Covering type liquid cooling plate

Abstract

The utility model provides a covering type liquid cooling plate which is arranged on the top of a server CPU in a covering mode, a heat conduction column extends outwards to be connected with a server mainboard heating device, a liquid storage cavity is formed in the covering type liquid cooling plate, and the liquid storage cavity is connected with an external heat exchanger through a liquid inlet pipe and a liquid outlet pipe. The covering type liquid cooling plate helps the server CPU to cool in a liquid cooling mode and helps the mainboard to cool through the heat conduction column, heat is directly taken away from a case through a secondary refrigerant flowing circularly in the covering type liquid cooling plate, the heat dissipation pressure of a case fan is reduced, and a powerful guarantee is provided for long-term efficient operation of the server. The heat conduction column is internally provided with a heat conduction core body made of a copper rod so as to improve the heat conduction efficiency, the heat conduction core body penetrates into a secondary refrigerant in the covering type liquid cooling plate to directly exchange heat with the secondary refrigerant, and the heat dissipation capacity of the server mainboard is improved. And in addition, the sieve pore plate is arranged in the communicating groove, so that the heat exchange efficiency between the covering type liquid cooling plate and the secondary refrigerant can be enhanced, and the effect of supporting and fixing the heat conduction core body can be achieved.

Description

TECHNICAL FIELD

[0001] The utility model relates to server heat dissipation technical field, specifically related to a covering type liquid cooling plate. BACKGROUND

[0002] With the society's requirement to server operation speed is unceasingly improving, the main component CPU, motherboard, memory and so on of server performance and power are unceasingly synchronous improvement, and the gradually increasing heat also brings the heat dissipation difficult problem for server. In order to solve CPU heat dissipation problem, the traditional method is to install fan on the top of CPU, and the way of strengthening exhaust by unceasingly improving fan power is used to cope with the continuous deterioration of heat dissipation problem. Fan makes air flow by shearing air, and the speed of fan is unceasingly improved, and the improvement of air volume is limited, and increasing fan blade radius is not realistic for the narrow space in the cabinet, and in addition, the influence of wind noise on the surrounding environment, and liquid cooling is more promising than air cooling. SUMMARY

[0003] In view of the defects of the background art, the utility model provides a covering type liquid cooling plate, which can help server CPU and motherboard cooling through liquid cooling mode, which directly takes away the heat from the cabinet by the circulating coolant inside, reduces the heat dissipation pressure of the cabinet fan, and provides a strong guarantee for long-term efficient operation of the server.

[0004] The utility model provides a covering type liquid cooling plate, cover is located at the top of server CPU, and extends out the heat conduction column and is connected with server motherboard heat generating device, the inside of covering type liquid cooling plate is equipped with liquid storage cavity, and liquid storage cavity is connected with external heat exchanger through inlet pipe and discharge pipe.

[0005] Preferably, the covering type liquid cooling plate comprises a main plate body and a secondary plate body connected by a bridge plate, the liquid storage cavity is arranged in the main plate body, the inlet groove is arranged in the secondary plate body, and the communication groove is arranged in the bridge plate and communicates the inlet groove and the liquid storage cavity.

[0006] The secondary plate body is located above the server motherboard heat generating device and is connected with the server motherboard heat generating device through the heat conduction column.

[0007] Preferably, the secondary plate body is provided with an inlet opening communicated with the inlet groove, the main plate body is provided with a discharge opening communicated with the liquid storage cavity, the inlet pipe is connected with the inlet opening, and the discharge pipe is connected with the discharge opening.

[0008] Preferably, the bottom of the covering type liquid cooling plate is provided with a heat conduction plate covering the server CPU.

[0009] Preferably, the heat-conducting column is internally provided with a heat-conducting core body, and the heat-conducting core body penetrates through the secondary plate body and extends into the liquid inlet groove.

[0010] Preferably, the communication groove is internally provided with a sieve plate, and the coolant circulating in the cover type liquid cooling plate passes through the sieve holes of the sieve plate and enters the liquid storage cavity.

[0011] The heat-conducting core body extends to the inlet of the liquid storage cavity through the sieve plate, and the sieve plate is also used for supporting and positioning the heat-conducting core body.

[0012] Preferably, the heat-conducting column and the liquid inlet groove extend in the same direction horizontally, the heat-conducting column is internally provided with a plurality of heat-conducting core bodies, and the plurality of heat-conducting core bodies are connected in one-to-one correspondence with a plurality of heat generating devices linearly arranged on the server mainboard.

[0013] Preferably, the liquid storage cavity is provided with a vortex flow channel, and the liquid outlet is arranged at the middle of the main plate body, and the coolant entering from the communication groove is discharged from the liquid outlet above the vortex center after passing through the vortex flow channel.

[0014] Preferably, the vortex flow channel is internally provided with a plurality of fins for guiding flow and heat exchange.

[0015] The beneficial effects of the utility model include: the cover type liquid cooling plate helps the server CPU to cool down in the mode of liquid cooling, and helps the mainboard to cool down through the heat-conducting column, which directly takes away the heat from the cabinet through the circulating coolant inside, reduces the heat dissipation pressure of the cabinet fan, and provides a strong guarantee for long-term and efficient operation of the server. The heat-conducting column is internally provided with a heat-conducting core body made of a copper rod to improve the heat-conducting efficiency, the heat-conducting core body penetrates into the coolant in the cover type liquid cooling plate and directly exchanges heat with the coolant, and the heat dissipation capacity of the server mainboard is improved. The sieve plate is arranged in the communication groove, which can not only strengthen the heat exchange efficiency between the cover type liquid cooling plate and the coolant, but also play the role of supporting and fixing the heat-conducting core body. The vortex flow channel is arranged in the liquid storage cavity, and a large number of fins are arranged in the vortex flow channel, which not only increases the heat exchange area of the cover type liquid cooling plate and the coolant, but also strengthens the flowability of the coolant, avoiding that part of the coolant is retained in the liquid storage cavity after heat exchange and is not discharged quickly. BRIEF DESCRIPTION OF DRAWINGS

[0016] The utility model will be described in detail in combination with embodiments and drawings, in which:

[0017] Figure 1 It is the perspective view of the cover type liquid cooling plate of the utility model.

[0018] Figure 2 It is the assembly schematic view of the base and the hoisting frame of the utility model.

[0019] Figure 3 It is the local enlarged view of the flexible supporting head of the utility model.

[0020] Figure 4 is the main board layout diagram matched with the utility model.

[0021] Reference signs:

[0022] 1-main board body, 11-liquid storage cavity, 12-liquid discharge port, 2-sub board body, 21-liquid inlet groove, 22-liquid inlet, 3-bridge plate, 31-communication groove, 4-heat conduction column, 41-heat conduction core, 5-heat conduction plate, 6-sieve plate, 7-fin, 100-CPU, 200-main board, 300-inductor. DETAILED DESCRIPTION

[0023] In order to make the technical problems, technical schemes and beneficial effects of the utility model clearer and more apparent, the utility model is further described in detail below in combination with the drawings and examples.It should be understood that the specific examples described herein are only used to explain the utility model and are not used to limit the utility model.

[0024] Therefore, one feature indicated in the specification will be used to explain one feature of one embodiment of the utility model, and it is not suggested that each embodiment of the utility model must have the explained feature.In addition, it should be noted that the specification describes many features.Although certain features can be combined together to show possible system designs, these features can also be used in other combinations that are not explicitly explained.Therefore, unless otherwise explained, the explained combinations are not intended to be limited.

[0025] The principle of the utility model is described in detail below in combination with the drawings and examples.

[0026] The utility model proposes a kind of covering liquid cooling plate, cover is arranged at the top of server CPU 100, and heat conduction column 4 is extended outward and is connected with server mainboard heat generating device, the inside of covering liquid cooling plate is equipped with liquid storage cavity 11, liquid storage cavity 11 is connected with external heat exchanger by liquid inlet pipe and liquid discharge pipe.Covering liquid cooling plate helps server CPU 100 to cool down by the way of liquid cooling, and helps mainboard 200 to cool down by heat conduction column 4, it directly takes heat away from cabinet by the internally circulating coolant, reduces the heat dissipation pressure of cabinet fan, provides strong guarantee for long-term efficient operation of server.The coolant can be water, and can also use propylene glycol, glycol or sodium chloride brine solution.In addition, external heat exchanger (not shown in drawing) can use low-cost air-cooled heat exchanger, and can also use relatively high-priced refrigerant cooling refrigeration equipment.

[0027] In the embodiment, the covering liquid cooling plate comprises a main plate body 1 and a secondary plate body 2 connected by a bridge plate 3, the liquid storage cavity 11 is arranged in the main plate body 1, the secondary plate body 2 is provided with a liquid inlet groove 21, and the bridge plate 3 is provided with a communication groove 31 communicating the liquid inlet groove 21 and the liquid storage cavity 11. The secondary plate body 2 is provided with a liquid inlet 22 communicating with the liquid inlet groove 21, the main plate body 1 is provided with a liquid outlet 12 communicating with the liquid storage cavity 11, a liquid inlet pipe is connected with the liquid inlet 22, and a liquid outlet pipe is connected with the liquid outlet 12. The secondary plate body 2 is located above the server main plate heating device and is connected with the server main plate heating device through the heat conduction column 4. The covering liquid cooling plate lengthens the refrigerant flow channel as much as possible and reduces the length of the heat conduction column outside as much as possible, thereby improving the heat exchange capacity of the covering liquid cooling plate. In the embodiment, the main plate 200 layout is changed, and the inductors 300 with high heat generation are arranged in a row near the CPU 100 mounting seat. The extension direction of the heat conduction column 4 and the liquid inlet groove 21 is consistent with the arrangement direction of the inductors 300, the heat conduction column is provided with a plurality of heat conduction cores 41, the plurality of heat conduction cores 41 are connected with the top of the inductors 300 one by one, and the connection between the heat conduction core 41 and the inductor 300 is isolated by using an insulating material.

[0028] In order to further improve the heat conduction capacity, the bottom of the main plate body 1 is provided with a heat conduction plate 5 covering the server CPU 100, the inside of the heat conduction column 4 is provided with a heat conduction core 41, the heat conduction core 41 penetrates the secondary plate body 2 and extends into the liquid inlet groove 21, and the heat conduction plate 5 and the heat conduction core 41 adopt copper as the material.

[0029] In the embodiment, the communication groove 31 is provided with a sieve plate 6, and the refrigerant circulating in the covering liquid cooling plate passes through the sieve holes of the sieve plate 6 and enters the liquid storage cavity 11 in the liquid inlet groove 21. The liquid inlet groove 21 extends linearly in the horizontal direction, and the plurality of heat conduction cores 41 are linearly arranged and penetrate into the liquid inlet groove 21. The heat conduction core 41 extends to the inlet of the liquid storage cavity 11 through the sieve plate 6, the sieve plate 6 can not only strengthen the heat exchange efficiency between the covering liquid cooling plate and the refrigerant, but also can support and fix the heat conduction core 41.

[0030] In the embodiment, the liquid storage cavity 11 has a vortex flow channel, the liquid outlet 12 is arranged in the middle of the main plate body 1, and the refrigerant is discharged from the liquid outlet 12 above the vortex center after passing through the vortex flow channel. In addition, a plurality of fins 7 for guiding flow and heat exchange are arranged in the vortex flow channel. The vortex flow channel and the fins 7 inside the vortex flow channel not only increase the heat exchange area of the covering liquid cooling plate and the refrigerant, but also strengthen the flowability of the refrigerant, so that the refrigerant which is not discharged quickly after heat exchange can be avoided to stay in the liquid storage cavity 11.

[0031] The above only describes the preferred embodiment of the utility model, and does not limit the utility model, and any modification, equivalent replacement and improvement made within the spirit and principle of the utility model should be included in the protection scope of the utility model.

Claims

1. A covered liquid cooling plate, characterized in that, It is installed on the top of the server CPU and extends outward to connect with the heat-conducting pillars of the server motherboard. The liquid cooling plate has a liquid storage chamber inside, which is connected to the external heat exchanger through the liquid inlet pipe and the liquid outlet pipe.

2. The covered liquid cooling plate as described in claim 1, characterized in that, The covered liquid cooling plate includes a main plate and a sub-plate connected by a bridge plate. The liquid storage chamber is disposed in the main plate, the sub-plate is provided with a liquid inlet groove, and the bridge plate is provided with a connecting groove that connects the liquid inlet groove and the liquid storage chamber. The sub-board is located above the heat-generating components of the server motherboard and is connected to the heat-generating components of the server motherboard through the heat-conducting pillar.

3. The covered liquid cooling plate as described in claim 2, characterized in that, The sub-plate has an inlet port communicating with the liquid inlet tank, the main plate has a drain port communicating with the liquid storage chamber, the inlet pipe is connected to the inlet port, and the drain pipe is connected to the drain port.

4. The covered liquid cooling plate as described in claim 3, characterized in that, The bottom of the cover-type liquid cooling plate is equipped with a heat-conducting plate that covers the server CPU.

5. The covered liquid cooling plate as described in claim 3, characterized in that, The heat-conducting column has a heat-conducting core inside, which penetrates the sub-plate and extends into the liquid inlet tank.

6. The covered liquid cooling plate as described in claim 5, characterized in that, The connecting groove is provided with a perforated plate, and the refrigerant flowing in the covered liquid cooling plate passes through the perforated plate in the connecting groove and enters the liquid storage chamber. The heat-conducting core extends through the perforated plate to the inlet of the liquid storage chamber, and the perforated plate is also used for supporting and positioning the heat-conducting core.

7. The covered liquid cooling plate as described in claim 6, characterized in that, The heat-conducting column and the liquid inlet extend horizontally in the same direction. The heat-conducting column is provided with multiple heat-conducting cores, which are connected one-to-one with multiple heat-generating devices linearly arranged on the server motherboard.

8. The covered liquid cooling plate as described in claim 3, characterized in that, The liquid storage chamber has a vortex-shaped flow channel, and the drain port is located in the middle of the main body. After passing through the vortex-shaped flow channel, the refrigerant is discharged from the drain port above the center of the vortex.

9. The covered liquid cooling plate as described in claim 8, characterized in that, The vortex-shaped flow channel is equipped with multiple fins for guiding flow and heat exchange.

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