High-temperature-resistant inductor structure

Abstract

The utility model discloses a high-temperature-resistant inductor structure, which relates to the field of inductor structures and comprises a shell, a plurality of mounting grooves arranged on the shell at equal intervals, high-temperature-resistant inductor units inserted in the mounting grooves, a pouring sealant layer arranged between the high-temperature-resistant inductor units and the shell, and a radiating component arranged on one side of the shell far away from the mounting grooves. The high-temperature-resistant inductor structure can stably work in a high-temperature environment so as to meet the use requirement of the inductor structure in the high-temperature environment.

Description

TECHNICAL FIELD

[0001] The utility model relates to inductance structure field, concretely is a kind of high-temperature-resistant inductance structure. BACKGROUND

[0002] Inverter is the core equipment of energy conversion and distribution, in some specific situations, such as solar power station, wind power station and some industrial applications, inverter needs to run for a long time in high temperature environment. As an important working structure of inverter, the performance of inductance directly affects the overall efficiency and stability of inverter.

[0003] The traditional inductance structure is easy to cause performance instability or even damage due to material thermal expansion, insulation performance degradation and other problems when working in high temperature environment. Especially in H level (maximum working temperature 180 DEG C) and above high temperature environment, higher requirements are put forward for the high-temperature-resistant performance and heat dissipation capacity of inductor. The traditional inductance structure often fails to meet these requirements, resulting in unstable performance of inverter in high temperature environment, and even damage. Therefore, an inductance structure capable of stably working in high temperature environment is needed. SUMMARY

[0004] The utility model aims at providing a kind of high-temperature-resistant inductance structure, the high-temperature-resistant inductance structure can stably work in high temperature environment, to meet the use demand of inductance structure in high temperature environment.

[0005] The above-mentioned optimization structure of the utility model is realized by the following technical scheme: a kind of high-temperature-resistant inductance structure, including shell;

[0006] Multiple installation grooves, multiple installation grooves are equidistantly arranged on the shell;

[0007] High-temperature-resistant inductance unit, the high-temperature-resistant inductance unit is inserted in the installation groove;

[0008] Potting adhesive layer, the potting adhesive layer is arranged between the high-temperature-resistant inductance unit and the shell;

[0009] Heat dissipation assembly, the heat dissipation assembly is arranged on the side of the shell away from the installation groove.

[0010] In some embodiments, it further includes pretreatment layer, and the pretreatment layer is arranged between the potting adhesive layer and the inner wall of the installation groove.

[0011] In some embodiments, the high-temperature-resistant inductance unit includes high-temperature-resistant framework;

[0012] Two high-temperature-resistant magnetic heads, two high-temperature-resistant magnetic heads are arranged at both ends of the high-temperature-resistant framework;

[0013] Two high-temperature-resistant magnetic columns, two high-temperature-resistant magnetic columns are arranged between the high-temperature-resistant magnetic head and are inserted and matched with the high-temperature-resistant framework;

[0014] A high-temperature-resistant coil winding is wound on the two high-temperature-resistant magnetic columns.

[0015] In some embodiments, the high-temperature-resistant framework comprises two parallel fixed plates;

[0016] Two insulation sleeves, two insulation sleeves are respectively inserted and matched with the fixed plate at both ends, and the insulation sleeve is sleeved on the high-temperature-resistant magnetic column;

[0017] A mounting plate is arranged at one end of the fixed plate away from the insulation sleeve.

[0018] A plurality of clamping springs are arranged on the mounting plate, and the high-temperature-resistant magnetic head is detachably connected between the plurality of clamping springs and the fixed plate.

[0019] In some embodiments, the insulation sleeve comprises at least two layers of composite insulation paper.

[0020] In some embodiments, the insulation sleeve and the two fixed plates are connected by high-temperature-resistant glue.

[0021] In some embodiments, the high-temperature-resistant framework adopts polyphenylene sulfide.

[0022] In some embodiments, the mounting groove comprises a flow guide table, the flow guide table is arranged in the middle of the mounting groove, and the flow guide table is arranged between the two high-temperature-resistant magnetic columns.

[0023] In some embodiments, the heat dissipation assembly comprises a plurality of heat dissipation fins, and the plurality of heat dissipation fins are arranged at equal intervals on the side of the shell away from the mounting groove.

[0024] In summary, the utility model has the following beneficial effects:

[0025] The high-temperature-resistant inductor structure sets a plurality of high-temperature-resistant inductor units in the shell, so that the inductor can work stably in a high-temperature environment, thereby meeting the use requirements of the inductor structure in a high-temperature environment, and setting a heat dissipation assembly on the shell can improve the heat dissipation efficiency of the inductor and prolong the service life. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 The structure of the utility model is shown in the figure;

[0027] Figure 2 The structure of the utility model is shown in the figure;

[0028] Figure 3The utility model discloses a structure schematic diagram of high temperature resistance inductance unit of the utility model removes the pouring sealant layer.

[0029] Figure 4 The utility model discloses a structure schematic diagram of high temperature resistance inductance unit of the utility model removes the pouring sealant layer.

[0030] Figure 5 The utility model discloses a structure schematic diagram of high temperature resistance inductance unit of the utility model removes the pouring sealant layer.

[0031] In the drawing: 1, shell, 2, mounting groove, 21, flow guide platform, 3, high temperature resistance inductance unit, 31, high temperature resistance framework, 311, fixed plate, 312, insulating sleeve, 313, mounting plate, 314, clamping elastic sheet, 32, high temperature resistance magnetic head, 33, high temperature resistance magnetic column, 34, high temperature resistance coil winding, 4, pouring sealant layer, 5, heat dissipation assembly, 51, cooling fin, 6, pretreatment layer. Specific implementation

[0032] The technical scheme in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model and not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the utility model.

[0033] Reference Figures 1-5 A high temperature resistance inductance structure, including shell 1, multiple mounting grooves 2, multiple high temperature resistance inductance units 3, pouring sealant layer 4, heat dissipation assembly 5, shell 1 can provide support and protection for the whole inductance structure, shell 1 can be made of high temperature resistance material, can adopt aluminum material, has high temperature resistance and good heat dissipation performance, can dissipate the heat in inductance in time, further enhances the high temperature resistance of inductance, multiple mounting grooves 2 are equidistantly arranged on shell 1, and the high temperature resistance inductance unit 3 is inserted in each mounting groove 2, the high temperature resistance inductance unit 3 can ensure the normal work of inductance structure under high temperature environment, pouring sealant layer 4 is filled between high temperature resistance inductance unit 3 and shell 1, can realize the fixed connection between high temperature resistance inductance unit 3 and shell 1, and simultaneously provides insulation protection, avoids the influence of metal shell on the work of high temperature resistance inductance unit 3, heat dissipation assembly 5, heat dissipation assembly 5 is located at the side of shell 1 away from mounting groove 2, can realize the effective heat dissipation of inductance structure, dissipates the heat in inductance in time, prolongs the service life.

[0034] In some embodiments, a pre-treatment layer 6 is further included between the potting adhesive layer 4 and the inner wall of the mounting groove 2, and the pre-treatment layer 6 can be composed of a polyimide primer, which has excellent heat resistance, chemical resistance, electrical resistance and mechanical properties, and can enhance the interfacial bonding force between the potting adhesive layer 4 and the inner wall of the mounting groove 2, thereby improving the stability and temperature resistance of the overall structure of the inductor.

[0035] In some embodiments, the high-temperature-resistant inductor unit 3 includes a high-temperature-resistant skeleton 31, two high-temperature-resistant magnetic heads 32, two high-temperature-resistant magnetic columns 33, and a high-temperature-resistant coil winding 34. The two high-temperature-resistant magnetic heads 32 are arranged at both ends of the high-temperature-resistant skeleton 31, the two high-temperature-resistant magnetic columns 33 are arranged between the two high-temperature-resistant magnetic heads 32 and are insertedly connected with the high-temperature-resistant skeleton 31, and the high-temperature-resistant coil winding 34 is wound on the two high-temperature-resistant magnetic columns 33. The high-temperature-resistant coil winding 34 includes two pins, which penetrate the potting adhesive layer 4, facilitating the connection of the high-temperature-resistant coil winding 34 with an external circuit. The high-temperature-resistant magnetic heads 32, the two high-temperature-resistant magnetic columns 33, and the high-temperature-resistant coil winding 34 can all be made of high-temperature-resistant materials, which is a prior art and will not be described here. Through the high-temperature setting of each structure in the high-temperature-resistant inductor unit 3 and the high-temperature setting of the connection between each structure, the high-temperature-resistant inductor unit 3 can work normally in a high-temperature environment, thereby meeting the inductor use requirements in a high-temperature environment.

[0036] In some embodiments, the high-temperature-resistant skeleton 31 includes two parallel fixed plates 311, two insulating sleeves 312, two mounting plates 313, and a plurality of clamping elastic pieces 314. The two insulating sleeves 312 are respectively insertedly connected with the fixed plates 311 at both ends, which can avoid magnetic leakage at the connection between the insulating sleeves 312 and the fixed plates 311, thereby affecting the operation of the high-temperature-resistant magnetic columns 33. The insulating sleeves 312 are sleeved on the high-temperature-resistant magnetic columns 33, the high-temperature-resistant magnetic columns 33 can penetrate the mounting plates 313, the high-temperature-resistant magnetic columns 33 are connected with the high-temperature-resistant magnetic heads 32, thereby realizing the connection of the magnetic circuit and the normal operation of the inductor. Through the penetration connection of the high-temperature-resistant magnetic columns 33 and the mounting plates 313, the high-temperature-resistant skeleton 31 can be pre-positioned during installation with the high-temperature-resistant magnetic columns 33, thereby facilitating the overall assembly of the high-temperature-resistant inductor unit 3. The mounting plates 313 are arranged at the ends of the fixed plates 311 away from the insulating sleeves 312, and the plurality of clamping elastic pieces 314 are arranged on the mounting plates 313. The clamping elastic pieces 314 can be L-shaped pieces, and the high-temperature-resistant magnetic heads 32 can be detachably connected between the clamping elastic pieces 314 and the fixed plates 311. Through the elastic action of the plurality of clamping elastic pieces 314, the high-temperature-resistant magnetic heads 32 can be clamped and fixed between the clamping elastic pieces 314 and the fixed plates 311, so that the high-temperature-resistant magnetic heads 32 are connected with the high-temperature-resistant magnetic columns 33, thereby realizing the installation of the high-temperature-resistant magnetic heads 32.

[0037] In some embodiments, the insulating sleeve 312 comprises at least two layers of composite insulating paper, which can ensure the insulation performance of the insulating sleeve 312 to the high-temperature-resistant magnetic column 33. The insulating sleeve 312 is connected with the two fixing plates 311 through high-temperature glue. The high-temperature glue can be 6065H glue, which can ensure the high-temperature resistance of the connection between the insulating sleeve 312 and the two fixing plates 311, and ensure the normal work of the high-temperature-resistant inductor unit 3 in a high-temperature environment.

[0038] In some embodiments, the high-temperature-resistant framework 31 is made of polyphenylene sulfide, which has good high-temperature resistance, corrosion resistance and mechanical strength, so that the high-temperature-resistant framework 31 can be used in a high-temperature environment.

[0039] In some embodiments, the mounting groove 2 comprises a flow guide table 21, which is arranged in the middle of the mounting groove 2 and between the two high-temperature-resistant magnetic columns 33. The cross section of the flow guide table 21 can be a triangle with concave arc edges on both sides. When filling the potting glue, the flow guide table 21 can guide the potting glue between the two high-temperature-resistant magnetic columns 33, thereby realizing full potting between the high-temperature-resistant inductor unit 3 and the mounting groove 2 and ensuring the stable connection between the shell 1 and the plurality of high-temperature-resistant inductor units 3.

[0040] In some embodiments, the heat dissipation assembly 5 comprises a plurality of heat dissipation fins 51, which are arranged at equal intervals on the side of the shell 1 away from the mounting groove 2, which can effectively increase the heat dissipation area of the shell 1 and improve the heat dissipation efficiency.

[0041] The specific working principle is as follows:

[0042] When the inductor works, the current passes through the high-temperature-resistant coil winding 34 to generate a magnetic field, thereby realizing the inductance function of the inductor structure. The high-temperature-resistant framework 31, the high-temperature-resistant magnetic head 32 and the high-temperature-resistant magnetic column 33 jointly bear the thermal stress in a high-temperature environment, thereby ensuring the stability and reliability of the inductor structure. The pretreatment layer 6 can enhance the interfacial bonding force between the potting glue layer 4 and the inner wall of the mounting groove 2, thereby improving the stability and temperature resistance of the inductor structure. The heat dissipation assembly 5 effectively dissipates the heat generated by the inductor structure to the environment through the heat dissipation fins 51, thereby keeping the working temperature of the inductor structure within a safe range.

[0043] The above embodiments are only used to illustrate the technical solutions of the present application, but not to limit them. Although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacements to some technical features. These modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A high temperature resistant inductor structure, characterized by: It comprises a shell (1); A plurality of installation grooves (2) are equidistantly arranged on the shell (1); A high-temperature-resistant inductor unit (3) is inserted into the installation groove (2); An encapsulation glue layer (4) is arranged between the high-temperature-resistant inductor unit (3) and the shell (1); A heat dissipation assembly (5) is arranged on the side of the shell (1) away from the installation groove (2).

2. The high temperature resistant inductor structure according to claim 1, wherein: It also comprises a pretreatment layer (6) arranged between the encapsulation glue layer (4) and the inner wall of the installation groove (2).

3. The high temperature resistant inductor structure of claim 1, wherein: The high-temperature-resistant inductor unit (3) comprises a high-temperature-resistant framework (31); Two high-temperature-resistant magnetic heads (32) are arranged at both ends of the high-temperature-resistant framework (31); Two high-temperature-resistant magnetic columns (33) are arranged between the two high-temperature-resistant magnetic heads (32) and are inserted into the high-temperature-resistant framework (31); A high-temperature-resistant coil winding (34) is wound around the two high-temperature-resistant magnetic columns (33).

4. The high temperature resistant inductor structure of claim 3, wherein: The high-temperature-resistant framework (31) comprises two parallel fixed plates (311); Two insulation sleeves (312) are respectively inserted into the fixed plates (311) at both ends and are sleeved on the high-temperature-resistant magnetic columns (33); An installation plate (313) is arranged at one end of the fixed plate (311) away from the insulation sleeve (312); A plurality of clamping spring sheets (314) are arranged on the installation plate (313) and are detachably connected between the fixed plate (311) and the high-temperature-resistant magnetic head (32).

5. The high temperature resistant inductor structure of claim 4, wherein: The insulation sleeve (312) comprises at least two layers of composite insulation paper.

6. The high temperature resistant inductor structure of claim 4, wherein: The insulation sleeve (312) and the two fixed plates (311) are connected by high-temperature glue.

7. The high temperature resistant inductor structure according to claim 3, wherein: The high-temperature-resistant framework (31) is made of polyphenylene sulfide.

8. The high temperature resistant inductor structure according to claim 3, wherein: The installation groove (2) comprises a flow guide table (21) arranged in the middle of the installation groove (2) and between the two high-temperature-resistant magnetic columns (33).

9. The high temperature resistant inductor structure of claim 1, wherein: The heat dissipation assembly (5) comprises a plurality of heat dissipation fins (51) equidistantly arranged on the side of the shell (1) away from the installation groove (2).

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