High-voltage box and energy storage container

Abstract

The utility model provides a high-voltage box and an energy storage container. The high-voltage box comprises a plurality of electrical assemblies; the conductive part is provided with a first plate surface and a second plate surface which are oppositely arranged along a first direction, the first plate surface comprises a first area, and the conductive part is electrically connected with the corresponding electrical component through the first area; the semiconductor refrigeration assembly comprises a cold end used for absorbing heat; the cold end is in heat-conducting connection with the conductive part through the second plate surface; and in the first direction, the orthographic projection of the cold end on the first plate surface is at least partially overlapped with the first area. According to the high-voltage box and the energy storage container provided by the invention, the semiconductor refrigeration assembly can directly convert electric energy into cold energy, the thermal inertia is very small, the conductive part can be rapidly cooled, it is ensured that the electrical assembly can safely operate at a proper temperature, the working efficiency and stability of the high-voltage box are improved, and the service life of the high-voltage box is prolonged. The overall operation efficiency of the energy storage system comprising the high-voltage box is improved, and the operation safety of the system is ensured.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of energy storage, and in particular to a high-voltage box and an energy storage container. BACKGROUND

[0002] The development of energy storage technology is rapidly advancing, becoming an important support for energy transformation and sustainable development. With the continuous progress of technology, the energy density of batteries used for energy storage is higher, the service life is longer, and the cost is lower, which also means that the battery capacity is larger and the current through the electrical equipment is higher. In order to ensure the normal operation of the energy storage system, the heat dissipation and heat resistance performance of the electrical equipment in the energy storage container has higher requirements.

[0003] The high-voltage box is an important part of the energy storage container, and there are various electrical components in the high-voltage box to ensure the safe and reliable operation of the energy storage system. When the system is running, the circuit is connected, and each electrical component will generate heat when working, which needs to be dissipated in time. In the related technology, the cooling method of the high-voltage box is natural cooling. With the development of energy storage technology, the current through the high-voltage box is getting larger and larger, and the natural cooling method cannot meet the cooling needs of the high-voltage box. CONTENT OF THE INVENTION

[0004] Therefore, the purpose of the present application is to provide a high-voltage box and an energy storage container to at least partially solve the problem that the natural cooling method cannot meet the cooling needs of the high-voltage box.

[0005] To achieve the above purpose, the first aspect of the present application provides a high-voltage box, comprising: a plurality of electrical components; a conductive part having a first plate surface and a second plate surface arranged opposite along a first direction, the first plate surface comprising a first region, the conductive part being electrically connected to the corresponding electrical component through the first region; a semiconductor refrigeration component comprising a cold end for absorbing heat; the cold end is in thermal connection with the conductive part through the second plate surface; wherein, along the first direction, the projection of the cold end on the first plate surface at least partially overlaps the first region.

[0006] Optionally, the semiconductor refrigeration component further comprises a hot end for outputting heat, and the hot end is in thermal connection with a first active heat dissipation component.

[0007] Optionally, the hot end and the first active heat dissipation component are further connected by a heat dissipation part.

[0008] Optionally, the heat dissipation part comprises a heat conduction body and a plurality of heat dissipation fins, the heat conduction body has a first heat conduction surface and a second heat conduction surface, the first heat conduction surface is in thermal connection with the hot end, and a plurality of heat dissipation fins are in thermal connection with the second heat conduction surface at intervals; the first active heat dissipation component is connected to the side of the heat dissipation fin away from the second heat conduction surface.

[0009] Optionally, when at least two of the hot ends have surfaces that are adjacent and in the same plane, the at least two surfaces are thermally connected to the same first thermal conduction surface.

[0010] Optionally, along the first direction, the cold end is projected on the first surface to cover the first region.

[0011] Optionally, at least part of the electrically conductive member is arranged in at least two layers along the first direction, and an insulating support is arranged between the electrically conductive members adjacent along the first direction.

[0012] Optionally, the high-voltage box comprises a housing, the electrical component, the electrically conductive member, and the semiconductor refrigeration component are arranged in the housing; a side wall of the housing is provided with a through ventilation hole and a mounting through hole, the second active heat dissipation component is connected in the mounting through hole; the electrically conductive member is close to the side wall of the housing and extends along the side wall of the housing.

[0013] Optionally, the high-voltage box comprises a first active heat dissipation component, at least one of the first active heat dissipation component and the second active heat dissipation component comprises a fan.

[0014] Optionally, the high-voltage box comprises a housing, the housing comprises a panel, the panel is connected with a plurality of electrical interfaces, the electrically conductive member is electrically connected with the corresponding electrical interface; the panel is further connected with a refrigeration electrical interface, the semiconductor refrigeration component is electrically connected with the refrigeration electrical interface.

[0015] Optionally, the electrically conductive member comprises a solid structure formed by an electrically conductive material.

[0016] Optionally, the electrical component comprises at least one of a pre-charging resistor, a pre-charging relay, a fuse, a high-voltage relay, a switching power supply relay, a switching power supply, an isolating switch, a current sensor, and a shunt.

[0017] Based on the same inventive concept, the second aspect of the present application further provides an energy storage container, comprising: an energy storage cluster, an energy storage converter, and a high-voltage box as described in the first aspect, the high-voltage box is electrically connected with the energy storage cluster and the energy storage converter respectively.

[0018] From the above, it can be seen that the high-voltage box and the energy storage container provided by the application can connect the cold end of the semiconductor refrigeration assembly to the surface of the conductive part, and cover at least part of the first area where the conductive part and the electrical component are electrically connected, based on the advantages of the semiconductor refrigeration assembly, such as small size, compact structure, no mechanical moving parts, small space and shape limitation, and high reliability. The semiconductor refrigeration assembly can directly convert electrical energy into cold energy, has small thermal inertia, can quickly cool the conductive part, ensures that the electrical component can operate safely at an appropriate temperature, helps to improve the working efficiency and stability of the high-voltage box, improves the overall operation efficiency of the energy storage system including the high-voltage box, and ensures the operation safety of the system. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the application or related art, the drawings needed to be used in the embodiments or related art description will be briefly introduced. Obviously, the drawings in the following description are only embodiments of the application, and other drawings can be obtained by those skilled in the art without creative labor.

[0020] Figure 1 It is a schematic diagram of the high-voltage box of the first structure of the embodiment of the application;

[0021] Figure 2 It is an exploded schematic diagram of the high-voltage box of the first structure of the embodiment of the application;

[0022] Figure 3 It is a partial schematic diagram of the high-voltage box of the embodiment of the application;

[0023] Figure 4 It is a partial schematic diagram of the high-voltage box of the embodiment of the application;

[0024] Figure 5 It is a schematic diagram of the structure principle of the semiconductor refrigeration plate of the embodiment of the application;

[0025] Figure 6 It is a schematic diagram of the structure principle of the semiconductor refrigeration plate of the embodiment of the application; Figure 3 It is a schematic diagram of the structure principle of the semiconductor refrigeration plate of the embodiment of the application;

[0026] Figure 7 It is a schematic diagram of the structure principle of the semiconductor refrigeration plate of the embodiment of the application;

[0027] Figure 8 It is a schematic diagram of the structure principle of the semiconductor refrigeration plate of the embodiment of the application;

[0028] Figure 9 It is a schematic diagram of the structure principle of the semiconductor refrigeration plate of the embodiment of the application;

[0029] Figure 10 Fig. 7 is an exploded perspective view of a high-voltage box according to a second embodiment of the present application;

[0030] Figure 11 Fig. 8 is a rear perspective view of a panel of the high-voltage box according to the second embodiment of the present application;

[0031] Figure 12 Fig. 9 is a schematic view of a connection between a semiconductor refrigeration assembly and a refrigeration wire of the high-voltage box according to the second embodiment of the present application.

[0032] BRIEF DESCRIPTION OF THE DRAWINGS

[0033] 100, electrical assembly; 110, input end; 120, output end;

[0034] 200, conductive member; 210, first plate surface; 211, first region; 220, second plate surface;

[0035] 300, semiconductor refrigeration assembly; 310, cold end; 320, hot end; 330, N-type semiconductor element; 340, P-type semiconductor element; 350, first electrically conductive body; 360, second electrically conductive body;

[0036] 400, first active heat dissipation assembly;

[0037] 500, heat dissipation member; 510, heat-conductive body; 511, first heat-conductive surface; 512, second heat-conductive surface; 520, heat dissipation fin;

[0038] 600, housing; 610, ventilation hole; 620, mounting through hole; 630, lower box body; 631, panel; 632, back plate; 633, side plate; 634, bottom plate; 640, upper cover;

[0039] 700, second active heat dissipation assembly; 800, electrical interface; 900, insulating support; 1000, refrigeration electrical interface; 1100, refrigeration wire; 1200, refrigeration main wire; 1300, circuit board. DETAILED DESCRIPTION

[0040] In order to make the objects, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the embodiments and the accompanying drawings.

[0041] It should be noted that the relative arrangement, numerical expressions and values of the components set forth in the embodiments are not intended to limit the scope of the present application unless otherwise specifically stated.

[0042] It should be understood that the sizes of the various parts shown in the drawings are not drawn according to the actual proportions in order to facilitate the description.

[0043] The following description of at least one exemplary embodiment is merely exemplary in nature and is in no way intended to limit the application or its application and uses.

[0044] It should be noted that the technical terms or scientific terms used in the embodiments of the present application should be understood as the general meaning understood by those skilled in the art to which the embodiments belong, unless otherwise defined. The terms "first", "second", and the like used in the embodiments of the present application do not represent any order, quantity or importance, but are only used to distinguish different components. The terms "include" or "contain" and the like mean that the elements or objects before the terms cover the elements or objects listed after the terms and their equivalents, and do not exclude other elements or objects. The terms "connect" or "connected" and the like are not limited to physical or mechanical connection, but can include electrical connection, whether direct or indirect. The terms "up", "down", "left", "right" and the like are only used to represent relative positional relationship, and when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0045] In some embodiments, the high-voltage box is cooled by forced cooling with a fan.

[0046] However, the forced cooling with a fan has high requirements for the selection and installation position of the fan. If the fan is improperly arranged, the surface wind speed of the components in the high-voltage box will be uneven, the local cooling effect of the flow parts will be poor, and in severe cases, a flow dead zone may even be formed in the high-voltage box, the components in the flow dead zone cannot be cooled, thereby causing an over-temperature risk, which may cause a fire and other safety accidents.

[0047] To solve the above problems, the embodiments provide a high-voltage box. Figure 1 A perspective view of the high-voltage box of the first structure is shown, Figure 2 An exploded view of the high-voltage box of the first structure is shown.

[0048] As Figure 1 and Figure 2 The high-voltage box includes a plurality of electrical components 100 and a conductive part 200.

[0049] Figure 3 A partial perspective view of the high-voltage box is shown, Figure 4 A partial side view of the high-voltage box is shown.

[0050] As Figure 3 and Figure 4 The conductive part 200 has a first direction (such as Figure 3 and Figure 4The first plate surface 210 and the second plate surface 220 are oppositely arranged along the Z direction in the coordinate system), the first plate surface 210 includes a first area 211, and the conductive member 200 is electrically connected to the corresponding electrical component 100 through the first area 211; the semiconductor refrigeration component 300 includes a cold end 310 for absorbing heat; the cold end 310 is in thermal connection with the conductive member 200 through the second plate surface 220. In the first direction, the orthographic projection of the cold end 310 on the first plate surface 210 at least partially overlaps the first area 211.

[0051] For example, the conductive member 200 can include a conductive copper bar or a plurality of parallel conductive wires.

[0052] For example, the electrical components 100 can be electrically connected through the conductive member 200, and the electrical components 100 can also be electrically connected to an external circuit through the conductive member 200.

[0053] For example, the first direction can be the height direction of the electrical component 100.

[0054] For example, the semiconductor refrigeration component 300 can be powered through the conductive member 200; or the semiconductor refrigeration component 300 can be connected to a power supply through a separate electrical connection line.

[0055] For example, the semiconductor refrigeration component 300 includes a semiconductor refrigeration plate, Figure 5 A structural schematic diagram of a semiconductor refrigeration plate is shown, which includes a plurality of N-type semiconductor elements 330 (including bismuth telluride) and a plurality of P-type semiconductor elements 340 (including bismuth telluride), the plurality of N-type semiconductor elements 330 and the plurality of P-type semiconductor elements 340 are alternately arranged and form a series circuit with a direct current power supply. Taking an example of an electric couple pair formed by one N-type semiconductor element 330 and one adjacent P-type semiconductor element 340, when the direct current is turned on in the series circuit, energy transfer can be generated. In the current direction, the current flows from the N-type semiconductor element 330 to the P-type semiconductor element 340 through a first conductive body 350, and the first conductive body 350 absorbs heat, and the insulator (such as a ceramic sheet) in thermal connection with all the first conductive bodies 350 is configured as a cold end 310. Similarly, the current flows from the P-type semiconductor element 340 to the N-type semiconductor element 330 through a second conductive body 360, and the second conductive body 360 releases heat, and the insulator in thermal connection with all the second conductive bodies 360 is configured as a hot end 320. The heat absorption amount of the cold end 310 and the heat release amount of the hot end 320 are both related to the size of the current and the number of electric couple pairs formed by the N-type semiconductor elements 330 and the P-type semiconductor elements 340. For example, the semiconductor refrigeration plate can include a thermoelectric pile formed by hundreds of electric couple pairs to enhance the refrigeration (heating) effect.

[0056] It should be noted that when the semiconductor heat-conducting assembly includes a semiconductor refrigeration plate, the plate size of the semiconductor refrigeration plate can be selected according to the size of the electrically conductive piece 200 and the refrigeration power requirement of the electrical assembly 100, and it is necessary to ensure that the semiconductor refrigeration plate can be stably connected to the electrically conductive piece 200, and the plate size of the semiconductor refrigeration plate is not limited herein.

[0057] For example, when the electrically conductive piece 200 is an electrically conductive copper bar, the first plate surface 210 and the second plate surface 220 can be two surfaces of the electrically conductive copper bar arranged opposite in the thickness direction; when the electrically conductive piece 200 is a plurality of parallel wires, the first plate surface 210 and the second plate surface 220 can be a plane formed by fitting the plurality of wires.

[0058] For example, the surface of the cold end 310 can be coated with a heat-conducting structural adhesive to enable the surface of the cold end 310 to be in heat-conducting connection with the surface of the electrically conductive piece 200 through the heat-conducting structural adhesive.

[0059] In this embodiment, the electrically conductive piece 200 can provide electrical energy or transmit signals to the corresponding electrical assembly 100. The applicant has found that when the electrical assembly 100 in the high-voltage box is working, the position of the electrical connection between the electrical assembly 100 and the electrically conductive piece 200, i.e., the first region 211 of the electrically conductive piece 200, can concentrate heat, resulting in a higher temperature of the first region 211. In order to cool the first region 211, the cold end 310 of the semiconductor refrigeration assembly 300 is heat-conducting connected to the corresponding position on the electrically conductive piece 200, so that the orthographic projection of the cold end 310 on the first plate surface 210 at least partially overlaps the first region 211, i.e., the cold end 310 at least partially covers the first region 211. Based on the excellent heat-conducting performance of the electrically conductive piece 200, the cold end 310 can quickly absorb heat, avoiding heat concentration.

[0060] The high-voltage box provided in this embodiment can heat-conducting connect the cold end 310 of the semiconductor refrigeration assembly 300 to the surface of the electrically conductive piece 200 based on the advantages of the semiconductor refrigeration assembly 300, such as small size, compact structure, no mechanical moving parts, small space and shape limitation, and high reliability, and enable the cold end 310 to cover at least part of the first region 211 of the electrically conductive piece 200 electrically connected to the electrical assembly 100. The semiconductor refrigeration assembly 300 can directly convert electrical energy into cold energy, has very small thermal inertia, and can quickly cool the electrically conductive piece 200, ensuring that the electrical assembly 100 can safely operate at an appropriate temperature, which helps to improve the working efficiency and stability of the high-voltage box, improve the overall operation efficiency of the energy storage system including the high-voltage box, and ensure the operation safety of the system.

[0061] For example, Figure 3 and Figure 4In some embodiments, the semiconductor refrigeration assembly 300 further comprises a heat end 320 outputting heat, and the heat end 320 is in thermal conduction connection with the first active heat dissipation assembly 400.

[0062] For example, the first active heat dissipation assembly 400 can include a fan or a liquid cooling unit, etc.

[0063] For example, the cold end 310 and the heat end 320 are oppositely arranged along a first direction.

[0064] For example, the first active heat dissipation assembly 400 can be directly or indirectly in thermal conduction connection with the heat end 320.

[0065] With the continuous operation of the semiconductor refrigeration assembly 300, the temperature of the heat end 320 will rise, and if the heat end 320 is not cooled, when the temperature of the heat end 320 is too high, it may cause the internal components of the semiconductor refrigeration assembly 300 to short circuit or open circuit, and thus the semiconductor refrigeration assembly 300 cannot work normally.

[0066] To avoid the above situation, the first active heat dissipation assembly 400 is arranged at the heat end 320 in the embodiment, and the heat end 320 is forcibly cooled by the first active heat dissipation assembly 400, which not only can effectively reduce the temperature of the heat end 320, but also can make the temperature of the cold end 310 also correspondingly drop, so as to achieve more rapid and effective heat dissipation of the electrically conductive part 200, so as to avoid the problem that the electrical components 100 or the electrically conductive part 200 in the high-voltage box work for a long time in a high-temperature environment, causing the components to age and be damaged, and help to improve the service life of the electrical components 100 and the electrically conductive part 200, and reduce the frequency of maintenance and replacement.

[0067] For example, Figure 4 In some embodiments, the heat end 320 and the first active heat dissipation assembly 400 are further connected with a heat dissipation part 500.

[0068] For example, the heat dissipation part 500 can be in thermal conduction connection with the heat end 320 through a thermal conductive structure adhesive.

[0069] For example, the first active heat dissipation assembly 400 can be connected with the heat dissipation part 500 through clamping, plug-in or fastener connection, etc.

[0070] For example, the heat dissipation part 500 covers the heat end 320 of the semiconductor refrigeration assembly 300, so as to have a heat dissipation effect on the whole heat end 320.

[0071] It should be noted that the size of the heat sink can be selected according to the actual space size inside the high-voltage box and the cooling power of the semiconductor refrigeration assembly 300, and is not limited herein.

[0072] When the temperature of the hot end 320 rises, the heat sink 500 can absorb the heat of the hot end 320, and under the joint action of the natural wind and the first active heat dissipation assembly 400, the heat of the heat sink 500 itself is rapidly dispersed to quickly reduce the temperature of the heat sink 500, so that the heat sink 500 continues to absorb the heat of the hot end 320, and such a cycle is repeated to realize more efficient heat dissipation of the hot end 320 of the semiconductor refrigeration assembly 300 through the heat sink 500 and the first active heat dissipation assembly 400, so as to ensure that the electrical components 100 and the conductive member 200 in the high-voltage box can operate safely and stably.

[0073] As Figure 4 In some embodiments, the heat sink 500 includes a heat-conducting body 510 and a plurality of heat dissipation fins 520, the heat-conducting body 510 has a first heat-conducting surface 511 and a second heat-conducting surface 512, the first heat-conducting surface 511 is in heat-conducting connection with the hot end 320, and the plurality of heat dissipation fins 520 are in heat-conducting connection with the second heat-conducting surface 512 at intervals; the first active heat dissipation assembly 400 is connected to a side of the heat dissipation fin 520 away from the second heat-conducting surface 512.

[0074] For example, the first heat-conducting surface 511 and the second heat-conducting surface 512 can be arranged adjacently or oppositely.

[0075] For example, the heat-conducting body 510 is in a plate structure, one side of the plate structure can be used as the first heat-conducting surface 511, and the other side of the plate structure can be used as the second heat-conducting surface 512.

[0076] For example, the heat dissipation fin 520 and the heat-conducting body 510 can be connected by welding, bonding, fastening or one-piece forming.

[0077] By connecting a plurality of heat dissipation fins 520 to the heat-conducting body 510, the surface area of the heat-conducting body 510 can be increased, so that the air flowing between two adjacent heat dissipation fins 520 can carry away more heat, which helps to improve the heat dissipation effect of the hot end 320.

[0078] At the same time, the first active heat dissipation assembly 400 is connected to a side of the heat dissipation fin 520 away from the second heat-conducting surface 512, that is, the first active heat dissipation assembly 400 is connected to the free end of the heat dissipation fin 520, which can increase the air flow speed between two adjacent heat dissipation fins 520 (when the first active heat dissipation assembly 400 is a fan) or reduce the medium temperature between two adjacent heat dissipation fins 520 (when the first active heat dissipation assembly 400 is a liquid cooling element), which helps to further improve the heat dissipation effect of the hot end 320.

[0079] Figure 6 It is shown that Figure 3A schematic diagram after removing the first active heat dissipation component 400 and the heat sink 500, as shown below. Figure 4 and Figure 6 In some embodiments, when at least two hot ends 320 have adjacent surfaces that are in the same plane, at least two of the surfaces are thermally connected to the same first thermally conductive surface 511.

[0080] For example, the surface connected to the first thermally conductive surface 511 is the surface of the hot end 320 that is away from the cold end 310.

[0081] by Figure 4 Taking the structure and orientation shown as an example, the electrical component 100 includes an input terminal 110 and an output terminal 120, both located on top of the electrical component 100 and arranged adjacent to each other. Each input terminal 110 and output terminal 120 is connected to a conductive element 200, and each conductive element 200 is connected to a semiconductor cooling component 300. Based on the positional relationship between the input terminal 110 and the output terminal 120, the hot ends 320 of the two semiconductor cooling components 300 are adjacent and on the same plane. In this case, the hot ends 320 of the two semiconductor cooling components 300 can be simultaneously thermally connected by the same heat sink 500, so that the two hot ends 320 can be cooled by the same heat sink 500 and the same first active cooling component 400. This not only helps reduce the manufacturing cost of the high-voltage box but also avoids the problem of interference between adjacent heat sinks 500 or adjacent first active cooling components 400 due to the small gap between adjacent semiconductor cooling components 300.

[0082] like Figure 4 In some embodiments, along a first direction, the cold end 310 is projected onto the first plate surface 210, covering the first region 211.

[0083] The cold end 310 fully covers the first region 211, which on the one hand helps to improve the cooling efficiency and cooling effect of the semiconductor cooling component 300 on the electrical connection parts of the conductive component 200 and the electrical component 100, and on the other hand can make the temperature of each position in the first region 211 more uniform, which helps to improve the temperature consistency of the electrical connection parts of the electrical component 100.

[0084] It should be noted that, in the embodiments of this application, the installation position of the semiconductor cooling component 300 can be designed according to the actual heat generation and space distribution within the high-voltage box. Besides connecting the semiconductor cooling component 300 to the conductive component 200, it can also be directly connected to the electrical component 100, which has a risk of overheating.

[0085] In some embodiments, the cold end 310 is thermally connected to at least a portion of the surface of the target electrical component 100.

[0086] Exemplarily, the target electrical component is an electrical component 100 prone to overload and overheating in a high-temperature environment.

[0087] Generally, the shell of the electrical component 100 requiring heat dissipation has a certain heat conduction performance, and the cold end 310 of the semiconductor refrigeration assembly 300 is heat-conductively connected to the surface of the target electrical component 100. The heat dissipation of each electrical component 100 in the high-voltage box can be accurately controlled according to the heat dissipation requirements of different electrical components 100, so as to accurately and effectively control the temperature of each electrical component 100 in the high-voltage box, thereby improving the heat dissipation efficiency and operation stability of the high-voltage box.

[0088] As shown in Figure 1 , Figure 2 and Figure 4 , in some embodiments, the high-voltage box comprises a shell 600, the electrical component 100, the conductive member 200 and the semiconductor refrigeration assembly 300 are arranged in the shell 600; the side wall of the shell 600 is provided with a through ventilation hole 610 and / or a mounting through hole 620, the second active heat dissipation assembly 700 is connected in the mounting through hole 620; the conductive member 200 is close to the side wall of the shell 600 and extends along the side wall of the shell 600.

[0089] Exemplarily, the ventilation hole 610 can be provided with one, two or more. When the ventilation hole 610 is provided with multiple, the multiple ventilation holes 610 can be arrayed or unidirectionally spaced on the side wall of the shell 600, so as to improve the flow rate and flow of air entering or flowing out of the high-voltage box through the ventilation hole 610, thereby improving the heat dissipation efficiency of the high-voltage box.

[0090] Exemplarily, the shell 600 comprises a lower box body 630 and an upper cover 640, the lower box body 630 comprises a panel 631 and a back plate 632 oppositely arranged along a second direction (such as the X direction in Figure 2 , two side plates 633 oppositely arranged along a third direction (such as the Y direction in Figure 2 , and a bottom plate 634, the panel 631, the back plate 632 and the two side plates 633 form a frame structure, the bottom plate 634 seals the bottom opening of the frame structure and is fixedly connected with the frame structure, and the upper cover 640 covers the top opening of the frame structure.

[0091] Exemplarily, Figure 7 shows a right view schematic view of the high-voltage box, Figure 8 shows a left view schematic view of the high-voltage box. As shown in Figure 7 and Figure 8 , each side plate 633 is provided with multiple ventilation holes 610, and the multiple ventilation holes 610 are spaced along the second direction.

[0092] Exemplarily, the ventilation hole 610 is a rectangular hole.

[0093] Exemplarily, the second active heat dissipation assembly 700 is provided with two and is spaced apart on the back plate 632 along the third direction.

[0094] Exemplarily, the first active heat dissipation assembly 400 and the second active heat dissipation assembly 700 can be the same or different.

[0095] The air can flow between the high-voltage box and the outside through the ventilation hole 610, which helps to disperse the high-temperature air in the high-voltage box to the outside, so as to improve the heat dissipation efficiency of the high-voltage box. The second active heat dissipation assembly 700 can improve the flow speed of the air between the high-voltage box and the outside, or reduce the temperature of the flowing air, which helps to further improve the heat dissipation effect of the high-voltage box.

[0096] Meanwhile, the conductive part 200 is close to the side wall of the shell 600, which can shorten the distance between the conductive part 200 and the ventilation hole 610 or the second active heat dissipation assembly 700, so as to improve the heat dissipation effect of the ventilation hole 610 or the second active heat dissipation assembly 700 on the conductive part 200 and the heat dissipation part 500, and improve the speed of releasing heat of the conductive part 200 or the heat dissipation part 500.

[0097] As shown in FIG. 1, the conductive part 200 is provided with a plurality of heat dissipation parts 500, and the heat dissipation part 500 is arranged on the conductive part 200 along the first direction. Figure 2 In some embodiments, at least part of the conductive part 200 is provided with at least two layers which are spaced apart along the first direction, and the insulating support 900 is arranged between the adjacent conductive parts 200 along the first direction.

[0098] Exemplarily, the insulating support 900 can be a columnar structure or a block structure.

[0099] Exemplarily, according to the extension length of the conductive part 200, the insulating support 900 can be provided with one, two or more along the extension direction of the conductive part 200, so that the adjacent conductive parts 200 can maintain a predetermined distance, thereby ensuring that the adjacent conductive parts 200 can achieve spatial insulation.

[0100] When it is necessary to arrange multiple conductive parts 200, the multiple conductive parts 200 can be arranged in layers along the first direction, so that each of the multiple conductive parts 200 can be close to the ventilation hole 610 or the second active heat dissipation assembly 700 on the side plate 633, so that the ventilation hole 610 or the second active heat dissipation assembly 700 can achieve better heat dissipation effect on the multiple conductive parts 200. The multiple conductive parts 200 arranged in layers can be spaced apart by the insulating support 900, so as to avoid the lap or arc between the adjacent conductive parts 200, ensure that the adjacent conductive parts 200 have better insulation effect, and ensure that the electrical components 100 in the high-voltage box can operate normally.

[0101] In some embodiments, at least one of the first active heat dissipation assembly 400 and the second active heat dissipation assembly 700 comprises a fan.

[0102] The fan has the advantages of high heat dissipation capacity, reliable operation, convenient installation and low cost. Using the fan as the first active heat dissipation assembly 400 and / or the second active heat dissipation assembly 700 helps to reduce the operation stability of the high-voltage box, reduces the equipment difficulty and material cost of the high-voltage box, and helps mass production.

[0103] Figure 9 A front view schematic diagram of the panel 631 of the first structure is shown in FIG. 6A. Figure 9 In some embodiments, the panel 631 of the shell 600 is connected with a plurality of electrical interfaces 800, and the conductive member 200 is electrically connected with the corresponding electrical interface 800.

[0104] For example, the electrical interface 800 is embedded in the panel 631, one end of the electrical interface 800 is located inside the shell 600 and is electrically connected with the conductive member 200, and the opposite end of the electrical interface 800 is located outside the shell 600 and is used for electrical connection with an external circuit.

[0105] The conductive member 200 can be electrically connected with the external circuit through the electrical interface 800 provided in the panel 631, so as to supply power or transmit signals to the electrical assembly 100 inside the shell 600.

[0106] Figure 10 An exploded perspective schematic diagram of the high-voltage box of the second structure is shown in FIG. 7A. Figure 11 A rear side perspective schematic diagram of the panel 631 of the high-voltage box of the second structure is shown in FIG. 7B. Figure 10 Figure 11 In some embodiments, the panel 631 is also connected with a refrigeration electrical interface 1000, and the semiconductor refrigeration assembly 300 is electrically connected with the refrigeration electrical interface 1000.

[0107] For example, as shown in FIG. 8A, Figure 10 Figure 11 The refrigeration electrical interface 1000 is embedded in the panel 631, one end of the refrigeration electrical interface 1000 is located inside the shell 600 and is electrically connected with the semiconductor refrigeration assembly 300 through the refrigeration lead 1100, and the opposite end of the refrigeration electrical interface 1000 is located outside the shell 600 and is used for electrical connection with an external circuit.

[0108] For example, as shown in FIG. 8B, Figure 12 ​​The connection diagram of the semiconductor refrigeration assembly 300 and the refrigeration lead 1100 is shown, and each semiconductor refrigeration assembly 300 is led out two refrigeration leads 1100. The plurality of refrigeration leads 1100 can be connected to the same refrigeration total lead 1200 at the same time after extending to the position close to the panel 631, and are electrically connected to the refrigeration electrical interface 1000 through the refrigeration total lead 1200.

[0109] The semiconductor refrigeration assembly 300 can be powered or power-regulated through the refrigeration electrical interface 1000 on the panel 631, so that the semiconductor refrigeration assembly 300 can stably cool the electrical assembly 100 in the high-voltage box, and the power of the semiconductor refrigeration assembly 300 can be regulated to more accurately control the temperature of the electrical assembly 100 and the conductive part 200, so that the electrical assembly 100 can stably operate in a preset temperature range, which helps to improve the working efficiency, stability, and working time of the high-voltage box.

[0110] In some embodiments, the conductive part 200 includes a solid structure formed of a conductive material.

[0111] Designing the conductive part 200 as a solid structure helps to increase the flow area of the conductive part 200, so that the conductive part 200 has stronger conductive capacity under the same surface area. At the same time, since the conductive material generally has good heat conduction capacity, designing the conductive part 200 as a solid structure formed of a conductive material can also ensure that the conductive part 200 has good heat conduction capacity, which helps to improve the heat dissipation effect of the semiconductor refrigeration assembly 300 on the electrical assembly 100 and the conductive part 200.

[0112] In some embodiments, the electrical assembly 100 includes at least one of a pre-charging resistor, a pre-charging relay, a fuse, a high-voltage relay, a switching power supply relay, a switching power supply, an isolation switch, a current sensor, and a shunt.

[0113] For example, a plurality of electrical assemblies 100 can be connected to at least one circuit board 1300, and the conductive part 200 can be arranged above the circuit board 1300 and separated from the circuit board 1300 by the insulating support 900.

[0114] It should be noted that the electrical assembly 100 and its connection structure in the high-voltage box can be selected and designed according to the functional requirements of the high-voltage box, and are not limited herein.

[0115] Based on the same inventive concept, in combination with the description of the high-voltage box in the above embodiments, the present embodiment provides an energy storage container, which has the corresponding technical effects of the high-voltage box in the above embodiments, and will not be described here.

[0116] An energy storage container comprises an energy storage cluster (or battery cluster), an energy storage converter (PCS), and a high-voltage box as described in the above embodiments, which are electrically connected with the energy storage cluster and the energy storage converter respectively.

[0117] The high-voltage box, as a high-voltage loop management module connecting the energy storage cluster and the energy storage converter, has functions of energy storage cluster voltage / current collection, contactor control and protection, etc.

[0118] It should be noted that the above describes some embodiments of the present application. Other embodiments are within the scope of the appended claims.

[0119] Each of the embodiments in the present application is described in a progressive manner, and each embodiment focuses on the difference from other embodiments. The same or similar parts between the embodiments can be referred to each other.

[0120] The description of the present application is given for the purpose of illustration and description, and is not intended to be exhaustive or to limit the present application to the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. Embodiments are chosen and described in order to best explain the principles of the present application and its practical application, and to enable others skilled in the art to understand the present application in order to design various embodiments with various modifications for specific use cases.

[0121] Those of ordinary skill in the art should understand that the above discussion of any embodiment is only exemplary, and is not intended to suggest that the scope of the present application is limited to these examples; the above embodiments or technical features in different embodiments can also be combined, and the steps can be implemented in any order, and there are many other changes to the aspects of the embodiments of the present application as described above. In order to be brief, they are not provided in detail.

[0122] Although the present application has been described in conjunction with specific embodiments thereof, many alternatives, modifications and variations will be apparent to those skilled in the art from the foregoing description.

[0123] The embodiments of the present application are intended to cover all such alternatives, modifications and variations as falling within the scope of the present application. Accordingly, any omission, modification, equivalent replacement, improvement, etc. made within the spirit and principle of the embodiments of the present application shall be included in the protection scope of the present application.

Claims

1. A high voltage box characterized by, The high-voltage box comprises: a plurality of electrical components; a conductive piece having a first plate surface and a second plate surface oppositely arranged along a first direction, the first plate surface comprising a first region, the conductive piece being electrically connected to the corresponding electrical component through the first region; a semiconductor refrigeration component comprising a cold end for absorbing heat; the cold end being thermally connected to the conductive piece through the second plate surface; wherein, along the first direction, a projection of the cold end on the first plate surface at least partially overlaps the first region.

2. The high-pressure cell of claim 1, wherein, The semiconductor refrigeration component further comprises a hot end for outputting heat, and the hot end is thermally connected to a first active heat dissipation component.

3. The high-pressure cell of claim 2, wherein, The hot end and the first active heat dissipation component are further connected to a heat dissipation piece.

4. The high-pressure cell of claim 3, wherein The heat dissipation piece comprises a thermally conductive body and a plurality of heat dissipation fins, the thermally conductive body having a first thermally conductive surface and a second thermally conductive surface, the first thermally conductive surface being thermally connected to the hot end, and the plurality of heat dissipation fins being thermally connected to the second thermally conductive surface at intervals; The first active heat dissipation component is connected to a side of the heat dissipation fin away from the second thermally conductive surface.

5. The high-pressure cell of claim 4, wherein When at least two hot ends have adjacent surfaces in the same plane, at least two of the surfaces are thermally connected to the same first thermally conductive surface.

6. The high pressure cell of claim 1, wherein, Along the first direction, the projection of the cold end on the first plate surface covers the first region.

7. The high pressure cell of claim 1, wherein, At least part of the conductive piece is arranged in at least two layers at intervals along the first direction, and insulating supports are arranged between the conductive pieces adjacent along the first direction.

8. The high pressure cell of claim 1, wherein, The high-voltage box comprises a housing, and the electrical components, the conductive piece, and the semiconductor refrigeration component are arranged in the housing; A side wall of the housing is provided with a through ventilation hole and a mounting through hole, a second active heat dissipation component is connected in the mounting through hole, and the conductive piece extends along the side wall of the housing and is close to the side wall of the housing.

9. The high-pressure cell of claim 8, wherein, The high-voltage box comprises a first active heat dissipation component, and at least one of the first active heat dissipation component and the second active heat dissipation component comprises a fan.

10. The high pressure cell of claim 1, wherein, The high-voltage box comprises a housing, and the housing comprises a panel connected with a plurality of electrical interfaces, and the conductive piece is electrically connected to the corresponding electrical interface. The panel is further connected with a refrigeration electrical interface, and the semiconductor refrigeration component is electrically connected to the refrigeration electrical interface.

11. The high pressure cell of claim 1, wherein, The conductive piece comprises a solid structure formed of a conductive material.

12. The high pressure cell of claim 1, wherein, The electrical components comprise at least one of a pre-charging resistor, a pre-charging relay, a fuse, a high-voltage relay, a switching power supply relay, a switching power supply, an isolating switch, a current sensor, and a shunt.

13. An energy storage container, characterized by The high-voltage box is electrically connected to the energy storage cluster and the energy storage converter, respectively. ​

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