Semiconductor packaging testing machine

Abstract

The utility model discloses a semiconductor packaging testing machine which comprises a base, a fixing seat is fixedly installed in the middle of the top of the base, supporting rods are fixedly installed at the four corners of the top of the base, a top plate is fixedly installed at the tops of the supporting rods, and an electric push rod is fixedly installed in the middle of the top plate in a penetrating mode. The bottom of the movable end of the electric push rod is fixedly provided with a lower pressing plate located over the fixed seat, the movable end of the electric push rod is slidably connected with a follower plate located above the lower pressing plate in a penetrating mode, the bottom of the lower pressing plate is fixedly provided with a test plate, and the top of the fixed seat is provided with a placement groove. And a jacking rod is slidably connected to the bottom of the placement groove in a penetrating manner. According to the utility model, the semiconductors after being tested can be quickly unloaded and taken out, the semiconductors do not need to be dug out of the placing grooves, the unloading speed is high, the operation is convenient, and the device is very strong.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor packaging, specifically to a semiconductor packaging test machine. BACKGROUND

[0002] Packaging refers to connecting the circuit pins on the silicon wafer to the external connection through wires for connection with other devices, and the packaging form refers to the shell for mounting the semiconductor integrated circuit chip; the semiconductor needs to be tested after packaging.

[0003] Referring to the Chinese patent, the testing device for semiconductor packaging element (publication number: CN215297558U, publication date: 2021-12-24), the patent solves the problem that the existing testing device for semiconductor packaging element cannot fix the semiconductor packaging element well, leading to an unsmooth testing process, and the existing testing device for semiconductor packaging element is not convenient for testing multiple parts of the semiconductor packaging element, and the testing result of only one part is accidental, but the existing semiconductor packaging testing device is not convenient for quickly taking out and discharging the semiconductor in the placing groove after testing, and needs to be manually pried out, which is low in efficiency and inconvenient to operate.

[0004] Therefore, we propose a semiconductor packaging test machine. UTILITY MODEL CONTENTS

[0005] The utility model aims at providing a semiconductor packaging test machine to solve the problems in the above background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical scheme: a semiconductor packaging test machine, comprising a base, a fixed seat is fixedly installed at the middle of the top of the base, support rods are fixedly installed at the corners of the top of the base, a top plate is fixedly installed at the top of the support rod, an electric push rod is fixedly installed at the middle of the top plate, a lower pressing plate located directly above the fixed seat is fixedly installed at the bottom of the movable end of the electric push rod, a follow-up plate located above the lower pressing plate is slidingly connected to the movable end of the electric push rod, a test plate is fixedly installed at the bottom of the lower pressing plate, a placing groove is formed at the top of the fixed seat, a jack rod is slidingly connected to the bottom of the placing groove, a jack plate located inside the placing groove is fixedly installed at the top of the jack rod, a limiting convex ring is integrally arranged at the middle of the jack rod, an activity plate slidingly connected with the fixed seat is fixedly installed at the bottom of the jack rod, a lower pressing spring located inside the fixed seat is fixedly installed at the middle of the top of the activity plate, telescopic rods located at both sides of the fixed seat are fixedly installed at both ends of the activity plate, and the top of the two telescopic rods is fixedly installed with the two ends of the follow-up plate.

[0007] Optionally, the bottom of the test board is provided with several golden fingers, the test board is electrically connected with wires, the test board is located directly above the placing groove, and the size of the lower pressing plate is smaller than that of the fixing seat.

[0008] Optionally, the top of the lower pressing spring is in close contact with the top inside the fixing seat, the side of the jacking plate is in sliding contact with the side wall of the placing groove, and the distance from the top of the limiting convex ring to the top inside the fixing seat is equal to half the depth of the placing groove.

[0009] Optionally, the two ends of the movable plate are in sliding connection with the two sides of the fixing seat, and the length of the movable plate is greater than that of the fixing seat.

[0010] Optionally, the telescopic rod comprises telescopic sleeves fixedly installed at the two ends of the top of the movable plate, a sliding plate is in sliding connection with the inside of the telescopic sleeve, a telescopic long rod is fixedly installed at the top of the sliding plate, a contraction spring is sleeved on the outside of the telescopic long rod, and the two ends of the top of the telescopic long rod are fixedly installed on the bottom of the follow-up plate.

[0011] Optionally, the telescopic long rod is in sliding connection with the top of the telescopic sleeve, the bottom of the contraction spring is in close contact with the top of the sliding plate, and the top of the contraction spring is in close contact with the top inside the rope sleeve.

[0012] Optionally, the middle of the follow-up plate is in sliding connection with the movable end of the electric push rod, and the length of the follow-up plate is the same as that of the movable plate.

[0013] Compared with the prior art, the semiconductor packaging test machine has the following beneficial effects:

[0014] The semiconductor packaging test machine has the following beneficial effects:

[0015] The semiconductor packaging test machine, through setting the telescopic rod and the limiting convex ring, when the electric push rod pulls the lower pressing plate and the follow-up plate to move up, the telescopic rod pulls the movable plate and the jacking rod to move up, when the limiting convex ring is in abutment with the fixed seat, the semiconductor has been jacked out by the jacking plate, with the continuous rising of the follow-up plate, the telescopic long rod pulls the sliding plate to move up, so that the telescopic rod is lengthened, and the follow-up plate is prevented from excessively pulling the movable plate. BRIEF DESCRIPTION OF DRAWINGS

[0016] Fig. 1 It is a whole structure schematic view of the semiconductor packaging test machine.

[0017] Fig. 2 It is a structure schematic view of the fixed seat of the semiconductor packaging test machine.

[0018] Fig. 3 It is a structure schematic view of the telescopic rod of the semiconductor packaging test machine.

[0019] In the figure: 1, base; 2, support rod; 3, fixed seat; 4, placing groove; 5, top plate; 6, electric push rod; 7, lower pressing plate; 8, test plate; 9, follow-up plate; 10, movable plate; 11, jacking rod; 12, jacking plate; 13, limiting convex ring; 14, lower pressing spring; 15, telescopic rod; 1501, telescopic sleeve; 1502, sliding plate; 1503, telescopic long rod; 1504, contraction spring. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present application.

[0021] Please refer to Figs. 1 to 3The utility model provides a kind of semiconductor package testing machine, including base 1, the middle part fixed mounting of base 1 top is equipped with fixed seat 3, the four corners fixed mounting of base 1 top is equipped with support rod 2, the top fixed mounting of support rod 2 is equipped with top plate 5, the middle part of top plate 5 is fixedly installed with electric push rod 6, the bottom fixed mounting of electric push rod 6 movable end is located in the lower plate 7 of fixed seat 3 directly above, the movable end of electric push rod 6 is slidably connected with the follow-up plate 9 located above lower plate 7, the bottom fixed mounting of lower plate 7 is equipped with test plate 8, the top of fixed seat 3 is equipped with placing groove 4, the bottom of placing groove 4 is slidably connected with jack-up rod 11, the top fixed mounting of jack-up rod 11 is equipped with jack-up plate 12 located in placing groove 4 inside, the middle part of jack-up rod 11 is integrally provided with limiting convex ring 13, the bottom fixed mounting of jack-up rod 11 is equipped with the movable plate 10 of sliding connection with fixed seat 3, the middle part of the top of movable plate 10 is fixedly installed with the lower spring 14 located in fixed seat 3 inside, the both ends fixed mounting of movable plate 10 is equipped with telescopic rod 15 located in the both sides of fixed seat 3, the top of two telescopic rods 15 is respectively fixedly installed with the both ends of follow-up plate 9, by setting movable plate 10 and follow-up plate 9, first, after the semiconductor of packaging is placed in placing groove 4, electric push rod 6 is started, so that electric push rod 6 drives lower plate 7 and test plate 8 to move downward, while under the action of lower spring 14, movable plate 10 moves downward, and by jack-up rod 11, jack-up plate 12 is pulled to move to the bottom of placing groove 4, after the gold finger of test plate 8 bottom is contacted with semiconductor, tester tests the connectivity of its internal circuit, after testing, electric push rod 6 reversely moves, pulls lower plate 7 to move upward, while driving follow-up plate 9 to move upward, in turn, by telescopic rod 15, movable plate 10 is pulled to move upward, so that movable plate 10 pushes jack-up plate 12 to move upward by jack-up rod 11, semiconductor is ejected from placing groove 4, realizes the rapid unloading of semiconductor after testing, without picking semiconductor from placing groove 4, unloading speed is fast, convenient to operate, the utility model is very strong.

[0022] The bottom of test plate 8 is provided with a plurality of gold fingers, test plate 8 is electrically connected with a wire, test plate 8 is located directly above placing groove 4, the size of lower plate 7 is less than the size of fixed seat 3.

[0023] The top of lower spring 14 is in contact with the top of fixed seat 3 inside, the side of jack-up plate 12 is in sliding contact with the side wall of placing groove 4, the distance from the top of limiting convex ring 13 to the top of fixed seat 3 inside is equal to half of the depth of placing groove 4, the both ends of movable plate 10 are slidably connected with the both sides of fixed seat 3, the length of movable plate 10 is greater than the length of fixed seat 3, the middle part of follow-up plate 9 is slidably connected with the movable end of electric push rod 6, the length of follow-up plate 9 is same with the length of movable plate 10.

[0024] The telescopic rod 15 comprises telescopic sleeves 1501 fixedly installed at the top of the two ends of the movable plate 10, a sliding plate 1502 slidably connected inside the telescopic sleeves 1501, a telescopic long rod 1503 fixedly installed at the top of the sliding plate 1502, a contraction spring 1504 sleeved outside the telescopic long rod 1503, the telescopic long rod 1503 fixedly installed at the top of the two ends of the bottom of the follow-up plate 9, the telescopic long rod 1503 penetratingly and slidably connected at the top of the telescopic sleeves 1501, the bottom of the contraction spring 1504 abuttingly contacted with the top of the sliding plate 1502, the top of the contraction spring 1504 abuttingly contacted with the top inside the rope sleeve, by setting the telescopic rod and the limiting convex ring 13, when the electric push rod 6 pulls the lower pressing plate 7 and the follow-up plate 9 to move upwards, the telescopic rod 15 pulls the movable plate 10 and the jacking rod 11 to move upwards, when the limiting convex ring 13 abuts against the fixed seat 3, the semiconductor has been jacked out by the jacking plate 12, with the continuous rising of the follow-up plate 9, the telescopic long rod 1503 pulls the sliding plate 1502 to move upwards, so that the telescopic rod 15 is lengthened, preventing the follow-up plate 9 from excessively pulling the movable plate 10.

[0025] Working principle:

[0026] Firstly, the packaged semiconductor is placed into the placing groove 4, the electric push rod 6 is started, so that the electric push rod 6 drives the lower pressing plate 7 and the test plate 8 to move downwards, at the same time, the movable plate 10 moves downwards under the action of the lower pressing spring 14, and the jacking plate 12 is pulled to move to the bottom of the placing groove 4 through the jacking rod 11, after the gold finger at the bottom of the test plate 8 contacts with the semiconductor, the tester tests the connectivity of the internal circuit of the semiconductor, after the test is completed, the electric push rod 6 reversely moves, pulls the lower pressing plate 7 to move upwards, and drives the follow-up plate 9 to move upwards, and then the movable plate 10 is pulled to move upwards through the telescopic rod 15, so that the movable plate 10 pushes the jacking plate 12 to move upwards through the jacking rod 11, and the semiconductor is jacked out of the placing groove 4, realizing the rapid unloading and taking out of the semiconductor after the test is completed, without the need of picking out the semiconductor from the placing groove 4, when the electric push rod 6 pulls the lower pressing plate 7 and the follow-up plate 9 to move upwards, the telescopic rod 15 pulls the movable plate 10 and the jacking rod 11 to move upwards, when the limiting convex ring 13 abuts against the fixed seat 3, the semiconductor has been jacked out by the jacking plate 12, with the continuous rising of the follow-up plate 9, the telescopic long rod 1503 pulls the sliding plate 1502 to move upwards, so that the telescopic rod 15 is lengthened, preventing the follow-up plate 9 from excessively pulling the movable plate 10.

[0027] Although the embodiments of the present application have been shown and described, it is to be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A semiconductor package tester comprising a base (1), characterized in that, The middle part of the top of the base (1) is fixedly installed with a fixed seat (3), the four corners of the top of the base (1) are fixedly installed with support rods (2), the top of the support rod (2) is fixedly installed with a top plate (5), the middle part of the top plate (5) is fixedly installed with an electric push rod (6), the bottom of the movable end of the electric push rod (6) is fixedly installed with a lower pressing plate (7) located directly above the fixed seat (3), the movable end of the electric push rod (6) is slidably connected with a follow-up plate (9) located above the lower pressing plate (7), the bottom of the lower pressing plate (7) is fixedly installed with a test plate (8), the top of the fixed seat (3) is provided with a placing groove (4), the bottom of the placing groove (4) is slidably connected with a jacking rod (11), the top of the jacking rod (11) is fixedly installed with a jacking plate (12) located inside the placing groove (4), the middle part of the jacking rod (11) is integrally provided with a limiting convex ring (13), the bottom of the jacking rod (11) is fixedly installed with a movable plate (10) slidably connected with the fixed seat (3), the middle part of the top of the movable plate (10) is fixedly installed with a lower pressing spring (14) located inside the fixed seat (3), the two ends of the movable plate (10) are fixedly installed with telescopic rods (15) located on the two sides of the fixed seat (3), and the tops of the two telescopic rods (15) are fixedly installed with the two ends of the follow-up plate (9) respectively.

2. The semiconductor package testing machine of claim 1, wherein, The bottom of the test plate (8) is provided with a plurality of golden fingers, the test plate (8) is electrically connected with wires, and the test plate (8) is located directly above the placing groove (4).

3. The semiconductor package testing machine of claim 1, wherein, The top of the lower pressing spring (14) is in abutting contact with the top of the inside of the fixed seat (3), the side of the jacking plate (12) is in sliding contact with the side wall of the placing groove (4), and the distance from the top of the limiting convex ring (13) to the top of the inside of the fixed seat (3) is equal to half the depth of the placing groove (4).

4. The semiconductor package testing machine of claim 1, wherein, The two ends of the movable plate (10) are slidably connected with the two sides of the fixed seat (3), and the length of the movable plate (10) is greater than the length of the fixed seat (3).

5. The semiconductor package testing machine of claim 1, wherein, The telescopic rod (15) comprises a telescopic sleeve (1501) fixedly installed at the two ends of the top of the movable plate (10), a sliding plate (1502) slidably connected inside the telescopic sleeve (1501), a telescopic long rod (1503) fixedly installed at the top of the sliding plate (1502), a contraction spring (1504) sleeved outside the telescopic long rod (1503), and the two ends of the top of the telescopic long rod (1503) are fixedly installed with the bottom of the follow-up plate (9).

6. The semiconductor package testing machine of claim 5, wherein, The telescopic long rod (1503) is slidably connected with the top of the telescopic sleeve (1501), the bottom of the contraction spring (1504) is in abutting contact with the top of the sliding plate (1502), and the top of the contraction spring (1504) is in abutting contact with the top of the inside of the rope sleeve.

7. The semiconductor package testing machine of claim 4, wherein, The middle part of the follow-up plate (9) is slidably connected with the movable end of the electric push rod (6), and the length of the follow-up plate (9) is the same as the length of the movable plate (10).

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