Pin welding die for ceramic dual-in-line packaging
By designing a ceramic dual in-line package welding mold with lead frame slots and rotating ellipsoid components, the problems of graphite contamination and lead misalignment were solved, achieving automatic alignment and high-precision welding, thus improving welding efficiency and yield.
Patent Information
- Application Number
- CN202423291739.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-31
- Publication Date
- 2025-12-19
- Estimated Expiration
- 2034-12-31
AI Technical Summary
In existing ceramic dual in-line packages, graphite dust contamination and pin misalignment are prone to occur during the soldering process, affecting soldering accuracy and electroplating quality.
A welding mold was designed, comprising a base with a hollow cavity and a pin frame groove. Boron nitride material was used, and a rotating ellipsoid component was used to achieve automatic pin alignment and close contact with the ceramic shell pads. Boron nitride material was used instead of graphite to improve welding accuracy.
This achieves the elimination of manual alignment, reduces graphite contamination, improves welding precision and yield, and increases welding efficiency.
Smart Images
Figure CN223684728U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a kind of welding mould, specifically to a pin welding mould for chip packaging. BACKGROUND
[0002] Ceramic dual-in-line package (CDIP) is a kind of integrated circuit sealing packaging form, the corresponding integrated circuit appearance is rectangle, it is composed of ceramic shell, cover and enclose a dual-in-line pin frame, that is, there are two rows of parallel metal pins on the two sides of the rectangular integrated circuit. The components of ceramic dual-in-line package can be welded in the through-hole of printed circuit board electroplating, or inserted into DIP socket. Ceramic dual-in-line package is widely used in the packaging of various integrated circuits, optocoupler devices, MEMS and other devices with small number of output terminals and low assembly density requirements.
[0003] In conventional ceramic dual-in-line package, the pins are inserted into a graphite welding mold after being assembled with the ceramic shell by solder strips, and then the graphite pressing block is used to press the two sides of the pins, and the whole is placed in the welding furnace for welding. When using this welding process, graphite ash is easily attached to the pin frame during welding. In subsequent electroplating, the positions contaminated by graphite ash are not easy to be plated with gold, thereby affecting the electroplating quality. In addition, the alignment of the pin brazing is generally performed manually, so the relative position of the pin and the ceramic shell is easily deviated, thereby affecting the welding precision and yield. SUMMARY
[0004] The present application aims to provide a pin welding mold for ceramic dual-in-line package to improve the welding precision and solve the problem of graphite contamination.
[0005] Technical solution: A pin welding mold for ceramic dual-in-line package, comprising a base with a hollow cavity, an opening communicating with the cavity is provided in the center of the top of the base, and a pin frame slot is symmetrically arranged on both sides of the opening; the pin frame slot is a vertical slot formed by parallel inner and outer double-layer baffles, the top of the inner baffle is lower than that of the outer baffle, and the height of the inner baffle is less than that of the pin frame; the top of the two inner baffles forms a bottom support for the ceramic shell; when two pin frames are inserted into the vertical slots on both sides and the bottom of the ceramic shell is placed on the bottom support, the solder on the end of each pin is tightly attached to the pads on both sides of the ceramic shell.
[0006] Further, it further comprises a rotating ellipsoidal component for outwardly expanding the pin frame slots on both sides within the elastic deformation range.
[0007] Further, the inner and outer double-layer baffles are made of boron nitride material.
[0008] Further, the pin welding molds are arranged in a straight line back to back, connected together through the bottom of the base, and form a plurality of ceramic shell parallel reflow soldering molds.
[0009] Further, the thickness of the pin frame slot is greater than the thickness of the pin frame, and the difference between the thicknesses is less than or equal to 0.1mm; the spacing between the vertical slot bodies on both sides is less than the width of the ceramic shell, and the difference is 0.2-0.4mm.
[0010] Further, the cross-sectional shape of the base is a pair of C-shaped structures connected by a horizontal section at the bottom end.
[0011] Further, the top of the inner baffle is provided with a positioning protrusion matched with the bottom surface of the ceramic shell.
[0012] Further, the rotating ellipsoidal component includes an ellipsoid and a rotating rod connected with the ellipsoid, and the ellipsoid is inserted into the two inner baffles from the side.
[0013] Beneficial effects: the pin welding mold can make the lead wire well adhere to the ceramic shell, without manual alignment, convenient installation, and greatly improved welding precision. The graphite is eliminated on the material, and pollution can be reduced. BRIEF DESCRIPTION OF DRAWINGS
[0014] Figure 1 is a structure schematic view of the pin welding mold of the utility model;
[0015] Figure 2 is a structure schematic view of the pin frame of the utility model;
[0016] Figure 3 is an assembly schematic view of the pin welding mold, the pin frame and the ceramic shell of the utility model;
[0017] Figure 4 is an assembly process schematic view;
[0018] Figure 5 is a structure schematic view of a plurality of pin welding molds after combination;
[0019] Figure 6 is a structure schematic view of a plurality of pin welding molds after combination and assembly. DETAILED DESCRIPTION
[0020] The utility model will be explained further in combination with the drawings.
[0021] As Figure 1As shown, a lead bonding mold for a ceramic dual in-line package includes a base 1 with a hollow cavity. The cross-sectional shape of the base 1 is a pair of C-shaped structures connected at their bottom ends by a horizontal segment. The tops of the opposing C-shaped junctions form openings that connect to the cavity, and lead frame slots 2 are symmetrically arranged on both sides of the openings. The lead frame slots 2 are vertical slots formed by parallel inner and outer double-layer baffles. The bottom ends of the inner and outer double-layer baffles are fixed to the top of the C-shaped structures. The inner and outer double-layer baffles are made of cubic boron nitride ceramic material.
[0022] The pin frame slot 2 is used to insert one such pin respectively. Figure 2 The pin frame 5 shown has silver-copper solder on the upper part of each pin, with the solder-covered side facing inward. The top of the inner baffle 3 of the mold is lower than that of the outer baffle 4, and the height of the inner baffle is less than the height of the pin frame 5. The tops of the two inner baffles 3 form the base of the ceramic housing 6, and the tops of the inner baffles 3 are provided with positioning protrusions 7 that fit into the grooves on the bottom surface of the ceramic housing 6.
[0023] The thickness of pin frame slot 2 is greater than the thickness of pin frame 5, with a thickness difference of less than or equal to 0.1 mm; the spacing between the vertical slots on both sides is less than the width of the ceramic housing 6, with a difference of 0.2~0.4 mm. When the two pin frames 5 are inserted into the vertical slots on both sides respectively, and the bottom of the ceramic housing 6 is placed on the base, the solder on the ends of each pin is in close contact with the pads on both sides of the ceramic housing 6, such as... Figure 3 As shown.
[0024] For ease of assembly, a rotating ellipsoidal component is also included to extend the pin frame slots 2 on both sides outward within the range of elastic deformation. The rotating ellipsoidal component includes an ellipsoid 8 and a rotating rod (not shown) connected to the ellipsoid 8. The ellipsoid 8 is inserted from the side between two opposing inner baffles 3.
[0025] like Figure 4 As shown, during assembly, first insert the solder-coated pin frame 5 into the pin frame slot 2, then rotate the rotating ellipsoid component to expand the welding mold so that there is enough space to put in the ceramic shell 9. Place the ceramic shell 9 on top of the two inner baffles 3, adjust the position of the relative pins, and then rotate the rotating ellipsoid component again to make the welding mold naturally close, so that the upper part of the pin can clamp the ceramic shell 9, and the solder on the end of each pin is in close contact with the pads on both sides of the ceramic shell 6. Finally, place the assembled mold in the brazing furnace for reflow soldering.
[0026] To improve welding efficiency, several pin welding molds are arranged back-to-back in a straight line and connected together via the bottom of a base, forming a mold for parallel reflow soldering of multiple ceramic shells, such as... Figure 5 , Figure 6The efficiency is improved by operating each rotating ellipsoid part by an automatic equipment, then sucking a row of ceramic housings 9 from the tray by a vacuum suction assembly and assembling to each mold, and then putting the whole into a brazing furnace for welding.
[0027] The above merely describes the preferred embodiments of the present application, and it should be noted that for those skilled in the art, without departing from the principles of the present application, a number of improvements and refinements can be made, and these improvements and refinements should also be considered as the protection scope of the present application.
Claims
1. A pin soldering mold for a ceramic dual in-line package, characterized by, The application relates to a lead welding die, which comprises a base with a hollow cavity, an opening in the top center of the base for communicating with the cavity, and pin frame grooves symmetrically arranged on both sides of the opening; the pin frame groove is a vertical groove formed by parallel inner and outer double-layer baffles, the top of the inner baffle is lower than that of the outer baffle, and the height of the inner baffle is smaller than that of the pin frame; the top of the two inner baffles forms a bottom support of a ceramic shell; when two pin frames are respectively inserted into the vertical grooves on both sides and the bottom of the ceramic shell is placed on the bottom support, the solder on the end of each pin is tightly attached to the solder pad on both sides of the ceramic shell.
2. The pin soldering mold for a ceramic dual in-line package according to Claim 1, wherein The application also relates to a rotating ellipsoid component for outwardly expanding the pin frame grooves on both sides within an elastic deformation range.
3. The pin soldering mold for a ceramic dual in-line package according to Claim 1, wherein The inner and outer double-layer baffles are made of boron nitride material.
4. The pin bonding mold for a ceramic dual in-line package according to claim 1 or 2, wherein A plurality of the lead welding dies are arranged in a straight line back to back, connected together through the bottom of the base, and form a die for parallel reflow soldering of a plurality of ceramic shells.
5. The pin bonding mold for a ceramic dual in-line package according to claim 1 or 2, wherein The thickness of the pin frame groove is greater than that of the pin frame, and the difference between the thicknesses is less than or equal to 0.1 mm; the distance between the vertical grooves on both sides is smaller than the width of the ceramic shell, and the difference is 0.2-0.4 mm.
6. The pin bonding mold for a ceramic dual in-line package according to claim 1 or 2, wherein The cross section of the base is a pair of C-shaped structures connected by a horizontal section.
7. The pin bonding mold for a ceramic dual in-line package according to claim 1 or 2, wherein The top of the inner baffle is provided with a positioning protrusion matched with the bottom surface of the ceramic shell.
8. The pin bonding mold for ceramic dual in-line package according to claim 2, wherein The rotating ellipsoid component comprises an ellipsoid and a rotating rod connected with the ellipsoid, and the ellipsoid is inserted into the two inner baffles from the side.