set up to the opposite surface of protection cover inner wall, the push board is slidably connected in the movable slot, the limit pin is set up to the side of push board, the first spring is set up to the other side of push board, the clamping groove is set up to the upper surface of installation frame symmetry, the second spring is set up to the side of clamping groove inner wall, the clamping plate is set up to the one end of second spring, the clamping block is set up to the side of clamping plate, the pull plate is set up to the other side of clamping plate, the heat dissipation plate is set up in the inside of installation frame, the bottom surface of heat dissipation plate is provided with multiple sets of heat dissipation fin, the circuit board body is set up to the upper surface of heat dissipation plate, a layer of heat-conducting silica gel is daubed between heat dissipation plate and circuit board body.

[0007] Further, the limit slot shape and size are adapted to the limit pin, the other end of the second spring is fixedly connected with the side of the clamping plate, and the clamping block is a trapezoidal structure in cross section.

[0008] Further, the installation frame is symmetrically provided with a wiring slot on one side, the other end of the first spring is fixedly connected with one side of the inner wall of the movable slot, the limiting slot is located in correspondence with the movable slot, a plurality of heat dissipation through holes are formed in the upper surface of the protective cover, and the installation frame is clamped with the protective cover.

[0009] The utility model has the following beneficial effects:

[0010] The protective cover is covered on the installation frame, the protective cover is pressed downward, the limiting pin is extruded and pushes the push plate into the movable slot under the extrusion of the inner wall of the protective cover, the push plate pushes the limiting pin into the limiting slot under the elastic force of the first spring when being pressed to a certain position, the limiting pin is clamped with the protective cover, the protective cover can effectively protect the circuit board body, the pull plate is pulled to two sides, the clamping block is moved to two sides, the circuit board body can be disassembled, and the circuit board body and the heat-conducting silica gel between the heat dissipation plate are convenient for the staff to overhaul in the future.

[0011] Of course, any product implementing the utility model does not necessarily need to achieve all the advantages mentioned above. BRIEF DESCRIPTION OF DRAWINGS

[0012] In order to more clearly illustrate the technical scheme in the embodiments of the utility model, the following will briefly introduce the drawings needed to be used in the embodiment description, and obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can also be obtained according to these drawings without creative labor.

[0013] Figure 1 It is a whole structure schematic diagram of a kind of inner interconnection multilayer HDI circuit board;

[0014] Figure 2 It is a right view of a kind of inner interconnection multilayer HDI circuit board;

[0015] Figure 3 It is Figure 2 Sectional view of A-A part in it;

[0016] Figure 4 It is Figure 3 Enlarged view of B part in it;

[0017] Figure 5 It is Figure 3 Enlarged view of C part in it.

[0018] In the drawings, the component list represented by each reference numeral is as follows: 1, mounting frame; 101, heat dissipation plate; 102, heat dissipation fin; 103, heat-conducting silica gel; 11, movable slot; 110, push plate; 111, first spring; 112, limiting pin; 2, protective cover; 201, wiring slot; 202, limiting slot; 12, clamping slot; 120, second spring; 121, clamping plate; 122, clamping block; 123, pull plate; 3, circuit board body. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0020] In the description of the present application, it should be understood that the terms "upper", "middle", "outer", "inner" and the like indicate the orientation or positional relationship, and are only used to facilitate the description of the present application and simplify the description, and do not indicate or imply that the indicated components or elements must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present application.

[0021] In the description of the present application, it should be noted that, unless otherwise explicitly specified and limited, the terms "mounting", "provided with", "connected" and the like should be understood broadly, for example, "connected" can be fixedly connected, or detachably connected, or integrally connected; can be mechanically connected, or electrically connected; can be directly connected, or indirectly connected through an intermediate medium; can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0022] Please refer to Figures 1-5 As shown in the drawings, the present application is a kind of inner layer interconnection multilayer HDI circuit board, including mounting frame 1, mounting frame 1 relative two surfaces are provided with movable slot 11, the upper surface of mounting frame 1 is provided with protective cover 2, the inner wall of protective cover 2 relative two surfaces are provided with limiting slot 202, movable slot 11 is slidably connected with push plate 110, one side of push plate 110 is provided with limiting pin 112, the other side of push plate 110 is provided with first spring 111.

[0023] Further, the upper surface of the mounting frame 1 is symmetrically provided with a clamping groove 12, the inner wall of the clamping groove 12 is provided with a second spring 120, one end of the second spring 120 is provided with a clamping plate 121, one side of the clamping plate 121 is provided with a clamping block 122, the other side of the clamping plate 121 is provided with a pulling plate 123, the inside of the mounting frame 1 is provided with a heat dissipation plate 101, the bottom surface of the heat dissipation plate 101 is provided with a plurality of heat dissipation fins 102, the upper surface of the heat dissipation plate 101 is provided with the circuit board body 3, and the heat dissipation plate 101 and the circuit board body 3 are coated with a layer of heat-conducting silica gel 103.

[0024] Further, the limiting groove 202 is in shape and size adapted to the limiting pin 112, the other end of the second spring 120 is fixedly connected to one side of the clamping plate 121, the clamping block 122 is in a trapezoidal structure in cross section, the one side of the mounting frame 1 is symmetrically provided with a wiring groove 201, and the other end of the first spring 111 is fixedly connected to one side of the inner wall of the movable groove 11.

[0025] Further, the limiting groove 202 is in position adapted to the movable groove 11, the upper surface of the protective cover 2 is provided with a plurality of heat dissipation through holes, and the mounting frame 1 is clamped and matched with the protective cover 2.

[0026] It should be noted that, by covering the mounting frame 1 with the protective cover 2 and pressing downward the protective cover 2, the limiting pin 112 is extruded and pushed to push the plate 110 into the movable groove 11 under the extrusion of the inner wall of the protective cover 2, when pressed to a certain position, the plate 110 pushes the limiting pin 112 to be clamped into the limiting groove 202 under the elastic force of the first spring 111, the limiting pin 112 is clamped with the protective cover 2, the protective cover 2 can effectively protect the circuit board body 3, and meanwhile, the pulling plate 123 is pulled to two sides, the clamping block 122 is moved to two sides, and the circuit board body 3 can be disassembled, so that the staff can be convenient for overhauling in the future, and the heat-conducting silica gel 103 coated between the circuit board body 3 and the heat dissipation plate 101 mainly functions to enhance heat conduction, so that the heat on the circuit board body 3 can be effectively conducted to the heat dissipation plate 101, thereby improving the heat dissipation efficiency.

[0027] In the description of the present specification, the description of the terms "one embodiment", "example", "specific example" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are contained in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily mean the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0028] The preferred embodiments disclosed above are only used to help describe the utility model. The preferred embodiments do not describe all the details and do not limit the application to the specific embodiments described. Obviously, according to the content of the specification, many modifications and changes can be made. The specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the utility model, so that the skilled in the art can well understand and utilize the utility model. The utility model is limited by the claims and the entire scope and equivalents thereof.

Claims

1. A multi-layer HDI circuit board with inner layer interconnections comprising a mounting frame (1), characterized in that: The installation frame (1) is provided with a movable slot (11) on opposite surfaces, the upper surface of the installation frame (1) is provided with a protective cover (2), the inner wall of the protective cover (2) is provided with a limiting slot (202) on opposite surfaces, the movable slot (11) is slidably connected with a push plate (110), one side of the push plate (110) is provided with a limiting pin (112), the other side of the push plate (110) is provided with a first spring (111).

2. The inner layer interconnected multilayer HDI circuit board of claim 1, wherein, The upper surface of the installation frame (1) is symmetrically provided with a clamping groove (12), one side of the inner wall of the clamping groove (12) is provided with a second spring (120), one end of the second spring (120) is provided with a clamping plate (121), one side of the clamping plate (121) is provided with a clamping block (122), the other side of the clamping plate (121) is provided with a pull plate (123).

3. The inner layer interconnected multilayer HDI circuit board of claim 2, wherein, The installation frame (1) is provided with a heat dissipation plate (101) inside, the bottom surface of the heat dissipation plate (101) is provided with a plurality of heat dissipation fins (102), the upper surface of the heat dissipation plate (101) is provided with a circuit board body (3), the heat dissipation plate (101) and the circuit board body (3) are coated with a layer of heat-conducting silica gel (103).

4. The inner layer interconnected multilayer HDI circuit board of claim 2, wherein, The limiting slot (202) is adapted in shape and size to the limiting pin (112), the other end of the second spring (120) is fixedly connected with one side of the clamping plate (121), and the cross section of the clamping block (122) is a trapezoidal structure.

5. The inner layer interconnected multilayer HDI circuit board of claim 4, wherein, The installation frame (1) is symmetrically provided with a wiring slot (201) on one side, and the other end of the first spring (111) is fixedly connected with one side of the inner wall of the movable slot (11).

6. The inner layer interconnected multilayer HDI circuit board of claim 5, wherein, The limiting slot (202) is adapted in position to the movable slot (11), the upper surface of the protective cover (2) is provided with a plurality of heat dissipation through holes, and the installation frame (1) is clamped and matched with the protective cover (2).

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