Burn-in board and test system

Abstract

The utility model provides a burn-in board and a test system. The burn-in board comprises an expansion output module, a plurality of first switch modules and a plurality of terminating resistors. The to-be-tested device is provided with a plurality of pins, the pins, the first switch modules and the terminating resistors are in one-to-one correspondence, the first switch modules and the corresponding terminating resistors are connected in series between the first power supply and the corresponding pins, the first switch modules are further connected with the expansion output module, and the expansion output module is in communication connection with the main control board through the communication bus. The expansion output module is arranged in the burn-in board, so that when a switching test is carried out on the device to be tested, the main control board does not need to directly control each first switch module, and each first switch module can be controlled by communicating with the expansion output module; the main control board only needs to provide one communication interface to be in communication connection with the expansion output module in the burn-in board, so that different tests can be switched, the number of pins of the main control board is reduced, and the structural complexity and cost are reduced.

Description

TECHNICAL FIELD

[0001] The utility model embodiment relates to chip test technical field, concretely relates to an aging board and test system. BACKGROUND

[0002] The aging board is a kind of equipment specially used to carry out long-term stability and reliability test to device, is especially widely used in the field of semiconductor and electronic component.

[0003] Traditional aging board is mainly limited to the aging test of the device to be tested, and does not support current parameter test.Because a large number of relays are used in the aging board to establish the connection between the pin of the device to be tested and the termination resistance, in order to meet the demand of current parameter test, the main control board needs to control a large number of relays to disconnect the connection between the pin of the device to be tested and the termination resistance, which leads to the main control board needing to allocate more pins to control these relays, resulting in complex structure and cost increase. CONTENT OF UTILITY MODEL

[0004] The utility model embodiment provides an aging board and test system, which is provided with an expansion output module in the aging board, reduces the number of pins connected between the main control board and the aging board, simplifies the structure and reduces the cost.

[0005] In the first aspect, the utility model embodiment provides an aging board for aging test of the device to be tested, which comprises an expansion output module, a plurality of first switch modules and a plurality of termination resistors;The device to be tested has a plurality of pins, and the pin, the first switch module and the termination resistor are one-to-one corresponding, the first switch module and the corresponding termination resistor are connected in series between the first power supply and the corresponding pin, the first switch module is also connected with the expansion output module, and the expansion output module is connected with the main control board through communication bus;The expansion output module is configured to receive the first control signal of the main control board through the communication bus, and output a plurality of first control sub-signals to a plurality of first switch modules based on the first control signal, and receive the second control signal of the main control board through the communication bus, and output a plurality of second control sub-signals to a plurality of first switch modules based on the second control signal;The first switch module is configured to be turned on based on the first control sub-signal, so that the first power supply, the first switch module, the termination resistor and the pin form a loop, and to be turned off based on the second control sub-signal, so as to disconnect the loop.

[0006] In some embodiments, the expansion output module comprises an IO expansion chip;The IO expansion chip is connected with each first switch module, and the IO expansion chip is also connected with the main control board through the communication bus.

[0007] In some embodiments, the expansion output module further comprises a first switch unit; the first switch unit is connected with the IO expansion chip and the first switch module respectively.

[0008] In some embodiments, the first switch module comprises a first optical relay; a first end of the first optical relay is connected with the expansion output module, a second end of the first optical relay is grounded, a third end of the first optical relay is connected with the first power supply, a fourth end of the first optical relay is connected with the corresponding terminal resistance, and the terminal resistance is connected with the corresponding pin.

[0009] In some embodiments, the aging board further comprises a second switch module; the second switch module is connected with the expansion output module, the pin, a second power supply, and the main control board respectively; the expansion output module is further configured to output a third control sub-signal to the second switch module based on the first control signal, and output a fourth control sub-signal to the second switch module based on the second control signal; the second switch module is configured to establish a connection between the pin and the second power supply and disconnect the connection between the pin and the main control board based on the third control sub-signal, and establish a connection between the pin and the main control board and disconnect the connection between the pin and the second power supply based on the fourth control sub-signal.

[0010] In some embodiments, the second switch module comprises a second optical relay and a third optical relay; a first end of the second optical relay is connected with a third power supply, a second end of the second optical relay and a first end of the third optical relay are both connected with the expansion output module, a second end of the third optical relay is grounded, a third end of the second optical relay is connected with the second power supply, a fourth end of the second optical relay and a third end of the third optical relay are connected with the pin, and a fourth end of the third optical relay is connected with the main control board.

[0011] In the second aspect, the embodiments of the utility model provide a test system, the test system includes the device to be measured, main control board, like the aging board of any one of the first aspect embodiment; the pin of the device to be measured is connected with the aging board, the main control board respectively, the expansion output module in the aging board is connected with the main control board through communication bus communication.

[0012] In some embodiments, the main control board comprises a control module, a DC test module, a read-write test module and a switch module; the control module is connected with the DC test module, the read-write test module and the switch module respectively, the control module is connected with the extension output module through the communication bus, and the switch module is also connected with the DC test module, the read-write test module and the pins of the device under test respectively; the control module is configured to control the working state of the switch module to establish the connection between the pins and the DC test module, so that the device under test is subjected to DC test, or to establish the connection between the pins and the read-write test module, so that the device under test is subjected to read-write test.

[0013] In some embodiments, the DC test module comprises a parameter measurement unit, an AD acquisition unit and a second switch unit; the parameter measurement unit is connected with the control module, and the second switch unit is also connected with the AD acquisition unit, the control module and the switch module.

[0014] In some embodiments, the control module comprises a first controller and a second controller; the first controller is connected with the second controller, the extension output module and the read-write test module respectively, and the second controller is connected with the DC test module and the switch module respectively.

[0015] The utility model discloses an embodiment provides a kind of aging board and test system, aging board includes extension output module, multiple first switch module and multiple termination resistance;Device under test has multiple pins, pin, first switch module and termination resistance one-to-one, first switch module and corresponding termination resistance are connected in series between first power supply and corresponding pin, first switch module is also connected with extension output module, and extension output module is connected with main control board by communication bus communication. When switching test is carried out to device under test, each first switch module can be controlled by communicating with extension output module without main control board directly controlling each first switch module, and main control board only needs to provide a communication interface to be connected with extension output module in aging board to realize switching different test, save the pin number of main control board, reduce structural complexity and cost. BRIEF DESCRIPTION OF DRAWINGS

[0016] One or more embodiments are illustrated by way of example in the figures that are part of this disclosure and which are illustrative, but not restrictive, of the embodiments, wherein elements having the same reference number designates like elements. Figures in the drawings are not necessarily to scale, except if so expressly indicated.

[0017] Figure 1A structure block diagram of a test system provided by the utility model for an embodiment;

[0018] Figure 2 A partial structure block diagram of an aging board provided by the utility model for an embodiment;

[0019] Figure 3 A partial structure block diagram of another aging board provided by the utility model for an embodiment;

[0020] Figure 4 A partial structure block diagram of still another aging board provided by the utility model for an embodiment;

[0021] Figure 5 A partial structure block diagram of yet another aging board provided by the utility model for an embodiment;

[0022] Figure 6 A structure block diagram of another test system provided by the utility model for an embodiment;

[0023] Figure 7 A structure block diagram of a main control board provided by the utility model for an embodiment. DETAILED DESCRIPTION

[0024] In order to facilitate the understanding of the utility model, the utility model will be described in more detail below in conjunction with the drawings and specific embodiments. It should be noted that when an element is described as "fixed to" another element, it can be directly on another element, or one or more intervening elements can be present therebetween. When an element is described as "electrically connected" to another element, it can be directly connected to another element, or one or more intervening elements can be present therebetween. The terms "upper", "lower", "inner", "outer", "bottom", etc. used in the specification indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the utility model. In addition, the terms "first", "second", "third", etc. are only for the purpose of description, and cannot be understood as indicating or implying relative importance.

[0025] Unless otherwise defined, all technical and scientific terms used in the specification are the same as those commonly understood by those skilled in the art to which the utility model belongs. The terms used in the specification of the utility model are only for the purpose of describing the specific embodiments and are not used to limit the utility model. The term "and / or" used in the specification includes any and all combinations of one or more related listed items. In addition, the technical features involved in the different embodiments of the utility model described below can be combined with each other as long as there is no conflict between them.

[0026] Current double data rate (DDR) memory particles aging is tested by an aging during repair test machine, which does not support a parameter measurement unit (PMU) to perform DC testing; and an FT test machine capable of DC testing cannot be used for aging testing. This results in the need to use different test machines when performing aging testing and DC testing on a device under test, resulting in increased development and testing costs. In addition, a main control board can be used to control a large number of relays in the aging board to disconnect the connection between the pins of the device under test and the termination resistors to support current parameter testing, but this approach will result in a sharp increase in the number of pins of the main control board, resulting in a complex structure and increased costs. The DC testing includes open and short circuit testing, leakage current testing, and IDD testing. The IDD testing refers to the testing of the total current flowing into the device under test.

[0027] To solve the above technical problems, the utility model embodiment provides an aging board and a test system, by setting up the expansion output module in the aging board, and the expansion output module is in communication connection with the main control board, using the main control board to control the expansion output module to output a plurality of control signals to a plurality of first switch modules, to control the loop between each pin and termination resistor, thereby reducing the number of pins of the main control board, reducing the complexity of the structure and the cost.

[0028] In a first aspect, the utility model embodiment provides an aging board, which is used for Figure 1 The aging board 100 is used for aging testing of a device under test 200, and the aging board 100 includes an expansion output module 10, a plurality of first switch modules 20, and a plurality of termination resistors 30.

[0029] The device under test 200 has a plurality of pins 210, and the pins 210, the first switch modules 20, and the termination resistors 30 correspond one-to-one. The first switch modules 20 and the corresponding termination resistors 30 are connected in series between a first power supply V1 and the corresponding pins 210. The first switch modules 20 are also connected to the expansion output module 10, and the expansion output module 10 is in communication connection with a main control board 300 through a communication bus. The expansion output module 10 is configured to receive a first control signal of the main control board 300 through the communication bus, and output a plurality of first control sub-signals to the plurality of first switch modules 20 based on the first control signal. The expansion output module 10 is also configured to receive a second control signal of the main control board 300 through the communication bus, and output a plurality of second control sub-signals to the plurality of first switch modules 20 based on the second control signal. The first switch modules 20 are configured to be turned on based on the first control sub-signals, so as to form a loop of the first power supply V1, the first switch modules 20, the termination resistors 30, and the pins 210, and to be turned off based on the second control sub-signals, so as to disconnect the loop.

[0030] The device under test 200 can be a DDR memory or other test chip, such as DDR4, which has a plurality of pins 210 for connecting with external devices. The packaging form of the device under test is various, including single not limited 78 ball grid array, 82 ball grid array and 496 ball grid array. Through the aging test of the device under test 200, the state of the chip after long time use, such as performance change, can be detected.

[0031] The expansion output module 10 refers to a device with multiple output terminals, which can be communicatively connected with the main control board 300 and output multiple control sub-signals to the multiple first switch modules 20 in response to the control signal of the main control board 200, so as to control the conduction state of the multiple first switch modules 20.

[0032] The first switch module 20 is a switch device on the aging board 100 for controlling the connection between the pin 210 of the device under test 200 and the termination resistor 30. Each pin 210 of the device under test 200 corresponds to one first switch module 20 and one termination resistor 30. The first switch module 20 can be turned on or off according to the control sub-signal provided by the expansion output module 10, so as to control the circuit connection state between the pin 210 of the device under test 200 and the termination resistor 30.

[0033] The termination resistor 30 is a resistor on the aging board 100 for connecting in series with the pin 210 of the device under test 200. During the aging test, the termination resistor 30 can simulate the load in the actual circuit to evaluate the performance of the device under test 200 under specific load conditions. At the same time, the termination resistor 30 can also be used to limit the current and protect the device under test 200 from damage caused by excessive current.

[0034] The first power supply V1 can be an external DC power supply, which can be provided by the main control board 300 or other devices.

[0035] The main control board 300 is the core control unit of the aging test system, which is responsible for generating control signals and sending them to the expansion output module 10 through the communication bus. The software or hardware logic on the main control board 300 can dynamically adjust the content of the control signal according to the test requirements, execute the test process and collect the test results.

[0036] In the aging board 100, the main control board 300 can send different control signals to the expansion output module 10 through the communication bus. The expansion output module 10 can output multiple control sub-signals to the multiple first switch modules 20 based on the control signals, so as to control the first switch modules 20 to be in the conduction state or in the off state, thereby establishing or breaking the loop. In this way, when the loop is established, the device under test 200 can be subjected to aging test or read-write test, and when the loop is broken, the device under test 200 can be subjected to DC test, such as leakage current test, open circuit and short circuit test, etc.

[0037] It can be seen that, in the utility model, by setting the expansion output module 10 in the aging board 100, when the to-be-tested device 200 is switched for testing, the main control board 300 does not need to directly control each first switch module 20, but can control each first switch module 20 by communicating with the expansion output module 10, the main control board 300 only needs to provide a communication interface to be connected with the expansion output module 10 in the aging board 100 to realize switching different tests, the pin number of the main control board 300 is saved, and the structural complexity and cost are reduced.

[0038] In some embodiments, referring to Figure 2 The expansion output module 10 comprises an IO expansion chip 11; the IO expansion chip 11 is connected with each first switch module 20, and the IO expansion chip 11 is further connected with the main control board 300 through a communication bus.

[0039] The IO expansion chip 11 is a chip specially used for increasing or expanding system input and output ports. Specifically, the IO expansion chip 11 can be a TCA9539QPWRQ1 chip, the communication bus can be an I2C communication bus, that is, the IO expansion chip 11 communicates with the main control board 300 by using an I2C communication protocol, and the number of IO expansion chips 11 can be set according to actual needs.

[0040] In the embodiment, by setting the IO expansion chip 11 to provide additional IO ports, the main control board 300 only needs to provide a communication interface for communicating with the IO expansion chip 11 to control multiple first switch modules 20, so as to control whether the loop between the multiple pins 210 of the to-be-tested device 200, the terminating resistor 30 and the first power supply V1 is conducted, realize switching different tests for the to-be-tested device 200, and the aging board 100 can support a test environment of up to 110 DEG C and can stably operate in an environment of 98 DEG C.

[0041] In some embodiments, referring to Figure 3 The expansion output module 10 further comprises a first switch unit 12; the first switch unit 12 is connected with the IO expansion chip 11 and the first switch module 20 respectively.

[0042] For the convenience of management, the first switch module 20 can be controlled in groups, for example, the first switch module 20 corresponding to the same type of pin 210 is taken as the same group, in the embodiment, in order to save the output pin 210 of the IO expansion chip 11, the on-off state of the first switch module 20 in different groups can be controlled by the on-off state of the first switch unit 12, in this way, the IO expansion chip 11 can control the on-off state of the first switch unit 12, that is, the on-off state of the first switch module 20 in multiple groups. Specifically, the control end of the first switch unit 12 is connected to the IO expansion chip 11, one end of the first switch unit 12 is connected to the fourth power supply V4, such as a 3.3V power supply, the other end of the first switch unit 12 is respectively connected to the multiple first switch modules 20 in the same group, the first switch unit 12 can include a PMOS tube or a PNP transistor, in this way, the IO expansion chip 11 can control the on-off of the first switch unit 12 to control the connection state between the first switch module 20 and the fourth power supply V4, so that the first switch module 20 is in the on-off state.

[0043] In the embodiment, by using the first switch unit 12, the group control of the multiple first switch modules 20 can be realized, so that the multiple first switch modules 20 originally needing multiple IO expansion chip 11 output pins 210 to control respectively can be controlled synchronously by one or a few first switch units 12, thereby greatly saving the output pin resources of the IO expansion chip 11.

[0044] In some embodiments, referring to Figure 4 , the first switch module 20 includes a first optical relay U1; the first end of the first optical relay U1 is connected to the expansion output module 10, the second end of the first optical relay U1 is grounded GND, the third end of the first optical relay U1 is connected to the first power supply V1, the fourth end of the first optical relay U1 is connected to the corresponding terminating resistor 30, and the terminating resistor 30 is connected to the corresponding pin 210.

[0045] The first optical relay U1 can adopt a TLP3450 chip, the first control sub-signal can be a high-level signal, and the second control sub-signal can be a low-level signal; after the first optical relay U1 receives the high-level signal output by the expansion output module 10, the light-emitting diode between the first end and the second end will emit light to make the connection between the third end and the fourth end conductive, that is, the loop between the first power supply V1, the terminating resistor 30 and the pin 210 is conductive; after the first optical relay U1 receives the low-level signal output by the expansion output module 10, the light-emitting diode between the first end and the second end will not emit light, the connection between the third end and the fourth end is disconnected, that is, the loop between the first power supply V1, the terminating resistor 30 and the pin 210 is disconnected.

[0046] In the embodiment, the first optical relay U1 is set as the first switch module 20, and the transmission of the control signal is realized by optical signal. Compared with the traditional relay directly connected by electricity, the first optical relay U1 has higher isolation performance.

[0047] In some embodiments, referring to Figure 4 In order to protect the light-emitting diode in the first optical relay U1, a current-limiting resistor Rp1 can be connected between the second end of the first optical relay U1 and the ground GND, and / or, in order to improve the stability of the power supply, the first capacitor C1 can be connected to the first power supply V1 and the ground GND respectively, and the first power supply V1 is filtered by the first capacitor C1 to improve the stability of the circuit.

[0048] In some embodiments, referring to Figure 5 The aging board 100 further includes a second switch module 40. The second switch module 40 is connected to the extension output module 10, the pin 210, the second power supply V2, and the main control board 300 respectively. The extension output module 10 is further configured to output a third control sub-signal to the second switch module 40 based on the first control signal, and output a fourth control sub-signal to the second switch module 40 based on the second control signal. The second switch module 40 is configured to establish a connection between the pin 210 and the second power supply V2 and disconnect the connection between the pin 210 and the main control board 300 based on the third control sub-signal, and establish a connection between the pin 210 and the main control board 300 and disconnect the connection between the pin 210 and the second power supply V2 based on the fourth control sub-signal.

[0049] The voltage value of the second power supply V2 can be 0V, or a voltage higher than 0V. For example, for the pin 210 in the device under test 200 that needs to be pulled up during read-write test, the voltage value of the second power supply V2 connected to the corresponding second switch module 40 can be a voltage higher than 0V, and for the pin 210 in the device under test 200 that needs to be pulled down during read-write test, the voltage value of the second power supply V2 connected to the corresponding second switch module 40 can be 0V, i.e. grounded.

[0050] The second switch module 40 can adopt a switching switch or other suitable switching device, and can change the connection state between the pin 210 and the second power supply V2 and the connection state between the pin 210 and the main control board 300 under different signal indications. Specifically, the first control signal includes a first A control signal and a first B control signal. When the aging test of the to-be-tested device 200 is needed, the main control board 300 sends the first A control signal to the expansion output module 10, the expansion output module 10 outputs the first control sub-signal to the first switch module 20 based on the first A control signal, and the first switch module 20 is turned on. When the read-write test of the to-be-tested device 200 is needed, the main control board 300 sends the first B control signal to the expansion output module 10, the expansion output module 10 outputs the first control sub-signal to the first switch module 20 and outputs the third control sub-signal to the second switch module 40 based on the first B control signal, the first switch module 20 is turned on, and the second switch module 40 establishes the connection between the pin 210 and the second power supply V2 based on the third control sub-signal and disconnects the connection between the pin 210 and the main control board 300, so as to pull up or pull down the level of the pin 210. When the DC test of the to-be-tested device 200 is needed, the main control board 300 sends the second control signal to the expansion output module 10, the expansion output module 10 outputs the second control sub-signal to the first switch module 20 and outputs the fourth control sub-signal to the second switch module 40 based on the second control signal, the first switch module 20 is disconnected, and the second switch module 40 establishes the connection between the pin 210 and the main control board 300 and disconnects the connection between the pin 210 and the second power supply V2.

[0051] In the embodiment, by setting the second switch module 40, the main control board 300 can control the second switch module 40 to be in the turned-on state through the expansion output module 10, so that the pin 210 is connected to the second power supply V2 in the read-write test state, and the pull-up level or the pull-down level is realized. In this way, the circuit for pulling up or pulling down the level of the pin 210 in the main control board 300 is not needed, and the structure in the main control board 300 is reduced; or the main control board 300 can control the second switch module 40 to establish the connection between the pin 210 and the main control board 300 through the expansion output module 10, so as to perform the DC test on the pin 210.

[0052] In some embodiments, see Figure 5The second switch module 40 comprises a second optical relay U2 and a third optical relay U3; a first end of the second optical relay U2 is connected to a third power supply V3, a second end of the second optical relay U2 and a first end of the third optical relay U3 are both connected to the expansion output module 10, a second end of the third optical relay U3 is grounded GND, a third end of the second optical relay U2 is connected to a second power supply V2, a fourth end of the second optical relay U2 and a third end of the third optical relay U3 are connected to the pin 210, and a fourth end of the third optical relay U3 is connected to the main control board 300.

[0053] The second optical relay U2 and the third optical relay U3 can adopt TLP3450 chips, the third control sub-signal is a low-level signal, and the fourth control sub-signal is a high-level signal. When the expansion output module 10 outputs a low-level signal to the second optical relay U2 and the third optical relay U3, a light-emitting diode between the first end and the second end of the second optical relay U2 is turned on, a connection between the third end and the fourth end of the second optical relay U2 is turned on, a light-emitting diode between the first end and the second end of the third optical relay U3 is not turned on, a connection between the third end and the fourth end of the third optical relay U3 is turned on, and thus a connection between the pin 210 and the second power supply V2 is turned on.

[0054] In the embodiment, the second optical relay U2 and the third optical relay U3 are arranged as the second switch module 40, and the transmission of the control signal is realized through an optical signal, so that the isolation performance is higher than that of a traditional relay directly connected through electricity.

[0055] In a second aspect, the utility model provides a test system, refer to Figure 1 The test system comprises a device under test 200, a main control board 300 and the aging board 100 as described in any one of the first aspect.

[0056] In the embodiment, the aging board 100 has the same structure and function as the aging board 100 as described in any one of the first aspect, and details are not repeated here.

[0057] In the test system, the extension output module 10 in the aging board 100 communicates with the main control board 300, so that the main control board 300 can control the plurality of first switch modules 20 through the extension output module 10 to switch different tests, thereby reducing the pin number of the main control board 300 and reducing the structural complexity and cost.

[0058] In some embodiments, referring to Figure 6 The main control board 300 includes a control module 310, a DC test module 320, a read-write test module 330 and a switch module 340. The control module 310 is connected with the DC test module 320, the read-write test module 330 and the switch module 340 respectively. The control module 310 is connected with the extension output module 10 through a communication bus. The switch module 340 is also connected with the DC test module 320, the read-write test module 330 and the pins 210 of the device under test 200 respectively. The control module 310 is configured to control the working state of the switch module 340 to establish a connection between the pins 210 and the DC test module 320, so that the device under test 200 performs DC test, or to establish a connection between the pins 210 and the read-write test module 330, so that the device under test 200 performs read-write test.

[0059] The DC test module 320 refers to a module that can perform DC parameter test on each pin 210 of the device under test 200. For example, the DC test module 320 can provide DC power to the pins 210 of the device under test 200, and measure the current value through the pins 210, to evaluate the working performance and electrical characteristics of the device under test 200 under different voltage or current conditions, such as leakage current.

[0060] The read-write test module 330 refers to a module that can perform read-write test on each pin 210 of the device under test 200. For example, the read-write test module 330 can send data to the pins 210 to perform write operation, or receive data from the pins 210 to perform read operation, thereby verifying the data processing capability, data transmission rate and communication protocol of the device under test 200.

[0061] The switch module 340 refers to a module that can establish a connection between different terminals under receiving different control signals, so that the connection state between each pin 210 and the DC test module 320 and the read-write test module 330 can be changed.

[0062] In different tests, the main control board 300 can selectively connect the DC test module 320 or the read-write test module 330 to the pins of the device under test by controlling the switch module 340, so as to facilitate different tests. For example, when the aging test is performed, the main control board 300 controls the switch module 340 to be turned off, so that the pins 210 of the device under test 200 are not connected to the DC test module 320 or the read-write test module 330; when the DC test is performed, the main control board 300 controls the switch module 340 to connect the pins 210 of the device under test 200 to the DC test module 320; when the read-write test is performed, the main control board 300 controls the switch module 340 to connect the pins 210 of the device under test 200 to the read-write test module 330. In this flexible way, different tests on the pins can be realized without changing the hardware.

[0063] In some embodiments, referring to Figure 7 The DC test module 320 includes a parameter measurement unit 321, an AD acquisition unit 322, and a second switch unit 323. The parameter measurement unit 321 is connected to the control module 310, and the second switch unit 322 is further connected to the AD acquisition unit 322, the control module 310, and the switch module 340.

[0064] The parameter measurement unit (PMU) 321 is a device specially used for measuring circuit parameters. In the DC test module 320, the parameter measurement unit 321 is responsible for leakage current test, open circuit test, and short circuit test.

[0065] The AD acquisition unit 322 is connected to the parameter measurement unit 321 and the second switch unit 323. The AD acquisition unit 322 can more accurately measure whether the signal output by the parameter measurement unit 321 is correct, so as to ensure the reliability of the test.

[0066] The second switch unit 323 is an electronic element used for switching signals between multiple circuit paths, which can include analog switches, relays, and other switching devices. In the DC test module 320, the second switch unit 323 selectively connects or disconnects the connection between the pins 210 and the parameter measurement unit 321 according to the instructions of the control module 310.

[0067] In this embodiment, by setting the parameter measurement unit 321 and the second switch unit 323, the DC test on the pins 210 can be performed.

[0068] In some embodiments, referring to Figure 7The control module 310 comprises a first controller 311 and a second controller 312. The first controller 311 is connected with the second controller 312, the extension output module 10 and the read-write test module 330 respectively, and the second controller 312 is connected with the DC test module 320 and the switch module 340 respectively.

[0069] Specifically, the first controller 311 can be a central processing unit (CPU), and the second controller 312 can be a field-programmable gate array (FPGA). The first controller 311 and the second controller 312 can be connected through an SPI communication bus. The first controller 311 and the read-write test module 330 can be connected through an SPI communication bus. The first controller 311 and the extension output module 10 can be connected through an I2C communication bus. The second controller 321 and the parameter measurement unit 321 can be connected through an SPI communication bus. The second controller 321 is further connected with the second switch unit 323 and the switch module 340 respectively.

[0070] In the embodiment, by setting two controllers as the control module 310, different tasks can be allocated to the two controllers for processing, so as to improve the data processing efficiency.

[0071] It should be noted that the apparatus embodiments described above are merely illustrative, and the units described as separate components can or can not be physically separated, and the components shown as units can or can not be physical units, i.e., they can be located in one place or distributed on multiple network units. Part or all of the modules can be selected according to actual needs to achieve the purpose of the embodiment.

[0072] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; under the idea of the present application, the technical features in the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other changes of different aspects of the present application as described above. In order to be brief, they are not provided in details; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: the technical solutions recorded in the foregoing embodiments can still be modified, or some technical features can be replaced; and these modifications or replacements do not make the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. An aging board, characterized by, The application discloses an aging board for aging test of a device to be tested, which comprises an expansion output module, a plurality of first switch modules and a plurality of termination resistors. The device to be tested has a plurality of pins, the pins, the first switch modules and the termination resistors are in one-to-one correspondence, the first switch module and the corresponding termination resistor are connected in series between a first power supply and the corresponding pin, the first switch module is also connected with the expansion output module, and the expansion output module is connected with a main control board through a communication bus. The expansion output module is configured to receive a first control signal of the main control board through the communication bus, output a plurality of first control sub-signals to a plurality of the first switch modules based on the first control signal, receive a second control signal of the main control board through the communication bus, and output a plurality of second control sub-signals to a plurality of the first switch modules based on the second control signal. The first switch module is configured to be turned on based on the first control sub-signal to form a loop of the first power supply, the first switch module, the termination resistor and the pin, and be turned off based on the second control sub-signal to disconnect the loop.

2. The aging board of claim 1, wherein The expansion output module comprises an IO expansion chip. The IO expansion chip is connected with each of the first switch modules, and the IO expansion chip is also connected with the main control board through the communication bus.

3. The aging board of claim 2, wherein, The expansion output module further comprises a first switch unit. The first switch unit is connected with the IO expansion chip and the first switch module respectively.

4. The burn-in board of claim 1, wherein The first switch module comprises a first optical relay. A first end of the first optical relay is connected with the expansion output module, a second end of the first optical relay is grounded, a third end of the first optical relay is connected with the first power supply, and a fourth end of the first optical relay is connected with the corresponding termination resistor, and the termination resistor is connected with the corresponding pin.

5. The aging board according to any one of claims 1 to 4, characterized in that The aging board further comprises a second switch module. The second switch module is connected with the expansion output module, the pin, a second power supply and the main control board respectively. The expansion output module is further configured to output a third control sub-signal to the second switch module based on the first control signal and output a fourth control sub-signal to the second switch module based on the second control signal. The second switch module is configured to establish a connection between the pin and the second power supply and disconnect a connection between the pin and the main control board based on the third control sub-signal, and establish a connection between the pin and the main control board and disconnect a connection between the pin and the second power supply based on the fourth control sub-signal.

6. The aging board of claim 5, wherein, The second switch module comprises a second optical relay and a third optical relay. The first end of the second optical relay is connected with a third power supply, the second end of the second optical relay and the first end of the third optical relay are connected with the expansion output module, the second end of the third optical relay is grounded, the third end of the second optical relay is connected with the second power supply, the fourth end of the second optical relay and the third end of the third optical relay are connected with the pin, and the fourth end of the third optical relay is connected with the main control board.

7. A test system, characterized by The device under test, the main control board and the aging board as claimed in any one of claims 1-6 are included. The pins of the device under test are connected with the aging board and the main control board respectively, and the expansion output module in the aging board is connected with the main control board through a communication bus.

8. The test system of claim 7, wherein, The main control board comprises a control module, a DC test module, a read-write test module and a switch module. The control module is connected with the DC test module, the read-write test module and the switch module respectively, the control module is connected with the expansion output module through the communication bus, and the switch module is further connected with the DC test module, the read-write test module and the pins of the device under test respectively. The control module is configured to control the working state of the switch module to establish the connection between the pins and the DC test module, so that the device under test is subjected to DC test, or to establish the connection between the pins and the read-write test module, so that the device under test is subjected to read-write test.

9. The test system of claim 8, wherein, The DC test module comprises a parameter measurement unit, an AD acquisition unit and a second switch unit. The parameter measurement unit is connected with the control module, and the second switch unit is further connected with the AD acquisition unit, the control module and the switch module.

10. The test system of claim 9, wherein, The control module comprises a first controller and a second controller. The first controller is connected with the second controller, the expansion output module and the read-write test module respectively, and the second controller is connected with the DC test module and the switch module respectively. The control module comprises a first controller and a second controller. The first controller is connected with the second controller, the expansion output module and the read-write test module respectively, and the second controller is connected with the DC test module and the switch module respectively.

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