Display device manufacturing system

Abstract

The utility model discloses a display device manufacturing system. The display device manufacturing system includes: a display panel including anode electrodes disposed on a pixel circuit layer, an organic light emitting structure integrally disposed on the pixel circuit layer and the anode electrodes, and a heating wiring in contact with a lower surface of the organic light emitting structure between two anode electrodes adjacent to each other; a heating plate that is guided in a direction toward the display panel so as to contact an upper surface of the organic light-emitting structure that overlaps the heating wiring; a first power supply unit that supplies power to the heating plate such that the heating plate generates Joule heat; and a second power supply unit that supplies power to the heating wiring so that the heating wiring generates Joule heat.

Description

TECHNICAL FIELD

[0001] The utility model relates to a display device manufacturing system. BACKGROUND

[0002] A display device includes subpixels that emit light. The display device can display an image by combining the light emitted from the subpixels.

[0003] In addition, in order to achieve high resolution, as the distance between adjacent subpixels is closer, a lateral leakage current can occur between the adjacent subpixels, and thus a problem of a decrease in display quality can occur. SUMMARY

[0004] TECHNICAL PROBLEM

[0005] The utility model is used to provide a display device manufacturing system for providing a display device with improved display quality.

[0006] TECHNICAL SOLUTION

[0007] According to an embodiment of the utility model, a display device manufacturing system includes a display panel including anode electrodes arranged on a pixel circuit layer, an organic light emitting structure arranged on the pixel circuit layer and the anode electrodes as a whole, and a heating wire in contact with a lower surface of the organic light emitting structure between two anode electrodes adjacent to each other; a heating plate directed toward a direction of the display panel to contact an upper surface of the organic light emitting structure overlapping the heating wire; a first power supply part supplying power to the heating plate to make the heating plate generate Joule heat; and a second power supply part supplying power to the heating wire to make the heating wire generate Joule heat.

[0008] In an embodiment, after the heating plate contacts the upper surface of the organic light emitting structure, the first power supply part and the second power supply part can supply power to the heating plate and the heating wire, respectively.

[0009] In an embodiment, the organic light emitting structure can be disconnected between the two anode electrodes adjacent to each other by Joule heat generated in the heating plate and Joule heat generated in the heating wire.

[0010] In an embodiment, the heating plate can have a flat plate shape.

[0011] In an embodiment, when Joule heat is generated in the heating plate, the temperature of the heating plate can be lower than a sublimation temperature of the organic light emitting structure.

[0012] In an embodiment, the display panel can further include a pixel definition film disposed on the pixel circuit layer and including a pixel opening exposing a portion of the anode electrode. The organic light emitting structure and the heating wire can be disposed on the pixel definition film.

[0013] In an embodiment, the pixel definition film can include an inorganic insulating substance.

[0014] In an embodiment, an upper surface of the organic light emitting structure overlapping the heating wire can be located at a higher level than an upper surface of the organic light emitting structure not overlapping the heating wire.

[0015] A display device manufacturing system according to another embodiment of the present application includes a display panel including an anode electrode disposed above a pixel circuit layer, an organic light emitting structure disposed above the pixel circuit layer and the anode electrode as a whole, and a heating wire contacting a lower surface of the organic light emitting structure between two anode electrodes adjacent to each other; a heating plate including a protrusion portion protruding toward a direction of the display panel and guided toward the direction of the display panel so that the protrusion portion contacts an upper surface of the organic light emitting structure overlapping the heating wire; a first power supply portion supplying power to the heating plate so that the protrusion portion of the heating plate generates Joule heat; and a second power supply portion supplying power to the heating wire so that the heating wire generates Joule heat.

[0016] In an embodiment, the first power supply portion and the second power supply portion can supply power to the heating plate and the heating wire, respectively, after the protrusion portion contacts the upper surface of the organic light emitting structure.

[0017] In an embodiment, the organic light emitting structure can be disconnected between the two anode electrodes adjacent to each other by Joule heat generated in the protrusion portion and Joule heat generated in the heating wire.

[0018] In an embodiment, the protrusion portion can overlap the heating wire.

[0019] In an embodiment, the heating plate can further include an alignment mark for aligning the display panel and the heating plate so that the protrusion portion and the heating wire overlap.

[0020] In an embodiment, the display panel can further include a pixel definition film disposed on the pixel circuit layer and including a pixel opening exposing a portion of the anode electrode. The organic light emitting structure and the heating wire can be disposed on the pixel definition film.

[0021] In one embodiment, the pixel defining film can include an inorganic insulating substance.

[0022] In one embodiment, an upper surface of the organic light emitting structure overlapping the heating wiring can be located at a higher level than an upper surface of the organic light emitting structure not overlapping the heating wiring.

[0023] According to another embodiment of the display device manufacturing system of the present application, the display panel includes anode electrodes arranged on a pixel circuit layer and an organic light emitting structure integrally arranged on the pixel circuit layer and the anode electrodes, the heating plate includes a protruding portion protruding toward the display panel and guided toward the display panel so that the protruding portion contacts an upper surface of the organic light emitting structure between two anode electrodes adjacent to each other, and the first power supply supplies power to the heating plate so that the protruding portion of the heating plate generates Joule heat.

[0024] In one embodiment, the first power supply can supply power to the heating plate after the protruding portion contacts the upper surface of the organic light emitting structure.

[0025] In one embodiment, the organic light emitting structure can be disconnected between the two anode electrodes adjacent to each other by Joule heat generated in the protruding portion.

[0026] In one embodiment, the heating plate can further include an alignment mark for aligning the display panel and the heating plate so that the protruding portion is located between the two anode electrodes adjacent to each other.

[0027] Technical Effects

[0028] According to the display device manufacturing system of the present application, the organic light emitting structure can be disconnected between two anode electrodes adjacent to each other by using a heating plate or by using a heating plate and a heating wiring. BRIEF DESCRIPTION OF DRAWINGS

[0029] Figure 1 is a block diagram for explaining a display device according to an embodiment of the present application.

[0030] Figure 2 and Figure 3 is a diagram for explaining one of sub-pixels included in the display device of Figure 1 .

[0031] Figure 4 is a diagram for explaining one of sub-pixels included in the display device of Figure 3A diagram of an embodiment of an organic light-emitting structure in a sub-pixel.

[0032] Figure 5 It is used to illustrate that it includes Figure 3 A diagram of another embodiment of the organic light-emitting structure in the sub-pixel.

[0033] Figure 6 This is a diagram illustrating a display device manufacturing system according to an embodiment of the present invention.

[0034] Figures 7 to 11 It is used to illustrate the use Figure 6 A diagram illustrating a method for manufacturing a display device using a display device manufacturing system.

[0035] Figure 12 This is a diagram illustrating a display device manufacturing system according to another embodiment of the present invention.

[0036] Figures 13 to 17 It is used to illustrate the use Figure 12 A diagram illustrating a method for manufacturing a display device using a display device manufacturing system.

[0037] Figure 18 This is a diagram illustrating a display device manufacturing system according to another embodiment of the present invention.

[0038] Figures 19 to 23 It is used to illustrate the use Figure 18 A diagram illustrating a method for manufacturing a display device using a display device manufacturing system.

[0039] Explanation of reference numerals in the attached figures

[0040] Detailed Implementation

[0041] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that in the following description, only the parts necessary for understanding the operation of the present invention will be described, and other parts will be omitted to avoid obscuring the essence of the present invention. Furthermore, the present invention is not limited to the embodiments described herein and may be embodied in other forms. However, the embodiments described herein are provided to illustrate the technical concept of the present invention in a way that allows those skilled in the art to easily implement it.

[0042] Throughout the specification, when it is referred that a certain part is "connected" with another part, this includes not only the case where it is "directly connected", but also the case where it is "indirectly connected" with the other element in between. The terms used herein are intended to describe particular embodiments, and are not intended to limit the present application. Throughout the specification, when it is referred that a certain part "comprises" a certain constituent element, it means that it can further include other constituent elements unless it is specifically stated to the contrary. "At least one of X, Y, and Z", and "at least one selected from the group consisting of X, Y, and Z" can be interpreted as any one of X, Y, Z, or an arbitrary combination of two or more of X, Y, and Z (for example, XYZ, XYY, YZ, ZZ). Herein, "and / or" includes all combinations of one or more of the corresponding structures.

[0043] Herein, terms such as "first", "second", etc. can be used to describe various constituent elements, but the constituent elements are not limited to the terms. The terms are used to distinguish one constituent element from another. Thus, a first constituent element can refer to a second constituent element without departing from the scope disclosed herein.

[0044] Spatially relative terms such as "lower", "upper" and the like can be used for the purpose of explanation, whereby an element or feature described in the relative terms is described with respect to another element or feature in the figure. The spatially relative terms are intended to encompass different orientations of the device in use, or operation, in addition to the orientations depicted in the figures. For example, if the device depicted in the figures is turned over, elements described as "below" other elements or features would then be oriented "above" the other elements or features. Thus, the term "below" can encompass both an orientation of above and below. The device can be otherwise oriented (for example, rotated 90 degrees or at other orientations) and the spatially relative terms used herein interpreted accordingly.

[0045] Various embodiments are described with reference to the figures that illustrate ideal embodiments. Accordingly, variations to shapes of the figures that are permitted due to manufacturing tolerances and / or manufacturing techniques can be expected. Thus, embodiments disclosed herein are not to be construed as limited to the particular shapes of the figures, but are to be construed broadly including variations in shapes that occur due to manufacturing, for example. As such, the shapes of the figures shown in the figures can not show the actual shapes of regions of the device, which embodiments are not limited to.

[0046] Figure 1 is a block diagram for illustrating a display device according to an embodiment of the present application.

[0047] Referring to Figure 1The display device 100 can include a display panel 110, a gate driver 120, a data driver 130, a voltage generator 140, and a controller 150.

[0048] The display panel 110 can include sub-pixels SP. The sub-pixels SP can be connected to the gate driver 120 through 1st to mth gate lines GL1 to GLm. The sub-pixels SP can be connected to the data driver 130 through 1st to nth data lines DL1 to DLn.

[0049] Each of the sub-pixels SP can include at least one light emitting element configured to generate light. Accordingly, each of the sub-pixels SP can generate light of a specific color such as red, green, blue, cyan, magenta, yellow, etc. Two or more of the sub-pixels SP can constitute one pixel PXL. For example, as shown in FIG. 1, three sub-pixels SP can constitute one pixel PXL. Figure 1

[0050] The gate driver 120 can be connected to the sub-pixels SP arranged in a row direction through 1st to mth gate lines GL1 to GLm. The gate driver 120 can output scan signals to the 1st to mth gate lines GL1 to GLm in response to a gate control signal GCS. In an embodiment, the gate control signal GCS can include a start signal indicating the start of each frame, a horizontal synchronization signal for outputting scan signals in synchronization with a timing at which data signals are applied, etc.

[0051] In an embodiment, 1st to mth emission control lines EL1 to ELm connected to the sub-pixels SP in the row direction can also be provided. In this case, the gate driver 120 can include an emission driver configured to control the 1st to mth emission control lines EL1 to ELm, and the emission driver can operate according to the control of the controller 150.

[0052] The gate driver 120 can be disposed at one side of the display panel 110. However, embodiments are not limited thereto. For example, the gate driver 120 can be divided into two or more drivers that are physically and / or logically divided, and the drivers can be disposed at one side of the display panel 110 and at the other side opposite to the one side. As described above, according to embodiments, the gate driver 120 can be disposed in various forms at the periphery of the display panel 110.

[0053] ​The data driver 130 can be connected to the sub-pixels SP arranged in the column direction through the 1st to nth data lines DL1 to DLn. The data driver 130 can receive image data DATA and a data control signal DCS from the controller 150. The data driver 130 can operate in response to the data control signal DCS. In an embodiment, the data control signal DCS can include a source start pulse, a source shift clock, a source output enable signal, etc.

[0054] The data driver 130 can apply data signals having gradation voltages corresponding to the image data DATA to the 1st to nth data lines DL1 to DLn using voltages received from the voltage generator 140. When a scan signal is applied to each of the 1st to mth gate lines GL1 to GLm, data signals corresponding to the image data DATA can be applied to the data lines DL1 to DLn. Accordingly, the corresponding sub-pixels SP can emit light corresponding to the data signals. Accordingly, an image can be displayed on the display panel 110.

[0055] In an embodiment, the gate driver 120 and the data driver 130 can include complementary metal-oxide semiconductor (CMOS) circuit elements.

[0056] The voltage generator 140 can operate in response to a voltage control signal VCS from the controller 150. The voltage generator 140 can be configured to generate a plurality of voltages and provide the generated voltages to the constituent elements of the display apparatus 100. For example, the voltage generator 140 can be configured to generate a plurality of voltages by receiving an input voltage from the outside of the display apparatus 100, adjusting the received voltage, and regulating the adjusted voltage.

[0057] The voltage generator 140 can generate a first power voltage VDD and a second power voltage VSS, and can provide the generated first power voltage VDD and second power voltage VSS to the sub-pixels SP. The first power voltage VDD can have a relatively high voltage level, and the second power voltage VSS can have a voltage level lower than that of the first power voltage VDD. In other embodiments, the first power voltage VDD or the second power voltage VSS can be provided from the outside of the display apparatus 100.

[0058] Further, the voltage generator 140 can generate a plurality of voltages. For example, the voltage generator 140 can generate an initialization voltage applied to the sub-pixel SP. For example, when a sensing operation for sensing an electrical characteristic of a transistor and / or a light emitting element of the sub-pixel SP is performed, a predetermined reference voltage can be applied to the 1st to nth data lines DL1 to DLn, and the voltage generator 140 can generate such a reference voltage.

[0059] The controller 150 can control all operations of the display device 100. The controller 150 can receive input image data IMG and a control signal CTRL for controlling display of the input image data IMG from the outside. The controller 150 can provide a gate control signal GCS, a data control signal DCS, and a voltage control signal VCS in response to the control signal CTRL.

[0060] The controller 150 can convert the input image data IMG and output image data DATA in a manner suitable for the display device 100 or the display panel 110. In an embodiment, the controller 150 can arrange the input image data IMG and output image data DATA in a manner suitable for the sub-pixel SP of a line unit.

[0061] Two or more of the data driver 130, the voltage generator 140, and the controller 150 can be mounted on one integrated circuit. As Figure 1 shown, the data driver 130, the voltage generator 140, and the controller 150 can be included in a driver integrated circuit DIC. In this case, the data driver 130, the voltage generator 140, and the controller 150 can be constituent elements distinguished by functions within one driver integrated circuit DIC. In other embodiments, at least one of the data driver 130, the voltage generator 140, and the controller 150 can be provided as a constituent element distinguished from the driver integrated circuit DIC.

[0062] Figure 2 and Figure 3 is a diagram for explaining one of the sub-pixels included in the display device of Figure 1 In Figure 2 and Figure 3 , the sub-pixel SPij arranged in the i-th row (i is an integer equal to or greater than 1 and equal to or less than m) and the j-th column (j is an integer equal to or greater than 1 and equal to or less than n) of the sub-pixels SP of Figure 1

[0063] Referring to Figure 2 , the sub-pixel SPij can include a sub-pixel circuit SPC and a light emitting element LD.

[0064] ​The light emitting element LD can include an anode electrode AE, a cathode electrode CE, and an organic light emitting structure EMS connected between the anode electrode AE and the cathode electrode CE.

[0065] The anode electrode AE can be connected to the first power voltage node VDDN through the sub-pixel circuit SPC. For example, the anode electrode AE can be connected to the first power voltage node VDDN through one or more transistors included in the sub-pixel circuit SPC. Here, the first power voltage node VDDN can be a node through which the first power voltage VDD is transmitted. Figure 1

[0066] The cathode electrode CE can be connected to the second power voltage node VSSN. Here, the second power voltage node VSSN can be a node through which the second power voltage VSS is transmitted. Figure 1

[0067] The organic light emitting structure EMS can generate light based on a difference in voltage provided from the anode electrode AE and the cathode electrode CE. In an embodiment, the organic light emitting structure EMS can include an organic light emitting element. For such an organic light emitting structure EMS, detailed descriptions will be made with reference to Figure 4 and Figure 5 .

[0068] The sub-pixel circuit SPC includes an i-th gate line GLi among 1st to m-th gate lines GL1 to GLm, Figure 1 an i-th emission control line ELi among 1st to m-th emission control lines EL1 to ELm, and Figure 1 a j-th data line DLj among 1st to n-th data lines DL1 to DLn. The sub-pixel circuit SPC can be configured to control the light emitting element LD according to signals received through such signal lines. Figure 1 The sub-pixel circuit SPC can operate in response to a scan signal received through the i-th gate line GLi. The i-th gate line GLi can include one or more sub-gate lines. In an embodiment, as shown in

[0069] , the i-th gate line GLi can include a 1st sub-gate line SGL1 and a 2nd sub-gate line SGL2. The sub-pixel circuit SPC can operate in response to scan signals received through the 1st sub-gate line SGL1 and the 2nd sub-gate line SGL2. As described above, in the case where the i-th gate line GLi includes two or more sub-gate lines, the sub-pixel circuit SPC can operate in response to scan signals received through the respective sub-gate lines. Figure 2

[0070] ​​​The sub-pixel circuit SPC can operate in response to the light emission control signal received through the i-th light emission control line ELi. In an embodiment, the i-th light emission control line ELi can include one or more sub-light emission control lines. In the case where the i-th light emission control line ELi includes two or more sub-light emission control lines, the sub-pixel circuit SPC can operate in response to the light emission control signal received through the corresponding sub-light emission control line.

[0071] The sub-pixel circuit SPC can receive the data signal through the j-th data line DLj. The sub-pixel circuit SPC can generate a voltage corresponding to the data signal in response to at least one of the scan signals received through the first sub-gate line SGL1 and the second sub-gate line SGL2. The sub-pixel circuit SPC adjusts the current flowing from the first power voltage node VDDN to the second power voltage node VSSN through the light emitting element LD according to the stored voltage in response to the light emission control signal received through the i-th light emission control line ELi. Accordingly, the light emitting element LD can generate light having luminance corresponding to the data signal.

[0072] Referring to Figure 3 , the sub-pixel SPij can include a pixel circuit layer PCL, an anode electrode AE, a pixel definition layer PDL, an organic emission structure EMS, and a cathode electrode CE.

[0073] The pixel circuit layer PCL can include various circuit elements (e.g., transistors, capacitors, wirings, etc.) for implementing the sub-pixel circuit SPC. In an embodiment, the pixel circuit layer PCL can include insulating layers, conductive patterns, and semiconductor patterns for implementing the circuit elements. The conductive patterns and the semiconductor patterns can be electrically separated by the insulating layers. As necessary, the conductive patterns and / or the semiconductor patterns can be electrically connected to each other through a through-hole formed in the insulating layer.

[0074] The anode electrode AE can be disposed on the pixel circuit layer PCL. The anode electrode AE can be electrically connected to the sub-pixel circuit SPC of the pixel circuit layer PCL. In an embodiment, the anode electrode AE can include a conductive substance suitable for reflecting light. However, the material of the anode electrode AE is not limited thereto.

[0075] The pixel definition layer PDL can be disposed on the anode electrode AE and the pixel circuit layer PCL. The pixel definition layer PDL can include a pixel opening PO exposing a portion of the anode electrode AE. In an embodiment, the pixel definition layer PDL can include an inorganic insulating substance. For example, the pixel definition layer PDL can include silicon oxide, silicon nitride, silicon oxynitride, etc. In an embodiment, the pixel definition layer PDL can include a plurality of stacked inorganic insulating layers.

[0076] The organic light emitting structure EMS can be disposed on the pixel defining film PDL and the anode electrode AE exposed through the pixel opening PO. The organic light emitting structure EMS can include an organic light emitting layer configured to generate light, an electron transport layer configured to transport electrons, and a hole transport layer configured to transport holes, etc.

[0077] The cathode electrode CE can be disposed on the organic light emitting structure EMS. The cathode electrode CE can be integrally formed on the organic light emitting structure EMS. As such, the cathode electrode CE can be provided as a common electrode.

[0078] The cathode electrode CE can be a thin metal layer having a thickness capable of transmitting light emitted from the organic light emitting structure EMS to a certain extent. The cathode electrode CE can be formed using a metal layer having a relatively thin thickness, or can be formed using a transparent or semi-transparent conductive substance. For example, the cathode electrode CE can include at least one of a variety of transparent conductive substances including indium tin oxide, indium zinc oxide, indium tin zinc oxide, aluminum zinc oxide, gallium zinc oxide, zinc tin oxide, gallium tin oxide, etc. As another example, the cathode electrode CE can include at least one of silver (Ag), magnesium (Mg), and a mixture thereof. However, the material of the cathode electrode CE is not limited thereto.

[0079] It can be understood that the portion of the anode electrode AE exposed through the pixel opening OP, the portion of the organic light emitting structure EMS overlapping the portion of the anode electrode AE, and the portion of the cathode electrode CE overlapping the portion of the organic light emitting structure EMS constitute one light emitting element LD. In this case, holes injected from the anode electrode AE and electrons injected from the cathode electrode CE are transported into the organic light emitting layer of the organic light emitting structure EMS to form an exciton, and when the exciton transitions from an excited state to a ground state, light can be generated. The brightness of the light can be determined according to the amount of current flowing through the organic light emitting layer. The wavelength range of the generated light can be determined according to the layers constituting the organic light emitting layer.

[0080] In the light emitting element LD, the region in which light is substantially generated (or emitted) can be referred to as a light emitting region EA. For example, the light emitting region EA can be a region substantially identical (or similar) to the region overlapping the portion of the anode electrode AE exposed through the pixel opening OP.

[0081] In an embodiment, the organic light emitting structure EMS can have a tandem structure in which organic light emitting layers are arranged in series. Hereinafter, various embodiments of the organic light emitting structure EMS having a tandem structure are described with reference to Figure 4 and Figure 5 However, the organic light emitting structure EMS is not limited to Figure 4 and Figure 5In an embodiment of the present application, the organic emission structure EMS can have various series structures known in the art.

[0082] Figure 4 FIG. 1 is a diagram for explaining an embodiment of an organic emission structure included in a sub-pixel. Figure 3 FIG. 2 is a diagram for explaining an embodiment of an organic emission structure included in a sub-pixel.

[0083] Referring to Figure 4 In an embodiment of the present application, the organic emission structure EMS can have a series structure in which a first emission unit EU1 and a second emission unit EU2 are stacked.

[0084] Each of the first emission unit EU1 and the second emission unit EU2 can include at least one organic emission layer that generates light according to an applied current. The first emission unit EU1 can include a first organic emission layer EML1, a first electron transport unit ETU1, and a first hole transport unit HTU1. The first organic emission layer EML1 can be interposed between the first electron transport unit ETU1 and the first hole transport unit HTU1. The second emission unit EU2 can include a second organic emission layer EML2, a second electron transport unit ETU2, and a second hole transport unit HTU2. The second organic emission layer EML2 can be interposed between the second electron transport unit ETU2 and the second hole transport unit HTU2.

[0085] Each of the first hole transport unit HTU1 and the second hole transport unit HTU2 can include at least one of a hole injection layer and a hole transport layer, and, as necessary, can further include a hole buffer layer, an electron blocking layer, etc. The first hole transport unit HTU1 and the second hole transport unit HTU2 can have the same configuration as each other, or can have different configurations.

[0086] Each of the first electron transport unit ETU1 and the second electron transport unit ETU2 can include at least one of an electron injection layer and an electron transport layer, and, as necessary, can further include an electron buffer layer, a hole blocking layer, etc. The first electron transport unit ETU1 and the second electron transport unit ETU2 can have the same configuration as each other, or can have different configurations.

[0087] A charge generation layer CGL can be interposed between the first emission unit EU1 and the second emission unit EU2. For example, the charge generation layer CGL can have a stacked structure of a P-type dopant layer and an N-type dopant layer. For example, the P-type dopant layer can include a P-type dopant such as HAT-CN, TCNQ, NDP-9, etc., and the N-type dopant layer can include an alkali metal, an alkaline earth metal, a lanthanide metal, or a combination thereof. However, the present application is not limited thereto.

[0088] In an embodiment, the first organic light emitting layer EML1 and the second organic light emitting layer EML2 can generate light of different colors from each other. The light emitted from the first organic light emitting layer EML1 and the second organic light emitting layer EML2, respectively, can be mixed to be recognized as white light. For example, the first organic light emitting layer EML1 can generate blue light, and the second organic light emitting layer EML2 can generate yellow light. For example, such a second organic light emitting layer EML2 can have a structure in which a first sub organic light emitting layer configured to be able to generate red light and a second sub light emitting layer configured to be able to generate green light are stacked. The red light and the green light can be mixed with each other to be provided as yellow light. In this case, an intermediate layer performing a function of transporting holes and / or a function of blocking electron transport can also be disposed between the first sub light emitting layer and the second sub light emitting layer. In another embodiment, the first organic light emitting layer EML1 and the second organic light emitting layer EML2 can also generate light of the same color.

[0089] Figure 5 is a view for explaining another embodiment of an organic light emitting structure included in a sub-pixel of Figure 3 .

[0090] Referring to Figure 5 , the organic light emitting structure EMS' can have a series structure in which a first light emitting part EU1', a second light emitting part EU2', and a third light emitting part EU3' are stacked.

[0091] Each of the first light emitting part EU1' to the third light emitting part EU3' can include an organic light emitting layer generating light according to an applied current. The first light emitting part EU1' can include a first organic light emitting layer EML1', a first electron transport part ETU1', and a first hole transport part HTU1'. The first organic light emitting layer EML1' can be interposed between the first electron transport part ETU1' and the first hole transport part HTU1'. The second light emitting part EU2' can include a second organic light emitting layer EML2', a second electron transport part ETU2', and a second hole transport part HTU2'. The second organic light emitting layer EML2' can be disposed between the second electron transport part ETU2' and the second hole transport part HTU2'. The third light emitting part EU3' can include a third organic light emitting layer EML3', a third electron transport part ETU3', and a third hole transport part HTU3'. The third organic light emitting layer EML3' can be disposed between the third electron transport part ETU3' and the third hole transport part HTU3'.

[0092] Each of the first to third hole transport units HTU1' to HTU3' can include at least one of a hole injection layer and a hole transport layer, and, as necessary, a hole buffer layer, an electron blocking layer, etc. The first to third hole transport units HTU1' to HTU3' can have the same configuration as each other or different configurations.

[0093] Each of the first to third electron transport units ETU1' to ETU3' can include at least one of an electron injection layer and an electron transport layer, and, as necessary, an electron buffer layer, a hole blocking layer, etc. The first to third electron transport units ETU1' to ETU3' can have the same configuration as each other or different configurations.

[0094] The first charge generation layer CGL1' can be interposed between the first and second light emitting units EU1' and EU2'. The second charge generation layer CGL2' can be interposed between the second and third light emitting units EU2' and EU3'.

[0095] In an embodiment, the first to third organic light emitting layers EML1' to EML3' can generate light of different colors from each other. Light emitted from the first to third organic light emitting layers EML1' to EML3', respectively, can be mixed to be recognized as white light. For example, the first organic light emitting layer EML1' can generate blue light, the second organic light emitting layer EML2' can generate green light, and the third organic light emitting layer EML3' can generate red light. In another embodiment, two or more of the first to third organic light emitting layers EML1' to EML3' can also generate light of the same color.

[0096] Figure 6 FIG. 1 is a diagram for explaining a display device manufacturing system according to an embodiment of the present application.

[0097] Referring to Figure 6 , the display device manufacturing system SYSa can include a display panel 110, a heating plate PLT, a first power supply unit PW1, and a second power supply unit PW2.

[0098] With regard to the display panel 110, a description can be made substantially identically to the contents described with reference to Figures 1 to 5 . For example, the display panel 110 can include a sub-pixel SP. In Figure 6 , for the sake of clarity and conciseness of description, only a part of the plurality of constituent elements constituting the display panel 110 is selectively shown. For example, an anode electrode AE included in the sub-pixel SP is shown in Figure 6

[0099] ​In an embodiment, the anode electrodes AE can be arranged in a matrix form along a first direction DR1 and a second direction DR2 intersecting the first direction DR1. However, the present application is not limited thereto. For example, the anode electrodes AE can also be arranged in a zigzag form.

[0100] In an embodiment, the display panel 110 can include a heating wire HL arranged between two anode electrodes AE adjacent to each other. For example, the heating wire HL can include a transverse heating wire extending between the anode electrodes AE along the first direction DR1 and a longitudinal heating wire extending between the anode electrodes AE along the second direction DR2. According to an embodiment, each of the transverse heating wire and the longitudinal heating wire can be provided as a plurality. In this case, the transverse heating wire and the longitudinal heating wire can be provided to intersect each other, the heating wire HL can have a mesh form, and one of the anode electrodes AE can be surrounded by such a heating wire HL.

[0101] In an embodiment, the display panel 110 can be implemented within a base substrate BSUB. For example, such a base substrate BSUB can also be referred to as a mother substrate. The base substrate BSUB can function to provide a base for forming the display panel 110, and according to an embodiment, the base substrate BSUB can also be provided as one body with the display panel 110. For example, it can be understood that the base substrate BSUB can be provided to have an area greater than that of the display panel 110, and the display panel 110 is provided on a part of the area of the base substrate BSUB. In this case, a peripheral area of the base substrate BSUB other than the area on which the display panel 110 is provided can be arranged with various constituent elements provided to form various constituent elements constituting the display panel 110.

[0102] For example, the first pad PD1 and the second pad PD2 can be arranged in the peripheral area. The heating wire HL can extend from the display panel 110 to the peripheral area. In this case, one end of the heating wire HL can be electrically connected to the first pad PD1, and the other end of the heating wire HL can be electrically connected to the second pad PD2.

[0103] In an embodiment, after forming various constituent elements constituting the display panel 110 is completed, the display panel 110 can be separated from the constituent elements (for example, the first pad PD1, the second pad PD2, and a part of the base substrate BSUB overlapping the peripheral area) overlapping the peripheral area.

[0104] In an embodiment, in the peripheral area, the base substrate BSUB can include an alignment mark ALM_BSUB. The alignment mark ALM_BSUB can have an easily recognizable shape, and can include an easily recognizable substance.

[0105] A heating plate PLT can be disposed on the display panel 110. The heating plate PLT can relatively move in a direction toward the display panel 110 and a direction opposite thereto. For example, the heating plate PLT can move in a third direction DR3 perpendicular to the first direction DR1 and the second direction DR2 and a direction opposite to the third direction DR3.

[0106] In the present embodiment, the heating plate PLT can have a flat plate shape. For example, each of the upper surface and the lower surface of the heating plate PLT can be equipped as a flat surface.

[0107] In an embodiment, the heating plate PLT can include an alignment mark ALM_PLT. The alignment mark ALM_PLT can have an easily recognizable shape and can include an easily recognizable substance. By recognizing each of the alignment mark ALM_PLT of the heating plate PLT and the alignment mark ALM_BSUB of the base substrate BSUB, the relative position of the heating plate PTL with respect to the base substrate BSUB can be accurately adjusted.

[0108] The first power supply part PW1 can supply a power source to the heating plate PLT. For example, the first power supply part PW1 can supply a voltage (or a current) to the heating plate PLT. The heating plate PLT can include an electrically conductive substance (for example, Ti, Mo, W, TiN, TiW, or the like). In this case, Joule heat can be generated in the heating plate PLT.

[0109] The second power supply part PW2 can supply a power source to the heating wire HL. For example, the second power supply part PW2 can be electrically connected to the first contact pin PIN1 and the second contact pin PIN2. The first contact pin PIN1 and the second contact pin PIN2 can relatively move to be in contact with the first pad PD1 and the second pad PD2, respectively. The second power supply part PW2 can supply a power source (for example, a voltage or a current) to the heating wire HL through the first contact pin PIN1 in contact with the first pad PD1 and the second contact pin PIN2 in contact with the second pad PD2. In this case, Joule heat can be generated in the heating wire HL.

[0110] Hereinafter, a display device manufacturing system SYSa will be described in more detail with reference to Figures 7 to 11 .

[0111] Figures 7 to 11 is a view for explaining a method of manufacturing a display device using a display device manufacturing system. Figure 6

[0112] Referring to Figure 7 ​The display device manufacturing method using the display device manufacturing system SYSa can include a first step (SS1), a second step (SS2), a third step (SS3), and a fourth step (SS4).

[0113] Referring to Figure 8 The heating plate PLT can be aligned on the display panel 110, the first contact pin PIN1 can be aligned on the first pad PD1, and the second contact pin PIN2 can be aligned on the second pad PD2 (SS1). In this case, the alignment of the heating plate PLT can be performed using the alignment mark ALM_PLT of the heating plate PLT and the alignment mark ALM_BSUB of the base substrate BSUB.

[0114] In an embodiment, the display panel 110 can include a base substrate BSUB, a pixel circuit layer PCL, first and second anode electrodes AE1 and AE2, a pixel definition film PDL, a heating wire HL, and an organic emission structure EMS.

[0115] In an embodiment, the base substrate BSUB can include a silicon wafer substrate formed using a semiconductor process. In this case, the base substrate BSUB can include a semiconductor substance (e.g., silicon, germanium, and / or silicon-germanium) suitable for forming circuit elements. The base substrate BSUB can be provided from a bulk wafer, an epitaxial layer, a Silicon On Insulator (SOI) layer, or a Semiconductor On Insulator (SeOI) layer, etc. The circuit elements implemented as the base substrate BSUB can constitute a display panel together with the circuit elements implemented as the pixel circuit layer PCL, as described with reference to Figure 3 The illustrated sub-pixel circuit SPC.

[0116] The first and second anode electrodes AE1 and AE2 can be disposed on the pixel circuit layer PCL. The first and second anode electrodes AE1 and AE2 can correspond to two anode electrodes adjacent to each other among the anode electrodes AE illustrated in Figure 6 It can be understood that each of the first and second anode electrodes AE1 and AE2 constitutes one sub-pixel (e.g., refer to the illustrated sub-pixel SPij). Figure 3

[0117] ​The pixel definition film PDL can be disposed on the pixel circuit layer PCL, the first anode electrode AE1, and the second anode electrode AE2. The pixel definition film PDL can include a pixel opening that exposes a portion of the first anode electrode AE1 and a portion of the second anode electrode AE2. The pixel definition film PDL can include an inorganic insulating substance. According to this, the pixel definition film PDL can not be substantially removed by the Joule heat generated in the heating plate PLT and the heating wire HL.

[0118] The heating wire HL can be disposed between the first anode electrode AE1 and the second anode electrode AE2 adjacent to each other. The heating wire HL can be disposed on the pixel definition film PDL.

[0119] The organic light emitting structure EMS can be disposed on the pixel definition film PDL, the portion of the first anode electrode AE1 and the portion of the second anode electrode AE2 exposed by the pixel opening, and the heating wire HL. In this case, the heating wire HL can be in contact with a lower surface of the organic light emitting structure EMS.

[0120] In an embodiment, when the organic light emitting structure EMS is formed, the organic light emitting structure EMS can be provided in its entirety. In this case, the organic light emitting structure EMS can be formed in a shape corresponding to a profile of constituent elements disposed under the organic light emitting structure EMS in a cross section. For example, an upper surface of the organic light emitting structure EMS overlapping the heating wire HL can be located at a higher level than an upper surface of the organic light emitting structure EMS not overlapping the heating wire HL.

[0121] The first pad PD1 can be connected to one end of the heating wire HL through another region not shown in FIG. 10. Figure 8 The second pad PD2 can be connected to the other end of the heating wire HL through another region not shown in FIG. 10. Figure 8 The second pad PD2 can be connected to the other end of the heating wire HL through another region not shown in FIG. 10.

[0122] Referring to FIG. 11, Figure 9 The heating plate PLT can be brought into contact with the upper surface of the organic light emitting structure EMS, the first contact pin PIN1 can be brought into contact with the first pad PD1, and the second contact pin PIN2 can be brought into contact with the second pad PD2 (SS2). In this case, the heating plate PLT can be in contact with the upper surface of the organic light emitting structure EMS overlapping the heating wire HL, and can not be in contact with the upper surface of the organic light emitting structure EMS not overlapping the heating wire HL.

[0123] Referring to FIG. 11, Figure 10 The first power supply PW1 can supply power to the heating plate PLT, and the second power supply PW2 can supply power to the heating wire HL (SS3).

[0124] In this step, Joule heat can be generated in the heating plate PLT and the heating wiring HL. Accordingly, the organic substance in contact with (or adjacent to) the heating plate PLT and the heating wiring HL can be sublimated and removed.

[0125] For example, as shown in FIG. 6, the organic light emitting structure EMS can be removed between the first anode electrode AE1 and the second anode electrode AE2. Accordingly, the organic light emitting structure EMS can be disconnected between the first anode electrode AE1 and the second anode electrode AE2. In this case, it is possible to prevent the generation of a lateral leakage current through the organic light emitting structure EMS between the first anode electrode AE1 and the second anode electrode AE2 adjacent to each other. Figure 10

[0126] In an embodiment, when Joule heat is generated in the heating plate PLT, the temperature of the heating plate PLT can be set to be lower than the sublimation temperature of the organic light emitting structure EMS. Accordingly, even in the case where the heating plate PLT is arranged adjacent to the organic light emitting structure EMS, the problem that the organic light emitting structure EMS is removed in a large area due to the Joule heat generated in the heating plate PLT does not occur.

[0127] Referring to FIG. 7, the cathode electrode CE can be formed on the organic light emitting structure EMS (SS4). Accordingly, it is possible to provide a first sub-pixel and a second sub-pixel each including the first anode electrode AE1 and the second anode electrode AE2. In this case, as described above, since the organic light emitting structure EMS is disconnected between the first anode electrode AE1 and the second anode electrode AE2, a lateral leakage current can not substantially occur between the first sub-pixel and the second sub-pixel adjacent to each other. Figure 11 As described above, according to the display device manufacturing system SYSa of the present application, not only the heating wiring HL within the display panel 110 but also the heating plate PLT is used to generate Joule heat, so that the organic light emitting structure EMS of the area where the lateral leakage current problem occurs can be disconnected.

[0128] In this case, by generating Joule heat using the heating wiring HL and the heating plate PLT, it is possible to relatively reduce the consumption voltage (or consumption current) applied to the heating wiring HL for the disconnection of the organic light emitting structure EMS. Accordingly, it is possible to solve the problem that can occur when a high voltage is applied to the heating wiring HL (for example, damage to the display panel 110 including the heating wiring HL, etc.).

[0129]

[0130] Figure 12 ​​is a view for explaining a display device manufacturing system according to another embodiment of the present application.

[0131] Hereinafter, while explaining the display device manufacturing system SYSb shown in FIG. 10, the points different from the contents explained with reference to the display device manufacturing system SYSa will be mainly explained, and the explained contents will be replaced by the preceding contents. Figure 12 Figures 6 to 11 The points different from the display device manufacturing system SYSa explained above will be mainly explained, and the explained contents will be replaced by the preceding contents.

[0132] Referring to FIG. 10, Figure 12 The heating plate PLT' of the display device manufacturing system SYSb can include a protrusion portion protruding toward a direction opposite to the third direction DR3. Such a protrusion portion can have a shape corresponding to the heating wire HL.

[0133] Hereinafter, referring to FIG. 10, Figures 13 to 17 The heating plate PLT' provided with the protrusion portion and the display device manufacturing system SYSb including the same will be explained in more detail.

[0134] Figures 13 to 17 is a view for explaining a method of manufacturing a display device using the display device manufacturing system. Figure 12

[0135] Hereinafter, while explaining the display device manufacturing method using the display device manufacturing system SYSb, the points different from the contents explained with reference to the display device manufacturing method using the display device manufacturing system SYSa will be mainly explained, and the explained contents will be replaced by the preceding contents. Figures 7 to 11 Referring to FIG. 10,

[0136] The display device manufacturing method using the display device manufacturing system SYSb can include a first step (SS1'), a second step (SS2'), a third step (SS3'), and a fourth step (SS4'). Figure 13 Referring to FIG. 10,

[0137] The heating plate PLT' can be aligned on the display panel 110, the first contact pin PIN1 can be aligned on the first pad PD1, and the second contact pin PIN2 can be aligned on the second pad PD2 (SS1'). Figure 14 The heating plate PLT' can include a protrusion portion PRT protruding toward a direction opposite to the third direction DR3. The heating plate PLT' can be aligned in a manner that the protrusion portion PRT and the heating wire HL overlap each other. In this case, the alignment of the heating plate PLT' can be performed by using the alignment mark ALM_PLT' of the heating plate PLT' and the alignment mark ALM_BSUB of the base substrate BSUB.

[0138] Referring to FIG. 10,

[0139] Figure 15 ​​​This allows the protrusion PRT to contact the upper surface of the organic light-emitting structure EMS, making the first contact pin PIN1 contact the first pad PD1, and the second contact pin PIN2 contact the second pad PD2 (SS2'). In this case, the protrusion PRT can contact the upper surface of the organic light-emitting structure EMS that overlaps with the heating wiring HL.

[0140] Reference Figure 16 The first power supply unit PW1 can supply power to the heating plate PLT' and the protrusion PRT, and the second power supply unit PW2 can supply power to the heating wire HL (SS3').

[0141] In this step, Joule heating can be generated in the heating plate PLT' and the protrusion PRT. Furthermore, Joule heating can be generated in the heating wire HL. Accordingly, organic matter in contact with (or adjacent to) the protrusion PRT and the heating wire HL can be sublimated and removed. For example, as... Figure 16 As shown, the organic light-emitting structure EMS can be removed (or disconnected) between the first anode electrode AE1 and the second anode electrode AE2.

[0142] Furthermore, since the heating plate PRT' is equipped with a protrusion PRT, sufficient separation distance can be ensured between the heating plate PRT' and the organic light-emitting structure EMS. Accordingly, compared to the reference... Figure 10 In step SS3, the temperature of the heating plate PLT can be set to a relatively higher level. For example, when Joule heating is generated in the heating plate PLT, the temperature of the heating plate PLT can be set above the sublimation temperature of the organic light-emitting structure EMS.

[0143] Reference Figure 17 The cathode electrode (CE) can be formed entirely on the organic light-emitting structure (EMS) (SS4'). Accordingly, a first sub-pixel and a second sub-pixel, each comprising a first anode electrode (AE1) and a second anode electrode (AE2), can be provided. In this case, as described above, since the organic light-emitting structure (EMS) is disconnected between the first anode electrode (AE1) and the second anode electrode (AE2), lateral leakage current can be substantially avoided between the adjacent first and second sub-pixels.

[0144] As described above, the display device manufacturing system SYSb according to this invention utilizes not only the heating wiring HL within the display panel 110, but also the heating plate PLT' to generate Joule heat, thereby disconnecting the organic light-emitting structure EMS in the area where lateral leakage current problems occur.

[0145] In this case, by generating Joule heat using the heating wire HL and the heating plate PLT', it is possible to relatively reduce the consumption voltage (or consumption current) applied to the heating wire HL in order to break the organic light emitting structure EMS. Accordingly, it is possible to solve a problem that can occur when a high voltage is applied to the heating wire HL (for example, damage to the display panel 110 including the heating wire HL, etc.).

[0146] Figure 18 FIG. 1 is a diagram for explaining a display device manufacturing system according to an embodiment of the present disclosure.

[0147] Hereinafter, in explaining Figure 18 the display device manufacturing system SYSb illustrated in FIG. 1, a difference from the display device manufacturing system SYSb explained with reference to Figures 12 to 17 will be mainly explained, and the omitted part will be replaced by the previous content.

[0148] With reference to Figure 18 , the heating plate PLT' of the display device manufacturing system SYSc can be explained substantially the same as the heating plate PLT' explained with reference to Figures 12 to 17 . For example, the heating plate PLT' can include a protrusion PRT protruding toward a direction opposite to the third direction DR3.

[0149] With reference to Figures 12 to 17 , the display panel 110 of the display device manufacturing system SYSc can not include the heating wire HL.

[0150] With reference to Figures 12 to 17 , the base substrate BSUB' of the display device manufacturing system SYSc can not include the first pad PD1 and the second pad PD2.

[0151] With reference to Figures 12 to 17 , the display device manufacturing system SYSc can not include the second power supply part PW2.

[0152] Hereinafter, with reference to Figures 19 to 23 , the display device manufacturing system SYSc will be explained in more detail.

[0153] Figures 19 to 23 FIG. 2 is a diagram for explaining a method of manufacturing a display device using the display device manufacturing system explained with reference to Figure 18 .

[0154] With reference to Figure 19The display device manufacturing method using the display device manufacturing system SYSc can include a first step (SS1''), a second step (SS2''), a third step (SS3''), and a fourth step (SS4'').

[0155] Referring to Figure 20 The heating plate PLT' can be aligned on the display panel 110'' (SS1'').

[0156] The heating plate PLT' can include a protrusion PRT protruding toward a direction opposite to the third direction DR3. The heating plate PLT' can be aligned in such a manner that the protrusion PRT is located between the first anode electrode AE1 and the second anode electrode AE2 adjacent to each other. In this case, the alignment of the heating plate PLT' can be performed by using the alignment mark ALM_PLT' of the heating plate PLT' and the alignment mark ALM_BSUB' of the base substrate BSUB''.

[0157] Since the heating wire HL is omitted in the display panel 110'', the upper surface of the portion of the organic light emitting structure EMS overlapping with the upper surface of the pixel definition layer PDL can be substantially flat.

[0158] Referring to Figure 21 The protrusion PRT can be brought into contact with the upper surface of the organic light emitting structure EMS (SS2''). In this case, the protrusion PRT can be in contact with the upper surface of the organic light emitting structure EMS between the first anode electrode AE1 and the second anode electrode AE2.

[0159] Referring to Figure 22 The first power supply PW1 can supply power to the heating plate PLT' and the protrusion PRT (SS3'').

[0160] In this step, Joule heat can be generated in the heating plate PLT' and the protrusion PRT. Accordingly, the organic substance in contact with (or, adjacent to) the protrusion PRT can be sublimated and removed. For example, as shown in FIG. 11B, the organic light emitting structure EMS can be removed (or, broken) between the first anode electrode AE1 and the second anode electrode AE2. Figure 22

[0161] Referring to Figure 23 ​The cathode electrode CE can be formed entirely on the organic light emitting structure EMS (SS4''). Accordingly, the first and second sub-pixels each including the first and second anode electrodes AE1 and AE2 can be provided. In this case, as described above, since the organic light emitting structure EMS is disconnected between the first and second anode electrodes AE1 and AE2, a lateral leakage current can not substantially occur between the first and second sub-pixels adjacent to each other.

[0162] As described above, according to the display device manufacturing system SYSc of the present application, by omitting the heating wiring HL within the display panel 110', and generating Joule heat using the heating plate PLT', the organic light emitting structure EMS of the area in which a lateral leakage current problem occurs can be disconnected. Accordingly, a problem that can occur when a high voltage is applied to the heating wiring HL (e.g., damage to the display panel 110', etc.) can be solved.

[0163] The above has been described with reference to the embodiments, but it will be understood by those skilled in the art that various modifications and changes can be made to the present application without departing from the spirit and scope of the present application as recited in the claims.

Claims

1. A display device manufacturing system, characterized by comprising: including: a display panel including anode electrodes arranged on a pixel circuit layer, an organic light emitting structure arranged integrally on the pixel circuit layer and the anode electrodes, and a heating wiring in contact with a lower surface of the organic light emitting structure between two anode electrodes adjacent to each other; a heating plate directed toward a direction of the display panel to contact an upper surface of the organic light emitting structure overlapping the heating wiring; a first power supply portion supplying a power to the heating plate to cause the heating plate to generate Joule heat; and a second power supply portion supplying a power to the heating wiring to cause the heating wiring to generate Joule heat.

2. The display device manufacturing system according to claim 1, wherein after the heating plate is in contact with the upper surface of the organic light emitting structure, the first power supply portion and the second power supply portion supply powers to the heating plate and the heating wiring, respectively, the organic light emitting structure is broken between the two anode electrodes adjacent to each other by Joule heat generated in the heating plate and Joule heat generated in the heating wiring.

3. The display device manufacturing system according to claim 1, wherein the heating plate has a flat plate shape, when Joule heat is generated in the heating plate, a temperature of the heating plate is lower than a sublimation temperature of the organic light emitting structure.

4. The display device manufacturing system according to claim 1, wherein the display panel further includes a pixel defining film arranged on the pixel circuit layer and including a pixel opening exposing a portion of the anode electrodes, the organic light emitting structure and the heating wiring are arranged on the pixel defining film, an upper surface of the organic light emitting structure overlapping the heating wiring is located at a higher level than an upper surface of the organic light emitting structure not overlapping the heating wiring.

5. A display device manufacturing system, characterized by comprising: including: a display panel including anode electrodes arranged on a pixel circuit layer, an organic light emitting structure arranged integrally on the pixel circuit layer and the anode electrodes, and a heating wiring in contact with a lower surface of the organic light emitting structure between two anode electrodes adjacent to each other; a heating plate including a protruding portion protruding toward a direction of the display panel and directed toward the direction of the display panel to contact the protruding portion to an upper surface of the organic light emitting structure overlapping the heating wiring; a first power supply portion supplying a power to the heating plate to cause the protruding portion of the heating plate to generate Joule heat; and a second power supply portion supplying a power to the heating wiring to cause the heating wiring to generate Joule heat.

6. The display device manufacturing system according to claim 5, wherein after the protruding portion is in contact with the upper surface of the organic light emitting structure, the first power supply portion and the second power supply portion supply powers to the heating plate and the heating wiring, respectively, the organic light emitting structure is broken between the two anode electrodes adjacent to each other by Joule heat generated in the protruding portion and Joule heat generated in the heating wiring.

7. The display device manufacturing system according to claim 5, wherein the protrusion overlaps the heating wiring.

8. The display device manufacturing system according to claim 5, wherein the display panel further includes a pixel definition film arranged on the pixel circuit layer, including a pixel opening exposing a portion of the anode electrode, the organic light emitting structure and the heating wiring are arranged on the pixel definition film, an upper surface of the organic light emitting structure overlapping the heating wiring is located at a higher level than an upper surface of the organic light emitting structure not overlapping the heating wiring.

9. A display device manufacturing system, characterized by comprising: including: a display panel including an anode electrode arranged on a pixel circuit layer and an organic light emitting structure arranged integrally on the pixel circuit layer and the anode electrode; a heating plate including a protrusion protruding toward a direction of the display panel and guided toward the direction of the display panel so that the protrusion contacts an upper surface of the organic light emitting structure between two anode electrodes adjacent to each other; and a first power supply portion supplying a power to the heating plate so that the protrusion of the heating plate generates Joule heat.

10. The display device manufacturing system according to claim 9, wherein after the protrusion contacts the upper surface of the organic light emitting structure, the first power supply portion supplies a power to the heating plate, the organic light emitting structure is disconnected between the two anode electrodes adjacent to each other by the Joule heat generated in the protrusion.

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